阅读说明：本技术 全环绕闸极垂直贯穿式晶体管及其制备方法 (Full-surrounding gate vertical penetration transistor and preparation method thereof ) 是由 詹智颖 于 2021-01-19 设计创作，主要内容包括：本发明的实施例提供了一种全环绕闸极垂直贯穿式晶体管及其制备方法,涉及半导体技术领域。全环绕闸极垂直贯穿式晶体管包括基底、器件单元和闸极,其中,至少两个器件单元依次重叠设置在基底上,器件单元上开设有垂直于基底的过孔,过孔贯穿全部器件单元；闸极设置在过孔内、并与全部器件单元连接。这样,通过在多个重叠设置的器件单元上开设贯穿的过孔,并在过孔内一次性形成闸极,使闸极与全部器件单元连接,相当于全部器件单元共用一个闸极,或者说,闸极的某一段即可对一个器件单元进行控制,整个闸极可以控制多个器件单元,使闸极一次性形成,闸极上各个部位受到的负载相同,各个器件单元之间不会存在明显的电性差异。(The embodiment of the invention provides a full-surrounding gate vertical penetration transistor and a preparation method thereof, relating to the technical field of semiconductors. The all-around gate vertical penetration transistor comprises a substrate, device units and a gate, wherein at least two device units are sequentially overlapped on the substrate, through holes vertical to the substrate are formed in the device units, and the through holes penetrate through all the device units; the gate is disposed in the via and connected to all the device units. Therefore, through arranging the through holes on the device units which are arranged in an overlapped mode, and forming the gate in the through holes at one time, the gate is connected with all the device units, the gate is equivalent to one gate shared by all the device units, or one section of the gate can be controlled by one device unit, the whole gate can control the device units, the gate is formed at one time, the loads on all parts of the gate are the same, and obvious electrical difference does not exist among the device units.)

1. A full-surrounding gate vertical through transistor, comprising:

a substrate (110);

at least two device units (120) sequentially overlapped on the substrate (110), wherein the device units (120) are provided with through holes (125) vertical to the substrate (110), and the through holes (125) penetrate through all the device units (120);

and a gate (130) disposed within the via (125) and connected to all of the device cells (120).

2. The all-around-gate vertical pass transistor according to claim 1, wherein the gate (130) comprises:

a nanowire (131);

and the oxide layer (132) wraps the peripheral surface of the nanowire (131).

3. The all-around-gate vertical pass transistor of claim 2, wherein the oxide layer (132) is silicon dioxide.

4. The all-around gate vertical through transistor according to claim 1, wherein the number of the vias (125) is plural, and the plural vias (125) are arranged at intervals.

5. The all-around-gate vertical pass-through transistor of claim 1, wherein the device cell (120) comprises:

an insulating layer (121) disposed on the substrate (110);

a drain layer (122) disposed on the isolation layer (121);

a well layer (123) provided on the drain layer (122);

and a source layer (124) provided on the well layer (123).

6. A method for preparing a full-surrounding gate vertical through transistor is characterized by comprising the following steps:

forming at least two device units (120) which are sequentially overlapped on a substrate (110);

forming via holes (125) perpendicular to the substrate (110) on the device units (120), wherein the via holes (125) penetrate through all the device units (120);

forming a gate (130) within the via (125), the gate (130) being connected to all of the device cells (120).

7. The method of claim 6, wherein the step of forming the gate (130) in the via (125) comprises:

forming an oxide layer (132) within the via (125);

and forming a nanowire (131) in the via hole (125) so that the oxide layer (132) wraps the peripheral surface of the nanowire (131).

8. The method of claim 7, wherein said oxide layer (132) is formed of silicon dioxide.

9. The method of claim 6, wherein the step of forming a via (125) on the device unit (120) perpendicular to the substrate (110) comprises:

and forming the via hole (125) by adopting an exposure and development technology.

10. The method of claim 6, wherein the step of forming at least two device units (120) on the substrate (110) in a sequentially overlapped manner comprises:

forming an insulating layer (121) on the substrate (110);

forming a drain layer (122) on the isolation layer (121);

forming a well layer (123) on the drain layer (122);

a source layer (124) is formed on the well layer (123).

