阅读说明：本技术 一种半导体柔性材料生产用打磨装置及其使用方法 (Polishing device for semiconductor flexible material production and use method thereof ) 是由 胡晓刚 何华军 高峰 于 2021-09-18 设计创作，主要内容包括：本发明涉及柔性材料打磨技术领域,具体为一种半导体柔性材料生产用打磨装置,包括机箱和加工台,机箱的上表面设置有主控台,机箱的上表面固定安装有机械臂,机械臂远离机箱的一端固定安装有打磨头,加工台的上表面固定安装有打磨平台,加工台的上表面对称固定安装有支座,两组支座之间贯穿设置有丝杆,丝杆的一端固定安装有从动齿轮,加工台靠近从动齿轮的一端对称开设有安装孔。本发明,通过设置该活动架和刷板,通过从动齿轮、主动齿轮以及丝杆的传动作用下,利用电机的带动,可以实现活动架带着刷板在丝杆上进行来回运动,在刷板运动的过程中,即可以将废屑直接通过导板扫入到收集箱内,从而完成对废屑的高效、快速地收集和回收。(The invention relates to the technical field of flexible material polishing, in particular to a polishing device for producing a semiconductor flexible material, which comprises a case and a processing table, wherein a main control table is arranged on the upper surface of the case, a mechanical arm is fixedly arranged on the upper surface of the case, a polishing head is fixedly arranged at one end, away from the case, of the mechanical arm, a polishing platform is fixedly arranged on the upper surface of the processing table, supports are symmetrically and fixedly arranged on the upper surface of the processing table, a lead screw penetrates between the two groups of supports, a driven gear is fixedly arranged at one end of the lead screw, and mounting holes are symmetrically formed in one end, close to the driven gear, of the processing table. According to the invention, through the arrangement of the movable frame and the brush plate, the movable frame can drive the brush plate to move back and forth on the screw rod under the transmission action of the driven gear, the driving gear and the screw rod, and the waste scraps can be directly swept into the collection box through the guide plate in the process of movement of the brush plate, so that the waste scraps are efficiently and quickly collected and recovered.)

1. The utility model provides a grinding device is used in production of semiconductor flexible material, includes quick-witted case (1) and processing platform (5), its characterized in that: the upper surface of the case (1) is provided with a master control table (2), the upper surface of the case (1) is fixedly provided with a mechanical arm (3), one end of the mechanical arm (3) far away from the case (1) is fixedly provided with a polishing head (4), the upper surface of the processing table (5) is fixedly provided with a polishing platform (6), the upper surface of the processing table (5) is symmetrically and fixedly provided with supports (7), two groups of supports (7) are provided with screw rods (8) in a penetrating manner, one end of each screw rod (8) is fixedly provided with a driven gear (9), one end of the processing table (5) close to the driven gear (9) is symmetrically provided with mounting holes (10), the inner part of each mounting hole (10) is fixedly provided with a motor (11), the output end of each motor (11) is fixedly provided with a driving gear (12), and the outer surface of the two groups of the screw rods (8) is sleeved with a movable frame (13), the lower fixed surface of adjustable shelf (13) installs brush board (14), the side of processing platform (5) is provided with the check and keeps off the mechanism, the junction of machine case (1) and master control platform (2) is provided with receiving mechanism.

2. The polishing device for producing the semiconductor flexible material as claimed in claim 1, wherein: fixed blocks (15) are symmetrically and fixedly mounted on two sides of the movable frame (13), a rectangular groove is formed in one side of each fixed block (15), and steel balls (16) are uniformly embedded in the rectangular groove.

3. The polishing device for producing the semiconductor flexible material as claimed in claim 1, wherein: and a guide plate (17) is fixedly arranged on one side of the processing table (5) close to the motor (11).

4. The polishing device for producing the semiconductor flexible material as claimed in claim 1, wherein: and a collecting box (18) is arranged on one side of the processing table (5) close to the motor (11).

5. The polishing device for producing the semiconductor flexible material as claimed in claim 4, wherein: the lower surface of the processing table (5) is fixedly provided with supporting legs, magnetic sheets are symmetrically and fixedly arranged on one sides of the supporting legs close to the collecting box (18), and iron sheets are symmetrically and fixedly arranged on one sides of the collecting box (18) close to the supporting legs.

