阅读说明：本技术 树脂成形品的制造方法及树脂成形装置 (Method for producing resin molded article and resin molding apparatus ) 是由 梅木健志 片山雅之 于 2021-04-01 设计创作，主要内容包括：本发明提供一种树脂成形品的制造方法及树脂成形装置,即使液状树脂的喷出量超过目标值,也可不废弃成形对象物而进行树脂成形。所述树脂成形品的制造方法,包括：将液状树脂喷出到脱模膜上的液状树脂喷出步骤；对喷出到所述脱模膜上的所述液状树脂的重量进行计量的计量步骤；以及判定所述液状树脂的重量是正常还是异常的重量判定步骤,在所述重量判定步骤中所述液状树脂的重量正常的情况下,使用喷出到所述脱模膜的所述液状树脂进行树脂成形,在所述重量判定步骤中所述液状树脂的重量异常的情况下,废弃喷出有所述液状树脂的所述脱模膜。(The invention provides a method for manufacturing a resin molded product and a resin molding device, which can perform resin molding without discarding a molding object even if the ejection amount of liquid resin exceeds a target value. The method for producing a resin molded article includes: a liquid resin ejecting step of ejecting liquid resin onto the release film; a measuring step of measuring the weight of the liquid resin discharged onto the release film; and a weight determination step of determining whether the weight of the liquid resin is normal or abnormal, wherein when the weight of the liquid resin is normal in the weight determination step, resin molding is performed using the liquid resin discharged to the mold release film, and when the weight of the liquid resin is abnormal in the weight determination step, the mold release film from which the liquid resin has been discharged is discarded.)

1. A method for producing a resin molded article, comprising:

a liquid resin ejection step of ejecting liquid resin onto the release film;

a measuring step of measuring the weight of the liquid resin discharged onto the release film; and

a weight determination step of determining whether the weight of the liquid resin is normal or abnormal, and

performing resin molding using the liquid resin discharged to the release film when the weight of the liquid resin is normal in the weight determination step,

in the weight judging step, when the weight of the liquid resin is abnormal, the release film from which the liquid resin is discharged is discarded.

2. The method of producing a resin molded article according to claim 1, wherein the liquid resin ejection step includes a plurality of ejection steps, and the second and subsequent ejection steps include a calculation step of calculating an ejection amount based on a difference between the ejection amount in an immediately preceding ejection step and a target value.

3. The method of producing a resin molded article according to claim 1 or 2, further comprising a conveying step of conveying the release film from which the liquid resin is ejected to a molding die when the weight of the liquid resin is normal in the weight determination step.

4. The method of manufacturing a resin molded article according to claim 3, further comprising a resin molding step of performing resin molding by closing a molding die after the conveying step.

5. A resin forming apparatus comprising:

the forming die comprises an upper die and a lower die opposite to the upper die;

a mold clamping mechanism for clamping the molding die;

a liquid resin ejecting mechanism for ejecting liquid resin onto the release film; and

a control unit for determining the weight of the liquid resin,

the control unit determines whether the weight of the liquid resin is normal or abnormal, and

controlling the liquid resin discharged to the release film to perform resin molding when the weight of the liquid resin is normal,

when the weight of the liquid resin is abnormal, the control is performed so as to discard the release film from which the liquid resin has been discharged.

6. The resin molding apparatus according to claim 5, wherein the control unit controls the liquid resin ejection mechanism to perform ejection a plurality of times, and ejects, in the second and subsequent ejections, an ejection rate calculated based on a difference between a previous ejection rate and a target value.

Technical Field

The present invention relates to a method for producing a resin molded article and a resin molding apparatus.

Background

Patent document 1 discloses a resin molding apparatus in which, prior to resin molding, a piston 18c of a dispensing Unit (Dispense Unit)18 is moved downward by a drive source such as an air cylinder or a motor and is pushed into a syringe (syring) 19, thereby ejecting liquid resin from a nozzle 19a and supplying the resin to a workpiece W, as shown in fig. 6.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent laid-open No. 2012-114285

Disclosure of Invention

[ problems to be solved by the invention ]

In the resin molding device described in patent document 1, since the liquid resin is directly discharged from the distribution unit to the work, it is difficult to remove only the liquid resin from the work when the discharge amount of the liquid resin exceeds the allowable range. Therefore, if the discharge amount of the liquid resin exceeds the allowable range, the liquid resin must be discarded together with the workpiece. For example, when the wafer size is Φ 300 and the semiconductor chip size is 3mm × 3mm, about 3600 semiconductor chips are mounted on the wafer as the workpiece, and if the workpiece is discarded, 3600 semiconductor chips are lost.

