阅读说明：本技术 超声波驱动电路 (Ultrasonic drive circuit ) 是由 黄明益 刘育荣 于 2021-09-29 设计创作，主要内容包括：一种超声波驱动电路,包含超声波传感像素,超声波传感像素包含至少一超声波传感器、第一二极管以及第二二极管。至少一超声波传感器用以将高频输出信号转换为输出超声波,或将声波共振转换为高频输入信号。第一二极管的第一端电性耦接至少一超声波传感器,第一二极管的第二端用以接收直流信号。直流信号用以增强该高频输出信号或该高频输入信号。第二二极管的第一端电性耦接第一二极管的第二端,第二二极管的第二端电性耦接接收和发送电路。第二二极管用以传送高频输出信号或是高频输入信号。(An ultrasonic drive circuit comprises an ultrasonic sensing pixel, wherein the ultrasonic sensing pixel comprises at least one ultrasonic sensor, a first diode and a second diode. The ultrasonic sensor is used for converting a high-frequency output signal into an output ultrasonic wave or converting sound wave resonance into a high-frequency input signal. The first end of the first diode is electrically coupled with at least one ultrasonic sensor, and the second end of the first diode is used for receiving a direct current signal. The DC signal is used for enhancing the high-frequency output signal or the high-frequency input signal. The first end of the second diode is electrically coupled to the second end of the first diode, and the second end of the second diode is electrically coupled to the receiving and transmitting circuit. The second diode is used for transmitting a high-frequency output signal or a high-frequency input signal.)

1. An ultrasonic drive circuit comprising:

an ultrasonic sensing pixel, comprising:

at least one ultrasonic sensor for converting a high-frequency output signal into an output ultrasonic wave or converting a sound wave resonance into a high-frequency input signal; and

a first diode having a first end electrically coupled to the at least one ultrasonic sensor and a second end for receiving a dc signal, wherein the dc signal is used to enhance the high frequency output signal or the high frequency input signal.

2. The ultrasonic drive circuit according to claim 1, further comprising:

a second diode, a first end of which is electrically coupled to the second end of the first diode and the at least one ultrasonic sensor, and a second end of which is electrically coupled to a receiving and transmitting circuit.

3. The ultrasonic drive circuit of claim 2, wherein the receive and transmit circuit comprises:

a transceiving switch having a first end, a second end and a third end, wherein the first end of the transceiving switch is electrically coupled to the second end of the second diode;

a transmitting circuit electrically coupled to the second end of the transmit-receive switch for providing the high-frequency output signal to the at least one ultrasonic sensor; and

a receiving circuit, electrically coupled to the third terminal of the transmit-receive switch, for receiving the high-frequency input signal from the at least one ultrasonic sensor.

4. An ultrasonic drive circuit comprising:

a pixel array, comprising:

a plurality of ultrasonic sensing pixels, wherein each of the plurality of ultrasonic sensing pixels comprises an ultrasonic sensor, and the ultrasonic sensor is used for converting a high-frequency output signal into an output ultrasonic wave or converting an acoustic wave resonance into a high-frequency input signal;

a plurality of first conductive lines, wherein any one of the plurality of first conductive lines is electrically coupled to the ultrasonic sensing pixels located in the same row of the plurality of ultrasonic sensing pixels; and

a plurality of second wires, wherein any one of the plurality of second wires is electrically coupled to the ultrasonic sensing pixels in the same column; and

the first diodes are electrically coupled to the first wires respectively and used for transmitting a direct current signal, wherein the direct current signal is used for enhancing the high-frequency output signal or the high-frequency input signal.

5. The ultrasonic drive circuit according to claim 4, further comprising:

the second diodes are electrically coupled to the first wires and the first diodes respectively, and are used for transmitting the high-frequency output signal or the high-frequency input signal.

6. The ultrasonic drive circuit according to claim 4, further comprising:

a multiplexer electrically coupled to the second wires.

7. The ultrasonic drive circuit according to claim 4, further comprising:

and the grid driver is electrically coupled with the second leads and used for providing corresponding scanning signals to the corresponding ultrasonic sensing pixels.

8. An ultrasonic drive circuit comprising:

a pixel array, comprising:

a plurality of ultrasonic sensing pixels, wherein each of the plurality of ultrasonic sensing pixels includes:

an ultrasonic sensor for converting a high frequency output signal into an output ultrasonic wave or converting a sound wave resonance into a high frequency input signal; and

a first diode, the ultrasonic sensor, for transmitting a DC signal, wherein the DC signal is used for enhancing the high frequency output signal or the high frequency input signal.

