阅读说明：本技术 一种陶瓷混压集成电路板的外端面打磨装置及方法 (Outer end face polishing device and method for ceramic mixed-compression integrated circuit board ) 是由 邱星茗 周始全 于 2021-07-27 设计创作，主要内容包括：本发明公开了一种陶瓷混压集成电路板的外端面打磨装置,它包括工作台(1)、设置于工作台(1)上的动力单元和双作用油缸(2),动力单元的输出轴上安装有转盘(3),双作用油缸(2)两个活塞杆的作用端上均设置有打磨机构(5),打磨机构(5)包括安装板(6)、进给油缸(7)和电机(8),安装板(6)固设于双作用油缸(2)活塞杆的作用端上,进给油缸(7)水平设置且固设于安装板(6)的顶表面上,进给油缸(7)活塞杆的作用端上固设有L板(9),纵向油缸(10)活塞杆的作用端上固设有活动板(11)。本发明的有益效果是：结构紧凑、减轻工人劳动强度、提高集成电路板打磨效率、实现批量打磨。(The invention discloses an outer end face polishing device of a ceramic mixed-compression integrated circuit board, which comprises a workbench (1), a power unit and a double-acting oil cylinder (2), wherein the power unit and the double-acting oil cylinder (2) are arranged on the workbench (1), a rotating disc (3) is arranged on an output shaft of the power unit, polishing mechanisms (5) are respectively arranged on action ends of two piston rods of the double-acting oil cylinder (2), each polishing mechanism (5) comprises a mounting plate (6), a feeding oil cylinder (7) and a motor (8), the mounting plate (6) is fixedly arranged on the action end of the piston rod of the double-acting oil cylinder (2), the feeding oil cylinder (7) is horizontally arranged and fixedly arranged on the top surface of the mounting plate (6), an L plate (9) is fixedly arranged on the action end of the piston rod of the feeding oil cylinder (7), and a movable plate (11) is fixedly arranged on the action end of the piston rod of a longitudinal oil cylinder (10). The invention has the beneficial effects that: compact structure, alleviate workman intensity of labour, improve integrated circuit board efficiency of polishing, realize polishing in batches.)

1. The utility model provides an outer terminal surface grinding device of ceramic mixed compression integrated circuit board which characterized in that: the polishing machine comprises a workbench (1), a power unit and a double-acting oil cylinder (2) which are arranged on the workbench (1), a rotary table (3) is arranged on an output shaft of the power unit, two limiting rods (4) are fixedly arranged on the top surface of the rotary table (3), polishing mechanisms (5) are respectively arranged on action ends of two piston rods of the double-acting oil cylinder (2), each polishing mechanism (5) comprises a mounting plate (6), a feeding oil cylinder (7) and a motor (8), the mounting plate (6) is fixedly arranged on an action end of a piston rod of the double-acting oil cylinder (2), the feeding oil cylinder (7) is horizontally arranged and fixedly arranged on the top surface of the mounting plate (6), an L plate (9) is fixedly arranged on the action end of the piston rod of the feeding oil cylinder (7), a longitudinal oil cylinder (10) is fixedly arranged on the top surface of the L plate (9), and a movable plate (11) is fixedly arranged on the action end of the piston rod of the longitudinal oil cylinder (10), the motor (8) is fixedly arranged on the front end face of the movable plate (11), the motor (8) is longitudinally arranged, an output shaft of the motor is provided with a grinding wheel (12), and the grinding wheel (12) is arranged on the rear side of the rotary table (3).

2. The outer end surface grinding device of the ceramic mixed-compression integrated circuit board as claimed in claim 1, wherein: the two grinding mechanisms (5) are symmetrically arranged in front and back of the rotary table (3).

3. The outer end surface grinding device of the ceramic mixed-compression integrated circuit board as claimed in claim 1, wherein: the power unit comprises a stepping motor (13) and a speed reducer (14) which are fixedly arranged on the table top of the workbench (1), an output shaft of the stepping motor (13) is connected with an input shaft of the speed reducer (14) through a coupler, an output shaft of the speed reducer (14) is arranged upwards, and the turntable (3) is arranged on the output shaft of the speed reducer (14).

4. The outer end surface grinding device of the ceramic mixed-compression integrated circuit board as claimed in claim 1, wherein: the bottom of the workbench (1) is fixedly provided with a plurality of supporting legs supported on the ground.