Accordingly, a main object of the present invention is to perform resin molding without discarding a molding object even if the discharge amount of a liquid resin exceeds a target value.

[ means for solving problems ]

In order to solve the above problems, a method for producing a resin molded article according to the present invention includes: a liquid resin ejecting step of ejecting liquid resin onto the release film; a measuring step of measuring the weight of the liquid resin discharged onto the release film; and a weight determination step of determining whether the weight of the liquid resin is normal or abnormal, wherein when the weight of the liquid resin is normal in the weight determination step, resin molding is performed using the liquid resin discharged to the mold release film, and when the weight of the liquid resin is abnormal in the weight determination step, the mold release film from which the liquid resin has been discharged is discarded.

In order to solve the above problem, a resin molding apparatus according to the present invention includes: a forming die comprising an upper die and a lower die opposite to the upper die; a mold clamping mechanism for clamping the molding die; a liquid resin ejecting mechanism for ejecting liquid resin onto the release film; and a control unit for determining whether the weight of the liquid resin is normal or abnormal, wherein the control unit controls the resin molding using the liquid resin discharged to the release film when the weight of the liquid resin is normal, and controls the release film from which the liquid resin is discharged to be discarded when the weight of the liquid resin is abnormal.

[ Effect of the invention ]

According to the present invention, even if the discharge amount of the liquid resin exceeds a target value, resin molding can be performed without discarding the molding object.

Drawings

Fig. 1 is a schematic plan view showing an overall configuration of a resin molding apparatus according to an embodiment of the present invention.

Fig. 2 is a sectional view of a main part showing a schematic configuration of a part of the resin supply module.

Fig. 3 is a sectional view of a main part showing a schematic structure of a resin molding module.

Fig. 4 is a flowchart showing a resin molding operation according to an embodiment of the present invention.

Fig. 5 is a flowchart showing a resin molding operation according to an embodiment of the present invention.

[ description of symbols ]

1: resin molding apparatus

5: substrate before forming

6: substrate after forming

10: mold release film cutting module

11: roll-shaped demoulding film

12: mold release film

13: film placing table

14: film holder

20: resin supply module

21: resin conveying mechanism

22: film recovery mechanism

23: resin ejection part/liquid resin ejection mechanism

24: membrane adsorption platform

25: metering device

30: resin molding module

31: forming die

32: lower die

32 a: side member

32 b: bottom surface member

33: chamber

34: upper die

35: mould clamping mechanism

40: transport module

41: substrate loader

42: adsorption hand moving mechanism

43: adsorption hand

45: substrate accommodating part before forming

46: formed substrate storage part

70: liquid resin

CTR: control unit

X, Y, Z, θ: direction of rotation

S100, S110, S120, S130, S140, S150, S200, S210, S220, S230, S240, S250, S260, S270: step (ii) of

Detailed Description

Embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same or corresponding portions are denoted by the same reference numerals, and description thereof will not be repeated. In the present specification, the term "liquid" of a liquid resin means that the resin is liquid at ordinary temperature and has fluidity.

< integral Structure of resin Molding apparatus 1 >

The structure of the resin molding apparatus 1 according to the present embodiment will be described with reference to fig. 1 to 3. A resin molding apparatus 1 shown in fig. 1 is a resin molding apparatus 1 that performs resin molding by a compression molding method.

As shown in fig. 1, the resin molding apparatus 1 of the embodiment includes, from the right side of the figure, a mold release film cutting module 10, a resin supply module 20, a resin molding module 30, and a conveying module 40. Each module is independently separated, but can be mutually detached and increased and decreased relative to the adjacent modules. For example, 2 or 3 resin molding modules 30 may be disposed between the resin supply module 20 and the transfer module 40.

