阅读说明：本技术 光通信部件用树脂组合物和使用其的光通信部件 (Resin composition for optical communication member and optical communication member using same ) 是由 音光贵仁 于 2020-07-31 设计创作，主要内容包括：一种光通信部件用树脂组合物,含有基础树脂和二氧化硅,上述基础树脂包含聚醚醚酮树脂作为主要成分,光通信部件用树脂组合物中的二氧化硅的含有率为55～75质量％。(A resin composition for an optical communication member, comprising a base resin and silica, wherein the base resin contains a polyether ether ketone resin as a main component, and the content of silica in the resin composition for an optical communication member is 55 to 75% by mass.)

1. A resin composition for optical communication parts, comprising:

a base resin containing a polyether ether ketone resin as a main component, and

silicon dioxide;

the content of the silica in the resin composition for an optical communication member is 55 to 75% by mass.

2. The resin composition for optical communication members according to claim 1, wherein the base resin further comprises at least one resin selected from the group consisting of polyarylene sulfide resins, polyether sulfone resins, polyether imide resins, and liquid crystalline resins having a melting point of 300 ℃ or higher.

3. The resin composition for optical communication members according to claim 2, wherein the base resin further comprises the polyarylene sulfide resin.

4. The resin composition for optical communication parts according to claim 3, wherein the polyarylene sulfide resin is a polyphenylene sulfide resin.

5. The resin composition for optical communication parts according to claim 4, wherein a content of the polyphenylene sulfide resin in the base resin is 20% by mass or less.

6. The resin composition for optical communication members according to any one of claims 1 to 5, wherein the polyether ether ketone resin has a thickness of 100cm³Melt volume rate over 10 minutes, wherein the melt volume rate conditions: the resin temperature was 380 ℃ and the load 5kg was based on ISO 1133.

7. An optical communication part comprising the resin composition for an optical communication part according to any one of claims 1 to 6.

Technical Field

The present invention relates to a resin composition for an optical communication member and an optical communication member using the same.

Background

Optical communication parts such as ferrules and sleeves for optical connectors are generally made of a resin composition containing a resin and an inorganic filler. In addition, the optical communication part requires high dimensional accuracy. Therefore, it is required that the resin composition constituting the optical communication member can be easily molded and can impart excellent dimensional accuracy to the optical communication member. As a resin composition constituting such an optical communication member, a PPS resin composition comprising 20 to 35 wt% of a polyphenylene sulfide resin (PPS resin) and 80 to 65 wt% of a filler has been proposed (for example, see patent document 1 below).

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open No. 2000-273304

Disclosure of Invention

However, in recent years, the demand for reflow soldering in a state where an optical communication component such as a ferrule for an optical connector is mounted on a circuit board has become higher.

However, the resin composition for optical communication members described in patent document 1 can easily mold an optical communication member and can impart excellent dimensional accuracy to the optical communication member, but has the following problems.

That is, if reflow soldering is performed in a state where the optical communication member composed of the resin composition for an optical communication member described in patent document 1 is mounted on a circuit board, thermal deformation may occur.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a resin composition for an optical communication member, which can easily mold an optical communication member, can impart excellent dimensional accuracy to the optical communication member, and can sufficiently suppress thermal deformation of the optical communication member even when the optical communication member is heated at a reflow soldering temperature, and an optical communication member used in the resin composition.

The present inventors have studied the cause of the above-described problems. First, the reflow soldering temperature is generally about 260 ℃, whereas the melting point of the PPS resin is about 280 ℃. Therefore, the present inventors considered that the PPS resin should not melt even if the ferrule for an optical connector containing the PPS resin is heated at the reflow soldering temperature. However, as a result of a careful investigation, the present inventors have found that the PPS resin is partially melted in the crystal form at about 260 ℃. Therefore, the present inventors have found that when heating is performed at a reflow soldering temperature, the PPS resin of the ferrule for an optical connector melts partially to deform the ferrule. Therefore, the present inventors considered to use an epoxy resin or a polyimide resin having higher heat resistance than the PPS resin instead of the PPS resin. However, these resins have a long molding cycle and poor productivity, and also have high moisture absorption, and when used for a long period of time, the ferrule for an optical connector may swell due to moisture absorption. Therefore, the present inventors have conducted further intensive studies and, as a result, it has been found that it is effective to use a polyether ether ketone resin (PEEK resin) having low hygroscopicity and hardly melting in the vicinity of the reflow soldering temperature, instead of the PPS resin. However, merely changing the PPS resin to the PEEK resin may not impart excellent dimensional accuracy to the ferrule. Accordingly, the present inventors have further repeated intensive studies and, as a result, have found that the above problems can be solved by the following inventions.