9. The ultrasonic drive circuit according to claim 8, further comprising:

the pixel array further includes a plurality of first wires, wherein any one of the plurality of first wires is electrically coupled to the ultrasonic sensing pixels located in the same column of the plurality of ultrasonic sensing pixels, and the plurality of first wires are electrically coupled to the plurality of second diodes, respectively.

10. The ultrasonic drive circuit according to claim 8, further comprising:

a gate driver for providing corresponding scan signals to the corresponding ultrasonic sensing pixels, wherein the pixel array further comprises a plurality of second wires, any one of the plurality of second wires is electrically coupled to the ultrasonic sensing pixels in the same row of the plurality of ultrasonic sensing pixels, and the plurality of second wires is electrically coupled to the gate driver.

Technical Field

The present disclosure relates to an ultrasonic (ultrasonic) wave driving circuit, and more particularly, to an ultrasonic wave driving circuit for transmitting or receiving a high-frequency signal.

Background

In the prior art, the Ultrasonic driving circuit may be composed of a Capacitive Micro Ultrasonic Transducer (CMUT) or a Piezoelectric Micro Ultrasonic Transducer (PMUT). Among them, the capacitive mechanical ultrasonic sensor has advantages of high sensitivity, wide frequency band, high electromechanical conversion efficiency, low self noise, and easy manufacturing.

Disclosure of Invention

The present disclosure provides an ultrasonic drive circuit including ultrasonic sensing pixels. The ultrasonic sensing pixel comprises at least one ultrasonic sensor and a first diode. The ultrasonic sensor is used for converting a high-frequency output signal into an output ultrasonic wave or converting sound wave resonance into a high-frequency input signal. The first end of the first diode is electrically coupled with at least one ultrasonic sensor, the second end of the first diode is used for receiving a direct current signal, and the direct current signal is used for enhancing a high-frequency output signal or a high-frequency input signal.

The present disclosure provides another ultrasonic driving circuit, which includes a pixel array and a plurality of first diodes. Each of the ultrasonic sensing pixels includes an ultrasonic sensor, a plurality of first wires, and a plurality of second wires. The ultrasonic sensor is used for converting a high-frequency output signal into an output ultrasonic wave or converting sound wave resonance into a high-frequency input signal. Any one of the first wires is electrically coupled to the ultrasonic sensing pixels in the same row. Any one of the second wires is electrically coupled to the ultrasonic sensing pixels in the same column. The first diodes are electrically coupled to the first wires respectively for transmitting a DC signal, wherein the DC signal is used for enhancing the high-frequency output signal or the high-frequency input signal.

The present disclosure provides still another ultrasonic drive circuit including a pixel array. The pixel array comprises a plurality of ultrasonic sensing pixels and a first diode, wherein each of the plurality of ultrasonic sensing pixels comprises an ultrasonic sensor, and the ultrasonic sensor is used for converting a high-frequency output signal into an output ultrasonic wave or converting an acoustic wave resonance into a high-frequency input signal. The first diode is electrically coupled to the ultrasonic sensor and is used for transmitting a direct current signal, wherein the direct current signal is used for enhancing the high-frequency output signal or the high-frequency input signal.

In summary, the present disclosure provides an ultrasonic driving circuit that utilizes a first diode to transmit a dc signal.

Drawings

The foregoing and other objects, features, and advantages of the disclosure will be apparent from the following more particular description of the embodiments, as illustrated in the accompanying drawings in which:

fig. 1 is a schematic diagram of an ultrasonic driving circuit according to an embodiment of the disclosure.

Fig. 2 is a schematic diagram of a circuit architecture of an ultrasonic driving circuit according to an embodiment of the disclosure.

Fig. 3 is a schematic diagram of a circuit architecture of an ultrasonic driving circuit according to an embodiment of the disclosure.

Fig. 4 is a schematic diagram of a circuit architecture of an ultrasonic driving circuit according to an embodiment of the disclosure.

Fig. 5 is a schematic diagram of a circuit architecture of an ultrasonic driving circuit according to an embodiment of the disclosure.