As shown in fig. 1, the mold release film cutting module 10 mainly includes: a roll-shaped release film 11, a film mounting table 13, and a film holder 14. A long release film is drawn out from the roll-shaped release film 11 by a film holder 14, and a part of the release film is disposed so as to cover the film mounting table 13. The release film 12 having a circular shape can be obtained by cutting it into a circular shape with a cutter. The film stage 13 is movable in the X, Y, and Z directions and is movable between the mold release film cutting module 10 and the resin supply module 20. The shape of the release film 12 is not particularly limited to a circular shape, and may be, for example, a rectangular shape.

As shown in fig. 1, the resin supply module 20 mainly includes: a resin conveying mechanism 21, a film recovery mechanism 22, a liquid resin ejection mechanism 23, a film suction table 24, and a control unit CTR. The resin conveying mechanism 21 and the film recovery mechanism 22 are integrally configured and movable between the mold release film cutting module 10 and a resin molding module 30 described later. The resin transfer mechanism 21 can transfer the release film 12 supplied with the liquid resin 70 to a forming die 31 described later. The film recovery mechanism 22 can recover the used release film 12 from the inside of the molding die 31. As shown in fig. 2, the liquid resin ejection mechanism 23 can supply liquid resin from a nozzle (not shown) onto the release film 12. The film adsorption stage 24 can adsorb and hold the cut release film 12. A meter 25 is provided below the film adsorption table 24, and the meter 25 can measure the weight of the liquid resin 70 discharged onto the release film 12. The control unit CTR may determine the weight of the liquid resin 70, more specifically, whether the weight of the liquid resin 70 supplied to the release film 12 is normal or abnormal. The control unit CTR may control the resin molding using the liquid resin 70 discharged to the release film 12 when the weight of the liquid resin 70 is normal, and may control the release film 12 from which the liquid resin 70 is discharged to be discarded when the weight of the liquid resin 70 is abnormal. The control unit CTR controls the liquid resin ejection mechanism 23 to perform ejection a plurality of times, and in the second and subsequent ejections, the ejection amount calculated based on the difference between the previous ejection amount and the target value can be ejected.

As shown in fig. 1 and 3, the resin molding module 30 mainly includes a molding die 31 and a clamping mechanism 35. The molding die 31 includes an upper die 34 and a lower die 32 facing the upper die 34. Lower die 32 includes a side surface member 32a constituting a side surface of cavity 33 and a bottom surface member 32b constituting a bottom surface of cavity 33. The side surface member 32a and the bottom surface member 32b form a cavity 33 in the form of a recess for storing the liquid resin 70. The side surface member 32a and the bottom surface member 32b include an adsorption groove (not shown) for adsorbing the release film 12. The release film 12 supplied with the liquid resin 70 is transferred from the resin supply module 20 to the molding die 31 by the resin transfer mechanism 21, and is disposed on the cavity 33 of the lower die 32. In the resin molding module 30, the molding die 31 is clamped by the clamping mechanism 35, and the pre-molding substrate 5 on which the chip as the object to be molded is mounted is resin-molded, whereby the post-molding substrate 6 in which the chip is resin-sealed can be formed. Examples of the substrate include a semiconductor substrate such as a silicon wafer, a lead frame, a printed wiring board, a metal substrate, a resin substrate, a glass substrate, and a ceramic substrate. In addition, the substrate may be a carrier for Fan-Out Wafer Level Packaging (FOWLP) or Fan-Out Panel Level Packaging (FOPLP). Further, the substrate may be a substrate on which wiring is already formed, or may be a substrate on which no wiring is formed.

As shown in fig. 1, the transfer module 40 mainly includes a substrate loader 41, an adsorption hand 42, an adsorption hand moving mechanism 43, a pre-molding substrate storage section 45, and a post-molding substrate storage section 46. The substrate loader 41 can hold the substrate and move between the resin molding module 30 and the transfer module 40. The suction hand 42 is provided with a suction hand moving mechanism 43, and the suction hand moving mechanism 43 can move the suction hand 42 in the X direction, the Y direction, and the Z direction and rotate in the θ direction. The rotation may be performed by rotating the suction hand 42 in the horizontal direction, or by rotating the suction hand 42 in the vertical direction and reversing the rotation. The suction hand 42 can suction and hold the pre-mold substrate 5 stored in the pre-mold substrate storage 45, and can convey it to the substrate loader 41 by the suction hand moving mechanism 43. The suction hand 42 can suction-hold the molded substrate 6 held by the substrate loader 41, and can store the substrate in the molded substrate storage 46 by the suction hand moving mechanism 43.