The present invention is a resin composition for an optical communication part, comprising a base resin and silica, wherein the base resin comprises a PEEK resin as a main component, and the content of the silica in the resin composition for an optical communication part is 55 to 75 mass%.

The resin composition for an optical communication member of the present invention can easily mold an optical communication member, can impart excellent dimensional accuracy to the optical communication member, and can sufficiently suppress thermal deformation of the optical communication member even when the optical communication member is heated at a reflow soldering temperature.

In the resin composition for an optical communication member, the base resin preferably further contains at least 1 resin selected from the group consisting of a polyarylene sulfide (PAS) resin, a polyether sulfone (PES), a polyether imide (PEI) resin, and a liquid crystalline resin (LCP) having a melting point of 300 ℃.

In this case, since the resin has a melt viscosity generally lower than that of a PEEK resin at the time of molding, the fluidity of the resin composition for an optical communication part can be further improved as compared with a case where the base resin does not contain the resin, and the optical communication part can be molded more easily. Further, the resin has a melting point lower than that of the PEEK resin, but has high crystallinity, and therefore generally has a high melting point, a low linear expansion coefficient, and low moisture absorption, and therefore, excellent dimensional accuracy is imparted to the optical communication component, and thermal deformation of the optical communication component can be suppressed more sufficiently than in the case where another resin other than the above-mentioned resin is used in the case where the optical communication component is heated at a reflow soldering temperature.

In the resin composition for an optical communication member, the base resin preferably further contains the PAS resin.

In the resin composition for an optical communication member, the PAS resin is preferably a PPS resin.

In the resin composition for an optical communication member, the PPS resin content in the base resin is preferably 20 mass% or less.

In this case, even if the optical communication member is heated at the reflow soldering temperature, thermal deformation of the optical communication member can be suppressed more sufficiently than in the case where the content of the PPS resin in the base resin exceeds 20 mass%.

In the resin composition for optical communication parts, the PEEK resin preferably has a thickness of 100cm³Melt volume rate over 10 minutes (melt volume rate conditions: resin temperature 380 ℃ C., load 5kg weight, according to ISO 1133).

In this case, the Melt Volume Rate (MVR) with the PEEK resin is less than 100cm³The molding of the optical communication part can be performed more easily than in the case of 10 minutes.

The present invention is also an optical communication part comprising the resin composition for an optical communication part.

The optical communication member of the present invention comprises the resin composition for an optical communication member, and the resin composition for an optical communication member can easily mold an optical communication member, can impart excellent dimensional accuracy to the optical communication member, and can sufficiently suppress thermal deformation of the optical communication member even when the optical communication member is heated at a reflow soldering temperature. Therefore, the optical communication part of the present invention has excellent appearance and dimensional accuracy, and can sufficiently suppress thermal deformation even if heating is performed at a reflow soldering temperature.

According to the present invention, there are provided a resin composition for an optical communication member, which can easily mold an optical communication member, can impart excellent dimensional accuracy to the optical communication member, and can sufficiently suppress thermal deformation of the optical communication member even when the optical communication member is heated at a reflow soldering temperature, and an optical communication member using the same.

Drawings

Fig. 1 is an end view showing an MT ferrule as an optical communication member fabricated in the example.

Fig. 2 is a plan view schematically showing a connected body obtained by connecting two MT ferrules with eight-core optical fibers in the embodiment.

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail.

< resin composition for optical communication parts >

The resin composition for optical communication parts of the present invention contains a base resin and silica, and the base resin contains a PEEK resin as a main component. The content of silica in the resin composition for optical communication parts is 55-75% by mass.

According to the resin composition for an optical communication member of the present invention, an optical communication member can be easily molded, excellent dimensional accuracy can be imparted to the optical communication member, and thermal deformation of the optical communication member can be sufficiently suppressed even when the optical communication member is heated at a reflow soldering temperature.

The resin composition will be described in detail below.

(base resin)

The base resin contains a PEEK resin as a main component. The main component herein means a component having a content of 50% by mass or more in the base resin.

The PEEK resin has a repeating unit represented by the following structural formula (1).

In the above structural formula (1), R¹、R²、R³All are substituent groups, and p, q and r are integers of 0-4 respectively. As takingExamples of the substituent include a halogen group, an alkyl group, an alkenyl group, and an aryl group. p, q, and r are each preferably 0.