Description of reference numerals:

in order to make the above and other objects, features, advantages and embodiments of the present disclosure more comprehensible, the following symbols are provided:

100,100a,100b,100c,100 d: ultrasonic drive circuit

110: ultrasonic sensor

120: transmit-receive change-over switch

130: control circuit

140: multiplexer

150: gate driver

PD 1: first diode

PD 2: second diode

TRC: receiving and transmitting circuit

TX: transmission circuit

RX: receiving circuit

P1 to P128: ultrasonic sensing pixel

V_RFout,V_RFout1～V_RFout128: high frequency output signal

V_RFin,V_RFin1～V_RFin128: high frequency input signal

V_DC,V_DC1～V_DC128: direct current signal

A1, a2, A3: pixel array

L1: first conductive line

L2: second conductive line

HVAMP: voltage amplifier

HVP: pulse generator

DAC: digital-to-analog converter

LNA: low noise amplifier

PGA: programmable gain amplifier

LPF: low-pass filter

ADC: analog-to-digital converter

GND: grounding terminal

Detailed Description

The following detailed description is provided by way of example and not for the purpose of limiting the scope of the present disclosure, and the description of the operation of the structures is not intended to limit the execution order thereof, and any structures formed by the rearrangement of elements or the like which produce an apparatus with equivalent technical effect shall fall within the scope of the present disclosure. In addition, the drawings are for illustrative purposes only and are not drawn to scale. For ease of understanding, the same or similar elements will be described with the same reference numerals in the following description.

The term (terms) used throughout the specification and claims has the ordinary meaning as commonly understood in each term used in the art, in the disclosure herein, and in the specific context, unless otherwise indicated.

Furthermore, as used herein, the terms "comprising," including, "" having, "" containing, "and the like are open-ended terms that mean" including, but not limited to. Further, as used herein, "and/or" includes any and all combinations of one or more of the associated listed items.

When an element is referred to as being "coupled" or "connected," it can be referred to as being "electrically coupled" or "electrically connected. "coupled" or "connected" may also be used to indicate that two or more elements are in mutual engagement or interaction. Moreover, although terms such as "first," "second," …, etc., may be used herein to describe various elements, these terms are used merely to distinguish one element or operation from another element or operation described in similar technical terms.

Generally, a Capacitive Mechanical Ultrasonic Transducer (CMUT) needs to operate under a dc signal, so the CMUT is electrically coupled to a resistor for receiving the dc signal and a capacitor for transmitting a high frequency ac signal. The direct current signal is used for enhancing the high-frequency alternating current signal of the ultrasonic sensor. The resistor is used for transmitting a direct current signal, and the capacitor is used for transmitting a high-frequency alternating current signal and blocking the direct current signal transmitted by the resistor. Therefore, the structure of the resistor and the capacitor can be understood as a T-type Bias device (Bias Tee).

However, in the case that the ultrasonic sensing pixels are smaller and have higher density (for example, one ultrasonic sensing circuit of the ultrasonic sensor may include 128 ultrasonic sensing pixels), the circuit area is greatly increased and the volume of the ultrasonic driving circuit is increased by installing a T-type bias device in each corresponding ultrasonic sensing pixel for transmitting a dc or ac signal. Therefore, the present disclosure provides an ultrasonic driving circuit, which can replace the aforementioned T-shaped bias device with a diode, thereby reducing the volume of the ultrasonic driving circuit.

Referring to fig. 1, fig. 1 is a schematic diagram of an ultrasonic driving circuit 100 according to an embodiment of the disclosure. The ultrasonic drive circuit 100 may be a capacitive mechanical ultrasonic drive circuit. The ultrasonic drive circuit 100 includes an ultrasonic sensing pixel P1, a first diode PD1, a second diode PD2, and a reception and transmission circuit TRC. The ultrasonic sensing pixel P1 contains at least one ultrasonic sensor 110 (fig. 1 shows only one ultrasonic sensor 110 as an example). The ultrasonic sensor 110 may be a capacitive mechanical ultrasonic sensor. The receiving and transmitting circuit TRC includes a transmission/reception changeover switch 120, a transmitting circuit TX, a receiving circuit RX, and a control circuit 130. The transmission circuit TX includes a Voltage Amplifier HVAMP (HVAMP), a pulse generator HVP (HVP), and a digital-to-analog Converter DAC (DAC). The receiving circuit RX includes a Low-noise Amplifier LNA (LNA), a Programmable Gain Amplifier PGA (PGA), a Low Pass filter LPF (LPF), and an Analog Digital Converter ADC (ADC).

