阅读说明：本技术 一种电路板内层冲孔机模具自动调位结构及调位方法 (Automatic position adjusting structure and method for inner layer punching machine die of circuit board ) 是由 何精明 于 2021-08-10 设计创作，主要内容包括：本发明公开了一种电路板内层冲孔机模具自动调位结构及调位方法,调位结构包括：模具,其承载工业相机和至少一冲针；所述模具还具有定位组件；移位驱动机构,其与所述模具连接,用于驱动所述模具移动以带动所述冲针移动；定位板,其沿所述模具移动路径上开设有若干定位孔；所述定位组件包括定位销及驱动所述定位销进出所述定位孔的进出驱动机构。本发明模具自动调位结构,其通过移位驱动机构将冲针移动至指定位置,通过定位组件和定位板的配合承载冲针的模具进一步定位在指定位置,避免冲针下行时发生偏位造成错位影响冲孔精度；模具的移位以及定位均为全自动过程,无需人工干预,降低劳动强度大,提高工作效率,可重复性好。(The invention discloses an automatic position adjusting structure and a position adjusting method for a circuit board inner layer punching machine die, wherein the position adjusting structure comprises the following components: a mold carrying an industrial camera and at least one punch pin; the mold also has a positioning assembly; the displacement driving mechanism is connected with the die and used for driving the die to move so as to drive the punching needle to move; the positioning plate is provided with a plurality of positioning holes along the moving path of the die; the positioning assembly comprises a positioning pin and an in-out driving mechanism for driving the positioning pin to enter and exit the positioning hole. According to the automatic die positioning structure, the punching needle is moved to the designated position through the displacement driving mechanism, and the die bearing the punching needle is further positioned at the designated position through the matching of the positioning assembly and the positioning plate, so that the punching precision is prevented from being influenced by dislocation caused by deviation when the punching needle moves downwards; the shifting and positioning of the die are all full-automatic processes, manual intervention is not needed, the labor intensity is reduced, the working efficiency is improved, and the repeatability is good.)

1. The utility model provides an automatic structure of adjusting position of circuit board inlayer piercing press mould which characterized in that, it includes:

a mold carrying an industrial camera and at least one punch pin; the mold also has a positioning assembly;

the displacement driving mechanism is connected with the die and used for driving the die to move so as to drive the punch pin and the industrial camera to move;

the positioning plate is provided with a plurality of positioning holes along the moving path of the die;

the positioning assembly comprises a positioning pin and an in-out driving mechanism for driving the positioning pin to enter and exit the positioning hole.

2. The automatic die-positioning structure for inner layers of circuit boards as claimed in claim 1, wherein the positioning assembly further comprises a sliding groove and a return spring, and the positioning pin is disposed in the sliding groove and connected to the return spring.

3. The automatic die-positioning structure for inner layers of circuit boards as claimed in claim 2, wherein a sealing cavity is formed between the positioning pin and the sliding groove, and the sealing cavity is communicated with the air inlet pipe of the in-and-out driving mechanism.

4. The automatic die-positioning structure of the circuit board inner layer punching machine according to claim 2, wherein the positioning pin is a convex positioning pin, a groove for sleeving the return spring is formed in the lower portion of the positioning pin, and a sealing ring is sleeved in the middle of the positioning pin; the upper part of the positioning pin is limited in the sliding groove through a sealing sleeve; and a through hole is formed in the area of the die between the sealing ring and the sealing sleeve so as to communicate the sealing cavity with the air inlet pipe.

5. The automatic die-positioning structure for circuit board inner layer punching machines according to claim 4, wherein the sealing sleeves are positioned in the sliding grooves through clamping rings; and sealing parts are arranged in contact areas of the sealing sleeves, the positioning pins and the sliding grooves.

6. The automatic die-positioning structure for inner layers of circuit boards as claimed in claim 1, wherein the positioning assembly further comprises a manual handle connected to a lower portion of the positioning pin, the manual handle being pressed to move the positioning pin out of the positioning hole.

7. The automatic positioning structure of the die of the circuit board inner layer punching machine according to claim 1, wherein the automatic positioning structure further comprises a moving guide groove, and the moving guide groove is arranged on the positioning plate; the mold clamp is sleeved in the moving guide groove to move along the moving guide groove.

8. The automatic die-positioning structure for circuit board inner layer punching machine according to claim 1, wherein the connection between the displacement driving mechanism and the die is detachable.