The PEEK resin has n repeating units described above. n is a positive integer representing the average degree of polymerization.

MVR of PEEK resin is not particularly limited, but is preferably 100cm³More than 10 minutes. In this case, the MVR of the resin composition for an optical communication part is less than 100cm³The molding of the optical communication part can be performed more easily than in the case of 10 minutes.

The MVR of the PEEK resin is more preferably 150cm³A time of 10 minutes or more, particularly preferably 200cm³More than 10 minutes.

Wherein the MVR of the PEEK resin is preferably 500cm³Less than 10 minutes. In this case, the MVR with the PEEK resin exceeds 500cm³The melting point of the PEEK resin becomes higher than that in the case of 10 minutes, and thermal deformation of the optical communication part can be more sufficiently suppressed in the case of heating the optical communication part at the reflow soldering temperature. In addition, the strength of the optical communication part is further improved.

The base resin may be composed of only the PEEK resin, or may be composed of a mixed resin of the PEEK resin and another resin.

The other resin is preferably a PAS resin, a PES resin, a PEI resin, an LCP having a melting point of 300 ℃ or higher, or a combination of 2 or more of these.

In this case, since the other resin has a melt viscosity generally lower than that of a PEEK resin at the time of molding, the fluidity of the resin composition for an optical communication part can be further improved and the optical communication part can be molded more easily as compared with a case where the base resin does not further contain the other resin. The other resin has a melting point lower than that of the PEEK resin, but has high crystallinity, and therefore generally has a high melting point, a low linear expansion coefficient, and low moisture absorption, and therefore, excellent dimensional accuracy is imparted to the optical communication component, and thermal deformation of the optical communication component can be suppressed more sufficiently than in the case where a resin other than the other resin is used in the case where the optical communication component is heated at a reflow soldering temperature.

Among these, PAS resin is preferable as the other resin. The PAS resin is a polymer containing 80 mol% or more of a repeating unit represented by the formula [ -Ar-S- ] (wherein Ar is an arylene group, and S is sulfur). Among the PAS resins, a PPS resin having a repeating unit represented by the formula [ -Ph-S- ] (wherein Ph is p-phenylene and S is sulfur) is preferable.

Further, the PPS resin preferably contains 80 mol% or more of the above repeating unit, and more preferably 90 mol% or more. In this case, the crystallinity and melting point of the PPS resin become higher than those in the case where the repeating unit of the PPS resin is less than 80 mol%, and the deterioration of the heat resistance at the time of reflow soldering is more sufficiently suppressed even in the case where the PPS resin is blended with the PEEK resin.

The content of the PPS resin in the base resin is preferably 20 mass% or less. In this case, compared to the case where the content of the PPS resin in the base resin exceeds 20 mass%, the thermal deformation of the optical communication member can be suppressed more sufficiently than the case where a resin other than the PPS resin is used in the case where the optical communication member is heated at the reflow soldering temperature.

The content of the PPS resin in the base resin is more preferably 10 mass% or less. As compared with the case where the content of the PPS resin in the base resin exceeds 10 mass%, the PPS resin is less likely to be partially melted by a high temperature at the time of reflow soldering, and thermal deformation of the optical communication part as a molded article can be more sufficiently suppressed.

Among these, the content of the PPS resin in the base resin is more preferably 2 mass% or more. In this case, the fluidity of the resin composition for optical communication parts can be further improved, and therefore, the resin composition for optical communication parts can be easily molded. However, when the MVR of the PEEK resin is sufficiently high, the PPS resin does not necessarily need to be blended. That is, when the MVR of the PEEK resin is sufficiently high, the content of the PPS resin in the base resin may be 0 mass%.

The content of the base resin in the resin composition for an optical communication member is preferably 25 to 45% by mass.

In this case, the fluidity of the resin composition for an optical communication member becomes higher than that in the case where the content of the base resin in the resin composition for an optical communication member is less than 25% by mass, and the optical communication member can be molded more easily. In addition, it is possible to impart more excellent dimensional accuracy to the optical communication member than in the case where the content of the base resin in the resin composition for an optical communication member exceeds 45 mass%.

The content of the base resin in the resin composition for optical communication members is more preferably 27% by mass or more, and particularly preferably 29% by mass or more.

Among these, the content of the base resin in the resin composition for optical communication members is more preferably 42% by mass or less, and particularly preferably 40% by mass or less.