Structurally, a first terminal (e.g., a cathode terminal) of the first diode PD1 is electrically coupled to the ultrasonic sensor 110, and a second terminal (e.g., an anode terminal) of the first diode PD1 is configured to receive the dc signal V_DCA first terminal (e.g., an anode terminal) of the first diode PD1 is used for receiving the dc signal V_DCThe first diode PD1 is used for converting the DC signal V_DCTo the ultrasonic sensor 110. A first terminal (e.g., a cathode terminal) of the second diode PD2 is electrically coupled to the ultrasonic sensor 110, a second terminal (e.g., an anode terminal) of the second diode PD2 is electrically coupled to the duplexer 120, and the second diode PD2 is used for transmitting the high-frequency input signal V_RFinOr high frequency output signal V_RFout. The duplexer 120 has a first terminal, a second terminal, and a third terminal. The first terminal of the duplexer 120 is electrically coupled to the anode terminal of the second diode PD2, the second terminal of the duplexer 120 is electrically coupled to the transmitting circuit TX, and the third terminal of the duplexer 120 is electrically coupled to the receiving circuit RX. The transmission circuit TX is used for generating a high-frequency output signal V_RFoutThe receiving circuit RX is used for receiving a high-frequency input signal V_RFin. The control circuit 130 is used for controlling the transmitting circuit TX and the receiving circuit RX.

In detail, in the case where the ultrasonic sensor 110 outputs the ultrasonic wave, the transmission circuit TX is electrically connected to the anode terminal of the second diode PD2 through the duplexer 120, and the transmission circuit TX outputs the high-frequency output signal V_RFoutThe high-frequency output signal V is transmitted to the ultrasonic sensor 110 through the transmission/reception changeover switch 120 and the second diode PD2, so that the ultrasonic sensor 110 outputs the high-frequency output signal V_RFout is converted into output ultrasonic waves.

In the case where the ultrasonic sensor 110 receives the ultrasonic resonance, the receiving circuit RX is electrically connected to the anode terminal of the second diode PD2 through the duplexer 120.And, in response to the ultrasonic sensor 110 transmitting the output ultrasonic wave, the ultrasonic sensor 110 receives the ultrasonic resonance generated by the output ultrasonic wave returning (reflecting) to the object, and converts the ultrasonic resonance into the high-frequency input signal V_RFinThen, the high frequency input signal V is inputted_RFinThe signal is transmitted to the receiving circuit RX through the second diode PD2 and the duplexer 120.

It is noted that the first diode PD1 and the second diode PD2 in the present disclosure are implemented by PIN diodes. The PIN diode is composed of an intrinsic (I-type) semiconductor having a high resistance value, and the inter-terminal capacitance is very low. Here, the inter-terminal capacity can be regarded as an amount of charge accumulated when a reverse bias is applied to the diode. Thus, a PIN diode behaves like a resistor in forward bias and a capacitor in reverse bias. Specifically, the PIN diode can be regarded as a resistor having a resistance value of 0.1 Ω to 10 Ω under forward bias. Under reverse bias, the capacitance of the PIN diode hardly changes with the magnitude of the bias voltage, and is maintained between about 0.1pF and 10 pF. That is, the PIN diode can deliver high frequency signals with very low loss (or without inducing signal waveforms) under reverse bias.

Therefore, in the present disclosure, since the first diode PD1 operates under forward bias and transmits the dc signal V_DCTo the ultrasonic sensor 110 and filters the high frequency input signal V_RFinAnd a high frequency output signal V_RFoutTherefore, the first diode PD1 can be considered as a resistor. On the other hand, since the second diode PD2 operates under reverse bias and is used for transmitting the high frequency input signal V_RFinAnd a high frequency output signal V_RFoutAnd filtering the direct current signal V_DCThereby avoiding the direct current signal V_DCThe second diode PD2 can be regarded as a capacitor because it is transmitted to the transmission circuit TX or the reception circuit RX. In addition, the first diode PD1 and the second diode PD2 have the advantage of very small size, so that the area of the driving circuit in the ultrasonic driving circuit 100 can be reduced, the space in which the pixels of the ultrasonic driving circuit 100 can be arranged can be increased, and the image of the ultrasonic driving circuit 100 can be increasedThe density of the elements.

It should be noted that the second diode PD2 includes a P-type semiconductor, an I-type semiconductor, and an N-type semiconductor. Wherein the P-type semiconductor may have a thickness of 10nm and the N-type semiconductor may have a thickness of 30 nm. And the thickness of the I-type semiconductor may be 1000 nm. Suppose capacitive reactance (X) on the circuit_C) 50 omega, high pass cutoff frequency (i.e., the ac signal (e.g., high frequency input signal V) transmitted by the second diode PD2 under reverse bias_RFinOr a high frequency output signal V_RFout) Frequency of) is set to 10⁶Hertz. And the capacitance value is set to 3X 10^-9Farad and the area required for the second diode PD2 can be calculated according to the following equation.

C＝3nF

A＝0.027mm²

As shown in the above formula, the second diode PD2 only needs 0.027mm²Can transmit high frequency input signal V_RFinOr a high frequency output signal V_RFoutThereby saving the circuit area of the ultrasonic drive circuit 100.