Technical Field

The invention relates to the technical field of semiconductors, in particular to a full-surrounding gate vertical penetration transistor and a preparation method thereof.

Background

In advanced semiconductor manufacturing processes, Fin field effect transistors (Fin FETs) have been the main structure in the manufacturing process, but with the continuous shrinking of the structure, Gate All Around transistors (Gate Around FETs) in horizontal form have become the mainstream of the new generation technology, which not only can further shrink the size, but also can change the channel from three sides to four sides, so as to improve the control force of the Gate. In addition to the horizontal GAAFET technology, there is also a vertical gate all-around transistor, in which the nanowire extends in the vertical chip direction, which can increase the wafer utilization.

However, in the vertical type GAA FET device currently used, in the form of stacking a plurality of devices (Stacked GAAFET), and the gate electrode in the plurality of devices needs to be repeatedly fabricated. Moreover, the gate fabrication sequence is different among the devices, and the respective loads (Thermal bumps) are different, which may cause a significant electrical difference among the devices.

Disclosure of Invention

The technical problem to be solved by the embodiment of the invention is as follows: in the conventional gate all-around transistor, the gate fabrication sequence of the devices is different, and the loads applied to the devices are different, which may cause significant electrical differences among the devices.

To solve the above technical problem, an embodiment of the present invention may be implemented as follows:

in a first aspect, the present invention provides a full-surrounding gate vertical penetration transistor, which includes a substrate, device units and a gate, wherein at least two device units are sequentially overlapped on the substrate, the device units are provided with via holes perpendicular to the substrate, and the via holes penetrate through all the device units; the gate is disposed in the via and connected to all the device units.

In an alternative embodiment, the gate includes a nanowire and an oxide layer, wherein the oxide layer wraps the outer peripheral surface of the nanowire.

In an alternative embodiment, the oxide layer is silicon dioxide.

In an optional embodiment, the number of the vias is multiple, and the multiple vias are arranged at intervals.

In an alternative embodiment, the device unit comprises an isolation layer, a drain layer, a well layer and a source layer, wherein the isolation layer is arranged on the substrate; the drain layer is arranged on the isolation layer; the well layer is arranged on the drain layer; the source layer is disposed on the well layer.

In a second aspect, the present invention provides a method for manufacturing a fully-surrounding gate vertical through transistor, the method for manufacturing the fully-surrounding gate vertical through transistor includes: forming at least two device units which are sequentially overlapped on a substrate; through holes perpendicular to the substrate are formed in the device units and penetrate through all the device units; forming a gate in the via hole, wherein the gate is connected with all the device units.

In an alternative embodiment, the step of forming a gate within the via includes: forming an oxide layer in the via hole; and forming a nanowire in the via hole, so that the oxide layer wraps the peripheral surface of the nanowire.

In an alternative embodiment, the oxide layer is formed using silicon dioxide.

In an alternative embodiment, the step of forming a via hole perpendicular to the substrate on the device unit includes: and forming the via hole by adopting an exposure and development technology.

In an alternative embodiment, the step of forming at least two device units sequentially overlapped on the substrate includes: forming an isolation layer on a substrate; forming a drain layer on the isolation layer; forming a well layer on the drain layer; a source layer is formed on the well layer.

The fully-surrounding gate vertical penetration transistor and the preparation method thereof provided by the embodiment of the invention have the beneficial effects that: through arranging the through holes on the device units which are arranged in an overlapped mode, and forming the gate in the through holes at one time, the gate is connected with all the device units, the gate is equivalent to one gate shared by all the device units, or one section of the gate can be controlled by one device unit, the whole gate can control the device units, the gate in the transistor which is vertically penetrated and fully surrounds the gate is formed at one time under the condition that the gate of each device unit is not formed independently, the load on each part of the gate is the same, and obvious electrical difference does not exist among the device units.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic diagram of a full cross-section of a fully surrounding gate vertical through transistor according to a first embodiment of the present invention;

FIG. 2 is a top view of a fully surrounding gate vertical through transistor according to a first embodiment of the present invention;

FIG. 3 is a flowchart illustrating a method for fabricating a fully-around-gate vertical penetration transistor according to a second embodiment of the present invention;

fig. 4 to fig. 11 are schematic structural diagrams illustrating a process of manufacturing a fully-around-gate vertical through transistor according to a second embodiment of the present invention.