6. The polishing device for producing the semiconductor flexible material as claimed in claim 1, wherein: check keep off mechanism includes plug-in components (19), the inside of plug-in components (19) is inserted and is equipped with inserted bar (20), the top fixed mounting of inserted bar (20) has baffle (21), spread groove (22) have been seted up to one side of inserted bar (20), the inside of spread groove (22) is inserted and is equipped with fixture block (23), fixed mounting has spring (24) between the inner wall of fixture block (23) and spread groove (22).

7. The polishing device for producing the semiconductor flexible material as claimed in claim 6, wherein: and a handle is fixedly arranged on the outer surface of the baffle plate (21).

8. The polishing device for producing the semiconductor flexible material as claimed in claim 1, wherein: storage mechanism is including accomodating groove (25), accommodate the bottom inner wall in groove (25) and seted up built-in hole (26), the inside fixed mounting of built-in hole (26) has hydraulic stem (27), the output of hydraulic stem (27) and the lower fixed surface of master control platform (2) are connected, symmetry fixed mounting has telescopic link (28) between master control platform (2) and the inner wall of accomodating groove (25).

9. The polishing device for producing the semiconductor flexible material as claimed in claim 8, wherein: the lower surface fixed mounting of master console (2) has the mounting disc, master console (2) are through the output fixed connection of mounting disc and hydraulic stem (27).

10. The use method of the polishing device for producing the semiconductor flexible material is characterized by comprising the following steps of: the method comprises the following steps:

s1: when a worker uses the polishing equipment, the worker firstly places the semiconductor flexible material to be processed on a polishing platform (6);

s2: then, a worker holds the handle by hand, the baffle (21) is lifted upwards, when the baffle moves to a proper height position, the spring (24) can pop the clamping block (23) and the connecting groove (22) out under the action of the spring (24), then the worker loosens the handle, and the position of the baffle (21) is determined under the action of the clamping block (23);

s3: then, a worker opens the hydraulic rod (27), lifts the main control table (2) from the accommodating groove (25), and then controls the mechanical arm (3) and the polishing head (4) to polish the material through the main control table (2);

s4: after polishing, take out the material, then open motor (11), motor (11) can take driving gear (12) to rotate, driven gear (9) and lead screw (8) can rotate along with driving gear (12) immediately, under the auxiliary action of steel ball (16), adjustable shelf (13) area brush board (14) begin to move along the upper surface of processing platform (5), and sweep out the sweeps from processing platform (5), fall into collection box (18) through baffle (17), thereby accomplish the automatic clearance collection to the sweeps, then reset adjustable shelf (13) and brush board (14), repeated polishing work can.

Technical Field

The invention relates to the technical field of polishing of flexible materials, in particular to a polishing device for producing a semiconductor flexible material.

Background

At present, the continuous miniaturization and flexibility of semiconductor devices have become the mainstream trend, and two-dimensional semiconductor materials have ultrathin thickness, excellent electrical, optical and mechanical properties and multi-degree-of-freedom adjustability, so that the two-dimensional semiconductor materials have advantages in future lighter, thinner, faster and more sensitive electronic devices.

Disclosure of Invention

The invention aims to solve the defects in the prior art, and provides a polishing device for producing a semiconductor flexible material.

In order to achieve the purpose, the invention adopts the following technical scheme: a polishing device for producing a semiconductor flexible material comprises a case and a processing table, wherein a master control table is arranged on the upper surface of the case, a mechanical arm is fixedly arranged on the upper surface of the case, a polishing head is fixedly arranged at one end, far away from the case, of the mechanical arm, a polishing platform is fixedly arranged on the upper surface of the processing table, supports are symmetrically and fixedly arranged on the upper surface of the processing table, a lead screw penetrates between the two groups of supports, a driven gear is fixedly arranged at one end of the lead screw, a mounting hole is symmetrically formed in one end, close to the driven gear, of the processing table, a motor is fixedly arranged inside the mounting hole, a driving gear is fixedly arranged at the output end of the motor, a movable frame is sleeved on the outer surfaces of the two groups of lead screws, a brush plate is fixedly arranged on the lower surface of the movable frame, a blocking mechanism is arranged on the side surface of the processing table, and a storage mechanism is arranged at the joint of the case and the main control console.