Referring to fig. 2, fig. 2 is a schematic diagram of a circuit architecture of an ultrasonic driving circuit 100a according to an embodiment of the disclosure. The ultrasonic drive circuit 100a includes ultrasonic sensing pixels P1 to P128. Each of the ultrasonic sensor pixels P1 to P128 includes a plurality of ultrasonic sensors 110 electrically connected in series. In the same ultrasonic sensing pixel P1-P128, the signal intensity of the plurality of ultrasonic sensors 110 connected in series can be enhanced. Therefore, only 3 ultrasonic sensors 110 are shown in fig. 2 as an example, and the ultrasonic sensing pixels P1 to P128 may include 1 ultrasonic sensor 110 or other numbers of ultrasonic sensors 110, which should not be construed as a limitation of the present disclosure. Also, the ultrasonic sensor 110 in fig. 2 may be implemented by the ultrasonic sensor 110 in fig. 1.

In each of the ultrasonic sensing pixels P1 to P128, a plurality of the ultrasonic sensors 110 electrically connected in series are electrically coupled between the ground GND and the cathode terminal of the first diode PD1 and the cathode terminal of the second diode PD 2. The anode terminal of each first diode PD1 in the ultrasonic driving circuit 100a is used for receiving a DC signal V_DC1～V_DC128And each first diode PD1 respectively outputs the DC signal V_DC1～V_DC128To the corresponding ultrasonic sensing pixels P1 to P128. The second diodes PD2 in the ultrasonic driving circuit 100a are respectively used for transmitting the high-frequency output signal V_RFout1～V_RFout128Or a high frequency input signal V_RFin1～V_RFin128。

Although the receiving and transmitting circuit TRC is not shown in fig. 2, the anode terminal of each second diode PD2 in the ultrasonic driving circuit 100a may be electrically coupled to the corresponding receiving and transmitting circuit TRC, and the receiving and transmitting circuit TRC may include a plurality of transceiving switches 120, a plurality of receiving circuits RX, and a plurality of transmitting circuits TX. The second diodes PD2 of the ultrasonic driving circuit 100a are electrically coupled to corresponding ones of the switches 120. The plurality of duplexer 120 is electrically coupled to a corresponding one of the plurality of receiving circuits RX and a corresponding one of the plurality of transmitting circuits TX, respectively.

In detail, for example, a single second diode PD2, an anode terminal of the second diode PD2 is electrically coupled to the first terminal of the duplexer 120, a second terminal of the duplexer 120 is electrically coupled to the transmitting circuit TX, and a third terminal of the duplexer 120 is electrically coupled to the receiving circuit RX.

For transmission circuits TXTo provide a high frequency output signal V_RFoutAnd outputs the high frequency output signal V through the transmit/receive switch 120_RFoutTransmitting to the ultrasonic sensor 110 to make the ultrasonic sensor 110 output a high-frequency output signal V_RFoutConverted into output ultrasonic waves. In other words, the second diode PD2 outputs the high frequency output signal V_RFoutFrom the transmission circuit TX to the ultrasonic sensor 110.

And, in response to the ultrasonic sensor 110 transmitting the output ultrasonic wave, the ultrasonic sensor 110 receives the ultrasonic resonance generated by the output ultrasonic wave returning (reflecting) to the object, and converts the ultrasonic resonance into the high-frequency input signal V_RFinThen, the high frequency input signal V is inputted_RFinThe signal is transmitted to the receiving circuit RX through the second diode PD2 and the duplexer 120. In other words, the second diode PD2 inputs the high frequency input signal V_RFinFrom the ultrasonic sensor 110 to the transmission circuit TX. The first diode PD1 is used for transmitting the DC signal V_DCTo the ultrasonic sensor 110 to enhance the high frequency input signal V of the ultrasonic sensor 110_RFinAnd a high frequency output signal V_RFout。

Since the first diode PD1 and the second diode PD2 have the advantage of being very small in size, the area of the driving circuit in the ultrasonic driving circuit 100a can be reduced, so that the space in which the pixels of the ultrasonic driving circuit 100a can be arranged is increased, and the pixel density of the ultrasonic driving circuit 100a is increased. Moreover, the operation of the ultrasonic driving circuit 100a is similar to that of the ultrasonic driving circuit 100 in fig. 1, and is not repeated here.

