阅读说明：本技术 一种制作三维立体传感器的方法及传感器 (Method for manufacturing three-dimensional sensor and sensor ) 是由 陈涛 黄志颖 刘会聪 王凤霞 杨湛 倪克健 田玉祥 田显东 孙立宁 于 2021-07-14 设计创作，主要内容包括：本发明实施例公开了一种制作三维立体传感器的方法及三维立体传感器。制作三维立体传感器的方法可以继续采用目前成熟的丝网印刷技术进行电路图印制,在印制电路图的时候根据预设的立体三维结构进行电极排布,再结合折叠方法,可以将二维的传感方式转变成具有直观性的三维传感方式。这种方法简单地实现了二维传感方式至三维传感方式地跨越。(The embodiment of the invention discloses a method for manufacturing a three-dimensional sensor and the three-dimensional sensor. The method for manufacturing the three-dimensional sensor can continuously adopt the current mature screen printing technology to print the circuit diagram, electrode arrangement is carried out according to a preset three-dimensional structure when the circuit diagram is printed, and a folding method is combined, so that a two-dimensional sensing mode can be converted into a three-dimensional sensing mode with intuition. The method simply realizes the spanning from a two-dimensional sensing mode to a three-dimensional sensing mode.)

1. A method of fabricating a three-dimensional volumetric sensor, the method comprising the steps of:

step S1: printing a circuit diagram meeting the requirements on a preset substrate by adopting a screen printing technology;

step S2: and folding the preset substrate in a preset folding mode, so that the preset substrate forms a preset three-dimensional structure.

2. The method of claim 1, further comprising a step S12 between the step S1 and the step S2: and printing a folding datum line matched with the three-dimensional structure on the preset substrate.

3. The method of claim 1 or 2, wherein in step S2, a space frame conforming to the predetermined space frame structure is selected, and the predetermined substrate is folded along the space frame in a predetermined folding manner, so as to wrap the space frame inside the predetermined substrate.

4. The method of fabricating a three-dimensional sensor according to claim 3, wherein the predetermined substrate has a shape conforming to a shape of an outer surface of the space frame.

5. The method of claim 1, wherein the predetermined substrate with circuitry formed after the step S1 comprises a substrate layer, an electrode layer and a negative friction layer.

6. The method of claim 1, wherein the positions of the electrodes in the circuit diagram are arranged accordingly according to the predetermined three-dimensional structure.

7. The method of claim 1, wherein the circuit pattern may employ a pattern of common electrodes on each side of the three-dimensional structure.

8. A three-dimensional volumetric sensor, characterized in that it is manufactured by a method according to any one of claims 1 to 7.

9. The three-dimensional sensor according to claim 8, wherein the three-dimensional sensor is capable of sensing the two-dimensional planar motion of the object when the three-dimensional sensor is operated on any side of the three-dimensional sensor.

10. The three-dimensional sensor according to claim 8, wherein said three-dimensional sensor is capable of sensing spatial three-dimensional motion of an object when any plurality of faces of said three-dimensional sensor are combined.

Technical Field

The invention relates to the technical field of sensors, in particular to a method for manufacturing a three-dimensional sensor and a sensor manufactured by the method.

Background

With the development and application of intelligent sensing systems, control interfaces have been widely used in the fields of robots, wearable devices, biomedical devices, and the like as important interactive devices. Among them, the tactile sensor is the most important and complex type of sensor.

Self-powered tactile sensors based on triboelectric effects have been extensively studied since their report in 2012. Self-powered touch sensors based on the triboelectric effect utilize screen printing technology to print electrodes on a specific substrate as a positive friction layer of the sensor. The screen printing technique belongs to the traditional patterning technique and is a two-dimensional (2D) technique. The sensors prepared based on the screen printing technology are all used for recognizing touch and slip signals based on plane operation, and more intuitive three-dimensional sensing and control application cannot be realized.

Therefore, in view of the above technical problems, it is necessary to provide a method for fabricating a three-dimensional sensor and a sensor fabricated by the method.

Disclosure of Invention

In view of the above, the present invention provides a method for fabricating a three-dimensional sensor and a sensor fabricated by the method. The method for manufacturing the three-dimensional sensor can be used for manufacturing the three-dimensional sensor based on the existing screen printing technology and by combining the folding step.

In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:

a method of fabricating a three-dimensional stereo sensor includes step S1: printing a circuit diagram meeting the requirements on a preset substrate by adopting a screen printing technology; step S2: and folding the preset substrate in a preset folding mode, so that the preset substrate forms a preset three-dimensional structure.

