阅读说明：本技术 一种内置数字芯片的led及其封装工艺 (LED with built-in digital chip and packaging process thereof ) 是由 林坚耿 李浩锐 金国奇 于 2020-12-31 设计创作，主要内容包括：本申请涉及照明显示器件的领域,尤其是涉及一种内置数字芯片的LED,其包括封装底板以及发光芯片,所述封装底板上设置有数字芯片,所述封装底板上靠近所述数字芯片一侧设置有连接区,所述数字芯片靠近所述封装底板一侧设置有与所述连接区对准的焊区,所述连接区与所述焊区电连接；所述数字芯片远离所述封装底板一侧设置有第一导电组,所述发光芯片靠近所述数字芯片一侧设置有与所述第一导电组对准的第二导电组,所述第一导电组与所述第二导电组电连接。本申请具有精简灯板内的电路结构以及缩小灯板展示面面积的效果。(The application relates to the field of illumination display devices, in particular to an LED with a built-in digital chip, which comprises a packaging bottom plate and a light-emitting chip, wherein the packaging bottom plate is provided with the digital chip, one side of the packaging bottom plate, which is close to the digital chip, is provided with a connecting area, one side of the digital chip, which is close to the packaging bottom plate, is provided with a welding area aligned with the connecting area, and the connecting area is electrically connected with the welding area; the digital chip is far away from packaging bottom plate one side is provided with first electrically conductive group, luminous chip is close to digital chip one side is provided with the second electrically conductive group that first electrically conductive group aimed at, first electrically conductive group with the second electrically conductive group electricity is connected. The lamp panel has the effects of simplifying the circuit structure in the lamp panel and reducing the area of the display surface of the lamp panel.)

1. An LED with a built-in digital chip is characterized in that: the LED packaging structure comprises a packaging bottom plate (1) and a light-emitting chip (2), wherein a digital chip (3) is arranged on the packaging bottom plate (1), a connecting area (4) is arranged on one side, close to the digital chip (3), of the packaging bottom plate (1), a welding area (5) aligned with the connecting area (4) is arranged on one side, close to the packaging bottom plate (1), of the digital chip (3), and the connecting area (4) is electrically connected with the welding area (5); the digital chip (3) is far away from one side of the packaging bottom plate (1) and is provided with a first conductive group, the light-emitting chip (2) is close to one side of the digital chip (3) and is provided with a second conductive group aligned with the first conductive group, and the first conductive group is electrically connected with the second conductive group.

2. The LED with built-in digital chip of claim 1, wherein: the first conductive group comprises two first conductive areas (6) arranged on the digital chip (3) side by side, and the second conductive group comprises two second conductive areas (7) arranged on the light-emitting chip (2) side by side.

3. The LED with built-in digital chip of claim 2, wherein: one side of the light-emitting chip (2) facing the digital chip (3) is square, the two second conductive areas (7) are arranged in a long strip shape, and a concave part (8) is formed in the long strip shape of one of the second conductive areas (7).

4. The LED with built-in digital chip of claim 1, wherein: the area of one side of the packaging bottom plate (1) facing the digital chip (3) is larger than the area of one side of the digital chip (3) facing the packaging bottom plate (1).

5. The LED with built-in digital chip of claim 1, wherein: the packaging bottom plate (1) is provided with a protective cover (9) which wraps the digital chip (3) and the light-emitting chip (2).

6. The LED with the built-in digital chip as claimed in claim 5, wherein: the protective cover (9) is formed by compression molding of epoxy resin materials.

7. The LED with built-in digital chip of claim 1, wherein: the packaging structure is characterized in that 5 connecting areas (4) are arranged on the packaging bottom plate (1), first insulating areas (10) used for separating all the connecting areas (4) are arranged on the packaging bottom plate (1), the connecting areas (4) are arranged at two opposite edges of one side, facing the digital chip (3), of the packaging bottom plate (1), 5 welding areas (5) are arranged on the digital chip (3), second insulating areas (11) used for separating the welding areas (5) are arranged on the digital chip (3), and the welding areas (5) correspond to the connecting areas (4).

