阅读说明：本技术 一种多电感水冷装置 (Multi-inductance water cooling device ) 是由 陈材 王志伟 唐紫嫣 康勇 于 2021-10-13 设计创作，主要内容包括：本发明公开了一种多电感水冷装置,包括：壳体、水冷管；所述壳体包括上、下开口,放置于水冷板上,电感放置于由所述壳体及水冷板形成的空腔内；所述水冷管设置于壳体各壁面内部。本发明提供的多电感水冷装置可应用于大功率应用场合,水冷散热的效果相对自然冷却和风冷较好,且没有噪音,不受环境的制约,能有效保障器件的可靠性与运行稳定性。壳体是根据电感的形状进行设计,多个电感共用一个壳体,节省了一定的空间,实现高功率密度。电感引线与柔软编织铜带连接,能够更加方便地将电感引线从出口引出。(The invention discloses a multi-inductance water cooling device, which comprises: a shell and a water-cooled tube; the shell comprises an upper opening and a lower opening and is placed on the water cooling plate, and the inductor is placed in a cavity formed by the shell and the water cooling plate; the water cooling pipes are arranged inside each wall surface of the shell. The multi-inductance water cooling device provided by the invention can be applied to high-power application occasions, has a better water cooling and heat dissipation effect than natural cooling and air cooling, has no noise, is not limited by the environment, and can effectively guarantee the reliability and the operation stability of devices. The casing is designed according to the shape of the inductor, and a plurality of inductors share one casing, so that a certain space is saved, and high power density is realized. The inductance lead is connected with the soft braided copper strip, so that the inductance lead can be led out from the outlet more conveniently.)

1. A multi-inductance water cooling device, comprising: a shell and a water-cooled tube;

the shell is provided with an upper opening and a lower opening and is placed on the water cooling plate, and the inductor is placed in a cavity formed by the shell and the water cooling plate;

the water cooling pipes are arranged inside each wall surface of the shell.

2. A multi-inductor water cooling device as recited in claim 1 wherein said housing further comprises one or more side plates disposed between two opposing walls, said side plates dividing said housing into a plurality of cavities.

3. A multi-inductor water cooling device as claimed in claim 2 wherein water cooling tubes are provided in said side plates.

4. A multi-inductor water cooling device as claimed in any one of claims 1 to 3 wherein the housing is provided with an inductor lead outlet.

5. A multi-inductor water cooling device as claimed in claim 4 wherein said inductor leads are connected to flexible copper tape.

6. A multi-inductor water cooling device as claimed in claim 1 or 2, wherein the gap between the cavity and the inductor is filled with a potting compound.

7. A multi-inductor water cooling device as claimed in claim 1 wherein said housing is provided with a cooling water inlet and outlet.

8. A multi-inductor water cooling device as claimed in claim 1 wherein a PCB board is placed above the housing.

9. A multi-inductor water cooling device as claimed in claim 1 wherein the bottom and top of the housing are provided with fixing holes.

10. A multi-inductor water cooling device as claimed in claim 1 further comprising a temperature sensor for measuring the temperature of the inductor.

Technical Field

The invention belongs to the technical field of inductors, and particularly relates to a multi-inductor water cooling device.

Background

The inductor is an electromagnetic induction element formed by winding an insulated wire, can convert electric energy into magnetic energy for storage, has a structure similar to a transformer, and only has one winding. The inductor blocks the change of current, and is often applied to circuits such as voltage boosting, voltage reducing, power factor correction, inversion output filtering and the like in the field of power electronics. In the circuit, the losses generated by the inductance include iron loss and copper loss, the core loss is mainly caused by eddy current and hysteresis effects, and the winding loss is caused by the ac resistance of the winding. The loss that the inductance produced turns into the heat, can cause the temperature rise, influences the stability of device, and in order to reduce to cause the influence of temperature rise to the circuit performance because of power loss, the high-power inductance mostly adopts forced convection cooling or natural convection cooling's mode at present, and is great for guaranteeing that the radiating efficiency is usually bulky, and is restricted seriously by the environment, and the general degree is not high.