9. The automatic positioning structure of the die of the circuit board inner layer punching machine according to claim 1, wherein the die further defines at least one needle slot, a spring housing is disposed at a lower portion of each needle slot, and a pressing cover is disposed at an upper portion of each needle slot, and the pressing cover is detachably connected to the die; the punching needle is arranged in the needle groove.

10. An automatic position adjusting method for a circuit board inner layer punching machine die is characterized by comprising the following steps: the in-and-out driving mechanism controls the positioning pin to be separated from the positioning hole, the mold with the industrial camera and the at least one punching needle is in a free state relative to the positioning plate with the positioning holes, the displacement driving mechanism drives the mold to move to a specified position, and the in-and-out driving mechanism controls the positioning pin to enter the positioning hole at the position, so that the mold is in a fixed state relative to the positioning plate, and the position adjustment of the mold is completed.

Technical Field

The invention relates to an automatic position adjusting structure and method for a circuit board inner layer punching machine die.

Background

In the circuit board production process, punch a hole and be necessary process, a lot of automatic piercing press has also appeared among the prior art moreover, however the accuracy of control is not as good as possible, and the in-process that punches a hole is towards the needle and is appeared unstable problem and the inaccurate problem of counterpoint precision moreover, and the change process of punching the needle is complicated and trivial details moreover, so not only waste a large amount of manpower and materials and economic cost, still cause scrapping of circuit board easily. In addition, in the prior art, the punching is mainly positioned by manual visual inspection, and the positioning operation mode has the defects of high labor intensity, low efficiency and incapability of meeting the requirement of unmanned operation.

Disclosure of Invention

In order to solve the problems, the invention provides an automatic positioning structure and a positioning method for a circuit board inner layer punching machine die.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides a circuit board inlayer piercing press mould automatic positioning structure which includes:

a mold carrying an industrial camera and at least one punch pin; the mold also has a positioning assembly;

the displacement driving mechanism is connected with the die and used for driving the die to move so as to drive the punching needle to move;

the positioning plate is provided with a plurality of positioning holes along the moving path of the die;

the positioning assembly comprises a positioning pin and an in-out driving mechanism for driving the positioning pin to enter and exit the positioning hole.

As a preferred embodiment of the automatic positioning structure of the inner layer punching machine die for the circuit board provided by the invention, the positioning assembly further comprises a sliding groove and a return spring, and the positioning pin is arranged in the sliding groove and connected with the return spring.

As a preferred embodiment of the automatic positioning structure of the inner layer punching machine die for the circuit board provided by the invention, a sealing cavity is formed between a part of the positioning pin and the sliding groove, and the sealing cavity is communicated with the air inlet pipe of the in-and-out driving mechanism.

As a preferred embodiment of the automatic positioning structure of the circuit board inner layer punching machine die provided by the invention, the positioning pin is a convex positioning pin, the lower part of the positioning pin is provided with a groove sleeved with the return spring, and the middle part of the positioning pin is sleeved with a sealing ring; the upper part of the positioning pin is limited in the sliding groove through a sealing sleeve; and a through hole is formed in the area of the die between the sealing ring and the sealing sleeve so as to communicate the sealing cavity with the air inlet pipe.

As a preferred embodiment of the automatic die-positioning structure for the inner layer punching machine of the circuit board provided by the invention, the sealing sleeve is positioned in the sliding groove through a clamping ring.

As a preferred embodiment of the automatic positioning structure of the circuit board inner layer punching machine die provided by the invention, sealing elements are arranged in contact areas of the sealing sleeves, the positioning pins and the sliding grooves.

As a preferred embodiment of the automatic positioning structure of the inner layer punching machine die for the circuit board provided by the invention, the positioning assembly further comprises a manual handle which is connected with the lower part of the positioning pin and drives the positioning pin to be separated from the positioning hole when the manual handle is pressed.

As a preferred embodiment of the automatic positioning structure of the inner layer punching machine die for the circuit board provided by the invention, the automatic positioning structure further comprises a moving guide groove, and the moving guide groove is arranged on the positioning plate; the mold clamp is sleeved in the moving guide groove to move along the moving guide groove.

As a preferred embodiment of the automatic positioning structure of the die of the circuit board inner layer punching machine provided by the invention, the displacement driving mechanism is detachably connected with the die.

As a preferred embodiment of the automatic positioning structure of the circuit board inner layer punching machine die provided by the invention, the die is further provided with at least one needle groove, the lower part of each needle groove is provided with a spring sleeve, the upper part of each needle groove is provided with a gland, and the gland is detachably connected to the die; the punching needle is arranged in the needle groove.

