阅读说明：本技术 一种mems压力传感器 (MEMS pressure sensor ) 是由 宋宗波 沈超群 于 2021-07-30 设计创作，主要内容包括：本发明公开了一种MEMS压力传感器,包括陶瓷基台、MEMS压力芯片以及保护罩；所述陶瓷基台内设置有陶瓷电路板组,所述MEMS压力芯片设置于所述陶瓷基台上并与所述陶瓷电路板组电性连接,所述保护罩安装于所述陶瓷基台上并包裹所述MEMS压力芯片,所述陶瓷基台上开设有第一通孔,所述MEMS压力芯片上开设有第二通孔,所述第一通孔与第二通孔连通,所述陶瓷基台的边缘设有凸缘。(The invention discloses an MEMS pressure sensor, which comprises a ceramic base station, an MEMS pressure chip and a protective cover; be provided with ceramic circuit board group in the ceramic base station, MEMS pressure chip set up in on the ceramic base station and with ceramic circuit board group electric connection, the safety cover install in on the ceramic base station and parcel MEMS pressure chip, first through-hole has been seted up on the ceramic base station, the second through-hole has been seted up on the MEMS pressure chip, first through-hole and second through-hole intercommunication, the edge of ceramic base station is equipped with the flange.)

1. The MEMS pressure sensor is characterized by comprising a ceramic base station (1), an MEMS pressure chip (2) and a protective cover (3); be provided with ceramic circuit board group (11) in ceramic base station (1), MEMS pressure chip (2) set up in on ceramic base station (1) and with ceramic circuit board group (11) electric connection, safety cover (3) install in go up and parcel on ceramic base station (1) MEMS pressure chip (2), first through-hole (12) have been seted up on ceramic base station (1), second through-hole (21) have been seted up on MEMS pressure chip (2), first through-hole (12) and second through-hole (21) intercommunication, the edge of ceramic base station (1) is equipped with flange (13).

2. The MEMS pressure sensor according to claim 1, wherein the ceramic submount (1) is cylindrical, and the first through holes (12) penetrate through the ceramic submount (1) and are distributed along a center of the ceramic submount (1).

3. The MEMS pressure sensor according to claim 2, wherein the MEMS pressure chip (2) is disposed at the center of the ceramic submount (1), and the first through hole (12) is communicated with the second through hole (21).

4. A MEMS pressure sensor as claimed in claim 1, characterized in that the protective cover (3) is potted with silicone gel.

5. The MEMS pressure sensor according to claim 4, wherein the protection cover (3) comprises a frame (31) and a cover (32), the frame (31) is disposed around the MEMS pressure chip (2), the frame (31) is filled with silicone gel, and the cover (32) is disposed on the frame (31).

6. The MEMS pressure sensor according to claim 1, wherein the ceramic circuit board set (11) comprises a bonding circuit board (111) and a signal modulation circuit board (112), the bonding circuit board (111) is electrically connected to the signal modulation circuit board (112), an upper surface of the signal modulation circuit board (112) is exposed from an upper surface of the ceramic submount (1), and a tin pad is disposed on the upper surface of the ceramic submount (1).

7. The MEMS pressure sensor of claim 6, wherein the bond circuit board (111) is disposed parallel to the signal-modulating circuit board (112), and the signal-modulating circuit board (112) is located above the bond circuit board (111).

8. The MEMS pressure sensor according to claim 6, wherein the upper surface of the signal modulation circuit board (112) is provided with pins (14) protruding from the ceramic submount (1).

Technical Field

The invention relates to the technical field of pressure detection, in particular to an MEMS pressure sensor.

