阅读说明：本技术 芯片系统及相关装置 (Chip system and related device ) 是由 李波 于 2020-06-30 设计创作，主要内容包括：本申请公开了一种芯片系统及相关装置,该芯片系统包括SoC,该SoC包括主功耗控制单元PMU以及多个电源域模块,所述多个电源域模块中的每一电源域模块对应一个PMU,所述多个电源域模块中的每一电源域模块对应的PMU均连接所述主PMU；所述主PMU,用于通过预设信号实现所述主PMU与目标电源域模块对应的PMU之间的通信,所述目标电源域模块为所述多个电源域模块中的至少一个电源域模块,所述预设信号为握手信号或者控制信号。采用本申请实施例一方面,由于分布式功耗管理控制方案将控制器进行了拆分,使得每个控制器的功能更简洁,另一方面,由于主PMU和各电源域模块之间只有握手信号,使得交互信号数量较少,节省了布局布线资源、降低了物理实现难度。(The application discloses a chip system and a related device, wherein the chip system comprises an SoC (system on chip), the SoC comprises a main power consumption control unit (PMU) and a plurality of power domain modules, each power domain module in the plurality of power domain modules corresponds to one PMU, and the PMU corresponding to each power domain module in the plurality of power domain modules is connected with the main PMU; the main PMU is used for realizing communication between the main PMU and the PMU corresponding to the target power domain module through a preset signal, the target power domain module is at least one power domain module in the plurality of power domain modules, and the preset signal is a handshake signal or a control signal. By adopting the embodiment of the application, on one hand, the controller is split by the distributed power management control scheme, so that the function of each controller is simpler, and on the other hand, only handshake signals are arranged between the main PMU and each power domain module, so that the number of interaction signals is less, the layout and wiring resources are saved, and the physical realization difficulty is reduced.)

1. A chip system comprises a SoC, and is characterized in that the SoC comprises a main power consumption control unit (PMU) and a plurality of power domain modules, each power domain module in the plurality of power domain modules corresponds to one PMU, and the PMU corresponding to each power domain module in the plurality of power domain modules is connected with the main PMU;

the main PMU is used for realizing communication between the main PMU and the PMU corresponding to the target power domain module through a preset signal, the target power domain module is at least one power domain module in the plurality of power domain modules, and the preset signal is a handshake signal or a control signal.

2. The system-on-chip of claim 1, wherein the main PMU is located at a top layer of the SoC, and wherein the corresponding PMU for each of the plurality of power domain modules is located at a bottom layer of the SoC.

3. The chip system according to claim 1 or 2, wherein each of the plurality of power domain modules comprises a plurality of power consumption control standard cells, and each of the plurality of power consumption control standard cells is connected to a corresponding PMU.

4. The system-on-chip of any of claims 1-3, wherein the master PMU is further configured to handle system-level power consumption monitoring and dynamic power consumption regulation of the SoC.

5. The system-on-chip of claim 4, wherein, in the processing of power consumption monitoring and dynamic power consumption regulation at a system level of the SoC, the master PMU is specifically configured to:

optimizing thermal power consumption of the SoC when power consumption of a power domain module i exceeds a preset threshold, wherein the power domain module i is at least one power domain module in the plurality of power domain modules;

alternatively, the first and second electrodes may be,

when the thermal power consumption of the main PMU of the SoC reaches a preset upper limit range, optimizing the system performance of the SoC, specifically comprising the following steps: and adjusting the working parameters of the PMU corresponding to each power domain module in the plurality of power domain modules to realize the adjustment of the power consumption of the corresponding power domain module.

6. The chip system according to any one of claims 1 to 5, wherein in the aspect of the communication between the main PMU and the PMU corresponding to the target power domain module through the preset signal, the main PMU is specifically configured to:

receiving a status indication signal sent by a PMU corresponding to each of the plurality of power domain modules;

determining a target regulation parameter of a PMU corresponding to each power domain module in the plurality of power domain modules according to a pre-stored overall power consumption budget of the SoC and the state indication signal, and generating a corresponding power consumption management instruction according to the target regulation parameter;

and pushing the power consumption management instruction to the corresponding PMU so as to instruct the corresponding power domain module of the PMU to execute corresponding operation.

7. The chip system according to claim 6, wherein the status indication signal is at least one of: task load status, temperature, power domain status, voltage step, clock frequency, and clock switch.

8. The chip system according to claim 6 or 7, wherein the target tuning parameters comprise at least one of: a task load state adjustment parameter, a temperature adjustment parameter, a power domain switch state parameter, a voltage adjustment parameter, a clock frequency adjustment parameter, and a clock switch state parameter.

9. The chip system according to any of claims 1-8, wherein the plurality of power domain modules comprises at least two of a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a Digital Signal Processor (DSP), a communication baseband system, an audio system, a video system, and a display system.

10. A chip comprising a chip system according to any one of claims 1 to 9.

11. An electronic device, characterized in that the electronic device comprises a chip according to claim 10 or a chip system according to any one of claims 1-9.