阅读说明：本技术 一种纤维板及其制备方法 (Fiberboard and preparation method thereof ) 是由 徐�明 邢立艳 于 2020-07-08 设计创作，主要内容包括：本发明提供了一种纤维板,包括面层和芯层,所述芯层设置在所述面层之间,并与所述面层相连接,所述芯层中含有电热涂料,所述电热涂料用于对芯层通电后使芯层发热。本发明提供的纤维板通过芯层通电后使芯层发热,所述纤维板传热效率高,加快发热速度；植物纤维具有良好的耐热性能,在发热过程中只会有少量水分的挥发,造价低廉,延长纤维板使用寿命。本发明提供了一种纤维板制备方法,先通过植物原料为主料制作面层混合料和芯层混合料,将面层混合料和芯层混合料通过热压工艺制成所述纤维板。在芯层制备过程中将电热涂料加入搅拌混合,避免局部过热,保证芯层发热均匀性。(The invention provides a fiber board which comprises surface layers and a core layer, wherein the core layer is arranged between the surface layers and connected with the surface layers, and the core layer contains an electrothermal coating which is used for heating the core layer after the core layer is electrified. The fiber board provided by the invention heats the core layer after the core layer is electrified, the heat transfer efficiency of the fiber board is high, and the heating speed is accelerated; the plant fiber has good heat resistance, only a small amount of water is volatilized in the heating process, the manufacturing cost is low, and the service life of the fiberboard is prolonged. The invention provides a preparation method of a fiber board, which comprises the steps of firstly preparing a surface layer mixture and a core layer mixture by using plant raw materials as main materials, and preparing the surface layer mixture and the core layer mixture into the fiber board through a hot pressing process. The electrothermal coating is added, stirred and mixed in the core layer preparation process, so that local overheating is avoided, and the heating uniformity of the core layer is ensured.)

1. The fiberboard is characterized by comprising surface layers (1) and a core layer (2), wherein the core layer (2) is arranged between the surface layers (1) and connected with the surface layers (1), and the core layer (2) contains electrothermal paint which is used for heating the core layer (2) after being electrified.

2. A fibre board according to claim 1, characterised in that the fibre board further comprises circuit connection means (3), the circuit connection means (3) being adapted to be connected to a power supply for powering the fibre board, the circuit connection means (3) comprising a power adapter, the power adapter being electrically connected to the core layer (2).

3. The fiberboard of claim 2 further comprising a temperature control device electrically connected to the power adapter.

4. A fibre board according to any of claims 1-3, characterised in that the fibre board further comprises an insulating surface, which is connected to the face layer (1), for insulating the core layer (2) from electrical currents.

5. A method of making a fibreboard as claimed in any one of claims 1 to 4, comprising:

preparing a surface layer mixture, namely obtaining 70-110 parts of plant slurry, 2-20 parts of adhesive, 0.05-0.15 part of waterproof agent and 0.05-0.15 part of flame retardant, and putting the plant slurry, the adhesive, the waterproof agent and the flame retardant into a mixing pool to be stirred and mixed;

preparing a core layer mixture, namely obtaining 40-80 parts of plant slurry, 2-15 parts of adhesive, 0.05-0.15 part of waterproof agent, 0.05-0.15 part of flame retardant and 20-40 parts of electric heating coating, and stirring and mixing the plant slurry, the adhesive, the waterproof agent, the flame retardant and the electric heating coating;

And preparing the surface layer mixture and the core layer mixture into the fiber board through a hot pressing process.

6. The method for preparing the fiberboard of claim 5, wherein the preparation of the surface layer mixture or the core layer mixture further comprises homogenizing the plant slurry under a homogenizing pressure within a range of 1MPa to 100MPa, and stirring and mixing the homogenized plant slurry.

7. The method of claim 6, wherein the homogenizing further comprises ultrasonication at a frequency of 18-22 KHZ.

8. The method for preparing a fiber board according to any one of claims 5 to 7, wherein the hot pressing temperature of the hot pressing process is 160-200 ℃, and the hot pressing time is 1-5 min.