An automatic position adjusting method for a circuit board inner layer punching machine die comprises the following steps: the in-and-out driving mechanism controls the positioning pin to be separated from the positioning hole, the mold with the industrial camera and the at least one punching needle is in a free state relative to the positioning plate with the positioning holes, the displacement driving mechanism drives the mold to move to a specified position, and the in-and-out driving mechanism controls the positioning pin to enter the positioning hole at the position, so that the mold is in a fixed state relative to the positioning plate, and the position adjustment of the mold is completed.

The invention has the following beneficial effects:

according to the automatic position adjusting structure of the die of the circuit board inner layer punching machine, the die bearing the industrial camera and the punching needle is moved to the designated position through the displacement driving mechanism, and the die is further positioned at the designated position through the matching of the positioning assembly and the positioning plate, so that the punching precision is prevented from being influenced by dislocation caused by deviation when the punching needle moves downwards; meanwhile, the displacement driving mechanism and the in-out driving mechanism are matched for use, the displacement and the positioning of the die are fully automatic processes, manual intervention is not needed, the labor intensity is reduced greatly, the working efficiency is improved, and the repeatability is good.

The invention adopts an in-out driving mechanism with a pneumatic driving structure, so that the in-out driving mechanism only needs to be communicated into the sliding groove of the die through an air inlet pipe, driving force is provided to push the positioning pin to move relative to the sliding groove after the air inlet pipe is inflated into the sealing cavity in the sliding groove, the driving force is cancelled after the inflation is stopped, and the reset spring drives the positioning pin to reset; meanwhile, the problems that a complicated driving part is additionally arranged to cause overlarge and overweight die and large driving force is needed and the driving process is easy to have instability are solved.

Drawings

FIG. 1 is a schematic structural view of an automatic positioning structure of a die of an inner layer punching machine for a circuit board according to the present invention;

FIG. 2 is a side view of the automatic positioning structure of the inner layer punching machine die of the circuit board of the present invention;

FIG. 3 is a cross-sectional view taken at A-A of FIG. 2, with the locating pin in the locating hole;

FIG. 4 is a partial cross-sectional view of the automatic positioning structure of the circuit board inner layer punching machine die in the state that the positioning pin is removed from the positioning hole.

Detailed Description

In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

Referring to fig. 1-4, the present invention provides an automatic die positioning structure for a circuit board inner layer punching machine, which includes a die 2 for carrying an industrial camera 7 and at least one punching pin 1, a displacement driving mechanism 3 for driving the die 2 to move so as to drive the punching pin 1 to move to a designated position, and a positioning plate 4 having a plurality of positioning holes 41, wherein the positioning holes 41 are arranged along a moving path of the die 2; the mold 2 further has a positioning assembly 21, and the positioning assembly 21 includes a positioning pin 211 matched with the positioning hole 41 and an in-out driving mechanism for driving the positioning pin 211 to enter and exit the positioning hole 41.

Specifically, the positioning assembly 21 further includes a sliding groove 212 and a return spring 213, the sliding groove 212 is disposed on one side of the mold 2, and the positioning pin 211 is disposed in the sliding groove 212 and moves up and down relative to the sliding groove 212. The lower portion of the positioning pin 211 is further connected with the return spring 213, and when the in-out driving force is cancelled, the return spring 213 provides a return power to return the positioning pin 211 to the initial state. In one embodiment, the slide groove 212 is a groove that does not penetrate therethrough, that is, only the upper portion thereof is open, and in this case, the upper end of the return spring 213 is connected to the positioning pin 211, and the lower end thereof is connected to the bottom of the slide groove 212. In another embodiment, in order to facilitate assembly and disassembly of the positioning pin 211, the sliding groove 212 is a through groove, the upper portion and the lower portion are both in an open state, a cover plate detachably connected with the mold 2 is arranged on the lower portion of the sliding groove 212, so that the lower end of the return spring 213 is connected to the cover plate, and further, a limiting groove is further formed in the cover plate to limit the lower end of the spring in the limiting groove, so that the situation that the displacement occurs in the compression and resetting process and the positioning stability is affected is avoided. In this embodiment, the sliding groove 212 is preferably a through groove structure.

The in-out driving mechanism can be a linear motor 32 driving structure, a cylinder type driving structure or a pneumatic type driving structure. In order to further simplify the structural complexity of the mold 2 and miniaturize the structure of the mold 2, the present embodiment preferably employs an in-out driving mechanism with a pneumatic driving structure, so that only the air inlet pipe is needed to be communicated with the sliding groove 212 of the mold 2, and no complicated driving part needs to be additionally arranged on the mold 2, which is beneficial to miniaturize the structure of the mold 2 and reduce the assembly process; meanwhile, the problems that a complicated driving part is additionally arranged, so that the die 2 is too large and heavy and needs a large driving force and the driving process is easy to be unstable are solved.

