阅读说明：本技术 一种片式元器件成型装置 (Chip component forming device ) 是由 吕东洋 于 2021-10-13 设计创作，主要内容包括：本发明公开了一种片式元器件成型装置,包括元器件放置平台、第一折弯装置、第二折弯装置、电箱组件、气压表装置；所述元器件放置平台安装在工作台中间；所述第一折弯装置安装在所述元器件放置平台后侧；所述第二折弯装置安装在所述第一折弯装置前侧；所述电箱组件安装在工作台下方；所述气压表装置安装在工作台后侧下方；所述第二折弯装置设有第二折弯支撑板、第一升降组件、第二升降组件；所述第二折弯支撑板安装在工作台后侧；所述第一升降组件安装在所述第二折弯支撑板左侧；所述第二升降组件安装在所述第二折弯支撑板右侧；本发明节省人力,操作简单,提高工作效率,具有良好的市场应用价值。(The invention discloses a chip component forming device which comprises a component placing platform, a first bending device, a second bending device, an electric box assembly and a barometer device, wherein the first bending device is arranged on the component placing platform; the component placing platform is arranged in the middle of the workbench; the first bending device is arranged on the rear side of the component placing platform; the second bending device is arranged on the front side of the first bending device; the electric box assembly is arranged below the workbench; the barometer device is arranged below the rear side of the workbench; the second bending device is provided with a second bending supporting plate, a first lifting assembly and a second lifting assembly; the second bending support plate is arranged on the rear side of the workbench; the first lifting assembly is arranged on the left side of the second bending supporting plate; the second lifting assembly is arranged on the right side of the second bending supporting plate; the invention saves manpower, has simple operation, improves the working efficiency and has good market application value.)

1. A chip component forming device is characterized by comprising a component placing platform, a first bending device, a second bending device, an electric box assembly and a barometer device; the component placing platform is arranged in the middle of the workbench; the first bending device is arranged on the rear side of the component placing platform; the second bending device is arranged on the front side of the first bending device; the electric box assembly is arranged below the workbench; the barometer device is arranged below the rear side of the workbench; the second bending device is provided with a second bending supporting plate, a first lifting assembly and a second lifting assembly; the second bending support plate is arranged on the rear side of the workbench; the first lifting assembly is arranged on the left side of the second bending supporting plate; and the second lifting assembly is arranged on the right side of the second bending supporting plate.

2. The device for forming a chip component according to claim 1, wherein the component placement platform is provided with a placement plate telescopic support, a component placement plate, a chip component, a support spring, a first chip component fixing clip, a second chip component fixing clip, a support mounting hole and a slide way; the bracket mounting holes are respectively arranged at four corners of the component placing plate; the placing plate telescopic supports are respectively installed in the support installation holes and are vertically connected with the support installation holes; the support springs are respectively installed around the four placing plate telescopic supports; the first chip component fixing clamp is arranged on the left side of the chip component; the second chip component fixing plate is arranged on the right side of the chip component; the slide way is arranged below the front end of the chip component fixing clamp.

3. The device for forming a chip component as claimed in claim 1, wherein the first bending device is provided with a first slide rail, a chip component positioner, a chip component baffle, a first bending wheel assembly, and a second bending wheel assembly; the first sliding rail is arranged below the first bending device; the chip component baffle is arranged at the front end of the first sliding rail; the chip component positioner is arranged in the chip component baffle groove; the first bending wheel assembly is provided with a first roller fixing block, a first roller mounting plate, a first air cylinder fixing plate and a first lifting block; the first air cylinder is arranged on the left side of the first sliding rail; the first cylinder fixing plate is arranged above the first cylinder; the first lifting block is arranged on the right side of the first cylinder fixing plate; the first roller mounting plate is arranged on the right side of the first lifting block; the first roller fixing block is arranged on the right side of the first roller mounting plate; the first roller is arranged on the right side of the first roller fixing block; and the second bending wheel assembly is arranged on the right side of the first sliding rail and has the same structure as the first bending wheel assembly.