< method for producing resin molded article Using resin Molding apparatus 1 >

Next, an example of a method for producing a resin molded product according to the present embodiment using the resin molding apparatus 1 according to the present embodiment will be described with reference to fig. 1 to 4. Fig. 4 is a flowchart showing a resin molding operation according to the present embodiment. In the present embodiment, a wafer having a circular shape is used as a substrate on which chips are mounted, but the substrate is not particularly limited to a wafer and may have a rectangular shape.

First, as shown in fig. 1, the suction hand 42 is inserted to the lower side of the pre-mold substrate 5 on which the chips housed in the pre-mold substrate housing unit 45 are mounted, and after the pre-mold substrate 5 is sucked, the pre-mold substrate 5 is taken out from the pre-mold substrate housing unit 45. Here, the substrate is taken out from the pre-molding substrate housing section 45 with the mounting side of the chip as the upper side.

Next, the substrate sucked by the suction hand 42 is inverted, and the chip mounting side of the substrate is set to the lower side. Then, the suction hand 42 is moved by the suction hand moving mechanism 43, and the substrate 5 before molding is transferred to the substrate loader 41 with the chip mounting surface of the substrate sucked by the suction hand 42 as the lower side.

At this time, in the mold release film cutting module 10, the mold release film 12 is being cut. The roll-shaped release film 11 is drawn out onto the film mounting table 13 by the film holder 14, and the release film 11 is cut by a cutter (not shown) to form the release film 12 having a circular shape.

The film stage 13 holding the release film 12 by suction is moved to the front of the resin transfer mechanism 21. The resin transfer mechanism 21 moves above the film mounting table 13, receives the release film 12, and transfers the release film to the film suction table 21 of the resin supply module 20. The resin conveying mechanism 21 is in a state where the release film 12 is positioned above the film suction table 24. The film suction table 24 receives the release film 12 from the resin conveying mechanism 21, and then sucks and holds the release film 12.

The operation after the liquid resin is discharged will be described with reference to the flowchart of fig. 4. After the release film 12 is sucked and held on the film suction table 24, the liquid resin 70 is discharged onto the release film 12 from the liquid resin discharge mechanism 23 (liquid resin discharge step S100).

The weight of the liquid resin 70 discharged onto the release film 12 is measured by the meter 25 shown in fig. 2 (measuring step S110).

After the metering step S110, the control unit CTR determines whether the weight of the liquid resin 70 is normal or abnormal (weight determination step S120). More specifically, the control unit CTR determines whether the weight of the liquid resin 70 is greater than a target value. The target value is not limited to a single discharge amount value, but may be a range of an allowable discharge amount. The target value is the amount of resin to be finally ejected.

When the weight of the liquid resin 70 is normal, that is, when the weight of the liquid resin 70 is not more than the target value, resin molding is performed using the liquid resin 70 discharged to the release film 12 as described later.

When the weight of the liquid resin 70 is abnormal, that is, when the weight of the liquid resin 70 is greater than the target value, the release film on which the liquid resin 70 is discharged is discarded (S150). In recent years, products having a very thin package thickness have increased, and for example, products having a package thickness of 0.38mm or 0.43mm or the like have been required. In this way, in a product having a thin package thickness, the molding quality greatly varies depending on the supply amount of the liquid resin 70. Therefore, when the discharge amount of the liquid resin 70 exceeds the target value, the liquid resin 70 is discarded together with the release film 12, and the liquid resin 70 is discharged again. Since the liquid resin 70 is discharged onto the release film 12, the liquid resin 70 can be discarded without discarding the pre-molding substrate 5 on which the chip is mounted. In addition, this can produce a product with a target package thickness, and can improve the molding quality.

When the weight of the liquid resin 70 is normal, the release film 12 on which the liquid resin 70 is discharged is conveyed to the molding die 31 (conveying step S130). The release film 12 on which the liquid resin 70 is discharged is conveyed between the upper die 34 and the lower die 32 of the resin molding module 30 by the resin conveying mechanism 21. Before the release film 12 is placed on the mold 31, the substrate loader 41 holding the pre-mold substrate 5 is moved between the upper mold 34 and the lower mold 32, and the pre-mold substrate 5 is placed on the upper mold 34 so that the chip mounting side is on the lower side.