5. The outer end surface grinding device of the ceramic mixed-compression integrated circuit board as claimed in claim 1, wherein: and a support plate (15) is fixedly arranged on a piston rod of the double-acting oil cylinder (2), and the mounting plate (6) is fixedly arranged on the top surface of the support plate (15).

6. The outer end surface grinding device of the ceramic mixed-compression integrated circuit board as claimed in claim 1, wherein: two guide rails (16) are fixedly arranged on the top surface of the L-shaped plate (9), two sliding grooves corresponding to the guide rails (16) are formed in the bottom surface of the movable plate (11), and the movable plate (11) is slidably mounted on the guide rails (16) through the sliding grooves.

7. The outer end surface grinding device of the ceramic mixed-compression integrated circuit board as claimed in claim 1, wherein: the device also comprises a controller, wherein the controller is electrically connected with the electromagnetic valve of the longitudinal oil cylinder (10), the electromagnetic valve of the feeding oil cylinder (7), the electromagnetic valve of the double-acting oil cylinder (2), the motor (8) and the stepping motor (13).

8. The method for polishing the outer end face of the ceramic mixed-compression integrated circuit board by the polishing device as claimed in any one of claims 1 to 7, wherein: it comprises the following steps:

s1, stacking the ceramic mixed-compression integrated circuit boards to be polished, and drilling two through holes on the top of the integrated circuit boards by a drilling machine after stacking the integrated circuit boards to a certain number of layers, so as to ensure that the two through holes correspond to the two limiting rods (4);

s2, respectively sleeving two through holes on the stacked integrated circuit boards (17) on the two limiting rods (4) by a worker, supporting the integrated circuit boards (17) on the turntable (3), and positioning the integrated circuit boards (17) between the two grinding wheels (12) so as to fix the integrated circuit boards by the tool at the same time;

s3, a worker controls two piston rods of the double-acting oil cylinder (2) to retract synchronously, the piston rods drive the two mounting plates (6) to move synchronously and oppositely, the mounting plates (6) drive the L plate (9) to move synchronously, and when the grinding wheel (12) is observed to be in contact with the front end surface or the rear end surface of the integrated circuit board (17), the worker immediately closes the double-acting oil cylinder (2), so that the primary positioning of the grinding wheel (12) is realized;

s4, piston rods of two longitudinal oil cylinders (10) are controlled to synchronously extend, the piston rods drive a movable plate (11) to extend, and further a motor (8) and a grinding wheel (12) move towards the direction of an integrated circuit board (17), when the two grinding wheels (12) are observed to be respectively contacted with the front end surface and the rear end surface of the stacked integrated circuit board (17), a worker opens the motor (8) to drive the grinding wheel (12) to rotate, the two grinding wheels (12) respectively start to polish the front end surface and the rear end surface of the integrated circuit board (17), then the worker controls the piston rod of a feeding oil cylinder (7) to do reciprocating linear motion, the feeding oil cylinder (7) enables the grinding wheel (12) to do reciprocating horizontal motion, so that the two grinding wheels (12) respectively polish burrs on the front edge and the rear edge of the integrated circuit board (17), and therefore the burrs on the front edge and the rear edge of the integrated circuit boards are removed;

s5, after removal, operating two piston rods of the double-acting oil cylinder (2) to extend out, driving the mounting plate (6) to reset by the piston rods, further driving the grinding wheel (12) to reset, after the grinding wheel (12) resets, closing the double-acting oil cylinder (2), then controlling the starting of the stepping motor (13), transmitting the torque of the stepping motor (13) to the turntable (3) after the speed of the speed reducer (14) is reduced, and driving the integrated circuit board (17) on the turntable (3) to rotate 180 degrees;

s6, repeating the operation of the steps S2-S4, namely, simultaneously grinding burrs on the other two end surfaces of the integrated circuit boards (17), and thus processing the finished integrated circuit boards;

and S7, taking off the finished integrated circuit boards from the turntable (3) by workers to prepare for polishing the next batch of integrated circuit boards.

Technical Field

The invention relates to the technical field of grinding burrs on the outer end surface of a circuit board, in particular to a grinding device and method for the outer end surface of a ceramic mixed-compression integrated circuit board.