According to the invention, the industrial camera and the punching needle move together, namely change along with the change of the size of a product, so that the industrial camera 7 can be used for positioning before punching every time, and the punching precision is further improved.

In order to cooperate with the pneumatic driving mechanism, a sealing cavity is formed between the local positioning pin 211 and the sliding groove 212, and the sealing cavity is communicated with an air inlet pipe of the in-and-out driving mechanism. It can be understood that, as shown in fig. 3 and 4, after the air inlet pipe is inflated into the sealed cavity, a driving force is provided to push the positioning pin 211 to move relative to the sliding groove 212, and after the inflation is stopped, the driving force is removed, and the return spring 213 drives the positioning pin 211 to return.

In some embodiments, the sealing cavity may be designed on the upper portion of the positioning pin 211, i.e. the air is inflated to the sealing cavity to push the positioning pin 211 to descend out of the positioning hole 41; in another embodiment, the sealing cavity may be designed at the lower portion of the positioning pin 211, i.e. the air is inflated to the sealing cavity to push the positioning pin 211 to move upwards into the positioning hole 41. In specific implementation, the position of the sealing cavity can be selected and designed according to actual conditions. In this embodiment, the sealing cavity is preferably designed at the upper part of the positioning pin 211. As shown in fig. 3 and 4, after the air inlet pipe is inflated into the sealed cavity, a driving force is provided to push the positioning pin 211 to move relative to the sliding groove 212 to be out of the positioning hole 41, and after the inflation is stopped, the driving force is removed, and the return spring 213 drives the positioning pin 211 to return to enter the positioning hole 41.

Further, the positioning pin 211 is a convex positioning pin 211, i.e. the upper portion is narrow and the lower portion is wide, and the upper portion is narrow and the design is convenient for entering and exiting the positioning hole 41. The lower part of the positioning pin 211 is provided with a groove 2111 which is sleeved with the reset spring 213, and the middle part is sleeved with a sealing ring 2112; the upper portion of the positioning pin 211 is limited in the sliding groove 212 by the sealing sleeve 214, and a sealing cavity area is defined between the sealing ring 2112 and the sealing sleeve 214, it should be noted that, since the positioning pin 211 is in a movable state and the sealing ring 2112 is sleeved on the positioning pin 211, the size of the sealing cavity in this embodiment is not fixed, and the sealing cavity becomes larger during inflation. Further, the mold 2 is provided with a through hole 215 in a region between the sealing ring 2112 and the sealing sleeve 214 to communicate the sealing cavity with the air inlet pipe. An air inlet interface 218 is connected to the outer side of the through hole 215, so that the air inlet pipe can be conveniently detached and connected. Preferably, the air inlet interface 218 is communicated with the air inlet pipe for inputting an air source through a solenoid valve; more preferably, the electromagnetic valve is a two-position three-way electromagnetic valve, and specifically, the electromagnetic valve has two working positions and three air inlets, wherein the three air inlets are respectively connected with the air inlet pipe, the working air outlet is connected with the air inlet interface 218, and the electromagnetic valve further has an air outlet. When the electromagnetic valve is electrified and excited, the air inlet is communicated with the working air outlet so as to fill air into the sealing cavity; when the power is lost and the power returns to the normal state, the working air outlet is communicated with the air release port, so that the air in the sealed cavity is discharged when the return spring returns.

Further, the sealing sleeve 214 is positioned in the sliding groove 212 by a snap ring 216, and the upper portion of the positioning pin 211 can freely pass through the snap ring 216. The contact areas of the sealing sleeve 214, the positioning pin 211 and the sliding groove 212 are provided with sealing elements, so that the sealing performance of the sealing cavity is further improved.

The automatic position adjusting structure further comprises a movable guide groove, and the movable guide groove is arranged on the positioning plate 4; the mould 2 is sleeved in the moving guide groove in a clamping mode to move along the moving guide groove. Specifically, the both sides of locating plate 4 are provided with barricade 5, install clamp plate 6 on the barricade 5, the barricade 5 of both sides with locating plate 4 constitutes the guide slot of U type form. 6 inboard outstanding of clamp plate 5 inboards are in order to form and hang the platform, correspondingly, the hanging groove has been seted up to 2 sides of mould, during the assembly, will 2 hanging grooves of mould insert hang bench can with 2 sides of mould insert in the removal guide slot, and do not drop.