As shown in fig. 3, the release film 12 fed between the upper mold 34 and the lower mold 32 by the resin feed mechanism 21 is disposed in the cavity 33 including the side surface member 32a and the bottom surface member 32b of the lower mold 32. After the release film 12 is disposed in the cavity 33, the release film 12 is sucked by suction grooves (not shown) of the side surface member 32a and the bottom surface member 32 b.

As shown in fig. 3, after the mold release film 12 is sucked and held by the cavity 33, the mold 31 with the mold release film 12 conveyed thereto is clamped and resin molding is performed (resin molding step S140). Specifically, the lower mold 32 is raised by the mold clamping mechanism 35. Thereby, the upper mold 34 and the lower mold 32 are brought close to each other and clamped, and the chip mounted on the lower surface of the substrate 5 before molding is immersed in the liquid resin 70 in the cavity 33. In this state, the liquid resin 70 is heated and cured, and the pre-molding substrate 5 can be resin-molded, whereby the post-molding substrate 6 having the chips sealed with the resin can be manufactured. After the resin molding, the lower die 32 is lowered by the die clamping mechanism 35. Thereby, the upper mold 34 and the lower mold 32 are separated from each other to open the mold.

The molded substrate 6 is taken out from the upper die 34 by the substrate loader 41, and is held with the chip mounting side as the lower side. Then, the substrate loader 41 moves from the resin molding module 30 to the transfer module 40. Here, the release film 12 remaining in the chamber 33 is recovered by the film recovery mechanism 22 and discarded into an unnecessary film cassette (not shown).

After the molded substrate 6 held by the substrate loader 41 is conveyed to the transfer module 40, the suction hand 42 holds the chip mounting side as the lower side, and the suction hand 42 sucks and holds the chip. Thereafter, the molded substrate 6 held by the suction hand 42 is inverted so that the chip mounting side of the substrate 6 is on the upper side, and the suction hand is moved by the suction hand moving mechanism 43. Then, the suction hand 42 accommodates the molded substrate 6 in the molded substrate accommodating portion 46 with the mounting side of the chip being the upper side.

< other embodiments >

Next, another embodiment will be described with reference to a flowchart showing a resin molding operation shown in fig. 5. In the above embodiment, the liquid resin 70 is discharged and the weight of the liquid resin 70 discharged onto the release film 12 is measured at one time, but as shown in fig. 5, the discharge amount of the liquid resin 70 may be repeated a plurality of times until the discharge amount approaches the target value.

The operation before the measurement step S210 shown in fig. 5 is the same as that in the above embodiment, and therefore, the description thereof is omitted.

After the metering step S210, the control unit CTR determines whether the weight of the liquid resin 70 is normal or abnormal (weight determination step S220). More specifically, the control unit CTR determines whether the weight of the liquid resin 70 is less than a target value.

When the weight of the liquid resin 70 is smaller than the target value, the control unit CTR calculates the ejection rate based on the difference between the ejection rate in the immediately preceding ejection step and the target value (calculating step S230).

After the calculation step S230, the process returns to the resin ejection step S200, and the liquid resin 70 is ejected based on the calculated ejection amount. In this manner, the resin ejection step S200 includes a plurality of ejection steps, and in the second and subsequent ejection steps, the ejection amount is calculated based on the difference between the ejection amount in the immediately preceding ejection step and the target value (calculation step S230). This makes it possible to bring the discharge amount of the liquid resin 70 closer to the target value, and to improve the molding quality. Further, as shown in fig. 5, when the liquid resin 70 is discharged in a plurality of times, for example, the first discharge amount may be set to be smaller than the target value and discharged, and the second time and thereafter, the discharge amount calculated based on the difference between the discharge amount in the immediately preceding discharge step and the target value may be discharged. Thus, the liquid resin 70 can be discharged so as not to exceed a target value, and waste of the liquid resin 70 can be suppressed.

When the weight of the liquid resin 70 is not less than the target value, the process proceeds to the next weight determination step (S240). The operations after the weight determination step S240 are the same as those in the above embodiment, and therefore, are omitted.