Background

The ceramic mixed-compression integrated circuit board is an indispensable important component in electronic equipment, the manufacturing process of the ceramic mixed-compression integrated circuit board uses a circuit substrate as a raw material and is manufactured by a flattening process, an edge polishing process, an acid cleaning process, an etching process and the like in sequence, wherein the edge polishing process aims at polishing four end faces of the ceramic mixed-compression integrated circuit board to be smooth and further removing burrs on the end faces, so that hands of people are prevented from being stabbed by the burrs or scratches between the circuit board and the circuit board are prevented, and the product quality is further improved.

The existing method for polishing four end faces of the ceramic mixed-compression integrated circuit board mostly adopts manual operation, namely, a worker polishes the four end faces of the ceramic mixed-compression integrated circuit board along the length direction of the outer end face of the ceramic mixed-compression integrated circuit board by using a handheld grinding wheel, although the operation method can polish the four end faces of the ceramic mixed-compression integrated circuit board, after one face is polished, the other face can be polished until the last face is polished, which undoubtedly increases polishing time and further reduces polishing efficiency; the manual grinding undoubtedly increases the working strength of workers. In addition, one worker can only polish the integrated circuit board by one piece, and the number of polished pieces is limited every day, so that the production yield of the integrated circuit board is reduced, and the economic benefit of a circuit board manufacturer is reduced. Therefore, there is a need for an outer end surface polishing device that reduces labor intensity of workers, improves polishing efficiency of integrated circuit boards, and achieves batch polishing.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides the device and the method for polishing the outer end surface of the ceramic mixed-compression integrated circuit board, which have the advantages of compact structure, reduced labor intensity of workers, improved polishing efficiency of the integrated circuit board and realization of batch polishing.

The purpose of the invention is realized by the following technical scheme: the utility model provides an outer terminal surface grinding device of ceramic mixed compression integrated circuit board, which comprises a workbench, set up power unit and the double-acting cylinder on the workstation, install the carousel on power unit's the output shaft, two gag lever posts have set firmly on the top surface of carousel, all be provided with grinding machanism on the effect of two piston rods of double-acting cylinder, grinding machanism includes the mounting panel, feed cylinder and motor, the mounting panel sets firmly on the effect of double-acting cylinder piston rod is served, feed cylinder level sets up and sets firmly on the top surface of mounting panel, the L board has set firmly on the effect of feed cylinder piston rod, vertical hydro-cylinder has set firmly the fly leaf on the effect of vertical hydro-cylinder piston rod, the motor sets firmly on the preceding terminal surface of fly leaf, install the emery wheel on the motor vertically sets up and its output shaft, the emery wheel sets up in the rear side of carousel.

Two grinding machanism around the carousel longitudinal symmetry setting.

The power unit comprises a stepping motor and a speed reducer which are fixedly arranged on the table top of the workbench, an output shaft of the stepping motor is connected with an input shaft of the speed reducer through a coupler, an output shaft of the speed reducer is arranged upwards, and the turntable is arranged on the output shaft of the speed reducer.

The bottom of workstation sets firmly many supporting legs that support in subaerial.

And a support plate is fixedly arranged on a piston rod of the double-acting oil cylinder, and the mounting plate is fixedly arranged on the top surface of the support plate.

The top surface of the L plate is fixedly provided with two guide rails, the bottom surface of the movable plate is provided with two sliding grooves corresponding to the guide rails respectively, and the movable plate is slidably arranged on the guide rails through the sliding grooves.

The device also comprises a controller which is electrically connected with the electromagnetic valve of the longitudinal oil cylinder, the electromagnetic valve of the feeding oil cylinder, the electromagnetic valve of the double-acting oil cylinder, the motor and the stepping motor.

The method for polishing the outer end face of the ceramic mixed-compression integrated circuit board by the polishing device comprises the following steps:

s1, stacking the ceramic mixed-compression integrated circuit boards to be polished, and drilling two through holes on the top of the integrated circuit boards by a drilling machine after stacking the integrated circuit boards to a certain number of layers, so as to ensure that the two through holes correspond to the two limiting rods;

s2, respectively sleeving two through holes on the stacked integrated circuit boards on two limiting rods by a worker, supporting the integrated circuit boards on the turntable, and positioning the integrated circuit boards between two grinding wheels, so that simultaneous tool fixing of the integrated circuit boards is realized;

