阅读说明：本技术 一种用于微带器件的焊接工装及基于该焊接工装的焊接方法 (Welding tool for microstrip device and welding method based on welding tool ) 是由 梁培东 霍亚磊 钟剑丽 袁茜 于 2021-08-25 设计创作，主要内容包括：本发明提供一种用于微带器件的焊接工装及基于该焊接工装的焊接方法,该焊接工装包括底座；以及结合固定于底座上的框架；所述底座包括有位于框架内的凸起结构；所述凸起结构被配置为与框架的内侧壁配合形成压接工位；所述焊接工装还包括位于压接工位的用于压紧微带器件微带电路片和微带器件合金载体板的压块。该焊接工装能够有效提升微带器件焊接后的质量。(The invention provides a welding tool for a microstrip device and a welding method based on the welding tool, wherein the welding tool comprises a base; and a frame combined and fixed on the base; the base comprises a protruding structure positioned in the frame; the raised structure is configured to cooperate with an inner sidewall of the frame to form a crimping station; the welding tool further comprises a pressing block which is positioned at the crimping station and used for pressing the microstrip device microstrip circuit piece and the microstrip device alloy carrier plate. The welding tool can effectively improve the quality of the micro-strip device after welding.)

1. The utility model provides a welding frock for microstrip device which characterized in that includes:

a base; and

a frame combined and fixed on the base;

the base comprises a protruding structure positioned in the frame;

the raised structure is configured to cooperate with an inner sidewall of the frame to form a crimping station;

the welding tool further comprises a pressing block which is positioned at the crimping station and used for pressing the microstrip device microstrip circuit piece and the microstrip device alloy carrier plate.

2. The welding tool of claim 1, wherein the surface of the pressing block close to the microstrip circuit chip of the microstrip device is a plane;

the pressing block comprises a notch used for avoiding the microstrip device resistor disc.

3. The welding tool according to claim 1, wherein the protruding structures and the inner side wall of the frame are enclosed to form four crimping stations; the four crimping stations are arranged along the circumferential direction of the frame; the welding tool comprises four pressing blocks which are respectively located at the crimping stations.

4. The welding tooling of claim 1, wherein the protrusion structure is formed with a first outgassing channel penetrating through the upper and lower side surfaces of the protrusion structure, and the first outgassing channel penetrates through the side wall surface of the protrusion structure and is communicated with the crimping station.

5. The welding tooling of claim 1, wherein the frame is formed with a second outgassing channel that runs through the upper and lower side surfaces of the frame; the second air release channel penetrates through the inner side wall surface of the frame and is communicated with the crimping station.

6. The welding tool of claim 1, wherein the base is 3-5 mm thick, and the base is less than 60mm long.

7. The welding tool of claim 1, wherein the frame is fixedly coupled to the base by a positioning post; the frame comprises a first structural body and a second structural body which is arranged in a central symmetry mode with the first structural body;

the two nonadjacent corners of the base respectively comprise a positioning hole; the first structure body and the second structure body are respectively combined and fixed with the base through the positioning columns.

8. The welding tool of claim 1, wherein the base is made of aluminum alloy.

9. A welding method based on the welding tool of any one of claims 1-8, characterized by comprising:

providing an alloy carrier plate;

plating a metal solder mask on the side wall surface of the alloy carrier plate;

placing an alloy carrier plate with a metal solder mask into a crimping station of the welding tool;

placing a solder sheet on an alloy carrier plate having a metal solder resist;

placing a microstrip circuit piece above the solder piece, and adjusting the position of the microstrip circuit piece to ensure that the position of the microstrip circuit piece is superposed with that of the alloy carrier plate;

placing a pressing block above the microstrip circuit chip;

and placing the welding tool into a vacuum welding furnace to weld the alloy carrier plate and the microstrip circuit chip.

10. The soldering method according to claim 9, wherein a film thickness of the metal solder resist is 0.05 μm to 0.1 μm; the adhesive force of the film layer is more than 1.5Kg/mm²。

Technical Field

The invention relates to the technical field of ferrite microstrip devices. And more particularly, to a welding tool for a microstrip device and a welding method based on the welding tool.

Background

The high-power ferrite microstrip device is widely applied to an array antenna system of a solid active phased array radar in high-density micro-assembly due to the advantages of small volume, thin thickness, easiness in microwave circuit integration and the like, and is an essential important part of the radar system.