Background

At present, the sensitive elements applied to pressure measurement mainly comprise MEMS single crystal silicon, ceramic piezoresistance, metal oil-filled diffused silicon core, micro-melting core, sputtering film and the like. However, the ceramic piezoresistive pressure sensor is applied to pressure measurement of various media compatible with ceramic within 6MPa, but has poor overload capacity and is easy to damage, thereby causing serious consequences; the oil-filled diffused silicon core has large volume and high cost, and can not measure the pressure measurement of strong acid solution; the micro-melting core body is mainly applied to middle and high pressure measurement, and the cost is high; the sputtering film core body has high cost, is mainly applied to high-voltage measurement, and is widely applied to industries such as military industry and the like. In addition, the pressure sensor is susceptible to scratching by the installer.

In view of the foregoing, there is a need for a new type of MEMS pressure sensor that overcomes the above-mentioned deficiencies.

Disclosure of Invention

The invention aims to provide an MEMS pressure sensor which can avoid the phenomenon that the edge corner of a ceramic base station is too prominent, and reduce the possibility that installation workers are injured when the installation is carried out.

In order to achieve the above object, the present invention provides a MEMS pressure sensor, which includes a ceramic base, a MEMS pressure chip and a protection cover; be provided with ceramic circuit board group in the ceramic base station, MEMS pressure chip set up in on the ceramic base station and with ceramic circuit board group electric connection, the safety cover install in on the ceramic base station and parcel MEMS pressure chip, first through-hole has been seted up on the ceramic base station, the second through-hole has been seted up on the MEMS pressure chip, first through-hole and second through-hole intercommunication, the edge of ceramic base station is equipped with the flange.

Preferably, the ceramic base station is cylindrical, and the first through holes penetrate through the ceramic base station and are distributed along the circle center of the ceramic base station.

Preferably, the MEMS pressure chip is disposed at a center of the ceramic base, and the first through hole is communicated with the second through hole.

Preferably, the protective cover is filled with silicone gel.

Preferably, the protective cover includes a frame and a cover, the frame is disposed around the MEMS pressure chip, the frame is filled with silicone gel, and the cover is disposed on the frame.

Preferably, ceramic circuit board group includes bonding circuit board and signal modulation circuit board, bonding circuit board with signal modulation circuit board electric connection, signal modulation circuit board's upper surface is exposed in the upper surface of ceramic base station, the upper surface of ceramic base station is provided with the tin pad.

Preferably, the bonding circuit board and the signal modulation circuit board are arranged in parallel, and the signal modulation circuit board is located above the bonding circuit board.

Preferably, the upper surface of the signal modulation circuit board is provided with a pin protruding out of the ceramic base.

Compared with the prior art, the welding equipment provided by the invention has the beneficial effects that: 1) through set up the flange at the edge of ceramic base station, avoid because of the too prominent of edge edges and corners of ceramic base station, reduce installation staff when the installation injured possibility.

2) Through encapsulating silica gel in the protective cover, can be so that protective cover inside has good dampproofing, shockproof, waterproof performance, reinforcing MEMS pressure sensor's stability.

3) The pressure sensor is provided with the signal modulation circuit board, and the pressure signal can be calibrated and temperature compensated through the signal modulation circuit board, so that the detection precision is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a cross-sectional view of a MEMS pressure sensor provided by the present invention.

Fig. 2 is a top view of the MEMS pressure sensor shown in fig. 1.

Reference numerals: 1. a ceramic abutment; 2. an MEMS pressure chip; 3. a protective cover; 11. a ceramic circuit board assembly; 12. a first through hole; 13. a flange; 14. a pin; 21. a second through hole; 111. bonding the circuit board; 112. a signal modulation circuit board; 31. a frame body; 32. a cover body.

Detailed Description

In order to make the objects, technical solutions and advantageous effects of the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and the detailed description. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.

It will be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must be in a particular orientation, constructed and operated in a particular orientation, and are therefore not to be considered limiting.

It is also noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. To those of ordinary skill in the art, the above terms may be specifically defined in the present invention according to the specific circumstances.