In order to ensure the smooth movement of the movable frame, the invention has the improvement that fixed blocks are symmetrically and fixedly arranged on two sides of the movable frame, a rectangular groove is formed in one side of each fixed block, and steel balls are uniformly embedded in the rectangular groove.

In order to facilitate the blanking of the waste materials, the invention has the improvement that a guide plate is fixedly arranged on one side of the processing table close to the motor.

In order to collect the waste material in a centralized way, the invention improves that a collecting box is arranged on one side of the processing platform close to the motor.

In order to fix the collecting box to a certain extent, the invention is improved in that the lower surface of the processing table is fixedly provided with the supporting legs, the sides of the supporting legs, which are close to the collecting box, are symmetrically and fixedly provided with the magnetic sheets, and the sides of the collecting box, which are close to the supporting legs, are symmetrically and fixedly provided with the iron sheets.

In order to prevent scraps from splashing in the machining process, the invention is improved in that the blocking mechanism comprises an insert, an insert rod is inserted in the insert, a baffle is fixedly installed at the top end of the insert rod, a connecting groove is formed in one side of the insert rod, a clamping block is inserted in the connecting groove, and a spring is fixedly installed between the clamping block and the inner wall of the connecting groove.

In order to facilitate lifting of the baffle by workers, the invention is improved in that a handle is fixedly arranged on the outer surface of the baffle.

In order to improve the protection effect on the main control table, the invention is improved in that the accommodating mechanism comprises an accommodating groove, an internal hole is formed in the inner wall of the bottom end of the accommodating groove, a hydraulic rod is fixedly installed inside the internal hole, the output end of the hydraulic rod is fixedly connected with the lower surface of the main control table, and telescopic rods are symmetrically and fixedly installed between the main control table and the inner wall of the accommodating groove.

In order to facilitate the connection between the hydraulic rod and the main control table, the invention has the improvement that the lower surface of the main control table is fixedly provided with a mounting disc, and the main control table is fixedly connected with the output end of the hydraulic rod through the mounting disc.

In order to improve the effect, the invention improves the use method of the polishing device for producing the semiconductor flexible material, and the polishing device comprises the following steps:

s1: when a worker uses the polishing equipment, firstly, the worker places a semiconductor flexible material to be processed on a polishing platform;

s2: then, a worker holds the handle by hand, the baffle plate is lifted upwards, when the baffle plate moves to a proper height position, the spring can pop the clamping block and the connecting groove out under the action of the spring, and then the worker loosens the handle to realize the determination of the position of the baffle plate under the action of the clamping block;

s3: then, a worker starts the hydraulic rod to lift the main control console from the accommodating groove, and then the main control console controls the mechanical arm and the polishing head to polish the material;

s4: after polishing the completion, take out the material, then open the motor, the motor can take the driving gear to rotate, driven gear and lead screw can rotate along with the driving gear immediately, under the auxiliary action of steel ball, the adjustable shelf area brush board begins along the upper surface motion of processing platform to sweep out the sweeps from the processing platform, fall into the collection incasement through the baffle, thereby the completion is collected the automatic clearance of sweeps, then with adjustable shelf and brush board reset, repeated polishing work can.

Compared with the prior art, the invention has the advantages and positive effects that:

1. according to the invention, through the arrangement of the movable frame and the brush plate, the movable frame can drive the brush plate to move back and forth on the screw rod under the transmission action of the driven gear, the driving gear and the screw rod, and the waste scraps can be directly swept into the collection box through the guide plate in the process of movement of the brush plate, so that the waste scraps are efficiently and quickly collected and recovered.

2. According to the invention, the baffle is fixed by arranging the blocking mechanism and under the clamping action of the clamping block and the plug-in, and the blocking effect of the baffle is reused to block the scraps generated in the grinding process, so that the scraps are controlled in the processing table, and the later-stage scraps are convenient to clean and recycle.