Disclosure of Invention

Aiming at the defects or improvement requirements of the prior art, the invention provides a multi-inductance water cooling device, so that the technical problems of larger volume, environmental restriction and low universality of the conventional inductance cooling device are solved.

To achieve the above object, according to one aspect of the present invention, there is provided a multi-inductor water cooling device including: a shell and a water-cooled tube;

the shell comprises an upper opening and a lower opening and is placed on the water cooling plate, and the inductor is placed in a cavity formed by the shell and the water cooling plate;

the water cooling pipes are arranged inside each wall surface of the shell.

Preferably, the housing further comprises one or more side plates disposed between the two opposing walls, the side plates dividing the housing into a plurality of cavities.

Preferably, a water cooling pipe is arranged in the side plate.

Preferably, the housing is provided with an inductive lead outlet.

Preferably, the inductance leads are connected with a flexible copper strip.

Preferably, a gap between the cavity and the inductor is filled with a potting adhesive.

Preferably, the cooling water device further comprises a cooling water inlet and a cooling water outlet which are arranged on the shell.

Preferably, a PCB board is placed above the housing.

Preferably, the bottom and the top of the shell are provided with fixing holes.

Preferably, a temperature sensor for measuring the temperature of the inductor is further included.

In general, compared with the prior art, the above technical solution contemplated by the present invention can achieve the following beneficial effects:

1. the multi-inductance water cooling device provided by the invention can be applied to high-power application occasions, has a better water cooling and heat dissipation effect than natural cooling and air cooling, has no noise, is not limited by the environment, and can effectively guarantee the reliability and the operation stability of devices.

2. According to the multi-inductor water cooling device provided by the invention, the shell is designed according to the shape of the inductor, and a plurality of inductors share one shell, so that a certain space is saved, and high power density is realized.

3. According to the multi-inductor water cooling device provided by the invention, the inductor lead is connected with the soft braided copper strip, so that the inductor lead can be led out from an outlet more conveniently.

4. The multi-inductance water cooling device provided by the invention fills the redundant internal space through the pouring sealant, plays roles in fixing and heat conduction, and the pouring sealant is a dual-component/low-viscosity epoxy resin product and has the advantages of high-temperature stability, excellent electrical insulation, excellent heat dissipation performance, low viscosity, good durability and the like.

Drawings

Fig. 1 is a schematic diagram of a multi-inductor water cooling device provided by the invention.

Fig. 2 is a schematic diagram of a water cooling pipeline of the multi-inductance water cooling device provided by the invention.

Fig. 3 is a schematic diagram of an inductor structure provided by the present invention.

The same reference numbers will be used throughout the drawings to refer to the same or like elements or structures, wherein:

1-shell, 2-water inlet, 3-water outlet, 4-fixing hole, 5-inductance lead and 6-soft copper strip.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

An embodiment of the present invention provides a multi-inductor water cooling device, as shown in fig. 1, including:

a shell 1 and a water cooling pipe;

the shell is provided with an upper opening and a lower opening and is placed on the water cooling plate, and the inductor is placed in a cavity formed by the shell and the water cooling plate;

the water cooling pipes are arranged inside each wall surface of the shell.

Preferably, the shell is provided with a water inlet 2 and a water outlet 3 for cooling water.

Specifically, the shell is designed according to the shape of the inductor and is fixed above a water cooling plate of a prototype through a mounting hole; the inside processing of casing has the water-cooled tube, has all placed water-cooling pipeline in casing and water-cooled board promptly, and behind the cooling water flowed into the water-cooled tube through the water inlet, flow out from the delivery port after flowing through each runner in proper order, take away the heat to guarantee that the operating temperature of inductance is in safety range.

Preferably, the water inlet and the water outlet are arranged on the same side of the device.

Preferably, the water cooling tube is S-shaped.