(silica)

Examples of the silica used in the present invention include amorphous silica (fused silica), crystalline silica (quartz, cristobalite, and the like), and the like.

The silica may be either amorphous silica or crystalline silica, but amorphous silica is preferable as the silica used in the present invention. In this case, since amorphous silica has a lower hardness than crystalline silica, damage to equipment used for molding of the resin composition for optical communication parts can be more sufficiently suppressed.

The silica may be spherical or may be pulverized amorphous, and is preferably spherical. In this case, the fluidity of the material when blended with the base resin is higher than in the case of using pulverized amorphous silica instead of spherical silica, and the dimensional accuracy of the molded article is further improved.

When the silica is spherical in shape, the silica is particularly preferably produced by a melting method.

The sphericity of the silica is usually expressed as circularity, and the circularity is preferably 0.80 or more. In this case, an optical communication part having a lower anisotropy of linear expansion coefficient can be formed. The circularity is more preferably 0.85 or more, and particularly preferably 0.90 or more. Here, the circularity of silica is defined by the following equation (2) by taking a projection image of each silica particle and by the circumference of the projection image and the circumference of an equivalent circle.

(circularity) · (perimeter of equivalent circle)/(perimeter of particle projection image) · (2)

Specifically, the circularity was measured using a mobile particle image analyzer FPIA-1000 manufactured by Sysmex Corporation, and the average of the measured values was determined as the circularity. Generally, the number of particles sampled is about 200.

In the above formula (2), "equivalent circle" represents a virtual circle having the same area as the projected image of the silica particle to be measured, and if the particle is completely spherical, the projected image is also completely circular, and the circularity is 1. When the circumference and the area of one particle projection image are L and S, the circularity can be calculated by the following equation.

Circularity 4 pi S/L²

The average particle diameter of the silica is not particularly limited, but is preferably 1 μm or more. In this case, the resin composition for optical communication parts has higher fluidity and more excellent moldability than the case where the average particle diameter of silica is less than 1 μm, and therefore, the dimensional accuracy of a molded article obtained by molding the resin composition for optical communication parts is further improved.

Among them, the average particle diameter of silica is preferably 30 μm or less. In this case, the mechanical strength and dimensional accuracy of the resin composition for optical communication parts can be improved as compared with the case where the average particle diameter of silica exceeds 30 μm.

The average particle diameter is a value measured by a laser diffraction scattering particle size distribution measuring apparatus.

The content of silica in the resin composition for optical communication parts is 55-75% by mass. In this case, it is possible to impart more excellent dimensional accuracy to the optical communication member than in the case where the content of silica in the resin composition for an optical communication member is less than 55 mass%. Further, the fluidity of the resin composition for optical communication members is higher than that in the case where the content of silica in the resin composition for optical communication members exceeds 75 mass%, and the optical communication members can be molded more easily.

The content of silica in the resin composition for optical communication members is preferably 73 mass% or less, and particularly preferably 71 mass% or less.

Among these, the content of silica in the resin composition for optical communication members is more preferably 58 mass% or more, and particularly preferably 60 mass% or more.

(other Components)

The resin composition for an optical communication member of the present invention may contain other components as necessary in addition to the base resin and silica as long as the object of the present invention is not impaired. Examples of the other components include antioxidants, weather-resistant agents, lubricants, plasticizers, antistatic agents, colorants, and inorganic fillers other than silica.

Examples of the inorganic filler other than silica include inorganic whiskers typified by potassium titanate, and nanofillers typified by nano silica and carbon nanofibers (hereinafter, referred to as CNF). These materials are slightly reinforced, and functions such as electrical conductivity, surface smoothness, smoothness and the like can be imparted to the resin composition for optical communication members.

The resin composition for an optical communication member can be obtained by powder-mixing a base resin and silica or the like and then melt-kneading them. The kneading may be carried out using a kneader such as a single-screw extruder or a twin-screw kneader.

< optical communication part >

Next, an optical communication unit according to the present invention will be described.

The optical communication member of the present invention contains the resin composition in the optical communication member.

The resin composition for optical communication members can easily form optical communication members, can impart excellent dimensional accuracy to the optical communication members, and can sufficiently suppress thermal deformation of the optical communication members even when the optical communication members are heated at a reflow soldering temperature. Therefore, the optical communication part of the present invention has excellent appearance and dimensional accuracy, and can sufficiently suppress thermal deformation even if heating is performed at a reflow soldering temperature.