3. According to the invention, the storage mechanism is arranged, so that the lifting and the storage of the main control console can be realized, a certain protection effect can be realized on the main control console when the main control console is not used, the movement of the equipment is facilitated, and the main control console is prevented from colliding and affecting the use in the movement process of the equipment.

Drawings

Fig. 1 is a schematic perspective view of a polishing device for producing a semiconductor flexible material according to the present invention;

FIG. 2 is an exploded view of a polishing device for producing a semiconductor flexible material according to the present invention;

FIG. 3 is an enlarged view of the portion A in FIG. 2 of the polishing device for manufacturing semiconductor flexible material according to the present invention;

FIG. 4 is an enlarged view of a polishing device for manufacturing a semiconductor flexible material, which is shown in FIG. 2 and B;

FIG. 5 is a schematic side view of a polishing apparatus for manufacturing a semiconductor flexible material according to the present invention, shown in FIG. 2;

fig. 6 is an enlarged view of the polishing device for producing the semiconductor flexible material, which is shown in fig. 5 at C.

Illustration of the drawings:

1. a chassis; 2. a master console; 3. a mechanical arm; 4. polishing head; 5. a processing table; 6. polishing the platform; 7. A support; 8. a screw rod; 9. a driven gear; 10. mounting holes; 11. a motor; 12. a driving gear; 13. a movable frame; 14. brushing the board; 15. a fixed block; 16. steel balls; 17. a guide plate; 18. a collection box; 19. a plug-in; 20. inserting a rod; 21. a baffle plate; 22. connecting grooves; 23. a clamping block; 24. a spring; 25. a receiving groove; 26. A built-in hole; 27. a hydraulic lever; 28. a telescopic rod.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Referring to fig. 1-6, the present invention provides a technical solution: a polishing device for producing a semiconductor flexible material comprises a case 1 and a processing table 5, wherein a main control table 2 is arranged on the upper surface of the case 1, a mechanical arm 3 is fixedly arranged on the upper surface of the case 1, a polishing head 4 is fixedly arranged at one end, far away from the case 1, of the mechanical arm 3, a polishing platform 6 is fixedly arranged on the upper surface of the processing table 5, support seats 7 are symmetrically and fixedly arranged on the upper surface of the processing table 5, a screw rod 8 penetrates between the two groups of support seats 7, a driven gear 9 is fixedly arranged at one end of the screw rod 8, mounting holes 10 are symmetrically formed in one end, close to the driven gear 9, of the processing table 5, a motor 11 is fixedly arranged inside the mounting holes 10, a driving gear 12 is fixedly arranged at the output end of the motor 11, a movable frame 13 is sleeved on the outer surfaces of the two groups of screw rods 8, a brush plate 14 is fixedly arranged on the lower surface of the movable frame 13, and the screw rod 8 is arranged on the surface of the processing table 5, the motor 11 is used for driving, the driving gear 12 and the driven gear 9 are used for transmitting, the movable frame 13 and the brush plate 14 move back and forth on the upper surface of the processing table 5, the brush plate 14 can be used for automatically cleaning and recycling processing scraps on the surface of the processing table 5, manual intervention is not needed, labor burden of workers is relieved, and processing efficiency is guaranteed.

The fixed blocks 15 are symmetrically and fixedly arranged on two sides of the movable frame 13, the rectangular groove is formed in one side of each fixed block 15, steel balls 16 are uniformly embedded in the rectangular groove, the steel balls 16 are arranged, two groups of idler wheels are equivalently arranged, and the fluency of the moving process of the movable frame 13 can be guaranteed.

One side fixed mounting that processing platform 5 is close to motor 11 has baffle 17, one side that processing platform 5 is close to motor 11 is provided with collecting box 18, set up this baffle 17 and collecting box 18, can carry out centralized processing to the waste material, the lower fixed surface of processing platform 5 installs the landing leg, one side symmetry fixed mounting that the landing leg is close to collecting box 18 has the magnetic sheet, collecting box 18 is close to one side symmetry fixed mounting of landing leg has the iron sheet, magnetic sheet cooperation iron sheet, can fix the position of collecting box 18, avoid at the in-process that the sweeps was collected, because the deviation in collecting box 18 position leads to the sweeps to collect the condition emergence of presenting a problem.