8. The LED packaging process with the built-in digital chip as claimed in any one of claims 1 to 7, wherein: the method comprises the following steps:

s1: placing conductive adhesive on the connecting area (4) of the packaging bottom plate (1);

s2: attaching the digital chip (3) to the packaging bottom plate (1), and enabling the welding areas (5) on the digital chip (3) to correspond to the connecting areas (4) one by one to realize that the digital chip (3) is fixed on the surface of the packaging bottom plate (1);

s3: placing conductive adhesive on a first conductive area (6) on the digital chip (3);

s4: one square side of each light-emitting chip (2) is attached to the digital chip (3), the second conductive areas (7) of the light-emitting chips (2) are in one-to-one correspondence with the first conductive areas (6), and the light-emitting chips (2) can be fixed on the corresponding surfaces of the digital chip (3) according to the difference of the shapes of the two second conductive areas (7);

s5: after the packaging bottom plate (1), the digital chip (3) and the light-emitting chip (2) are fixed, a protective cover (9) is molded on the packaging bottom plate (1).

9. The LED packaging process with the built-in digital chip as claimed in claim 8, wherein: the packaging bottom plate (1) and the digital chip (3) are fixed through conductive adhesive and then are cured at high temperature, and the digital chip (3) and the light-emitting chip (2) are fixed through conductive adhesive and then are cured at high temperature.

Technical Field

The application relates to the field of illumination display devices, in particular to an LED with a built-in digital chip and a packaging process thereof.

Background

The LED is a light emitting diode which is a common light emitting device, releases energy through electron and hole recombination to emit light, and is widely applied in the field of illumination. The light emitting diode can efficiently convert electric energy into light energy, and has wide application in modern society, such as illumination, flat panel display, medical devices and the like.

In the use of LED, can be based on not using the bandwagon effect on the lamp plate, install the chip and install the LED of different colours on the circuit board to be connected LED and chip on with the circuit board through the wire on the circuit board, realize LED flicker control on the lamp plate through the chip, thereby form different bandwagon effects.

With respect to the related art among the above, the inventors consider that there is a defect: when designing different bandwagon effects of lamp plate, the interconnecting link that adopts the wire between chip and the LED is comparatively complicated, and required circuit board whole circuit area increases, leads to the lamp plate show face area increase of the different effects of show.

Disclosure of Invention

In order to simplify the circuit structure in the lamp panel and reduce the area of the display surface of the lamp panel, the application provides an LED with a built-in digital chip and a packaging process thereof.

The first purpose of the present application provides an LED with a built-in digital chip, which adopts the following technical solution:

an LED with a built-in digital chip comprises a packaging bottom plate and a light-emitting chip, wherein the packaging bottom plate is provided with the digital chip, one side, close to the digital chip, of the packaging bottom plate is provided with a connecting area, one side, close to the packaging bottom plate, of the digital chip is provided with a welding area aligned with the connecting area, and the connecting area is electrically connected with the welding area; the digital chip is far away from packaging bottom plate one side is provided with first electrically conductive group, luminous chip is close to digital chip one side is provided with the second electrically conductive group that first electrically conductive group aimed at, first electrically conductive group with the second electrically conductive group electricity is connected.

By adopting the technical scheme, when the digital chip and the light-emitting chip are assembled, the packaging bottom plate and the digital chip are fixed through the arranged connecting area and the welding area, and then the packaging bottom plate and the digital chip can be electrically connected; through the arrangement of the first conductive group and the second conductive group, the digital chip light-emitting chip can be electrically connected with each other after being fixed, the digital chip can control the light-emitting chip, and the wire connection between the digital chip and the light-emitting chip can be omitted during assembly; after the packaging bottom plate, the digital chip and the light-emitting chip are fixed, the digital chip is located on the packaging bottom plate, the light-emitting chip is located on one side, away from the packaging bottom plate, of the digital chip, namely the packaging bottom plate, the digital chip and the light-emitting chip are vertically installed, the overall plane area of the assembled LEDs can be reduced, when the LEDs are installed on the lamp plate in the follow-up mode, the occupied area of each LED on the plane of the lamp plate can be reduced, and therefore the area of the whole display surface can be reduced.

