阅读说明：本技术 一种用于连接陶瓷元件和线路板的金属边夹式连接端子 (Metal edge-clamping type connecting terminal for connecting ceramic element and circuit board ) 是由 向长秋 于 2020-12-30 设计创作，主要内容包括：本发明公开了一种用于连接陶瓷元件和线路板的金属边夹式连接端子,包括：U型卡槽和料臂,U型卡槽的一端与料臂相连；U型卡槽内壁两侧分别设置有焊锡一、焊锡二,U型卡槽夹持在陶瓷元件和转换电路线路板两侧,焊锡一与陶瓷元件上设置的金属焊盘焊接,焊锡二与转换电路线路板上设置的金属焊盘焊接。本发明从根本上避免了压力传感器中陶瓷敏感元件与转换电路线路板间连接必须在陶瓷敏感元件上开孔用放置引针,孔壁做金属化处理或在孔内填充导电浆料,再通过引针与转换电路线路板焊接的复杂工艺和连接方式,成本得以降低。(The invention discloses a metal edge clip type connecting terminal for connecting a ceramic element and a circuit board, which comprises: the feeding device comprises a U-shaped clamping groove and a feeding arm, wherein one end of the U-shaped clamping groove is connected with the feeding arm; the two sides of the inner wall of the U-shaped clamping groove are respectively provided with a first soldering tin and a second soldering tin, the U-shaped clamping groove is clamped on the two sides of the ceramic element and the conversion circuit board, the first soldering tin is welded with a metal bonding pad arranged on the ceramic element, and the second soldering tin is welded with a metal bonding pad arranged on the conversion circuit board. The invention fundamentally avoids the problems that the ceramic sensitive element in the pressure sensor is connected with the conversion circuit board, the ceramic sensitive element is provided with a hole for placing a guide pin, the hole wall is metallized or is filled with conductive slurry, and then the cost is reduced through the complex process and connection mode of welding the guide pin and the conversion circuit board.)

1. A metal edge clip type connection terminal for connecting a ceramic element and a wiring board, comprising: the feeding device comprises a U-shaped clamping groove and a feeding arm, wherein one end of the U-shaped clamping groove is connected with the feeding arm; u type draw-in groove inner wall both sides are provided with soldering tin one, soldering tin two respectively, U type draw-in groove centre gripping is in ceramic sensing element and conversion circuit board both sides, soldering tin one with the welding of the metal pad that sets up on the ceramic sensing element, soldering tin two with the welding of the metal pad that sets up on the conversion circuit board.

2. The metal edge-clip-type connecting terminal for connecting a ceramic element and a wiring board according to claim 1, wherein said conversion circuit board and said ceramic sensitive element are fixed together by glue after being aligned.

3. A metal edge clip type connection terminal for connecting a ceramic element and a wiring board according to claim 1, wherein a solder resist region is provided on an inner bottom surface of said U-shaped card slot.

4. A metal edge clip type connection terminal for connecting a ceramic element and a wiring board according to claim 3, wherein said solder resist region is formed by plating nickel tin on the surface of the web of said U-shaped card slot.

5. A metal edge-clip-type connecting terminal for connecting a ceramic element and a wiring board according to claim 1, wherein said arm is provided with a feeding hole.

6. A metal edge-clip-type connecting terminal for connecting a ceramic element and a wiring board according to claim 1 or 5, wherein a cut-off groove is provided at a position of the arm close to the U-shaped notch.

7. The metal edge-clip-type connection terminal for connecting a ceramic element to a circuit board according to claim 1, wherein the U-shaped engaging groove and the arm are made of phosphor copper or brass.

Technical Field

The invention belongs to the technical field of pressure sensor manufacturing, and particularly relates to a metal edge clamp type connecting terminal for connecting a ceramic element and a circuit board.

Background

With the rapid development of modern industry and smart driving, sensors are widely used in industry and automobile manufacturing, and ceramic is a base material having various excellent characteristics of high elasticity, corrosion resistance, abrasion resistance, impact resistance, vibration resistance, etc., and has excellent thermal stability, and thus is widely used in various sensor manufacturing due to its excellent properties.