s3, controlling two piston rods of the double-acting oil cylinder to synchronously retract by workers, driving two mounting plates to synchronously and oppositely move by the piston rods, driving an L plate to synchronously move by the mounting plates, and immediately closing the double-acting oil cylinder by the workers when the grinding wheel is observed to be in contact with the front or rear end face of the integrated circuit board, thereby realizing the primary positioning of the grinding wheel;

s4, controlling piston rods of two longitudinal oil cylinders to synchronously extend, driving a movable plate to extend by the piston rods, further enabling a motor and grinding wheels to move towards the direction of the integrated circuit board, turning on the motor by a worker to drive the grinding wheels to rotate when observing that the two grinding wheels respectively contact the front end surface and the rear end surface of the stacked integrated circuit board, respectively starting to grind the front end surface and the rear end surface of the integrated circuit board by the two grinding wheels, then controlling the piston rod of a feed oil cylinder to do reciprocating linear motion by the worker, enabling the feed oil cylinder to make reciprocating horizontal motion of the grinding wheels, and further enabling the two grinding wheels to respectively grind burrs on the integrated circuit board along the front edge and the rear edge of the integrated circuit board, thereby realizing the removal of the burrs on the front edge and the rear edge of the integrated circuit boards;

s5, after removal, operating two piston rods of the double-acting oil cylinder to extend out, driving the mounting plate to reset by the piston rods, further driving the grinding wheel to reset, after the grinding wheel resets, closing the double-acting oil cylinder, then controlling the stepping motor to start, transmitting the torque of the stepping motor to the turntable after being decelerated by the decelerator, and driving the integrated circuit board on the turntable to rotate 180 degrees;

s6, repeating the operation of the steps S2-S4, namely, simultaneously grinding burrs on the other two end surfaces of the integrated circuit boards, and thus processing the finished integrated circuit boards;

and S7, taking the finished integrated circuit board from the turntable by workers to prepare for polishing the next batch of integrated circuit boards.

The invention has the following advantages: the integrated circuit board polishing device is compact in structure, reduces the labor intensity of workers, improves the polishing efficiency of the integrated circuit board, and realizes batch polishing.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a cross-sectional view A-A of FIG. 1;

FIG. 3 is a cross-sectional view B-B of FIG. 1;

FIG. 4 is a schematic diagram of the operation of the present invention;

FIG. 5 is a cross-sectional view C-C of FIG. 4;

in the figure, 1-a workbench, 2-a double-acting oil cylinder, 3-a rotary table, 4-a limiting rod, 5-a polishing mechanism, 6-a mounting plate, 7-a feeding oil cylinder, 8-a motor, 9-an L plate, 10-a longitudinal oil cylinder, 11-a movable plate, 12-a grinding wheel, 13-a stepping motor, 14-a reducer, 15-a supporting plate, 16-a guide rail and 17-an integrated circuit board.

Detailed Description

The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:

as shown in fig. 1 to 3, an outer end surface polishing device for a ceramic mixed-compression integrated circuit board comprises a workbench 1, a power unit and a double-acting cylinder 2 arranged on the workbench 1, wherein a rotary table 3 is arranged on an output shaft of the power unit, two limiting rods 4 are fixedly arranged on the top surface of the rotary table 3, polishing mechanisms 5 are respectively arranged on action ends of two piston rods of the double-acting cylinder 2, the two polishing mechanisms 5 are symmetrically arranged in front and back of the rotary table 3, each polishing mechanism 5 comprises a mounting plate 6, a feeding cylinder 7 and a motor 8, the mounting plate 6 is fixedly arranged on an action end of a piston rod of the double-acting cylinder 2, the feeding cylinder 7 is horizontally arranged and fixedly arranged on the top surface of the mounting plate 6, an L plate 9 is fixedly arranged on the action end of the piston rod of the feeding cylinder 7, a longitudinal cylinder 10 is fixedly arranged on the top surface of the L plate 9, and a movable plate 11 is fixedly arranged on the action end of the piston rod of the longitudinal cylinder 10, the motor 8 is fixedly arranged on the front end face of the movable plate 11, the motor 8 is longitudinally arranged, an output shaft of the motor 8 is provided with a grinding wheel 12, and the grinding wheel 12 is arranged on the rear side of the rotary table 3. The power unit comprises a stepping motor 13 and a speed reducer 14 which are fixedly arranged on the table surface of the workbench 1, an output shaft of the stepping motor 13 is connected with an input shaft of the speed reducer 14 through a coupler, an output shaft of the speed reducer 14 is arranged upwards, and the rotary disc 3 is arranged on the output shaft of the speed reducer 14.