Preferably, the first conductive group comprises two first conductive regions arranged side by side on the digital chip, and the second conductive group comprises two second conductive regions arranged side by side on the light emitting chip.

By adopting the technical scheme, through the two first conductive areas and the two second conductive areas, one second conductive area is used as the anode of the light-emitting chip, the other second conductive area is used as the cathode of the light-emitting chip, and after the light-emitting chip and the digital chip are fixed, a closed loop is formed with the digital chip, so that the single-point control of the digital chip on the light-emitting chip is realized.

Preferably, one side of the light emitting chip, which faces the digital chip, is square, and the two second conductive regions are long strips, wherein a concave portion is formed in one of the second conductive regions.

By adopting the technical scheme, the second conductive regions are arranged into the strip shape, so that two ends of one side of the two second conductive regions facing the digital chip can be distributed over the strip shape, and when the light-emitting chip is fixed on the digital chip, the contact area between the second conductive regions and the first conductive regions can be increased, and the stability of the electrical connection between the digital chip and the light-emitting chip is ensured.

Preferably, a protective cover for wrapping the digital chip and the light emitting chip is arranged on the packaging bottom plate.

By adopting the technical scheme, after the light-emitting chip and the digital chip are fixed, the protective cover can play a role in protecting the digital chip and the light-emitting chip from being damaged by external force in the subsequent LED installation and use processes.

Preferably, the area of one side of the packaging bottom plate, which faces the digital chip, is larger than the area of one side of the digital chip, which faces the packaging bottom plate.

By adopting the technical scheme, the area of the packaging bottom plate is set to be larger than that of the digital chip, so that more space can be provided for placing the digital chip on the packaging bottom plate, and the packaging bottom plate and the digital chip are convenient to fix; in addition, when the protective cover is added subsequently, a molding space of the protective cover can be provided on the periphery of the light-emitting chip.

Preferably, the protective cover is formed by compression molding of an epoxy resin material.

Through adopting above-mentioned technical scheme, the safety cover adopts the compression molding mode to form on the packaging bottom plate to the safety cover adopts the epoxy material, and the protection cover has high temperature resistant and anti ultraviolet's effect on the one hand, and on the other hand can utilize the refraction of colloid micro molecule structure, the light that the luminous chip sent of reflection, can improve luminous chip's luminous efficacy.

Preferably, the package base plate is provided with 5 connecting areas, the package base plate is provided with first insulating areas for separating all the connecting areas, the connecting areas are arranged at two opposite edges of one side of the package base plate facing the digital chip, the digital chip is provided with 5 soldering areas, the digital chip is provided with second insulating areas for separating the soldering areas, and the positions of the 5 soldering areas correspond to the positions of the 5 connecting areas.

By adopting the technical scheme, the connecting areas are arranged at the opposite edges of one side of the packaging bottom plate, namely the number of the connecting areas on the opposite edges of the packaging bottom plate is different, when the digital chip is fixed on the packaging bottom plate, the fixed angle of the digital chip can be determined according to the positions of the connecting areas on the packaging bottom plate and the positions of the welding areas on the digital chip, and the identification degree can be improved.

The second objective of the present application provides an LED packaging process with a built-in digital chip, which adopts the following technical solution: a built-in digital chip LED packaging process comprises the following steps:

s1: placing conductive adhesive on the connection region of the packaging bottom plate;

s2: the digital chip is attached to the packaging bottom plate, and the welding areas and the connecting areas on the digital chip are in one-to-one correspondence, so that the digital chip is fixed on the surface of the packaging bottom plate;

s3: placing conductive adhesive on a first conductive area on the digital chip;

s4: attaching one square side of each light-emitting chip to the digital chip one by one, enabling second conductive areas of the light-emitting chips to correspond to the first conductive areas one by one, and fixing the light-emitting chips on the corresponding surfaces of the digital chips according to the different shapes of the two second conductive areas;

s5: and after the packaging bottom plate, the digital chip and the light-emitting chip are fixed, a protective cover is molded on the packaging bottom plate.