Furthermore, the terms "first", "second", and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first", "second", may explicitly or implicitly include one or more of that feature. Further, the meaning of "a plurality" or "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 to 2, the present invention provides an MEMS pressure sensor, which includes a ceramic base 1, an MEMS pressure chip 2 and a protection cover 3; be provided with ceramic circuit board group 11 in the ceramic base station 1, MEMS pressure chip 2 set up in on the ceramic base station 1 and with 11 electric connection of ceramic circuit board group, safety cover 3 install in on the ceramic base station 1 and parcel MEMS pressure chip 2, first through-hole 12 has been seted up on the ceramic base station 1, second through-hole 21 has been seted up on the MEMS pressure chip 2, first through-hole 12 and second through-hole 21 intercommunication, the edge of ceramic base station 1 is equipped with flange 13.

It should be noted that the MEMS pressure chip 2 is welded on the ceramic base 1, and in this embodiment, the MEMS pressure chip 2 is welded on the ceramic base 1 by a gold wire bonding wire; through the edge of ceramic base station 1 sets up flange 13, avoids because of the marginal edges and corners of ceramic base station 1 is too prominent, reduces installation staff's injured possibility when the installation.

Further, the ceramic base 1 is cylindrical, and the first through holes 12 penetrate through the ceramic base 1 and are distributed along the circle center of the ceramic base 1.

Further, the MEMS pressure chip 2 is disposed at the center of the ceramic base 1, and the first through hole 12 is communicated with the second through hole 21.

Further, silicone gel is encapsulated in the protective cover 3. Therefore, the protection cover 3 has good damp-proof, shockproof and waterproof performances, and the stability of the MEMS pressure sensor is enhanced.

Further, the protective cover 3 includes a frame 31 and a cover 32, the frame 31 is rectangular and surrounds the MEMS pressure chip 2, a silicone gel is encapsulated in the frame 31, and the cover 32 covers the frame 31.

Further, ceramic circuit board group 11 includes bonding circuit board 111 and signal modulation circuit board 112, bonding circuit board 111 with signal modulation circuit board 112 electric connection, bonding circuit board 111 with signal modulation circuit board 112 parallel arrangement, just signal modulation circuit board 112 is located bonding circuit board 111 top, signal modulation circuit board 112's upper surface is exposed in the upper surface of ceramic base station 1, the upper surface of ceramic base station 1 is provided with the tin pad, integrated circuit chip, resistance and electric capacity can weld.

It should be noted that the bonding circuit board 111 is disposed in the ceramic base 1, and the signal modulation circuit board 112 is electrically connected to the MEMS pressure chip 2. According to the technical scheme, the bonding circuit board 111 and the signal modulation circuit board 112 are separately designed, so that the size of the ceramic MEMS pressure sensor can be smaller, and packaging is facilitated; the signal modulation circuit board 112 is used for calibration and temperature compensation of the pressure signal.

Further, the upper surface of the signal modulation circuit board 112 is provided with pins 14 protruding from the ceramic base 1.

The signal modulation circuit board 112 can use a resistor or an integrated circuit chip to perform temperature compensation according to different outputs required by a user. The invention can provide output signals larger than the ceramic piezoresistive technology by adopting the MEMS pressure chip 2, and can realize the normalization of sensor signals by a built-in signal modulation circuit, thereby realizing the interchange of sensors in various application occasions.

The working principle is as follows: the fluid pressure is transmitted to the sensitive element of the MEMS pressure chip 2 through the first through hole 12 and the second through hole 21, and a corresponding electrical signal (i.e. pressure signal) change is generated; the signal is transmitted to signal modulation circuit board 112 through bonding circuit board 111; the signal conditioning circuit board 112 calibrates and temperature compensates the signal and then sends an accurate pressure signal to the communications electronics via pin 14.

The invention is not limited solely to that described in the specification and embodiments, and additional advantages and modifications will readily occur to those skilled in the art, so that the invention is not limited to the specific details, representative apparatus, and examples shown and described herein, without departing from the spirit and scope of the general concept as defined by the appended claims and their equivalents.