Referring to fig. 3, fig. 3 is a schematic diagram of a circuit architecture of an ultrasonic driving circuit 100b according to an embodiment of the disclosure. The ultrasonic driving circuit 100b includes a pixel array a1, a multiplexer 140, a plurality of first diodes PD1, and a plurality of second diodes PD 2. The pixel array a1 includes a plurality of pixels P1, a plurality of second conductive lines L2, and a plurality of first conductive lines L1. Each pixel P1 includes an ultrasonic sensor 110. The plurality of second wires L2 are electrically coupled to the ultrasonic sensing pixels P1 in the same row, and the ultrasonic sensing pixels P1 in the same row are electrically coupled to the multiplexing mechanism through the second wires L2And a device 140. The multiplexer 140 is used for selectively outputting the high frequency output signal V_RFoutAnd is used to select the high-frequency input signal V1 of the ultrasonic sensing pixel P1 to be read by the receiving circuit RX_RFin. The plurality of first wires L1 are electrically coupled to the plurality of ultrasonic sensing pixels P1 in the same row, and the plurality of first wires L1 are electrically coupled to the plurality of first diodes PD1 and the plurality of second diodes PD2, respectively, so that the plurality of ultrasonic sensing pixels P1 in the same row are electrically coupled to the cathode terminal of the first diode PD1 and the cathode terminal of the second diode PD2 through the first wires L1. The anode terminal of the first diode PD1 is used for receiving the DC signal V_DC. The anode terminal of the second diode PD2 is electrically coupled to the transmit-receive switch 120 for transmitting the high frequency output signal V_RFoutOr the high frequency input signal V_RFin。

Although the receiving and transmitting circuit TRC is not shown in fig. 3, the anode terminal of each second diode PD2 in the ultrasonic drive circuit 100b may be electrically coupled to the corresponding receiving and transmitting circuit TRC. The receiving and transmitting circuit TRC may include a plurality of duplexer 120, a plurality of receiving circuits RX, and a plurality of transmitting circuits TX. The second diodes PD2 of the ultrasonic driving circuit 100b are electrically coupled to corresponding ones of the switches 120. The plurality of duplexer 120 is electrically coupled to a corresponding one of the plurality of receiving circuits RX and a corresponding one of the plurality of transmitting circuits TX, respectively.

Taking a single ultrasonic sensing pixel P1 as an example, the transmission circuit TX is used to provide a high-frequency output signal V_RFoutAnd outputs the high frequency output signal V through the transmit/receive switch 120_RFoutTransmitting to the ultrasonic sensor 110 to make the ultrasonic sensor 110 output a high-frequency output signal V_RFoutConverted into output ultrasonic waves. In other words, the second diode PD2 outputs the high frequency output signal V_RFoutFrom the transmission circuit TX to the ultrasonic sensor 110.

And, in response to the ultrasonic sensor 110 transmitting the output ultrasonic wave, the ultrasonic sensor 110 receives the ultrasonic resonance generated by the output ultrasonic wave returning (reflecting) to the object, and converts the ultrasonic resonance into the high-frequency input signal V_RFinThen, the high frequency input signal V is inputted_RFinThe signal is transmitted to the receiving circuit RX through the second diode PD2 and the duplexer 120. In other words, the second diode PD2 inputs the high frequency input signal V_RFinFrom the ultrasonic sensor 110 to the transmission circuit TX. The first diode PD1 is used for transmitting the DC signal V_DCTo the ultrasonic sensor 110 to enhance the high frequency input signal V of the ultrasonic sensor 110_RFinAnd a high frequency output signal V_RFout。

Since the first diode PD1 and the second diode PD2 have the advantage of being very small in size, the area of the driving circuit in the ultrasonic driving circuit 100b can be reduced, so that the space in which the pixels of the ultrasonic driving circuit 100b can be arranged is increased, and the pixel density of the ultrasonic driving circuit 100b is increased. The operation of the ultrasonic driving circuit 100b is similar to that of the ultrasonic driving circuit 100 in fig. 1, and will not be described again.

Referring to fig. 4, fig. 4 is a schematic diagram of a circuit architecture of an ultrasonic driving circuit 100c according to an embodiment of the disclosure. The ultrasonic drive circuit 100c includes a pixel array a2, a gate driver 150, a plurality of first diodes PD1, and a plurality of second diodes PD 2. The pixel array a2 includes a plurality of ultrasonic sensing pixels P1, a plurality of second conductive lines L2, and a plurality of first conductive lines L1. Each ultrasonic sensing pixel P1 includes an ultrasonic sensor 110 and a transistor T1. The plurality of second wires L2 are electrically coupled to the ultrasonic sensing pixels P1 in the same row, and the ultrasonic sensing pixels P1 in the same row are electrically coupled to the gate driver 150 through the second wires L2. The gate driver 150 is configured to provide a corresponding scan signal to the corresponding ultrasonic sensing pixel P1.