9. The method for preparing the fiber board according to claim 8, wherein the step of manufacturing the fiber board by the hot pressing process by using the surface layer mixture and the core layer mixture comprises the following steps:

preparing the surface layer mixture into a surface layer through a hot pressing process;

preparing the core layer mixture into a core layer through a hot pressing process;

and arranging the core layer among the plurality of surface layers, and connecting the core layer with the surface layers to manufacture the fiberboard.

10. The method for preparing the fiber board according to claim 8, wherein the step of manufacturing the fiber board by the hot pressing process by using the surface layer mixture and the core layer mixture comprises the following steps:

the prepared surface layer mixture and the core layer mixture are paved in layers, and the core layer is paved in the middle of the surface layer;

and after paving, manufacturing the fiberboard by a hot pressing process.

Technical Field

The invention relates to the field of composite materials, in particular to a fiberboard and a preparation method thereof.

Background

With the development of modern science and technology, new materials are continuously developed, produced and widely applied. The composite material is an extremely important part in the field of materials, the development of modern high-tech techniques cannot be separated from the development of the composite material, and the composite material plays an important role in the development of modern science and technology. The research depth and the application range of the composite material and the speed and the scale of the production development of the composite material become one of the important marks for measuring the advanced level of the national science and technology.

The carbon fiber composite material is one kind of composite material, and the existing electric heating plate is usually made of the carbon fiber composite material and has the advantages of high electric heating conversion efficiency, ultrathin softness and the like. But the carbon fiber electric heating plate made of the carbon fiber composite material is usually higher in manufacturing cost.

Accordingly, there is a need in the art for a fiberboard and a method of making the same.

Accordingly, the present invention is directed to such a system.

Disclosure of Invention

The present invention is directed to a fiber board and a method for manufacturing the same, which solves at least one of the above problems.

The invention provides a fiber board which comprises surface layers and a core layer, wherein the core layer is arranged between the surface layers and connected with the surface layers, and the core layer contains an electric heating coating which is used for heating the core layer after being electrified.

By adopting the scheme, the core layer of the fiber board provided by the invention heats after being electrified, the fiber board has high heat transfer efficiency, and the heating speed is accelerated; the fiberboard has good heat resistance, only a small amount of water is volatilized in the heating process, the manufacturing cost is low, and the service life of the fiberboard is prolonged.

Furthermore, the fiberboard also comprises a circuit connecting device, the circuit connecting device is used for connecting a power supply to supply power to the fiberboard, the circuit connecting device comprises a power adapter, and the power adapter is electrically connected with the core layer.

Preferably, the circuit connecting device further comprises an electrode electrically connected with the power adapter.

By adopting the scheme, the electrodes can be connected with a power supply, and then the adaptive voltage is adjusted through the power adapter, so that the adjusted voltage is right for heating the core layer, the core layer is ensured not to be overheated, and the user is prevented from being scalded.

Preferably, the fiberboard further comprises a temperature control device, and the temperature control device is electrically connected with the power adapter.

By adopting the scheme, the temperature range can be set through the temperature control device, when the temperature tends to the upper limit temperature, the temperature control device is electrically connected with the power adapter, the heating voltage is adjusted, the heating speed is adjusted, the heating temperature of the fiber board is guaranteed to fluctuate within a certain range, and the comfort level of a user is guaranteed.

Further, the surface layer and the core layer both contain a waterproof agent.

Furthermore, the fiber board also comprises an insulating surface, the insulating surface is connected with the surface layer, and the insulating surface is used for insulating the core layer current.

Preferably, the insulating surface covers the upper surface and the lower surface of the surface layer.

Adopt above-mentioned scheme, the insulating surface can prevent that sewage or other conductors from passing through the surface course and permeating the sandwich layer and causing the electric leakage, and the electricity hinders the user, damages the fibreboard.

Further, the surface layer and the core layer both contain a flame retardant.

By adopting the scheme, the fiberboard is prevented from self-igniting when being overheated or burning under external conditions, and the use safety of a user is ensured.

Further, the fiberboard is also provided with a mounting groove, and the circuit connecting device is arranged in the mounting groove.