The high-power ferrite microstrip device consists of an alloy carrier plate, a ferrite microstrip circuit chip and a resistor. Wherein, the ferrite microstrip circuit chip and the alloy carrier plate adopt a vacuum brazing process. The minimum 3mm of welding area, the biggest 17mm 20mm, high power ferrite microstrip device is high to the welding quality requirement, requires that the penetration rate is greater than 97%, but uses current welding frock, can appear more welding quality problem, and the penetration rate is low, and the quality of microstrip device is than relatively poor.

Disclosure of Invention

In view of the above problems, an object of the present invention is to provide a welding tool for a microstrip device, which can effectively improve the quality of the microstrip device after welding.

In order to achieve the purpose, the invention adopts the following technical scheme:

the invention provides a welding tool for a microstrip device, which comprises:

a base; and

a frame combined and fixed on the base;

the base comprises a protruding structure positioned in the frame;

the raised structure is configured to cooperate with an inner sidewall of the frame to form a crimping station;

the welding tool further comprises a pressing block which is positioned at the crimping station and used for pressing the microstrip device microstrip circuit piece and the microstrip device alloy carrier plate.

In addition, preferably, the surface of the pressing block close to the microstrip circuit chip of the microstrip device is a plane;

the pressing block comprises a notch used for avoiding the microstrip device resistor disc.

In addition, preferably, the protruding structures and the inner side wall of the frame are enclosed to form four crimping stations; the four crimping stations are arranged along the circumferential direction of the frame; the welding tool comprises four pressing blocks which are respectively located at the crimping stations.

In addition, preferably, the protruding structure is provided with a first air release channel penetrating through the upper side surface and the lower side surface of the protruding structure, and the first air release channel penetrates through the side wall surface of the protruding structure and is communicated with the crimping station.

In addition, preferably, the frame is provided with a second air release channel which penetrates through the upper and lower side surfaces of the frame; the second air release channel penetrates through the inner side wall surface of the frame and is communicated with the crimping station.

In addition, preferably, the thickness of the base is 3 mm-5 mm, and the side length of the base is less than 60 mm.

In addition, preferably, the frame is fixed on the base through a positioning column; the frame comprises a first structural body and a second structural body which is arranged in a central symmetry mode with the first structural body;

the two nonadjacent corners of the base respectively comprise a positioning hole; the first structure body and the second structure body are respectively combined and fixed with the base through the positioning columns.

In addition, preferably, the base is made of aluminum alloy.

Another object of the present invention is to provide a welding method based on the welding tool, including:

providing an alloy carrier plate;

plating a metal solder mask on the side wall surface of the alloy carrier plate;

placing an alloy carrier plate with a metal solder mask into a crimping station of the welding tool;

placing a solder sheet on an alloy carrier plate having a metal solder resist;

placing a microstrip circuit piece above the solder piece, and adjusting the position of the microstrip circuit piece to ensure that the position of the microstrip circuit piece is superposed with that of the alloy carrier plate;

placing a pressing block above the microstrip circuit chip;

and placing the welding tool into a vacuum welding furnace to weld the alloy carrier plate and the microstrip circuit chip.

Further, it is preferable thatThe scheme is that the film thickness of the metal solder mask is 0.05-0.1 μm; the adhesive force of the film layer is more than 1.5Kg/mm²。

The invention has the beneficial effects that:

the micro-strip circuit piece, the alloy carrier plate and the pressing block are accommodated and fixed at the crimping station through the matching of the base and the frame, the pressing block is used for pressing the micro-strip circuit piece of the micro-strip device and the alloy carrier plate of the micro-strip device, so that the subsequent welding and fixing of the micro-strip circuit piece and the alloy carrier plate are facilitated, the production efficiency can be obviously improved, the yield of the micro-strip device is improved, and the welding quality is improved; in addition, the situation that the welding position of the microstrip circuit chip and the alloy carrier plate deviates due to the displacement of the pressing block in the process of taking, placing and moving the welding tool can be prevented.

Drawings

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of the welding tool of the present invention.

FIG. 2 is a schematic view of the metal solder mask of the present invention in cooperation with an alloy carrier plate.