The positioning assembly 21 further comprises a manual handle 217 connected to the lower portion of the positioning pin 211, the positioning pin 211 is driven to be removed from the positioning hole 41 when the manual handle 217 is pressed, and at this time, the mold 2 is in a free state relative to the positioning plate 4, and the mold 2 can be manually pushed to move along the moving guide groove without inflation.

The die 2 is also provided with at least one needle groove 24, the lower part of each needle groove 24 is provided with a spring sleeve 25, and the upper part is provided with a gland 26; the punching needle 1 is arranged in the needle groove 24. The gland 26 is detachably connected to the die 2, so that the punching needle 1 can be replaced conveniently. The spring sleeve 25 is sleeved at the lower part of the needle groove 24, when the punching needle 1 does not work, the punching needle 1 is hidden in the spring sleeve 25, when the punching needle 1 needs to work, when the positioning structure moves downwards, the spring sleeve 25 is firstly abutted to a circuit board to be extruded and compressed, the spring sleeve 25 further moves downwards to shrink upwards, and then the punching needle 1 extends out of a sleeve hole of the spring sleeve 25 to complete a punching action. Through the spring sleeve 25 not only helps to protect the punch pin 1 and avoid damaging the punch pin 1 in the moving process, but also moves downwards in the punching process and firstly buffers through the spring sleeve 25 to further protect the punch pin 1, and the spring sleeve 25 preferably abuts against the circuit board to press the circuit board before being favorable for punching to avoid displacement, so that the punching precision is improved, and the design is made because the circuit board is thin, so that the spring sleeve 25 always abuts against the circuit board before punching to avoid the circuit board from being bent after punching.

In order to facilitate replacement of the punch pin 1, the displacement driving mechanism 3 is detachably connected with the die 2. In the present embodiment, the displacement driving mechanism 3 is not particularly limited, and may be configured to drive the mold 2 to move to a predetermined position along the moving guide. For convenience of explanation, a motor-type driving structure will be described as an example. Specifically, the displacement driving mechanism 3 includes a motor fixing seat 31, a motor 32 fixed on the motor fixing seat 31, a screw rod 33 connected with an output shaft of the motor 32, and a nut 34 sleeved on the screw rod 33, and the motor 32 drives the screw rod 33 to rotate so as to electrically move the nut 34 on the screw rod 33. Furthermore, the die 2 is detachably connected to the nut 34 through the connecting block 27, for example, a screw 35 is used, when the punch pin 1 needs to be replaced, the manual handle 217 is pressed after the screw 35 is removed, the die 2 is driven to move out of the moving guide groove, the gland 26 is removed, the punch pin 1 is replaced, the gland 26 is installed, then reverse operation is performed to insert the die 2 into the moving guide groove, the connecting block 27 is fastened to the nut 34, and the punch pin 1 can be quickly disassembled, assembled and replaced.

Example 2

The embodiment also provides an automatic positioning method of the die of the circuit board inner layer punching machine, which is realized by the positioning structure of the embodiment 1, and the method comprises the following steps: the in-and-out driving mechanism controls the positioning pin to be separated from the positioning hole, the mold with the industrial camera and the at least one punching needle is in a free state relative to the positioning plate with the positioning holes, the displacement driving mechanism drives the mold to move to a specified position, and the in-and-out driving mechanism controls the positioning pin to enter the positioning hole at the position, so that the mold is in a fixed state relative to the positioning plate, and the position adjustment of the mold is completed.

Specifically, the process of controlling the movement of the positioning pin by the in-out driving mechanism is as follows: after the air inlet pipe is inflated into the sealing cavity, driving force is provided to push the positioning pin to move relative to the sliding groove, after the air inlet pipe is stopped inflating, the driving force is cancelled, and the reset spring drives the positioning pin to reset. In the specific implementation, the positioning pin is separated from the positioning hole in the ventilation state.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

It is to be understood that the above-described embodiments are merely illustrative of some, but not restrictive, of the broad invention, and that the appended drawings illustrate preferred embodiments of the invention and do not limit the scope of the invention. This application is capable of embodiments in many different forms and is provided for the purpose of enabling a thorough understanding of the disclosure of the application. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that the present application may be practiced without modification or with equivalents of some of the features described in the foregoing embodiments. All equivalent structures made by using the contents of the specification and the drawings of the present application are directly or indirectly applied to other related technical fields and are within the protection scope of the present application.