Icon: 100-full surrounding gate vertical penetration transistor; 110-a substrate; 120-a device unit; 121-an insulating layer; 122-a drain layer; 123-well layer; 124-source layer; 125-via holes; 130-gate; 131-nanowires; 132-an oxide layer; 200-photoresist.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.

First embodiment

Referring to fig. 1, the present embodiment provides a full-surrounding Gate vertical penetration transistor 100, in which the full-surrounding Gate vertical penetration transistor 100 includes a substrate 110(Bulk), a device unit 120, and a Gate 130 (Gate). The layer structure of the device unit 120 is disposed around the gate 130, and the gate 130 vertically penetrates through the layer structure of the device unit 120 or the substrate 110.

The substrate 110 may be formed by a wafer, and specifically, a silicon wafer may be used. The substrate 110 may also include silicon, germanium, and the like.

The number of the device units 120 may be multiple, and the device units 120 are sequentially overlapped and disposed on the substrate 110, in this embodiment, the number of the device units 120 is two as an example. In other embodiments, the number of device cells 120 may be more, such as three to eight.

The device unit 120 is provided with a via 125 perpendicular to the substrate 110, and the via 125 penetrates all the device units 120. The gate 130 is disposed in the via 125 and connected to all of the device units 120. The gate 130 includes a nanowire 131(Nano wire) and an oxide layer 132(oxide), wherein the oxide layer 132 wraps the outer circumference of the nanowire 131. The oxide layer 132 may be made of an insulating material, and in this embodiment, the oxide layer 132 is silicon dioxide.

Referring to fig. 2, the number of the vias 125 may be multiple, and the vias 125 are arranged at intervals, in the embodiment, the number of the vias 125 is, for example, six, the six vias 125 are arranged in an array, and each of the vias 125 has one gate 130. In other embodiments, the number of vias 125 and gates 130 may be more, such as tens or hundreds.

Each device unit 120 includes an isolation layer 121(isolation), a Drain layer 122(Drain), a Well layer 123(Well), and a Source layer 124(Source), wherein the isolation layer 121 is disposed on the substrate 110; the drain layer 122 is disposed on the isolation layer 121; the well layer 123 is disposed on the drain layer 122; the source layer 124 is disposed on the well layer 123.

The working principle of the fully-surrounding gate vertical pass transistor 100 provided in this embodiment is as follows:

the gate 130 provides a voltage to each device unit 120 to turn on the well layer 123 in the device unit 120, the source layer 124 in the device unit 120 is electrically connected to a signal source, and an electrical signal (current) received by the source layer 124 from the signal source can be transmitted to the drain layer 122 through the well layer 123, so that the electrical signal can be transmitted from the source layer 124 to the drain layer 122.

The advantage of the fully-surrounding gate vertical pass transistor 100 provided in this embodiment includes:

1. through forming the through via 125 on the multiple overlapped device units 120 and forming the gate 130 in the via 125 at one time, the gate 130 is connected with all the device units 120, which is equivalent to that all the device units 120 share one gate 130, or one section of the gate 130 can control one device unit 120, the whole gate 130 can control multiple device units 120, under the condition that the gate 130 of each device unit 120 is not formed independently, the gate 130 in the all-around gate vertical through transistor 100 is formed at one time, the load on each part on the gate 130 is the same, and no obvious electrical difference exists between the device units 120;

2. the plurality of gates 130 are arranged perpendicular to the substrate 110, the area of the substrate 110 or the wafer occupied by a single gate 130 is smaller, a larger number of gates 130 can be arranged, and the utilization rate of the substrate 110 or the wafer is improved;

3. by forming each layer structure of the device unit 120 in a thin film form, the thickness of the device unit 120 is reduced, which can increase the number of the device units 120 overlapping, or reduce the thickness of the all-around gate vertical through transistor 100 under the condition that the number of the device units 120 overlapping is not changed;

4. in each device unit 120, the source layer 124 receives current in the entire layer structure, so that the current can be stably and uniformly input, and the gate 130 uniformly provides voltage to each device unit 120 to control the conduction of each device unit 120.