4. The device for forming a chip component as claimed in claim 1, wherein the second bending device is provided with a second bending support plate, a second slide rail, a first lifting assembly and a second lifting assembly; the second bending support plate is arranged on the rear side of the upper surface of the workbench; the second sliding rail is arranged in front of the second bending supporting plate; the first lifting assembly is arranged on the left side in front of the second bent supporting plate; the second lifting assembly is arranged on the front right side of the second bending supporting plate.

5. The device for forming a chip component as claimed in claim 4, wherein the first lifting assembly is provided with a first sliding table cylinder, a second cylinder mounting plate, a second cylinder and a second roller device; the first sliding table cylinder is arranged on the left side of the second bending supporting plate; the second cylinder mounting plate is arranged on the right side of the first sliding table cylinder; the second cylinder is arranged below the front end of the second cylinder mounting plate; the second roller device is arranged on the right side of the second cylinder mounting plate; the second lifting assembly is arranged on the front right side of the second bending supporting plate, and the first lifting assembly and the second lifting assembly are identical in structure.

6. The device for forming a chip component as claimed in claim 4, wherein the second roller device comprises a roller, a roller shaft, a roller supporting arm, a supporting arm fixing frame, a supporting arm fixing bolt, and a fixing frame mounting plate; the fixed frame mounting plate is arranged on a clamping groove at the front end of the first lifting block; the supporting arm fixing frame is arranged on the right side of the fixing frame mounting plate; the roller supporting arm is arranged in the supporting arm fixing frame; the supporting arm fixing bolt is arranged on the left side of the supporting arm fixing frame; the roller shaft is arranged below the right side of the roller supporting arm; the roller is arranged at the top end of the front side of the roller shaft.

7. The device for forming a chip component as claimed in claim 5, wherein the electronic box assembly is provided with a leakage protection device, a power supply device, a storage battery device, a solenoid valve supporting block; the leakage protection device is arranged on the left side of the placing table; the power supply device is arranged on the right side of the leakage protection device; the storage battery device is arranged on the right side of the power supply device; the electromagnetic valve supporting block is arranged on the right side of the placing table; the solenoid valve device is installed on the solenoid valve supporting block.

Technical Field

The invention relates to the field of electronic components, in particular to a chip component forming device.

Background

With the development of science and technology, electronic products are changing day by day, and products such as novel refrigerators are all integrated into daily life of people. The above products can not be separated from the components. In particular, chip capacitors, resistors, inductors and other components are needed to be used in all electronic products. With the continuous expansion of the technical field, a plurality of components have further requirements on shapes, appearances and the like, and the production process of the traditional chip components cannot well meet the development of the times. The production process of the chip component comprises vacuum packaging, pre-cutting of an air bag, secondary fine sealing, fine trimming, bending, dispensing, edge ironing and the like, wherein in the bending process, 90-degree bending needs to be performed on skirt edges on two sides of the chip component, and then the bent chip component is subjected to hot press forming. In the prior art, the bending process usually adopts rollers to sequentially bend the single sides of the chip components, but the processing mode needs to move and repeatedly position the chip components in the bending process, so that the positioning error in the processing process is increased, and the bending precision is reduced.

The prior art has defects and needs to be improved.

Disclosure of Invention

In order to overcome the defects in the prior art, the invention provides a chip component forming device.

The invention provides a technical scheme, and discloses a chip component forming device, which comprises a component placing platform 1, a first bending device 2, a second bending device 3, an electric box assembly 4 and a barometer device 5; the component placing platform 1 is arranged in the middle of the workbench; the first bending device 2 is arranged on the rear side of the component placing platform 1; the second bending device 3 is arranged at the front side of the first bending device 2; the electric box assembly 4 is arranged below the workbench; the barometer device 5 is arranged below the rear side of the workbench; the second bending device 3 is provided with a second bending support plate 301, a first lifting assembly 303 and a second lifting assembly 304; the second bending support plate 301 is arranged at the rear side of the workbench; the first lifting assembly 303 is installed at the left side of the second bending supporting plate 301; the second lifting assembly is installed at the right side of the second bent supporting plate 301.