In each ultrasonic sensing pixel P1, a first terminal (e.g., a drain terminal) of the transistor T1 is electrically coupled to the first wire L1, a second terminal (e.g., a source terminal) of the transistor T1 is electrically coupled to the ultrasonic sensor 110, and a gate terminal of the transistor T1 is electrically coupled to the second wire L2.

The first wires L1 are electrically coupled to the ultrasonic sensor pixels P1 in the same row, and the first wire L1 is electrically coupled to the first diode PD1 and the second diodeThe PD2 makes the ultrasonic sensing pixels P1 in the same row electrically coupled to the cathode terminal of the first diode PD1 and the cathode terminal of the second diode PD2 through the first wire L1. The anode terminal of the first diode PD1 is used for receiving the DC signal V_DC. The anode terminal of the second diode PD2 is electrically coupled to the transmit-receive switch 120 for transmitting the high frequency output signal V_RFoutOr the high frequency input signal V_RFin。

Although the receiving and transmitting circuit TRC is not shown in fig. 4, the anode terminal of each second diode PD2 in the ultrasonic drive circuit 100c may be electrically coupled to the corresponding receiving and transmitting circuit TRC. The receiving and transmitting circuit TRC may include a plurality of duplexer 120, a plurality of receiving circuits RX, and a plurality of transmitting circuits TX. The second diodes PD2 of the ultrasonic driving circuit 100c are electrically coupled to corresponding ones of the switches 120. The plurality of duplexer 120 is electrically coupled to a corresponding one of the plurality of receiving circuits RX and a corresponding one of the plurality of transmitting circuits TX, respectively.

Taking a single ultrasonic sensing pixel P1 as an example, when the gate driving circuit 160 turns on the transistor T1 in the ultrasonic sensing pixel P1 through the second wire L2, so that the ultrasonic sensor 110 is connected to the cathode terminal of the first diode PD1 and the cathode terminal of the second diode PD2 through the first wire L1, the sending circuit TX is used to provide a high frequency output signal V_RFoutAnd outputs the high frequency output signal V through the transmit/receive switch 120_RFoutTransmitting to the ultrasonic sensor 110 to make the ultrasonic sensor 110 output a high-frequency output signal V_RFoutConverted into output ultrasonic waves. In other words, the second diode PD2 outputs the high frequency output signal V_RFoutFrom the transmission circuit TX to the ultrasonic sensor 110.

And, in response to the ultrasonic sensor 110 transmitting the output ultrasonic wave, the ultrasonic sensor 110 receives the ultrasonic resonance generated by the output ultrasonic wave returning (reflecting) to the object, and converts the ultrasonic resonance into the high-frequency input signal V_RFinThen, the high frequency input signal V is inputted_RFinThe signal is transmitted to the receiving circuit RX through the second diode PD2 and the duplexer 120. In other words, the second diode PD2 will have a high frequencyInput signal V_RFinFrom the ultrasonic sensor 110 to the transmission circuit TX. The first diode PD1 is used for transmitting the DC signal V_DCTo the ultrasonic sensor 110 to enhance the high frequency input signal V of the ultrasonic sensor 110_RFinAnd a high frequency output signal V_RFout。

Since the first diode PD1 and the second diode PD2 have the advantage of being very small in size, the area of the driving circuit in the ultrasonic driving circuit 100c can be reduced, so that the space in which the pixels of the ultrasonic driving circuit 100c can be arranged is increased, and the pixel density of the ultrasonic driving circuit 100c is increased. The operation of the ultrasonic driving circuit 100c is similar to that of the ultrasonic driving circuit 100 in fig. 1, and will not be described again.

Referring to fig. 5, fig. 5 is a schematic diagram of a circuit architecture of an ultrasonic driving circuit 100d according to an embodiment of the disclosure. The ultrasonic drive circuit 100d includes a pixel array a3, a gate driver 150, and a plurality of second diodes PD 2. The pixel array a2 includes a plurality of ultrasonic sensing pixels P1, a plurality of second conductive lines L2, and a plurality of first conductive lines L1. Each ultrasonic sensing pixel P1 includes an ultrasonic sensor 110, a transistor T1, and a first diode PD 1. The plurality of second wires L2 are electrically coupled to the ultrasonic sensing pixels P1 in the same row, and the ultrasonic sensing pixels P1 in the same row are electrically coupled to the gate driver 150 through the second wires L2. The gate driver 150 is configured to provide a corresponding scan signal to the corresponding ultrasonic sensing pixel P1.