By adopting the technical scheme, the conductive adhesive is applied to the connecting area, the connecting area and the welding area are fixed, the fixing and the electric connection between the packaging bottom plate and the digital chip are realized, then the conductive adhesive is applied to the first conductive area, the fixing and the electric connection between the light-emitting chip and the digital chip can be realized, at the moment, the packaging bottom plate, the digital chip and the light-emitting chip are vertically installed, the whole plane area of the assembled LEDs can be reduced, and the occupied area of each LED on the plane of the lamp panel can be reduced when the LEDs are subsequently installed on the lamp panel, so that the whole display surface area can be reduced; and finally, a protective cover is formed on the packaging bottom plate and around the digital chip and the light-emitting chip, so that the protective function can be achieved.

Preferably, the package substrate and the digital chip are fixed by a conductive adhesive and then cured at high temperature, and the digital chip and the light emitting chip are fixed by a conductive adhesive and then cured at high temperature.

By adopting the technical scheme, after the packaging bottom plate and the digital chip are fixed through the conductive adhesive, high-temperature baking is carried out again, so that the reinforcing effect can be achieved, and meanwhile, the packaging bottom plate and the digital chip are more attached; in a similar way, the light-emitting chip is fixed and then is baked at high temperature again, so that the connection between the light-emitting chip and the digital chip can be reinforced, and the light-emitting chip and the digital chip are better attached.

In summary, the present application includes at least one of the following beneficial technical effects:

when the digital chip and the light-emitting chip are assembled, the packaging bottom plate and the digital chip are fixed through the arranged connecting area and the welding area, and then the packaging bottom plate and the digital chip can be electrically connected; through the arrangement of the first conductive group and the second conductive group, the digital chip light-emitting chip can be electrically connected with each other after being fixed, the digital chip can control the light-emitting chip, and the wire connection between the digital chip and the light-emitting chip can be omitted during assembly; after the packaging bottom plate, the digital chip and the light-emitting chip are fixed, the digital chip is located on the packaging bottom plate, the light-emitting chip is located on one side, away from the packaging bottom plate, of the digital chip, namely the packaging bottom plate, the digital chip and the light-emitting chip are vertically installed, the overall plane area of the assembled LEDs can be reduced, when the LEDs are installed on the lamp plate in the follow-up mode, the occupied area of each LED on the plane of the lamp plate can be reduced, and therefore the area of the whole display surface can be reduced.

Through set up the depressed part on second conductive area bar form, when will give out light the chip installation, can be convenient for distinguish the positive negative pole of giving out light the chip, improve the degree of discernment.

Drawings

Fig. 1 is a schematic view of the overall structure of the present application after a protective cover is hidden.

Fig. 2 is a schematic structural diagram of a package substrate.

Part a in fig. 3 is a schematic structural view of the digital chip facing the package substrate; part B is a structural schematic diagram of the digital chip far away from the side of the package base plate.

Fig. 4 is a schematic structural diagram of a side of the light emitting chip facing the digital chip.

Fig. 5 is a schematic structural view of the package substrate and the protection cover.

Description of reference numerals: 1. packaging the bottom plate; 2. a light emitting chip; 3. a digital chip; 4. a connecting region; 5. a welding area; 6. a first conductive region; 7. a second conductive region; 8. a recessed portion; 9. a protective cover; 10. a first insulating region; 11. a second insulating region.

Detailed Description

The present application is described in further detail below with reference to figures 1-5.

The embodiment of the application discloses LED of built-in digital chip, refer to fig. 1 and fig. 2, including packaging substrate 1 and luminescent chip 2, luminescent chip 2 is the LED chip, install digital chip 3 on packaging substrate 1, adopt the mini LED chip in this embodiment, digital chip 3 is drive IC, and packaging substrate 1 and digital chip 3 are square, be fixed in packaging substrate 1 with digital chip 3 in order to realize, be formed with joining region 4 on packaging substrate 1 near digital chip 3 one side, be formed with the welding zone 5 of aiming at with joining region 4 on digital chip 3 is close to packaging substrate 1 one side, and be connected electrically between joining region 4 and welding zone 5.