As a further improvement of the present invention, between the steps S1 and S2, there is further included a step S12: and printing a folding datum line matched with the three-dimensional structure on the preset substrate.

As a further improvement of the present invention, in step S2, a three-dimensional frame conforming to the preset three-dimensional frame structure is selected, and the preset substrate is folded along the three-dimensional frame in a preset folding manner, so as to wrap the three-dimensional frame inside the preset substrate.

As a further improvement of the invention, the shape of the predetermined substrate is in conformity with the shape of the outer surface of the space frame.

As a further improvement of the present invention, the predetermined substrate with circuit formed after the step S1 includes a substrate layer, an electrode layer and a negative friction layer.

As a further improvement of the invention, the positions of the electrodes in the circuit diagram are correspondingly arranged according to the preset three-dimensional structure.

As a further development of the invention, the circuit diagram may employ a pattern of common electrodes on each face of the three-dimensional structure.

The embodiment of the invention also provides a three-dimensional sensor which is manufactured by adopting any one of the methods.

As a further improvement of the invention, when any one surface of the three-dimensional stereo sensor works, the three-dimensional stereo sensor can realize the two-dimensional plane motion perception of the object.

As a further improvement of the invention, when any plurality of surfaces of the three-dimensional stereo sensor work in combination, the three-dimensional stereo sensor can realize the spatial three-dimensional motion perception of the object.

The invention has the following advantages:

the embodiment of the invention provides a method for manufacturing a three-dimensional sensor, which can continuously adopt the current mature screen printing technology to print a circuit diagram, carry out electrode arrangement according to a preset three-dimensional structure when printing the circuit diagram, and can convert a two-dimensional sensing mode into a three-dimensional sensing mode with intuition by combining a folding method. The method simply realizes the spanning from a two-dimensional sensing mode to a three-dimensional sensing mode.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic flow chart illustrating a method for manufacturing a three-dimensional sensor according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a circuit diagram of a screen printing process in a method for fabricating a three-dimensional sensor according to an embodiment of the present invention;

fig. 3 is a schematic diagram illustrating a folding process in a method for manufacturing a three-dimensional sensor according to an embodiment of the present invention;

fig. 4 is a schematic diagram of a folding process in the method for manufacturing a three-dimensional sensor according to the second embodiment of the present invention;

fig. 5 is a schematic diagram illustrating a two-dimensional plane control principle of a three-dimensional sensor according to an embodiment of the present invention;

fig. 6 is an expanded schematic view of six faces of a hexahedral three-dimensional sensor according to an embodiment of the present invention.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, a flow chart of a method for manufacturing a three-dimensional sensor according to an embodiment of the present invention is schematically illustrated. The method for manufacturing the three-dimensional sensor comprises the following two steps.

Step S1: and printing a circuit diagram meeting the requirement on a preset substrate by adopting a screen printing technology. Referring to fig. 2, a schematic diagram of a circuit diagram of a screen printing in a method for manufacturing a three-dimensional sensor according to an embodiment of the present invention is shown. And the positions of the electrodes in the circuit diagram are correspondingly arranged according to the preset three-dimensional structure. Further, the circuit diagram may employ a pattern of common electrodes on each side of the three-dimensional structure. The drawing person can arrange the positions of the electrodes and/or consider the common electrode according to the shape of the three-dimensional structure and the function to be realized by the circuit diagram. Through various different arrangement combinations, the three-dimensional sensor can realize various sensing corresponding relations.

Preferably, between step S1 and step S2, step S12 is further included: and printing a folding datum line matched with the three-dimensional structure on the preset substrate. The operator can fold according to folding the datum line, reduces the degree of difficulty of follow-up folding step effectively. In this embodiment, the solid lines in fig. 2 represent circuit traces, the solid-line block diagram in fig. 2 represents electrodes, and the broken lines in fig. 2 represent folding reference lines.

The predetermined substrate 10 having the circuit formed after the step S1 includes a substrate layer, an electrode layer, and a negative friction layer. In this embodiment, the substrate layer is the bottom layer, and the material used for the substrate layer is poly-p-phenylene terephtalate (PET). The electrode layer is an intermediate layer, i.e. an electrode made on the base layer by screen printing. The electrode may also be referred to as the positive friction layer of the sensor. The electrode is made of metal material, such as silver, copper or aluminum. The negative friction layer is the uppermost layer and is made of Polyimide (PI) film material, polytetrafluoroethylene (Teflon or PTFE), polyvinylidene fluoride (PVDF) or fluorinated ethylene propylene copolymer (FEP) and the like.