Fig. 3 a-3 b are schematic diagrams of the overall structure of a microstrip device.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be considered a part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

The problem of current welding frock welding quality is low is solved. The invention provides a welding tool for a microstrip device, which is shown in a combined figure 1-figure 2 and a figure 3 a-figure 3b, and specifically comprises: a base 1; and a frame 2 combined and fixed on the base 1; the base 1 comprises a convex structure 3 positioned in the frame 2; the raised structure 3 is configured to cooperate with an inner side wall of the frame 2 to form a crimping station; the welding tool further comprises a pressing block 8 which is positioned at the crimping station and used for pressing the microstrip circuit piece 6 of the microstrip device 4 and the alloy carrier plate 7 of the microstrip device 4. The microstrip circuit piece 6, the alloy carrier plate 7 and the pressing block 8 are accommodated and fixed at the crimping station through the matching of the base 1 and the frame 2, the pressing block 8 is used for pressing the microstrip circuit piece 6 of the microstrip device 4 and the alloy carrier plate 7 of the microstrip device 4, so that the subsequent microstrip circuit piece 6 and the alloy carrier plate 7 are welded and fixed conveniently, the production efficiency can be obviously improved by using the welding tool, the yield of the microstrip device 4 is improved, and the welding quality is improved; in addition, the situation that the welding position of the microstrip circuit chip 6 and the alloy carrier plate 7 deviates due to the displacement of the pressing block 8 can be prevented in the process of taking, placing and moving the welding tool.

In a specific embodiment, the surface of the pressing block 8 close to the microstrip circuit chip 6 of the microstrip device 4 is a plane; the pressing block 8 comprises a notch for avoiding the resistor disc 9 of the microstrip device 4. The welding tool adopts a surface contact pressurizing mode, namely pressurizing by the pressing block 8, and adopts the pressing blocks 8 with different weights according to the size of the ferrite micro-strip device 4 and the volume of the solder sheet, so that the stress of the micro-strip circuit sheet 6 is uniform during welding, and the risk of the micro-strip circuit sheet 6 fragmentation caused by point contact in the past is avoided.

In a specific embodiment, the protruding structure 3 and the inner side wall of the frame 2 enclose to form four crimping stations; the four crimping stations are arranged along the circumferential direction of the frame 2; the welding tool comprises four pressing blocks 8 which are respectively located at the crimping stations. Four groups of microstrip circuit chips 6 and alloy carrier plates 7 can be placed at four crimping stations at the same time, and upper pressing blocks 8 are respectively pressed, so that the production efficiency is improved.

In order to improve the yield of the microstrip device 4 during welding, first air release channels 10 penetrating through the upper and lower side surfaces of the protruding structure 3 are formed on the protruding structure 3, and the first air release channels 10 penetrate through the side wall surfaces of the protruding structure 3 and are communicated with the crimping station. The first air release channel 10 is designed on the convex structure 3 of the welding tool, so that release of a solder resist and extension of solder during vacuum pumping are facilitated, and the problem that excessive bubbles are generated at the position where the solder sheet is placed between the microstrip circuit sheet 6 and the alloy carrier plate 7 due to existence of air to influence the welding effect is avoided.

In an alternative embodiment, the frame 2 is formed with a second air release channel 11 penetrating the upper and lower side surfaces of the frame 2; the second outgassing route 11 penetrates the inner side wall surface of the frame 2 and communicates with the crimping station. The frame 2 of the welding tool is provided with the second air release channel 11, so that release of a solder resist and extension of solder are facilitated during vacuum pumping, the situation that the welding effect is affected by too many bubbles generated due to existence of gas at the position where the solder sheet is placed between the microstrip circuit sheet 6 and the alloy carrier plate 7 is avoided, the first air release channel 10 and the second air release channel 11 can be arranged in a plurality of ways, and the first air release channel 10 and the second air release channel 11 are matched to play a role of exhausting during vacuum pumping.

It can be understood that the vacuum welding equipment adopts a heat conduction mode, that is, during vacuum welding, heat is transferred from a heating plate in a vacuum welding furnace to the welding tool, and the welding tool is transferred to the alloy carrier plate 7, the solder sheet and the microstrip circuit sheet 6; welding fixture materials and thicknesses have a great influence on the uniformity and consistency of welding heat transfer, thereby affecting the penetration rate. The welding tool base 1 is made of an aluminum alloy material with small heat capacity and high heat conductivity, the thickness of the base 1 is subjected to simulation analysis and tests to obtain the base with the thickness of 3-5 mm as the optimal size, the side length size is less than 60mm, and when the thickness of the base 1 is too thin or the external size is too large, the base is easy to deform, so that the flatness of a contact surface is poor, and heat conduction is not facilitated; when the thickness of the base 1 is too large, the heat capacity is large, and the heat transfer efficiency is lowered.

Regarding the matching manner of the frame 2 and the base 1, specifically, the frame 2 is fixedly combined on the base 1 through the positioning column 12; the frame 2 comprises a first structural body 13 and a second structural body 14 which is arranged in central symmetry with the first structural body 13; two nonadjacent corners of the base 1 respectively comprise a positioning hole; the first structure 13 and the second structure 14 are respectively fixed to the base 1 through the positioning posts 12. The base 1 of the welding tool is provided with the positioning column 12, and the first structural body 13 and the second structural body 14 are sleeved on the positioning column 12 through the positioning hole and fixed with the base 1; furthermore, the welding tool is of an open structure, the assembling mode is stacking layer by layer, and the welding tool is suitable for assembling on an automatic chip mounter, so that the assembling efficiency is improved.