The bottom of the workbench 1 is fixedly provided with a plurality of supporting legs supported on the ground. A support plate 15 is fixedly arranged on a piston rod of the double-acting oil cylinder 2, and the mounting plate 6 is fixedly arranged on the top surface of the support plate 15. Two guide rails 16 are fixedly arranged on the top surface of the L-plate 9, two sliding grooves corresponding to the guide rails 16 are formed on the bottom surface of the movable plate 11, and the movable plate 11 is slidably mounted on the guide rails 16 through the sliding grooves. The automatic feeding device also comprises a controller, wherein the controller is electrically connected with the electromagnetic valve of the longitudinal oil cylinder 10, the electromagnetic valve of the feeding oil cylinder 7, the electromagnetic valve of the double-acting oil cylinder 2, the motor 8 and the stepping motor 13, and the controller can also control the extension or retraction of the piston rods of the longitudinal oil cylinder 10, the double-acting oil cylinder 2 and the feeding oil cylinder 7, so that the automatic feeding device is convenient for workers to operate and has the characteristic of high automation degree.

The method for polishing the outer end face of the ceramic mixed-compression integrated circuit board by the polishing device comprises the following steps:

s1, stacking the ceramic mixed-compression integrated circuit boards to be polished, and drilling two through holes on the top of the integrated circuit boards by a drilling machine after stacking the integrated circuit boards to a certain number of layers, so as to ensure that the two through holes correspond to the two limiting rods 4;

s2, respectively sleeving two through holes on the stacked integrated circuit boards 17 on the two limiting rods 4 by a worker, supporting the integrated circuit boards 17 on the turntable 3, and enabling the integrated circuit boards 17 to be located between the two grinding wheels 12, so that simultaneous tool fixing of the integrated circuit boards is realized, as shown in FIGS. 4-5;

s3, controlling two piston rods of the double-acting oil cylinder 2 to retract synchronously by workers, driving the two mounting plates 6 to move synchronously and oppositely by the piston rods, driving the L plate 9 to move synchronously by the mounting plates 6, and immediately closing the double-acting oil cylinder 2 by the workers when the grinding wheel 12 is observed to be in contact with the front or rear end face of the integrated circuit board 17, thereby realizing the primary positioning of the grinding wheel 12;

s4, controlling the piston rods of the two longitudinal oil cylinders 10 to synchronously extend, driving the movable plate 11 to extend, further enabling the motor 8 and the grinding wheels 12 to move towards the direction of the integrated circuit board 17, when observing that the two grinding wheels 12 respectively contact the front end surface and the rear end surface of the stacked integrated circuit board 17, opening the motor 8 by a worker to drive the grinding wheels 12 to rotate, respectively starting to polish the front end surface and the rear end surface of the integrated circuit board 17 by the two grinding wheels 12, then controlling the piston rod of the feed oil cylinder 7 to do reciprocating linear motion by the worker, enabling the feed oil cylinder 7 to make the grinding wheels 12 do reciprocating horizontal motion, further enabling the two grinding wheels 12 to respectively polish burrs on the front edge and the rear edge of the integrated circuit board 17, and further realizing the removal of the burrs on the front edge and the rear edge of the plurality of integrated circuit boards;

s5, after removal, operating two piston rods of the double-acting oil cylinder 2 to extend out, driving the mounting plate 6 to reset by the piston rods, further driving the grinding wheel 12 to reset, after the grinding wheel 12 resets, closing the double-acting oil cylinder 2, then controlling the stepping motor 13 to start, transmitting the torque of the stepping motor 13 to the turntable 3 after being decelerated by the decelerator 14, and driving the integrated circuit board 17 on the turntable 3 to rotate 180 degrees;

s6, repeating the operation of the steps S2-S4, namely, simultaneously grinding burrs on the other two end surfaces of the integrated circuit boards 17, and thus processing a finished integrated circuit board; therefore, the polishing device polishes two surfaces of the integrated circuit boards at one time, compared with the traditional polishing method in which one surface is sequentially polished, polishing efficiency is greatly improved, and production yield is further improved. In addition, need not the manual work and polish, very big work intensity that has alleviateed the workman.

S7, the worker takes the finished ic board off the turntable 3 in preparation for polishing the next batch of ic boards.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.