Preferably, the component placement platform 1 is provided with a placement plate telescopic bracket 101, a component placement plate 102, a chip component 103, a bracket spring 104, a first chip component fixing clip 105, a second chip component fixing clip 106, a bracket mounting hole 107 and a slide 108; the holder mounting holes 107 are provided at four corners of the component placement board 102, respectively; the placing plate telescopic supports 101 are respectively installed in the support installation holes 107, and the placing plate telescopic supports 101 are vertically connected with the support installation holes 107; the bracket springs 104 are respectively installed around the four placing plate telescopic brackets 101; the first chip component fixing clip 105 is mounted on the left side of the chip component 103; the second chip component fixing plate 106 is installed on the right side of the chip component 103; the slide way 108 is arranged below the front end of the chip component fixing clamp;

the technical scheme is as follows: by installing the placing plate telescopic support 101, the support springs 104 are installed around the placing plate telescopic support 101, and in the process of bending the sheet element 103 by the first bending device 2 and the second bending device 3, the gravity generated by the placing plate telescopic support 101 is reduced, so that the sheet element 103 can be protected; after the bending operation of the chip component 103 is completed, the component placement board 102 is sprung up by the reaction force of the holder spring 104, and the next bending operation of the chip component 103 is continued.

Preferably, the first bending device 2 is provided with a first slide rail 201, a chip component positioner 202, a chip component baffle 203, a first bending wheel assembly 204, and a second bending wheel assembly 205; the first slide rail 201 is installed below the first bending device 2; the chip component baffle 203 is arranged at the front end of the first slide rail 201; the chip component positioner 202 is arranged in a groove of the chip component baffle 203; the first bending wheel assembly 204 is provided with a first roller fixing block 206, a first roller 207, a first roller mounting plate 208, a first air cylinder 209, a first air cylinder fixing plate 210 and a first lifting block 211; the first air cylinder 209 is arranged on the left side of the first slide rail 201; the first cylinder fixing plate 210 is installed above the first cylinder 209; the first lifting block 211 is installed at the right side of the first cylinder fixing plate 210; the first roller mounting plate 208 is mounted on the right side of the first lifting block 211; the first roller fixing block 206 is mounted on the right side of the first roller mounting plate 208; the first roller 207 is installed at the right side of the first roller fixing block 206; the second bending wheel assembly 205 is mounted on the right side of the first slide rail 201, and has the same structure as the first bending wheel assembly 204;

the technical scheme is as follows: the first bending wheel assembly 204 can be moved on the sliding rails by arranging the first sliding rails 201, the chip component baffle 203 is arranged at the front ends of the first sliding rails 201 to prevent the chip component 103 from shifting, the chip component positioner 202 is arranged in the groove of the first sliding rails 201, the chip component 103 is determined by the chip component positioner 202, the first bending wheel assembly 204 slides by controlling a power supply, and the chip component 103 is bent by the first rollers 207 in the first bending wheel assembly 204.

Preferably, the second bending device 3 is provided with a second bending support plate 301, a second slide rail 302, a first lifting assembly 303 and a second lifting assembly 304; the second bending support plate 301 is arranged on the rear side of the upper surface of the workbench; the second slide rail 302 is arranged in front of the second bent support plate 301; the first lifting assembly 303 is installed at the left front side of the second bending support plate 301; the second lifting assembly 304 is arranged at the front right side of the second bending support plate;

the technical scheme is as follows: by installing the second bending support plate 301, the first bending device 2 can move left and right through the second slide rail 302 in the second bending device 3, and the left and right sides of the chip component 103 are bent by arranging the first lifting assembly 303 and the second lifting assembly 304.