Examples of the optical communication member include a ferrule for an optical connector, and a sleeve housing the ferrule. Among them, the present invention is particularly effective for ferrules for optical connectors which require extremely high dimensional accuracy, are mounted on circuit boards, and are sometimes reflow-soldered.

The optical connector of the ferrule for an optical connector may be a single-core optical connector or a multi-core optical connector. The ferrule includes MT ferrules, SC ferrules, LC ferrules, and the like.

The optical communication component may be molded by, for example, injection molding or transfer molding.

The present invention will be described more specifically with reference to the following examples, but the present invention is not limited to the following examples.

(example 1)

The base resin and silica were mixed using a henschel mixer at a ratio of 30: 70 (mass ratio), and then melt-kneading the mixture at a resin temperature of 380 to 410 ℃ using a biaxial kneading extruder (product name "TEM 37 SS", manufactured by Toshiba mechanical Co., Ltd.) to obtain pellets of the resin composition. At this time, specifically, the following substances are used as the base resin and silica.

(1) Base resin

As the base resin, the following PEEK resin and the following PPS resin were used in a ratio of 95: 5 (mass ratio).

(PEEK resin)

The PEEK resin used was "1000P" trade name manufactured by Daicel-Evonik Ltd. The resin has p, q and r of the structural formula (1) as 0, and MVR of 150cm determined at 380 deg.C under a load of 5kg based on ISO1133³10 minutes.

(PPS resin)

The PPS resin was designated as "# 140" by Tosoh corporation.

(2) Silicon dioxide

As the silica, spherical amorphous silica having a surface treated (trade name "TSS-6 vinylsilane treated", manufactured by Torson, Ltd., circularity: 0.93 and average particle diameter: 5 μm) was used.

Next, the pellets obtained as described above were put into an electric injection molding machine having a mold clamping force of 10 tons, and were injection molded by a ferrule molding die under molding conditions of a resin temperature of 400 to 420 ℃, a die set temperature of 200 ℃, and a holding pressure of 100MPa, so that an MT ferrule for eight cores shown in fig. 1 was produced such that the outer dimensions (length × width) of the end face, the spacing S between two guide holes, and the spacing p (horizontal pitch) between adjacent fiber holes became the design values described below. In fig. 1, reference numeral 1 denotes an MT ferrule, reference numeral 1a denotes an end face of the MT ferrule, reference numeral 2 denotes a guide hole, and reference numeral 3 denotes a fiber hole.

(design value)

External dimensions of end faces: 2.5mm (H) x 6.4mm (W)

Spacing S of two vias: 4.6mm

Lateral pitch p of fiber holes: 0.25mm

(example 2)

In obtaining the pellets of the resin composition, the base resin and silica were mixed in a ratio of 40: an MT ferrule was produced in the same manner as in example 1 except that the mixing ratio was 60 (mass ratio) and the molding conditions of the pellets were set to a resin temperature of 420 ℃, a mold set temperature of 200 ℃ and a holding pressure of 100 MPa.

[ Property evaluation ]

For the MT ferrules of examples 1 and 2 obtained as described above, dimensional accuracy, moldability, and thermal deformation suppression were evaluated as follows.

(moldability)

With respect to the MT ferrules of examples 1 and 2 obtained as described above, moldability was evaluated by the number of times required to produce ferrules without "depressions" or "voids". The presence or absence of "dishing" was determined from the external appearance of the MT ferrule, and the "presence or absence of voids" was examined by X-ray examination.

(dimensional accuracy)

The MT ferrules of examples 1 and 2 obtained as described above were evaluated by examining differences between the outer dimensions (height H × width W) of the end faces shown in fig. 1, the spacing S between two guide holes, and the spacing p (horizontal pitch) between adjacent fiber holes, and the above-mentioned design values.

(Heat distortion inhibition)

In order to evaluate the heat distortion suppression property, first, a connecting body (see fig. 2) was prepared by connecting the MT ferrules of examples 1 and 2 obtained as described above to another MT ferrule that is the same. In this connection, the insertion loss before and after heating at the reflow soldering temperature (260 ℃) was measured for the second and sixth optical fibers among the eight-core optical fibers, and the absolute value of the difference between the insertion losses before and after heating was determined. Then, the thermal deformation suppression property was evaluated based on the average value of the difference between the absolute values of the second and sixth optical fibers. Namely, the evaluation was: if the average value of the absolute values of the differences in insertion loss before and after heating at the reflow soldering temperature (260 ℃) is small, the thermal deformation suppression property is large, and if it is large, the thermal deformation suppression property is small. In fig. 2, reference numeral 10 denotes a connection body of two MT ferrules with eight-core optical fibers, and reference numeral 4 denotes a multi-core optical fiber ribbon.