The side surface of the processing table 5 is provided with a blocking mechanism, the blocking mechanism comprises a plug-in piece 19, an insertion rod 20 is inserted into the plug-in piece 19, a baffle 21 is fixedly installed at the top end of the insertion rod 20, a connecting groove 22 is formed in one side of the insertion rod 20, a clamping block 23 is inserted into the connecting groove 22, and a spring 24 is fixedly installed between the clamping block 23 and the inner wall of the connecting groove 22.

A containing mechanism is arranged at the joint of the case 1 and the main control platform 2, the containing mechanism comprises a containing groove 25, the inner wall of the bottom end of the containing groove 25 is provided with a built-in hole 26, a hydraulic rod 27 is fixedly arranged inside the built-in hole 26, the output end of the hydraulic rod 27 is fixedly connected with the lower surface of the main control platform 2, telescopic rods 28 are symmetrically and fixedly arranged between the main control platform 2 and the inner wall of the containing groove 25, in the invention, the main purpose of arranging the containing mechanism can realize the control effect of the staff on the main control platform 2, can control the height of the main control platform 2 and can also contain and protect the main control platform 2, when realizing the protection to master control platform 2, also make things convenient for the removal and the arrangement of equipment, the lower fixed surface of master control platform 2 installs the mounting disc, and master control platform 2 sets up this mounting disc through the output fixed connection of mounting disc with hydraulic stem 27, mainly makes things convenient for hydraulic stem 27 and master control platform 2 to carry out erection joint.

A use method of a polishing device for producing a semiconductor flexible material comprises the following steps:

s1: when a worker uses the polishing equipment, the worker firstly places the semiconductor flexible material to be processed on the polishing platform 6;

s2: then, a worker holds the handle by hand, the baffle plate 21 is lifted upwards, when the baffle plate moves to a proper height position, the spring 24 can pop the clamping block 23 and the connecting groove 22 out under the action of the spring 24, then the worker loosens the handle, and under the action of the clamping block 23, the position of the baffle plate 21 is determined;

s3: then, the worker opens the hydraulic rod 27 to lift the main control table 2 from the accommodating groove 25, and then the main control table 2 controls the mechanical arm 3 and the polishing head 4 to polish the material;

s4: after polishing, take out the material, then open motor 11, motor 11 can take driving gear 12 to rotate, driven gear 9 and lead screw 8 can rotate along with driving gear 12 immediately, under the auxiliary action of steel ball 16, adjustable shelf 13 takes brush board 14 to begin to move along the upper surface of processing platform 5, and sweep the sweeps out the sweeps from processing platform 5, fall into collection box 18 through guide 17 in, thereby accomplish the automatic clearance of sweeps and collect, then reset adjustable shelf 13 and brush board 14, repeated polishing work can.

The working principle is as follows: when a worker uses the polishing device, firstly, the worker places a semiconductor flexible material to be processed on the polishing platform 6, then holds the handle by the hand, the baffle 21 is lifted upwards, when the worker moves to a proper height position, the spring 24 can pop the clamping block 23 and the connecting groove 22 out under the action of the spring 24, then the worker loosens the handle, under the action of the clamping block 23, the position of the baffle 21 is determined, then the worker opens the hydraulic rod 27 to lift the main control table 2 from the accommodating groove 25, then the main control table 2 controls the mechanical arm 3 and the polishing head 4 to polish the material, after polishing is completed, the material is taken out, then the motor 11 is started, the motor 11 can drive the driving gear 12 to rotate, then the driven gear 9 and the screw rod 8 can rotate along with the driving gear 12, under the auxiliary action of the steel ball 16, the movable frame 13 carries the brush plate 14 to start moving along the upper surface of the processing table 5, sweeps out the waste chips from the processing table 5, and the waste chips fall into the collecting box 18 through the guide plate 17, so that the waste chips are automatically cleaned and collected, then the movable frame 13 and the brush plate 14 are reset, and the polishing work is repeated.

Although the present invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.