Preferably, the first lifting assembly 303 comprises a first sliding table cylinder 305, a second cylinder mounting plate 306, a second cylinder 307 and a second roller device 308; the first sliding table cylinder 305 is installed on the left side of the second bending support plate 301; the second cylinder mounting plate 306 is mounted on the right side of the first sliding table cylinder 305; the second cylinder 307 is installed below the front end of the second cylinder installation plate 306; the second roller device 308 is arranged at the right side of the second air cylinder mounting plate 306; the second lifting assembly 304 is installed at the front right side of the second bent supporting plate 301, and the first lifting assembly 303 has the same structure as the second lifting assembly 304;

the technical scheme is as follows: the first lifting assembly 303 is moved by providing a first slide cylinder 305, and the second roller device 308 is moved by installing a second cylinder 307.

Preferably, the second roller device 308 is provided with a roller 309, a roller shaft 310, a roller supporting arm 311, a supporting arm fixing frame 312, a supporting arm fixing bolt 313 and a fixing frame mounting plate 314; the fixed frame mounting plate 313 is mounted on a clamping groove at the front end of the first lifting block 211; the support arm fixing frame 312 is arranged at the right side of the fixing frame mounting plate 314; the roller supporting arm 311 is arranged in the supporting arm fixing frame 312; the support arm fixing bolt 313 is arranged on the left side of the support arm fixing frame 312; the roller shaft 310 is mounted below the right side of the roller support arm 311; the roller 309 is mounted on the front top end of the roller shaft 310.

The technical scheme is as follows: the roller shaft 310 is supported by a roller support arm 311, the roller 309 is mounted on the front side of the roller shaft 310, and the stability of the roller support arm 311 is controlled by a support arm mount 312.

The electrical box component 4 is provided with a power-off protection device 401, a power supply device 402, a storage battery device 403, an electromagnetic valve device 404 and an electromagnetic valve supporting block 405; the power-off protection device 401 is installed on the left side of the placing table; the power supply device 402 is arranged on the right side of the power-off protection device 401; the storage battery device 403 is installed at the right side of the power supply device 402; the electromagnetic valve supporting block 405 is installed on the right side of the placing table; the solenoid valve device 404 is mounted on the solenoid valve support block 405.

The technical scheme is as follows: through setting up power supply unit 402 and accumulator device 403, make whole device normal operating, power protection device 401 protects whole device under the outage condition, makes whole device electric current reinforcing, and the circular telegram performance is more steady through setting up solenoid valve device 404.

Compared with the prior art, the electronic box has the beneficial effects that the electronic box is provided with the component placing platform, the first bending device, the second bending device, the electronic box assembly and the barometer device; the component placing platform is used for placing and fixing the chip components, and the gravity generated in the bending process is reduced by installing the placing plate telescopic support, so that the chip components can be better protected; the component placing plate is bounced through the counterforce of the bracket spring, and the next bending operation is continuously carried out on the chip component; bending the chip component according to a set requirement through a first bending device and a second bending device; the current of the whole device is enhanced through a power supply device, and the operation is stable; the invention saves manpower, has simple operation, improves working efficiency and has good market application value.

Drawings

For a clearer explanation of the embodiments or technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a rear side schematic view of the overall structure of the present invention;

FIG. 3 is a schematic view of a component placement platform according to the present invention;

FIG. 4 is a schematic view of a first bending apparatus of the present invention;

FIG. 5 is a schematic view of a second bending apparatus according to the present invention;

FIG. 6 is a schematic view of a second roller device according to the present invention;