Preferably, the surface layer is provided with a first groove, the core layer is provided with a second groove, and the first groove and the second groove are matched to form the mounting groove.

By adopting the scheme, the fiber board is convenient for installing the circuit connecting device.

The invention also provides a preparation method of the fiberboard, which comprises the following steps:

preparing a surface layer mixture, namely obtaining 70-110 parts of plant pulp, wherein the cellulose content of the plant pulp is 30% -70%, 2-20 parts of adhesive, 0.05-0.15 part of waterproof agent and 0.05-0.15 part of flame retardant, and putting the plant pulp, the adhesive, the waterproof agent and the flame retardant into a mixing pool to be stirred and mixed;

preparing a core layer mixture, namely obtaining 40-80 parts of plant slurry, 2-15 parts of adhesive, 0.05-0.15 part of waterproof agent, 0.05-0.15 part of flame retardant and 20-40 parts of electric heating coating, and putting the plant slurry, the adhesive, the waterproof agent, the flame retardant and the electric heating coating into a mixing tank to be stirred and mixed;

And preparing the surface layer mixture and the core layer mixture into the fiber board through a hot pressing process.

By adopting the scheme, the main raw materials of the fiber board are plants, so that the fiber board is easy to obtain and low in manufacturing cost; the electrothermal coating is added, stirred and mixed in the preparation process of the core layer, so that the core layer is heated to avoid local heating or the heating part is too thin to cause local overheating, and the heating uniformity of the core layer is ensured; the fiber board manufactured by adopting the hot pressing process has strong structural rigidity and prolonged service life.

Further, the cellulose is a linear polysaccharide formed by combining glucose molecules.

Furthermore, the components of the electric heating coating can be 40-60% of metal oxide, 5-20% of non-metal oxide, 5-20% of organic semiconductor material and 5-20% of high molecular polymer; the metal oxide comprises 20-40% of tin dioxide, 5-20% of antimony pentoxide, 5-10% of cobaltosic oxide, 5-35% of aluminum oxide, 5-15% of zinc oxide, 5-10% of barium oxide, 5-10% of yttrium oxide, 0-20% of zirconium oxide and 5-10% of lithium oxide; the non-metallic oxide comprises 10-30% of boron oxide, 30-50% of silicon dioxide and 20-40% of tellurium dioxide; the organic semiconductor material comprises 10-90% of polyaniline and 10-90% of polypyrrole; the high molecular polymer comprises 10-90% of polypropylene cyanide and 10-90% of polyamide.

Further, the plant pulp can be a mixture of one or more of wheat straw crushed raw materials, rice straw crushed raw materials, wood pulp solid waste, bamboo pulp solid waste, wheat straw pulp solid waste, eucalyptus powder, bamboo powder, wheat straw pulp, rice straw pulp, eucalyptus pulp solid waste, eucalyptus chemical pulp, bamboo pulp solid waste and bamboo chemical pulp; the adhesive is a phenolic resin adhesive or an isocyanate adhesive; the waterproof agent is molten paraffin, emulsified paraffin or paraffin rosin emulsion; the flame retardant is one or a mixture of more of ammonium monohydrogen phosphate, ammonium dihydrogen phosphate, ammonium polyphosphate and melamine.

Preferably, the preparation of the surface layer mixture or the core layer mixture further comprises homogenizing the plant slurry, wherein the homogenizing pressure is in the range of 40-80 MPa, and stirring and mixing the plant slurry after homogenizing.

By adopting the scheme, the plant pulp is more refined, the later stage of the plant pulp is more fully mixed with other raw materials, and the final product is more stable.

More preferably, the homogenization treatment further comprises ultrasonic treatment, and the ultrasonic treatment frequency is 18-22 KHZ.

Further, after homogenization treatment including ultrasonic treatment, hydroxyl groups can be released in an increased manner, and the hydroxyl groups can be subjected to an aldol condensation reaction with formaldehyde in the adhesive.

By adopting the scheme, the ultrasonic treatment is added in the homogenization treatment, the structure of the plant slurry can be more refined, the homogenization treatment effect is enhanced, the hydroxyl can be increased and released after the homogenization treatment including the ultrasonic treatment is carried out, the hydroxyl can absorb the formaldehyde in the adhesive, and the formaldehyde poisoning is prevented.