The sensor generally comprises a sensing element, a conversion element and a conversion circuit, the sensing element and the conversion circuit are generally connected together in some specific ways, the connection between the ceramic sensing element and the conversion circuit of the existing ceramic pressure sensor is generally welded together by a lead pin penetrating through a through hole pad of a circuit board, which results in that: the ceramic element is required to be provided with holes for placing guide pins, the hole wall needs to be metallized or filled with conductive slurry, the process is complex, and the cost is high; when a pin is inserted after the hole wall of the ceramic element via hole is metalized, the hole wall can be scratched by the pin to cause open circuit connection or can generate an air gap when the pin is inserted after conductive slurry is filled in the hole wall to cause open circuit connection or reduction of connection reliability.

Therefore, how to provide a metal edge-clip type connection terminal for connecting a ceramic element and a circuit board is a problem that needs to be solved by those skilled in the art.

Disclosure of Invention

In view of the above, the present invention provides a metal edge-clip type connection terminal for connecting a ceramic device and a circuit board, which fundamentally avoids the problem that the connection between the ceramic sensitive device and the conversion circuit board in the pressure sensor requires a hole to be opened for placing a pin, the hole wall is metallized or conductive paste is filled in the hole, and then the cost is reduced by the complicated process and connection mode of welding the pin and the conversion circuit board.

In order to achieve the purpose, the invention adopts the following technical scheme:

a metal edge-clip-type connection terminal for connecting a ceramic element and a wiring board, comprising: the feeding device comprises a U-shaped clamping groove and a feeding arm, wherein one end of the U-shaped clamping groove is connected with the feeding arm; u type draw-in groove inner wall both sides are provided with soldering tin one, soldering tin two respectively, U type draw-in groove centre gripping is in ceramic sensing element and conversion circuit board both sides, soldering tin one with the welding of the metal pad that sets up on the ceramic sensing element, soldering tin two with the welding of the metal pad that sets up on the conversion circuit board.

Preferably, the conversion circuit board and the ceramic sensitive element are fixed together by gluing after being aligned.

Preferably, a solder mask area is arranged on the bottom surface of the inner side of the U-shaped clamping groove.

Preferably, nickel tin is electroplated on the surface of the material sheet of the U-shaped clamping groove to form the solder mask area.

Preferably, the broken arm is provided with a feeding hole.

Preferably, a cutting groove is formed in the position, close to the U-shaped clamping groove, of the breaking arm.

Preferably, the U-shaped clamping groove and the material arm are made of phosphor copper or brass.

The invention has the beneficial effects that:

the invention realizes the fixed position and reliable welding by respectively arranging the first soldering tin and the second soldering tin on two sides of the inner wall of the U-shaped clamping groove, welding the first soldering tin with the first metal pad arranged on the ceramic sensitive element and welding the second soldering tin with the second metal pad arranged on the conversion circuit board, simplifies the manufacturing process, fundamentally avoids the problem that holes are formed on the ceramic sensitive element for placing guide pins when the ceramic sensitive element and the conversion circuit board are connected in the pressure sensor, the hole wall is metallized or conductive slurry is filled in the holes, and the cost is reduced by the complex process and the connection mode of welding the guide pins and the conversion circuit board.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

FIG. 1 is a schematic diagram of the present invention.

Figure 2 the attached figure is a front view of the invention.

Figure 3 the accompanying drawing is a side view of the invention.

Figure 4 the accompanying drawing is a top view of the invention.

Fig. 5 is a schematic view illustrating an installation structure of the metal edge clip-type connection terminal according to the present invention.

Fig. 6 is a schematic structural view showing the metal edge-clip type connection terminal broken along the cutting groove after being mounted.

FIG. 7 is a schematic structural diagram of a ceramic sensor.

Fig. 8 is a schematic structural diagram of the conversion circuit board.

Wherein, in the figure:

1-metal edge-clip type connection terminals; 2-ceramic sensitive elements; 3-a conversion circuit line; 4, a first metal pad; 5-metal pad two; 6-a feeding hole; 7-a material arm; 8-cutting off the groove; 9-soldering a first tin; 10-soldering tin II; 11-U-shaped clamping grooves; 12-solder mask area.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 8, the present invention provides a metal edge clip type connection terminal for connecting a ceramic element and a circuit board, comprising: the feeding device comprises a U-shaped clamping groove 11 and a feeding arm 7, wherein one end of the U-shaped clamping groove 11 is connected with the feeding arm 7; one side of the inner wall of the U-shaped clamping groove 11 is provided with a first soldering tin 9, the other side of the inner wall of the U-shaped clamping groove 11 is provided with a second soldering tin 10, after the conversion circuit 3 board and the ceramic sensitive element 2 are aligned and fixed together through glue, the U-shaped clamping groove 11 is clamped at two sides of the ceramic sensitive element 2 and the conversion circuit 3 board, the first soldering tin 9 is welded with a first metal pad 4 arranged on the ceramic sensitive element 2, and the second soldering tin 10 is welded with a second metal pad 5 arranged on the conversion circuit.