FIG. 7 is a schematic view of an electrical box assembly of the present invention;

the above legend shows: the device comprises a device placing platform 1, a first bending device 2, a second bending device 3, an electric box assembly 4, a barometer device 5, a placing plate telescopic support 101, a device placing plate 102, a chip device 103, a support spring 104, a first chip device fixing clamp 105, a second chip device fixing clamp 106, a support mounting hole 107, a slide 108, a first slide rail 201, a chip device positioner 202, a chip device baffle 203, a first bending wheel assembly 204, a second bending wheel assembly 205, a first roller fixing block 206, a first roller 207, a first roller mounting plate 208, a first air cylinder 209, a first air cylinder fixing plate 210, a first lifting block 211, a second bending support plate 301, a second slide rail 302, a first lifting assembly 303, a second lifting assembly 304, a first sliding table air cylinder, a second air cylinder mounting plate 306, a second air cylinder 307, a second roller device 308, a roller 309, a first lifting assembly 302, a second lifting assembly 303, a second lifting assembly 304, a first sliding table air cylinder, a second air cylinder mounting plate 305, a second air cylinder 307, a second air cylinder device 308, a roller 309, The device comprises a roller shaft 310, a roller supporting arm 311, a supporting arm fixing frame 312, a supporting arm fixing bolt 313, a fixing frame mounting plate 314, a power-off protection device 401, a power supply device 402, a storage battery device 403, a solenoid valve device 404 and a solenoid valve supporting block 405.

Detailed Description

In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for descriptive purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The present invention will be described in detail with reference to the accompanying drawings.

The first embodiment is as follows: as shown in fig. 1, in order to solve the problem of bending a lithium battery chip component, a chip component forming device is proposed, which is provided with a component placing platform 1, a first bending device 2, a second bending device 3, an electronic box assembly 4 and a barometer device 5; the component placing platform 1 is arranged in the middle of the workbench; the first bending device 2 is arranged on the rear side of the component placing platform 1; the second bending device 3 is arranged at the front side of the first bending device 2; the electric box assembly 4 is arranged below the workbench; the barometer device 5 is arranged below the rear side of the workbench; the second bending device 3 is provided with a second bending support plate 301, a first lifting assembly 303 and a second lifting assembly 304; the second bending support plate 301 is arranged at the rear side of the workbench; the first lifting assembly 303 is installed at the left side of the second bending supporting plate 301; the second lifting assembly is arranged at the right side of the second bending supporting plate 301;

the component placing platform is used for placing and fixing the chip components, and the gravity generated in the bending process is reduced by installing the placing plate telescopic support, so that the chip components can be better protected; the component placing plate is bounced through the counterforce of the bracket spring, and the next bending operation is continuously carried out on the chip component; bending the chip component according to a set requirement through a first bending device and a second bending device; the current of the whole device is enhanced through the power supply device, and the operation is stable.

The second embodiment is different from the first embodiment in that: as shown in fig. 3, in order to reduce the gravity on the lithium battery chip component caused in the bending process of the chip component, a component placement platform 1 is provided; by installing the placing plate telescopic support 101, the support springs 104 are installed around the placing plate telescopic support 101, and in the process of bending the sheet element 103 by the first bending device 2 and the second bending device 3, the gravity generated by the placing plate telescopic support 101 is reduced, so that the sheet element 103 can be protected; after the bending operation of the chip component 103 is completed, the component placement board 102 is sprung up by the reaction force of the holder spring 104, and the next bending operation of the chip component 103 is continued.

Further, in order to enable the product to be better bent and reduce damage to the product, a component placing platform 1 is arranged on the workbench, and the component placing platform 1 is provided with a placing plate telescopic support 101, a component placing plate 102, a chip component 103, a support spring 104, a first chip component fixing clamp 105, a second chip component fixing clamp 106, a support mounting hole 107 and a slide 108; the holder mounting holes 107 are provided at four corners of the component placement board 102, respectively; the placing plate telescopic supports 101 are respectively installed in the support installation holes 107, and the placing plate telescopic supports 101 are vertically connected with the support installation holes 107; the bracket springs 104 are respectively installed around the four placing plate telescopic brackets 101; the first chip component fixing clip 105 is mounted on the left side of the chip component 103; the second chip component fixing plate 106 is installed on the right side of the chip component 103; the slide way 108 is arranged below the front end of the chip component fixing clamp;

after a product is placed on the component placing plate, gravity generated in the bending process is reduced through the placing plate telescopic support 101, and the component placing plate 102 is bounced up through the reaction force of the support spring 104; for example: the product is placed on the component placing plate 102, the chip component 103 is bent through the first bending device 2 and the second bending device 3, at the moment, the component placing plate 102 moves downwards through the placing plate telescopic support 101, the influence of gravity on the chip component 103 is reduced, and then the component placing plate 102 is bounced upwards through the support spring 104.