The invention also provides a welding method based on the welding tool, which specifically comprises the following steps: providing an alloy carrier plate 7; plating a metal solder mask 15 on the side wall surface of the alloy carrier plate 7; placing the alloy carrier plate 7 with the metal solder mask 15 into a crimping station of the welding tool; placing a solder sheet on the alloy carrier plate 7 with the metal solder resist 15; placing a microstrip circuit chip 6 above the solder chip, and adjusting the position of the microstrip circuit chip 6 to ensure that the position of the microstrip circuit chip 6 is superposed with the position of the alloy carrier plate 7; a pressing block 8 is arranged above the microstrip circuit piece 6; and placing the welding tool into a vacuum welding furnace to weld the alloy carrier plate 7 and the microstrip circuit chip 6.

It can be understood that, because the material of the microstrip circuit chip 6 is a hard and brittle material, the welding method is improper, the chip is easy to crack, and the cracking rate is about 2%, thereby affecting the quality of the microstrip device 4, the production efficiency is low, and the mass production is not facilitated, in addition, the solder is difficult to be accurately controlled, the soldering tin is easy to flow to the mounting surface, the defects of tin beads and the like are easy to occur, and the welding precision is low, and is about +/-50 μm; and the current solder mask is mostly liquid or dry film, the manufacturing process of the solder mask is relatively complex, the precision is low, and the requirement of precision welding of the ferrite microstrip device 4 can not be met.

Specifically, a metal solder resist 15 is plated on the peripheral surface of the alloy carrier plate 7; extracting 5% of alloy carrier plate 7 with metal solder mask 15 to detect the quality of film layer, wherein the detection items include film layer adhesion, dimensional accuracy and film thickness accuracy; loading the alloy carrier plate 7 qualified by inspection into the welding tool, placing a solder sheet on the alloy carrier plate 7 with the metal solder mask 15, placing the ferrite microstrip circuit chip 6 above the solder sheet, and adjusting the position to ensure that the positions of the microstrip circuit chip 6 and the alloy carrier plate 7 are consistent; a pressing block 8 is arranged above the microstrip circuit piece 6; the step can be manually operated or completed by a chip mounter; putting the welding tool into a vacuum welding furnace, selecting a proper temperature curve according to the specific microstrip device 4, and operating the equipment to complete batch welding; and taking down the welded microstrip device 4 from the welding tool to carry out welding penetration rate and welding precision inspection.

The metal solder resist 15 has a film thickness of 0.05 μm to 0.1 μm in consideration of the soldering characteristics of various metal materials, the bonding characteristics with the alloy carrier plate 7, and the economy; the adhesive force of the film layer is more than 1.5Kg/mm²Depending on the thickness of the alloy carrier plate 7, the width of the solder resist on the side walls of the alloy carrier plate 7 is made slightly larger than the thickness of the alloy carrier plate 7, so that it can just be stopped at the location of the solder joint, without affecting the placement of the microstrip circuit chip 6 and preventing solder flow.

The welding method solves the problems of low penetration rate, low welding precision, easy cracking of a micro-strip circuit chip and low production efficiency in the welding of ferrite micro-strip devices, and the metal solder mask is simple in manufacturing process, can be used for manufacturing 3000-5000 alloy carrier plates per hour, and is high in production efficiency. By implementing the welding method through the welding tool, the penetration rate of the existing ferrite microstrip device is increased from 75% to more than 97%, the welding precision is increased from +/-50 microns to +/-20 microns, the welding flux can be accurately controlled in a welding area and cannot flow to a mounting surface, the welding crack rate is reduced from 2% to 0, the welding tool is simple to operate, the welding tool is suitable for manual operation and a chip mounter, the assembly efficiency can be greatly improved, mass production of the ferrite microstrip device can be guaranteed, and the quality consistency of the microstrip device is guaranteed.

The welding inspection results of a certain batch of ferrite microstrip devices are attached as follows:

after welding, the solder is detected under a microscope, the solder is accurately controlled in a welding area and does not flow to a mounting surface, 100 percent of welding precision is detected under an imager, the precision is all better than +/-20 mu m, 100 percent of welding penetration rate is all better than 97 percent and the crack rate is 0.

It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.