As described above, the method for producing a resin molded article according to the present embodiment includes: a liquid resin ejection step of ejecting liquid resin 70 onto release film 12; a measuring step of measuring the weight of the liquid resin 70 discharged onto the release film 12; and a weight determination step of determining whether the weight of the liquid resin 70 is normal or abnormal, wherein when the weight of the liquid resin 70 is normal in the weight determination step, resin molding is performed using the liquid resin 70 discharged to the release film 12, and when the weight of the liquid resin 70 is abnormal in the weight determination step, the release film 12 from which the liquid resin 70 has been discharged is discarded.

Thus, even if the discharge amount of the liquid resin 70 exceeds a target value, resin molding can be performed without discarding the molding object. Since the liquid resin 70 is discharged onto the release film 12, only the liquid resin 70 can be discarded without discarding the substrate 5 before molding on which the chip as the object to be molded is mounted. Further, since resin molding is not performed using the liquid resin 70 exceeding the target value, a product having a target package thickness can be produced, and molding quality can be improved.

The liquid resin ejection step includes a plurality of ejection steps, and the second and subsequent ejection steps include a calculation step of calculating an ejection amount based on a difference between the ejection amount in the immediately preceding ejection step and a target value.

This makes it possible to bring the discharge amount of the liquid resin 70 closer to the target value, and to improve the molding quality. In addition, the liquid resin 70 can be discharged so as not to exceed a target value, and thus the waste of the liquid resin 70 can be suppressed.

Further, the method includes a conveying step of conveying the release film 12, on which the liquid resin 70 is discharged, to the molding die 31 when the weight of the liquid resin is normal in the weight determination step.

Thus, only the release film 12 having a normal weight of the liquid resin 70 can be conveyed to the molding die 31.

Further, after the conveying step, a resin molding step of performing resin molding by closing the mold 31 is further included.

Thus, a resin molded product can be produced with an appropriate amount of the liquid resin 70.

Further, the resin molding apparatus of the present embodiment includes: the mold includes a mold 31 including an upper mold 34 and a lower mold 32 opposed to the upper mold 34, a mold clamping mechanism 35 for clamping the mold 31, a liquid resin ejection mechanism 23 for ejecting a liquid resin 70 onto a release film 12, and a control unit CTR for determining a weight of the liquid resin 70, wherein the control unit CTR determines whether the weight of the liquid resin 70 is normal or abnormal, controls the resin molding by using the liquid resin 70 ejected onto the release film 12 when the weight of the liquid resin 70 is normal, and controls the release film 12 ejected with the liquid resin 70 to be discarded when the weight of the liquid resin 70 is abnormal.

Thus, even if the discharge amount of the liquid resin 70 exceeds a target value, resin molding can be performed without discarding the molding object. Since the liquid resin 70 is discharged onto the release film 12, only the liquid resin 70 can be discarded without discarding the substrate 5 before molding on which the chip as the object to be molded is mounted. Further, since resin molding is not performed using the liquid resin 70 exceeding the target value, a product having a target package thickness can be produced, and molding quality can be improved.

The control unit CTR controls the liquid resin ejection mechanism 23 to perform ejection a plurality of times, and ejects an ejection rate calculated based on a difference between the previous ejection rate and a target value in the second and subsequent ejections.

This makes it possible to bring the discharge amount of the liquid resin 70 closer to the target value, and to improve the molding quality. In addition, the liquid resin 70 can be discharged so as not to exceed a target value, and thus the waste of the liquid resin 70 can be suppressed.

While one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and can be modified as appropriate within the scope of the technical idea of the invention described in the claims.

In the present embodiment, the film mounting table 13 and the film suction table 24 are included, but the film mounting table 13 and the film suction table 24 may be shared to form only the film suction table 21. In this case, the film suction table 24 is movable in the X direction, the Y direction, and the Z direction, and is movable between the mold release film cutting module 10 and the resin supply module 20. The film suction table 24 on which the release film 12 is disposed is moved to a position below the resin ejection portion of the resin supply module 20, and in this state, the liquid resin 70 is ejected onto the release film 11.

The embodiments disclosed herein are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the scope of the claims rather than the description of the above embodiments, and is intended to include meanings equivalent to the scope of the claims and all modifications within the scope.