The third embodiment is different from the first embodiment: as shown in fig. 7, in order to realize the smooth operation of the whole device and avoid damage to the product in case of power failure, an electrical box assembly 4 is provided; through setting up power supply unit 402 and accumulator device 403, make whole device normal operating, power protection device 401 protects whole device under the outage condition, makes whole device electric current reinforcing, and the circular telegram performance is more steady through setting up solenoid valve device 404.

Further, in order to enhance the current of the whole device and enable the device to run stably, a power supply assembly 4 is arranged below the workbench, and the power supply assembly 4 is provided with a power-off protection device 401, a power supply device 402, a storage battery device 403, an electromagnetic valve device 404 and an electromagnetic valve supporting block 405; the power-off protection device 401 is installed on the left side of the placing table; the power supply device 402 is arranged on the right side of the power-off protection device 401; the storage battery device 403 is installed at the right side of the power supply device 402; the electromagnetic valve supporting block 405 is installed on the right side of the placing table; the solenoid valve device 404 is mounted on the solenoid valve supporting block 405;

the whole device can normally run by controlling the power supply device and the storage battery device, the product is protected from being damaged by the power-off protection device under the power-off condition of the whole device, and the running current of the whole device can be enhanced by the electromagnetic valve device; for example: when the power is cut off suddenly, the power-off protection device is automatically started, so that parts at various parts cannot lose power and damage the product; the number of the opened electromagnetic valves is controlled, so that the current is increased or reduced according to the requirement, and the whole device can run more stably.

The working principle of the invention is as follows: by installing the placing plate telescopic support 101, the support springs 104 are installed around the placing plate telescopic support 101, and in the process of bending the sheet element 103 by the first bending device 2 and the second bending device 3, the gravity generated by the placing plate telescopic support 101 is reduced, so that the sheet element 103 can be protected; after the bending operation of the chip component 103 is completed, the component placing plate 102 is bounced up by the reaction force of the bracket spring 104, and the next bending operation of the chip component 103 is continued; the first bending wheel assembly 204 can move on the sliding rails by arranging the first sliding rails 201, the chip component baffle 203 is arranged at the front ends of the first sliding rails 201 to prevent the chip component 103 from shifting, the chip component positioner 202 is arranged in a groove of the first sliding rails 201, the chip component 103 is determined by the chip component positioner 202, the first bending wheel assembly 204 slides by controlling a power supply, and the chip component 103 is bent by the first rollers 207 in the first bending wheel assembly 204; by installing the second bending support plate 301, the first bending device 2 can move left and right through a second slide rail 302 in the second bending device 3, and the left and right sides of the chip component 103 are bent by arranging a first lifting assembly 303 and a second lifting assembly 304; the first lifting assembly 303 is moved by arranging a first sliding table air cylinder 305, and the second roller device 308 is moved by installing a second air cylinder 307; the roller shaft 310 is supported by the roller support arm 311, the roller 309 is installed at the front side of the roller shaft 310, and the stability of the roller support arm 311 is controlled by the support arm fixing frame 312; through setting up power supply unit 402 and accumulator device 403, make whole device normal operating, power protection device 401 protects whole device under the outage condition, makes whole device electric current reinforcing, and the circular telegram performance is more steady through setting up solenoid valve device 404.

The technical features mentioned above are combined with each other to form various embodiments which are not listed above, and all of them are regarded as the scope of the present invention described in the specification; also, modifications and variations may be suggested to those skilled in the art in light of the above teachings, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.