Preferably, the housing further comprises one or more side plates disposed between the two opposing walls, the side plates dividing the housing into a plurality of cavities.

Specifically, the shell is a multi-inductor water-cooling shell, and the shell is designed according to the shape and the volume of a plurality of inductors.

The plurality of inductors may have the same volume or different volumes.

Preferably, a water cooling pipe is arranged in the side plate.

Specifically, the water cooling tubes are processed in an S shape inside the shell and are placed on five surfaces of the shell and in the side plates.

As shown in fig. 1-2, when the number of the side plates is 1 and the side plates divide the housing equally into two grooves capable of holding 2 inductors, the accommodating space formed by the housing and the water cooling plate is two U-shaped grooves with upward openings, the inductors are placed in the grooves, and the water cooling tubes are processed in an S-shape inside the housing and placed on five surfaces of the housing and the wall between the two U-shaped grooves of the housing.

The water quantity required by the water cooling device can be calculated by the heat dissipation capacity according to the following formula:

Q＝c·m·Δt；P＝c·l·Δt；

wherein Q is heat dissipation capacity, P is heat dissipation power, c is specific heat capacity of water, m is cooling water mass, delta t is water-cooling inlet and outlet water temperature difference, and l is cooling water flow.

Preferably, the housing is provided with an inductive lead outlet.

As shown in fig. 1-2, when the number of the side plates is 1 and the side plates divide the housing equally into grooves capable of holding 2 inductors, the accommodating space formed by the housing and the water cooling plate is two U-shaped grooves with upward openings, the inductors are placed in the grooves, and the inductor lead-out wires are led out from the cavities through the inductor lead outlets.

Because the water-cooling pipes are arranged in each wall surface of the shell, in order to achieve a good heat dissipation effect, the clearance between the inductor and the inner wall is small; moreover, for the convenience of encapsulation, the outlet of the inductance lead is usually set to be small, and the inductance lead is usually an enameled wire and has certain hardness, which causes the inductance lead to be difficult to penetrate out.

For this purpose, the inductance leads 5 are preferably connected to a flexible copper strip 6, as shown in fig. 3.

The inductor leads are typically enameled wires; preferably, the flexible copper strip is a flexible braided copper strip.

Connecting the inductor leads with a flexible braided copper tape, for example: and welding to lead the inductance lead out of the outlet.

Preferably, a gap between the cavity and the inductor is filled with a potting adhesive.

Specifically, the space of the cavity formed by the shell after the inductor is installed is filled with the potting adhesive, and the adopted potting adhesive has good heat conduction capability.

The pouring sealant is a bi-component/low-viscosity epoxy resin product.

Preferably, a PCB board is placed above the housing.

Specifically, the PCB is placed above the water cooling device shell, namely the five-surface heat dissipation structure, and space is saved.

As shown in fig. 1-2, when the number of the side plates is 1 and the side plates equally divide the housing into slots in which 2 inductors can be placed, the size of the housing is designed according to the size of the inductors, and the two inductors are arranged in parallel and spaced apart from each other. Because the inductance loss is great, five-surface heat dissipation is adopted, the water cooling pipe in the shell is designed and arranged, and the water outlet and the water inlet are designed on the same side. The inductor is placed in a cavity of the water cooling device shell, is fixedly installed on the water cooling plate through the installation hole, and is filled with pouring sealant so as to fix the inductor and play roles in heat dissipation and heat conduction. After the inductor device is installed, a PCB is placed on the whole inductor device and fixed.

Preferably, the bottom and top of the housing are provided with fixing holes 4.

Specifically, the bottom of the shell is provided with a fixing hole for fixing the device on the water cooling plate, and the top of the shell is provided with a fixing hole for placing the PCB on the device.

Preferably, the device further comprises a temperature sensor for measuring the temperature of the inductor.

In particular, the temperature sensor may be a thermocouple.

The temperature sensor can measure the temperature, real-time observation is carried out, and the temperature of the inductor is ensured to be within a safety range.

It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.