Further, the hot-pressing temperature of the hot-pressing process is 160-200 ℃, and the hot-pressing time is 1-5 min.

By adopting the scheme, the fiberboard has rigidity and toughness, and the physical strength of the fiberboard is improved.

Further, the step of manufacturing the surface layer mixture and the core layer mixture into the fiber board through a hot pressing process comprises the following steps:

preparing the surface layer mixture into a surface layer through a hot pressing process;

preparing the core layer mixture into a core layer through a hot pressing process;

and arranging the core layer among the plurality of surface layers, and connecting the core layer with the surface layers to manufacture the fiberboard.

By adopting the scheme, the surface layer and the core layer can be conveniently disassembled and assembled, and the surface layer or the core layer in the fiber board can be conveniently replaced.

Preferably, the step of manufacturing the surface layer mixture and the core layer mixture into the fiber board through a hot pressing process comprises the following steps:

the prepared surface layer mixture and core layer mixture are paved in layers, and the core layer is paved in the middle of the surface layer;

and after paving, manufacturing the fiberboard by a hot pressing process.

By adopting the scheme and adopting the one-step forming preparation process, the preparation speed is high, and the prepared fiberboard has strong integrity and strong structural rigidity.

Furthermore, the preparation method of the fiber board further comprises a circuit connecting device, wherein the circuit connecting device is used for connecting a power supply to supply power to the fiber board, the circuit connecting device comprises a power adapter, and the power adapter is electrically connected with the core layer.

Preferably, the circuit connecting device further comprises an electrode electrically connected with the power adapter.

Further, the fiberboard also comprises a temperature control device, and the temperature control device is electrically connected with the power adapter.

By adopting the scheme, the temperature range can be set through the temperature control device, when the temperature tends to the upper limit temperature, the temperature control device is electrically connected with the power adapter, the heating voltage is adjusted, the heating speed is adjusted, the heating temperature of the fiber board is guaranteed to fluctuate within a certain range, and the comfort level of a user is guaranteed.

Further, the temperature control device controls the temperature of the fiber board to be 30-50 ℃.

In conclusion, the invention has the following beneficial effects:

1. the core layer of the fiber board provided by the invention is heated after being electrified, the fiber board has high heat transfer efficiency, and the heating speed is accelerated; the fiberboard has good heat resistance, only a small amount of water is volatilized in the heating process, the manufacturing cost is low, and the service life of the fiberboard is prolonged;

2. the temperature control device is electrically connected with the power adapter when the temperature approaches to the upper limit temperature, so that the heating voltage and the heating speed are adjusted, the heating temperature of the fiber board is guaranteed to fluctuate within a certain range, and the comfort level of a user is guaranteed;

3. according to the preparation method of the fiberboard, the electrothermal coating is added, stirred and mixed in the preparation process of the core layer, so that the core layer is heated to avoid local heating or the heating part is too thin, local overheating is caused, and the heating uniformity of the core layer is ensured; the fiber board manufactured by adopting the hot pressing process has strong structural rigidity and prolonged service life.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic view of a first embodiment of a method of making a fiberboard of the present invention;

FIG. 2 is a schematic view of a second embodiment of a method of making a fiberboard of the present invention;

FIG. 3 is a schematic view of a third embodiment of a fiberboard making process of the present invention;

FIG. 4 is a schematic view of a fourth embodiment of a fiberboard making process of the present invention;

FIG. 5 is a schematic view of a fifth embodiment of a method of making a fiberboard of the present invention;

FIG. 6 is a perspective view of one embodiment of a fiberboard of the present invention;

FIG. 7 is a perspective view of another embodiment of a fiberboard of the present invention.

Description of reference numerals:

the technical scheme of the invention can be more clearly understood and explained by combining the embodiment of the invention through the reference sign description.

1. A surface layer; 2. a core layer; 3. a circuit connection device; 4. mounting grooves; 41. a first groove; 42. a second groove.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

The present invention will be described in detail below by way of examples.