At this time, a connection body of two MT ferrules with eight-core fibers was prepared as follows. That is, as shown in fig. 2, first, two MT ferrules 1 are prepared for each of examples 1 and 2, and an eight-core optical fiber ribbon 4 including 8 single-mode fibers is fixed to each MT ferrule 1, and two fitting pins are fitted into guide holes 2 to butt end faces of the two MT ferrules 1 with optical fibers against each other. Thus, two MT ferrule connected bodies 10 were prepared.

The difference between the insertion loss before and after heating at the reflow soldering temperature (260 ℃) measured for each of the eight-core optical fibers was calculated specifically as follows.

(1) First, the insertion loss before heating at the reflow soldering temperature (260 ℃) was measured as follows.

That is, in the connected body 10 of two MT ferrules with eight-core optical fibers, a reflection attenuation measuring instrument (product name "MBR 5", manufactured by JGR corporation, light source wavelength: 1310nm) was connected to eight optical fibers of one MT ferrule 1 to measure the insertion loss (dB). In this case, the measurement was performed twice, and the average value of the two measurements was used as the measurement value. The insertion loss before heating (first time) B1 at the reflow soldering temperature, the insertion loss before heating (second time) B2 at the reflow soldering temperature, and the average value B of these results are shown in tables 1 and 2. Table 1 shows the results of example 1, and table 2 shows the results of example 2. The values of B1 and B2 are relative values when the insertion loss of the optical fiber having the smallest insertion loss of the second and sixth optical fibers is set to 0 dB.

(2) Next, the insertion loss after heating at the reflow soldering temperature (260 ℃ C.) was measured as follows.

That is, after heating at a reflow soldering temperature (260 ℃) for 5 minutes in a state where two MT ferrules 1 are removed from the reflection attenuation amount measuring instrument, the insertion measuring instrument is connected to the optical fiber fixed to one MT ferrule 1 again to measure the insertion loss (dB) again. In this case, the measurement was performed twice, and the average value of the two measurements was used as the measurement value. The insertion loss after heating at the reflow soldering temperature (first time) a1, the insertion loss after heating at the reflow soldering temperature (second time) a2, and the results of the average value a thereof, which were thus measured, are shown in tables 1 and 2. The values a1 and a2 are relative values when the insertion loss of the optical fiber having the smallest insertion loss among the insertion losses before heating at the reflow soldering temperature of the second and sixth optical fibers is 0 dB.

(3) Finally, the absolute value of the difference between a and B calculated as described above is calculated. The results are shown in tables 1 and 2.

TABLE 1

TABLE 2

With regard to moldability, MT ferrules without "depressions" and "voids" can be molded in one shot in both examples 1 and 2. Therefore, it is understood that the resin compositions of examples 1 and 2 can be easily molded.

The dimensional accuracy shows that the outer dimensions (height H × width W) of the end face, the spacing S between two guide holes, and the spacing S (horizontal pitch) between adjacent fiber holes are extremely small in difference from the above-mentioned design values, as follows.

External dimensions of end faces: 2.45mm (H) x 6.38mm (W)

Spacing S of two vias: 4.6006mm

Lateral pitch p of fiber holes: 0.25mm +/-0.001 mm

As for the thermal deformation inhibition, the results shown in table 1 in example 1 indicate that the average value of the absolute values of the differences between a and B is 0.11dB, which is a small value. In particular, since the absolute value of the difference between B1 and B2, which is the insertion loss before heating at the reflow soldering temperature, is 0.15dB at most, it cannot be said that the insertion loss after heating at the reflow soldering temperature is increased more than that before heating, and it is found that the thermal deformation is sufficiently suppressed. In example 2, the results shown in table 2 indicate that the average of the absolute values of the differences between a and B is 0.08dB, which is a small value. The absolute value of the difference between B1 and B2, which is the insertion loss before heating at the reflow soldering temperature, is 0.09dB at maximum, and it cannot be said that the insertion loss after heating at the reflow soldering temperature is increased as compared to before heating, and it is found that the thermal deformation is sufficiently suppressed.

As described above, it was confirmed that the resin composition for optical communication members according to the present invention can easily mold an optical communication member, can impart excellent dimensional accuracy to the optical communication member, and can sufficiently suppress thermal deformation of the optical communication member even when the optical communication member is heated at a reflow soldering temperature.