In each ultrasonic sensing pixel P1, a first terminal (e.g., a drain terminal) of the transistor T1 is electrically coupled to the first wire L1, a second terminal (e.g., a source terminal) of the transistor T1 is electrically coupled to the ultrasonic sensor 110, and a gate terminal of the transistor T1 is electrically coupled to the second wire L2. The cathode terminal of the first diode PD1 is electrically coupled to the ultrasonic sensor 110, and the anode terminal of the first diode PD1 is used for receiving the DC signal V_DC。

The plurality of first wires L1 are electrically coupled to the ultrasonic sensing pixels P1 in the same row, and the plurality of first wires L1 are electrically coupled to the plurality of second diodes PD2, respectively, such that the ultrasonic sensing pixels P1 in the same row are electrically coupled to the plurality of first wires L1The wave sensing pixel P1 is electrically coupled to the cathode terminal of the second diode PD2 through the first conductive line L1. The anode terminal of the second diode PD2 is electrically coupled to the transmit-receive switch 120 for transmitting the high frequency output signal V_RFoutOr the high frequency input signal V_RFin。

However, the receiving and transmitting circuit TRC is not shown in fig. 5, however, the anode terminal of each second diode PD2 in the ultrasonic driving circuit 100d may be electrically coupled to the corresponding receiving and transmitting circuit TRC. The receiving and transmitting circuit TRC may include a plurality of duplexer 120, a plurality of receiving circuits RX, and a plurality of transmitting circuits TX. The second diodes PD2 of the ultrasonic driving circuit 100d are electrically coupled to corresponding ones of the switches 120. The plurality of duplexer 120 is electrically coupled to a corresponding one of the plurality of receiving circuits RX and a corresponding one of the plurality of transmitting circuits TX, respectively.

Taking a single ultrasonic sensing pixel P1 as an example, when the gate driving circuit 160 turns on the transistor T1 of the ultrasonic sensing pixel P1 through the second conducting wire L2, so that the ultrasonic sensor 110 is connected to the cathode terminal of the second diode PD2 through the first conducting wire L1, the transmitting circuit TX is used to provide the high-frequency output signal V_RFoutAnd outputs the high frequency output signal V through the transmit/receive switch 120_RFoutTransmitting to the ultrasonic sensor 110 to make the ultrasonic sensor 110 output a high-frequency output signal V_RFoutConverted into output ultrasonic waves. In other words, the second diode PD2 outputs the high frequency output signal V_RFoutFrom the transmission circuit TX to the ultrasonic sensor 110.

And, in response to the ultrasonic sensor 110 transmitting the output ultrasonic wave, the ultrasonic sensor 110 receives the ultrasonic resonance generated by the output ultrasonic wave returning (reflecting) to the object, and converts the ultrasonic resonance into the high-frequency input signal V_RFinThen, the high frequency input signal V is inputted_RFinThe signal is transmitted to the receiving circuit RX through the second diode PD2 and the duplexer 120. In other words, the second diode PD2 inputs the high frequency input signal V_RFinFrom the ultrasonic sensor 110 to the transmission circuit TX. The first diode PD1 is used for transmitting the DC signal V_DCTo the ultrasonic sensor 110 to enhance the ultrasoundHigh-frequency input signal V of wave sensor 110_RFinAnd a high frequency output signal V_RFout。

Since the first diode PD1 and the second diode PD2 have the advantage of being very small in size, the area of the driving circuit in the ultrasonic driving circuit 100d can be reduced, so that the space in which the pixels of the ultrasonic driving circuit 100d can be arranged is increased, and the pixel density of the ultrasonic driving circuit 100d is increased. The operation of the ultrasonic driving circuit 100d is similar to that of the ultrasonic driving circuit 100 in fig. 1, and will not be described again.

In summary, the ultrasonic driving circuits 100,100a,100b,100c and 100d provided by the present disclosure operate the first diode PD1 under forward bias to transmit the dc signal V using the first diode PD1 as a resistor_DCAnd may operate the second diode PD2 under reverse bias to deliver the high frequency output signal V with the second diode PD2 as a capacitor_RFoutOr a high frequency input signal V_RFin. Furthermore, it can be known from the foregoing that the second diode PD2 can transmit the high frequency output signal V of about 1MHz only with an area of 0.027mm_RFoutOr a high frequency input signal V_RFinThereby greatly reducing the circuit area.

Although the present disclosure has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the disclosure, and therefore, the scope of the disclosure should be limited only by the appended claims.