Referring to fig. 1, in order to fix a light emitting chip 2 on a digital chip 3, a first conductive group is disposed on a side of the digital chip 3 away from a package substrate 1, and a second conductive group aligned with the first conductive group is disposed on a side of the light emitting chip 2 close to the digital chip 3, and the first conductive group is electrically connected to the second conductive group, when the light emitting chip 2 is mounted on the digital chip 3, the second conductive group and the first conductive group are attached to each other, so that the light emitting chip 2 and the digital chip 3 can be electrically connected to each other, and the digital chip 3 can realize single-point control of the light emitting chip 2.

In addition, the number of the first conductive groups on the side of the digital chip 3 away from the package base plate 1 can be set to be multiple, in this embodiment, the number of the first conductive groups is 3, correspondingly, 3 light emitting chips 2 can be mounted on the digital chip 3, and the light emitting chips 2 emitting different colors can be mounted according to the display effect of the lamp panel;

referring to fig. 3 and 4, the first conductive group includes two first conductive regions 6 disposed side by side on the digital chip 3, while the second conductive group includes two second conductive regions 7 disposed side by side on the light emitting chip 2, wherein one second conductive region 7 is located at the positive electrode of the light emitting chip 2, and the other second conductive region 7 is the negative electrode of the light emitting chip 2; when the light emitting chip 2 is mounted on the digital chip 3, in order to distinguish the positive and negative electrodes on the light emitting chip 2, one side of the light emitting chip 2 facing the digital chip 3 is square, and the two second conductive areas 7 are configured to be long strips, so that when the light emitting chip 2 is fixed on the digital chip 3, the contact area between the first conductive area 6 and the second conductive area 7 can be increased, and the electrical connection between the digital chip 3 and the light emitting chip 2 can be ensured.

Referring to fig. 4, a recessed portion 8 is formed in one of the second conductive regions 7, and the two second conductive regions 7 on the light emitting chip 2 have different shapes, so that the positive and negative electrodes of the light emitting chip 2 can be distinguished conveniently, the mounting accuracy of the light emitting chip 2 is ensured, and the situation that the positive and negative electrodes of the light emitting chip 2 are reversely mounted is avoided.

Referring to fig. 5, after assembling digital chip 3 and light emitting chip 2, in order to avoid being damaged in the subsequent use process, a protective cover 9 covering digital chip 3 and light emitting chip 2 is formed on package substrate 1, protective cover 9 is formed by compression molding of epoxy resin material on package substrate 1, protective cover 9 protects the internal structure from being damaged by external force in the use process on one hand, on the other hand, the light emitted by light emitting chip 2 can be refracted and reflected by the colloidal small molecular structure of epoxy resin, and the light emitting efficiency of light emitting chip 2 can be improved.

Referring to fig. 2 and 3, the number of the connection areas 4 is 5 on the package substrate 1, the package substrate 1 is provided with a first insulation area 10 for separating all the connection areas 4, the connection areas 4 are arranged at two opposite edges of one side of the package substrate 1 facing the digital chip 3, the number of the connection areas 4 at two opposite edges of one side of the package substrate 1 is different, meanwhile, 5 soldering areas 5 are arranged on the digital chip 3, the digital chip 3 is provided with a second insulation area 11 for separating the soldering areas 5, the positions of the 5 soldering areas 5 correspond to the positions of the 5 connection areas 4, when the digital chip 3 is fixed on the package substrate 1, the installation position of the digital chip 3 on the package substrate 1 can be conveniently determined by the connection areas 4 with different numbers at two opposite edges of one side of the package substrate 1.

In this embodiment, the connection regions 4, the lands 5, the first conductive regions 6, and the second conductive regions 7 are metal pads, and the 5 connection regions 4 are ground GND, signal input DIN, standby signal FDIN, power input VDD, and signal output DOUT, respectively; the 5 lands 5 are ground GND, signal input DIN, standby signal FDIN, power input VDD, and signal output DOUT, respectively.