Step S2: and folding the preset substrate 10 in a preset folding manner, so as to form a preset three-dimensional structure on the preset substrate. As shown in fig. 3, a schematic diagram of a folding process in a method for manufacturing a three-dimensional sensor according to an embodiment of the present invention is provided. According to the steps shown in fig. 3, the predetermined substrate 10 after the completion of step S1 may be formed into a predetermined three-dimensional structure, thereby obtaining the three-dimensional sensor 100. In this embodiment, the predetermined three-dimensional structure is a cube. Of course, in other embodiments, the predetermined three-dimensional structure may have other three-dimensional shapes. It is only necessary to ensure that the shape of the predetermined substrate is consistent with the shape of the outer surface of the space frame.

As shown in fig. 4, a schematic diagram of a folding process in the method for manufacturing a three-dimensional sensor according to the second embodiment of the present invention is provided. Preferably, in step S2, a space frame 20 corresponding to the preset space frame structure is selected, and the preset substrate 10 is folded along the space frame 20 in a preset folding manner, so that the space frame 20 is wrapped inside the preset substrate 10. By wrapping a space frame 20, the three-dimensional sensor 100 is more stable. The space frame 20 may be obtained using 3D printing technology.

The method for manufacturing the three-dimensional sensor provided by the embodiment of the invention can continuously adopt the current mature screen printing technology to print the circuit diagram, electrode arrangement is carried out according to the preset three-dimensional structure when the circuit diagram is printed, and a folding method is combined, so that a two-dimensional sensing mode can be converted into a three-dimensional sensing mode with intuition. The method simply realizes the spanning from a two-dimensional sensing mode to a three-dimensional sensing mode.

The embodiment of the invention also provides a three-dimensional sensor 100, which is manufactured by adopting any one of the methods. When any one surface of the three-dimensional sensor works, the three-dimensional sensor can realize the two-dimensional plane motion perception of an object; when any plurality of surfaces of the three-dimensional sensor work in a combined mode, the three-dimensional sensor can realize space three-dimensional motion perception of an object.

As shown in fig. 5, a schematic diagram of a two-dimensional plane control principle of a three-dimensional stereo sensor according to an embodiment of the present invention is provided. The top view structure on the three-dimensional stereo sensor can realize the movement of an object in a two-dimensional plane, such as controlling the movement of a trolley in the two-dimensional plane. In fig. 5, E1, E2, E3, and E4 represent forward, left, rear, and right movements, respectively. By sliding or knocking the corresponding electrode position by the finger, a corresponding signal can be generated to move towards the corresponding direction. Meanwhile, the three-dimensional sensor can realize the steering of the object in a two-dimensional plane. Such as: when the finger quickly passes through the E1 and the E2 or the electrodes E1 and the E2 at the same time, two signals can be generated simultaneously, and the trolley can realize the left-turning movement through a programmed program. Similarly, when the E1 and E4 signals are generated simultaneously, the trolley can realize the right-turn movement.

As shown in fig. 6, an expanded view of six faces of a hexahedral three-dimensional sensor according to an embodiment of the present invention is provided. In this embodiment, the three-dimensional motion of the object in space can be realized by the electrode arrangement set on each surface and the L-shaped and U-shaped common electrodes. On the basis of controlling the movement in the X and Y directions as shown in fig. 5, the up-and-down movement of the object in the Z-axis direction can be realized by adding the E7 and E8 electrodes of the front view. E7 represents positive motion along the Z-axis, and E8 represents negative motion along the Z-axis. The left and right views are L-shaped electrodes E6 and E9, and the rear view is electrode E5. Through the electrode distribution of the top view and the front view, XYZ three-degree-of-freedom linear motion can be realized. In addition, the controller may also effect rotational movement along various axes. For example: when the finger is swiftly slid over, or clicks on the E4 and E6 electrodes simultaneously, the controller is caused to generate two electrical signals simultaneously, which by a programmed program, are caused to produce a rotational movement in the clockwise direction along the X-axis. Similarly, the signals of E2 and E9 correspond to a counterclockwise rotation of the X-axis. Signals of E1 and E5 correspond to rotation of the Y axis in a clockwise direction; the signals of E3 and E7 correspond to a counterclockwise rotation of the Y-axis. Signals of E6 and E7 correspond to clockwise rotation of the Z axis; the signals of E7 and E9 correspond to a counterclockwise rotation of the Z axis.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.