Second embodiment

Referring to fig. 3, the present embodiment provides a method for manufacturing a full-surrounding gate vertical through transistor (hereinafter referred to as "manufacturing method"), which is mainly used to manufacture the full-surrounding gate vertical through transistor 100 provided in the first embodiment.

The preparation method comprises the following steps:

s1: referring to fig. 4, a substrate 110 is provided.

The substrate 110 may be formed by a wafer, and specifically, a silicon wafer may be used. The substrate 110 may also include silicon, germanium, and the like.

S2: referring to fig. 5 and 6, at least two device units 120 are formed on the substrate 110 and are sequentially overlapped.

The number of the device units 120 may be multiple, and the device units 120 are sequentially overlapped and disposed on the substrate 110, in this embodiment, the number of the device units 120 is two as an example. In other embodiments, the number of device cells 120 may be more, such as three to eight.

The device unit 120 includes an isolation layer 121, a drain layer 122, a well layer 123 and a source layer 124, and the manufacturing process of the device unit 120 includes: forming an isolation layer 121 on the substrate 110; forming a drain layer 122 on the isolation layer 121; forming a well layer 123 on the drain layer 122; a source layer 124 is formed on the well layer 123.

S3: referring to fig. 7 to 9, a via 125 is formed on the device unit 120 and perpendicular to the substrate 110.

Referring to fig. 7 and 8, the vias 125 may be formed by an exposure and development technique, the photoresist 200 is formed on the device unit 120, and the vias 125 are formed by development, in this embodiment, the number of the vias 125 is six, the six vias 125 are arranged in an array, and referring to fig. 9, the vias 125 penetrate through all the device units 120.

S4: referring to fig. 10 to 11, a gate 130 is formed in the via 125, and the gate 130 is connected to all the device units 120.

The gate 130 includes a nanowire 131 and an oxide layer 132, wherein the oxide layer 132 wraps the outer peripheral surface of the nanowire 131. Referring to fig. 10, first, an oxide layer 132 is formed in the via 125, and the oxide layer 132 may be made of an insulating material, in this embodiment, the oxide layer 132 is silicon dioxide. Next, referring to fig. 11, a nanowire 131 is formed in the via 125, and the oxide layer 132 is wrapped on the outer circumferential surface of the nanowire 131.

The method for manufacturing the fully-surrounding gate vertical through transistor provided by the embodiment has the following beneficial effects:

1. through forming the through via 125 on the multiple overlapped device units 120 and forming the gate 130 in the via 125 at one time, the gate 130 is connected with all the device units 120, which is equivalent to that all the device units 120 share one gate 130, or one section of the gate 130 can control one device unit 120, the whole gate 130 can control multiple device units 120, under the condition that the gate 130 of each device unit 120 is not formed independently, the gate 130 in the all-around gate vertical through transistor 100 is formed at one time, the load on each part on the gate 130 is the same, and no obvious electrical difference exists between the device units 120;

2. the plurality of gates 130 are arranged perpendicular to the substrate 110, the area of the substrate 110 or the wafer occupied by a single gate 130 is smaller, a larger number of gates 130 can be arranged, and the utilization rate of the substrate 110 or the wafer is improved;

3. by forming each layer structure of the device unit 120 in a thin film form, the thickness of the device unit 120 is reduced, which can increase the number of the device units 120 overlapping, or reduce the thickness of the all-around gate vertical through transistor 100 under the condition that the number of the device units 120 overlapping is not changed;

4. in each device unit 120, the source layer 124 receives current in the entire layer structure, so that the current can be stably and uniformly input, and the gate 130 uniformly provides voltage to each device unit 120 to control the conduction of each device unit 120.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.