After the package substrate 1, the digital chip 3 and the light-emitting chip 2 are assembled, the FDIN of the digital chip 3 is connected with a standby signal FDIN of the package substrate 1, the DIN of the digital chip 3 is connected with a signal input DIN of the package substrate 1, the GND of the digital chip 3 is connected with a grounding GND of the package substrate 1, the DOUT of the digital chip 3 is connected with a signal output DOUT of the package substrate 1, and the VDD of the digital chip 3 is connected with a power input VDD of the package substrate 1; at this time, the grounded GND and the power supply VDD form a power supply closed loop to supply power to the light-emitting chips 2, the signal input DIN or the standby signal input FDIN and the signal output DOUT form a signal data transmission loop, a control data signal is transmitted to the digital chip 3 through the DIN or the FDIN, the digital chip 3 drives the output ports to carry out data transmission control on the light-emitting chips 2 through the OUTG, the OUTR and the OUTB, the light-emitting chips 2 are controlled to emit light independently, two light-emitting chips or three light-emitting chips at the same time, and the brightness degree and the light-emitting time of each light-emitting chip 2 are controlled.

The implementation principle of the LED with the built-in digital chip in the embodiment of the application is as follows: through 5 soldering lands 5 on the digital chip 3 and 4 one-to-one of 5 joining region on the packaging substrate 1, and be fixed in packaging substrate 1 with digital chip 3, then with 3 second conduction region 7 and the 6 one-to-one of corresponding first conduction region of luminous chip 2, be fixed in on the digital chip 3 with luminous chip 2, packaging substrate 1 this moment, digital chip 3 and luminous chip 2 are at same vertical installation fixed, thereby reduce the holistic planar area of LED after the equipment, when subsequently installing LED on the lamp plate, can reduce the area occupied of each LED on the lamp plate plane, thereby can reduce whole show surface area.

Based on the above, the embodiment of the application further discloses an LED packaging process with a built-in digital chip, which includes the following steps:

s1: a conductive adhesive is dotted on the connection area 4 of the package base plate 1, the conductive adhesive can be conductive solder paste or conductive silver adhesive, and the conductive silver adhesive is adopted in the embodiment;

the conductive silver adhesive combines conductive particles together through the bonding action of matrix resin to form a conductive path, so that the conductive connection of the bonded material is realized; coating a layer of conductive silver adhesive on each connecting area 4 on the package bottom plate 1, wherein the thickness of the conductive silver adhesive of each connecting area 4 is consistent;

s2: attaching the digital chip 3 to the packaging bottom plate 1, and enabling the welding areas 5 on the digital chip 3 to correspond to the connecting areas 4 one by one so as to fix the digital chip 3 on the surface of the packaging bottom plate 1;

because the thickness of the conductive silver adhesive on each connecting area 4 is consistent, when the digital chip 3 is attached to the packaging bottom plate 1, the smoothness of the digital chip 3 on the packaging bottom plate 1 can be kept; after the packaging bottom plate 1 and the digital chip 3 are fixed through the conductive silver adhesive, high-temperature curing is carried out, and a high-temperature baking or reflow soldering mode can be adopted, so that the connection firmness between the packaging bottom plate 1 and the digital chip 3 is improved;

s3: conductive silver adhesive is arranged on the first conductive area 6 on the digital chip 3; similarly, the thickness of the conductive silver paste coated on each first conductive area 6 on the digital chip 3 is consistent;

s4: attaching one square side of each light-emitting chip 2 to the digital chip 3 one by one, corresponding the second conductive areas 7 of the light-emitting chips 2 to the first conductive areas 6 one by one, and fixing the light-emitting chips 2 on the corresponding surfaces of the digital chip 3 according to the different shapes of the two second conductive areas 7;

because the thickness of the conductive silver adhesive on each first conductive area 6 is consistent, when the light-emitting chip 2 is attached to the digital chip 3, the smoothness of the 3 light-emitting chips 2 on the digital chip 3 can be kept, and similarly, the connection firmness between the digital chip 3 and the light-emitting chips 2 is improved by adopting the same high-temperature curing mode;

s5: after the package substrate 1, the digital chip 3 and the light emitting chip 2 are fixed, a protective cover 9 is molded on the package substrate 1.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.