The metal edge-clamping type connecting terminal 1 clamps the ceramic sensitive element 2 and the conversion circuit 3 board which are bonded together, the first soldering tin 9 is aligned to the first metal bonding pad 4 of the ceramic sensitive element 2, and after the second soldering tin 10 is aligned to the second metal bonding pad 5 of the conversion circuit 3 board, the first soldering tin 9 and the second soldering tin 10 are heated to be melted and welded, so that the effects of connection and conduction and fixing positions are achieved.

In this embodiment, a solder wire with a certain diameter is wrapped in a solder groove by bending to form a first solder part 9 and a second solder part 10, and then the material sheet is bent to form a U-shaped slot 11.

In this embodiment, a solder mask region 12 is disposed on the inner bottom surface of the U-shaped card slot 11, and the solder mask region 12 is formed by electroplating nickel tin on the surface of the material sheet of the U-shaped card slot 11. The problem of short circuit caused by mutual adhesion of the first solder tin 9 and the second solder tin 10 due to the prefabricated solder mask area 12 can be solved.

In this embodiment, the broken arm is provided with a feeding hole 6. The metal edge-clamping type connecting terminal 1 respectively aligns two sides of a first soldering tin 9 and a second soldering tin 10 in a U-shaped clamping groove 11 to a first metal pad 4 of the ceramic sensitive element 2 and a second metal pad 5 of a conversion circuit 3 board to be clamped through automatic mounting equipment along a feeding hole 6 and a material arm 7.

In this embodiment, the position of the breaking arm close to the U-shaped slot 11 is provided with a cutting groove 8. After the first soldering tin 9 and the second soldering tin 10 in the U-shaped clamping groove 11 are respectively welded with the first metal pad 4 and the second metal pad 5, the material arm 7 is cut off along the cutting groove 8, and therefore the conversion circuit 3 board and the ceramic sensitive element 2 are connected together.

In this embodiment, the U-shaped slot 11 and the arm 7 are made of phosphor copper or brass with good electrical conductivity and bending elasticity.

The manufacturing process flow of the invention is as follows: the conversion circuit board 3 and the ceramic sensitive element 2 are fixedly bonded together through glue after being aligned to the positions, then the metal edge clamp type connecting terminal 1 is clamped tightly by a first soldering tin 9 and a second soldering tin 10 in a U-shaped clamping groove 11 through automatic mounting equipment along a feeding hole 7 and a material arm 8 and the first metal pad 4 of the ceramic sensitive element 2 and a second metal pad 5 of the conversion circuit board 3 are respectively aligned to two sides of the second soldering tin 10, the first soldering tin 9 and the second soldering tin 10 are heated to melt and weld after being clamped, short circuits caused by mutual adhesion of the melted soldering tin are avoided by a solder mask area 12, and finally the short circuits are cut off along a cutting groove 8, so that the conversion circuit board 3 and the ceramic sensitive element 2 are connected together.

The invention punches the feeding hole and the material arm on the material belt through the punching technology to realize full-automatic feeding in cooperation with automatic feeding equipment, pre-embeds the soldering tin I and the soldering tin II into the side clamp soldering tin groove through the bending technology, and then bends to form the U-shaped clamping groove to realize fixed position and reliable welding, simplifies the manufacturing process, can realize full-automatic high-efficiency welding by using simple automatic mounting equipment and heating equipment, has high welding reliability, punches the feeding hole and the material arm on the material belt through the punching technology to realize full-automatic feeding in cooperation with the automatic feeding equipment, pre-embeds the soldering tin into the side clamp soldering tin groove through the bending technology, and then bends to form the U-shaped elastic clamping groove to realize fixed position and reliable welding, simplifies the manufacturing process, and realizes full-automatic high-efficiency welding by using the simple automatic mounting equipment and the heating equipment, the welding reliability is high, and the complex process and connection mode that the ceramic sensitive element in the pressure sensor is connected with the conversion circuit board by punching a hole on the ceramic element for placing a guide pin, carrying out metallization treatment on the hole wall or filling conductive slurry in the hole and then welding the guide pin and the circuit board are fundamentally avoided, so that the manufacturing cost is greatly reduced.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.