阅读说明：本技术 一种芯片分选机晶圆底膜自动扩张及供料机构 (Automatic expansion and feeding mechanism for wafer bottom film of chip sorting machine ) 是由 俞晓华 何飞 高娜娜 于 2021-07-22 设计创作，主要内容包括：本发明公开一种芯片分选机晶圆底膜自动扩张及供料机构,包括设置在平台上的拾料机构、扩膜机构以及搬运机构,所述拾料机构沿x轴向布置且在行程沿线匹配有扩膜机构,所述扩膜机构承载在沿x、y轴向布置的搬运机构上,所述扩膜机构由扩膜台、升降机构以及膜片治具组成,所述膜片治具活动架设在升降机构上且同心设置在所述扩膜台的外围。通过上述方式,本发明提供一种芯片分选机晶圆底膜自动扩张及供料机构,通过拾料机构装载晶圆,利用扩膜机构扩张芯片间隙,借助搬运机构为分选机找到瑕疵芯片完成剥离下料,具有芯片分离度高、分选定位速度快、自动化程度高等优点。(The invention discloses an automatic expanding and feeding mechanism for a wafer bottom film of a chip sorting machine, which comprises a material picking mechanism, a film expanding mechanism and a carrying mechanism, wherein the material picking mechanism, the film expanding mechanism and the carrying mechanism are arranged on a platform, the material picking mechanism is arranged along the x axial direction, the film expanding mechanism is matched along the stroke line, the film expanding mechanism is borne on the carrying mechanism arranged along the x axial direction and the y axial direction, the film expanding mechanism consists of a film expanding table, a lifting mechanism and a film jig, and the film jig is movably erected on the lifting mechanism and concentrically arranged on the periphery of the film expanding table. Through the mode, the automatic expanding and feeding mechanism for the wafer bottom film of the chip sorting machine is provided, wafers are loaded through the material picking mechanism, the chip gap is expanded through the film expanding mechanism, defective chips are found for the sorting machine through the carrying mechanism to complete stripping and blanking, and the automatic expanding and feeding mechanism has the advantages of being high in chip separation degree, high in sorting and positioning speed, high in automation degree and the like.)

1. The utility model provides an automatic expansion of chip sorter wafer basement membrane and feed mechanism, its characterized in that, including setting up the mechanism of picking up on the platform, expand membrane mechanism and transport mechanism, pick up the mechanism and arrange and be equipped with along the journey along the line and expand membrane mechanism, expand membrane mechanism and bear on the transport mechanism who arranges along x, y axial, expand membrane mechanism and comprise by expanding membrane platform, elevating system and membrane tool, the membrane tool activity erects on elevating system and concentric setting and is in expand the periphery of membrane platform.

2. The automatic expanding and feeding mechanism for the wafer bottom film of the chip sorting machine according to claim 1, wherein the film expanding table is cylindrical, the upper edge of the film expanding table is provided with a film expanding edge which is cut into a round angle shape, the film expanding edge is horizontally arranged in the stroke of the lifting mechanism, the lower edge of the film expanding table is sleeved with a bearing and movably embedded on a carrying platform, and the carrying platform is carried on the carrying mechanism.

3. The automatic expanding and feeding mechanism for the bottom wafer film of the chip sorting machine according to claim 1, wherein the lifting mechanism comprises at least two servo screw rod lifters and a synchronous lifting platform, the servo screw rod lifters are symmetrically arranged on two sides of the synchronous lifting platform, the outer edge of the synchronous lifting platform is connected with at least four groups of vertical linear rails which are vertically and symmetrically distributed, and the servo screw rod lifters are connected with the synchronous lifting platform through ball nuts.

4. The automatic expanding and feeding mechanism of wafer bottom film of chip sorting machine according to claim 1, wherein said membrane fixture is composed of an upper ring and a lower ring which are coaxially connected and integrally formed, and the diameter of said upper ring is larger than that of said lower ring;

the upper ring surface is provided with a abdicating groove passing through the center of the upper ring along the stroke line diameter of the material picking mechanism, the upper ring surface taking the abdicating groove as a central axis is symmetrically provided with a flat-mouth material groove, the depth of the abdicating groove is greater than that of the flat-mouth material groove, and a pair of semi-annular pressing blocks covering the flat-mouth material groove are arranged on the two symmetrical outer sides of the flat-mouth material groove;

the peripheral surface of the lower ring is sleeved with two pairs of bearings, and the diaphragm jig is borne on the lifting mechanism through the bearings on the peripheral surface of the lower ring.

5. The automatic expanding and feeding mechanism for a wafer bottom film of a chip sorting machine according to claim 4, wherein a pair of film ring limiting columns are convexly arranged in the flat-mouth material groove at two sides of the abdicating groove.

6. The automatic expanding and feeding mechanism for a wafer bottom film of a chip sorting machine according to claim 1, wherein the picking mechanism is composed of a linear module, a switching arm and an air claw, the linear module horizontally externally connects the switching arm, the air claw is arranged at the tail end of the switching arm, and the size and the position of the air claw are matched with those of the film expanding mechanism.

7. The automatic expanding and feeding mechanism of wafer bottom film of chip handler of claim 4, characterized in that, the joint of the upper ring and the lower ring is sleeved with a toothed ring, the toothed ring is connected with a synchronous belt in tension, the synchronous belt is connected to a servo motor in a transmission way to enable the diaphragm tool to rotate 360 degrees.

Technical Field

The invention relates to the field of chip sorting machines, in particular to an automatic expanding and feeding mechanism for a wafer bottom film of a chip sorting machine.

Background

The wafer is attached to the film, the film is packaged on the stainless steel ring, and after the complete wafer is cut into single chips, sorting operation needs to be implemented according to the quality of the chips, so that the defective chips are taken away from the film. The mutual acting force still exists after every adjacent single chip of wafer is cut, and the stability of peripheral chips is influenced by directly sucking the defective chips by the suction nozzle, so that secondary damage is caused.

Disclosure of Invention

The invention mainly solves the technical problem of providing an automatic expanding and feeding mechanism for a wafer bottom film of a chip sorting machine.

In order to solve the technical problems, the invention adopts a technical scheme that: the utility model provides an automatic expansion of chip separation machine wafer basement membrane and feeding mechanism, including setting up pick-up mechanism on the platform, expand membrane mechanism and transport mechanism, pick-up mechanism arranges and is furnished with along the journey along the line and expand membrane mechanism, expand membrane mechanism and bear on the transport mechanism who arranges along x, y axial, expand membrane mechanism and comprise by expanding membrane platform, elevating system and membrane tool, the membrane tool activity is erect and is set up on elevating system and concentric expand the periphery of membrane platform.

In a preferred embodiment of the present invention, the film expanding table is cylindrical, the upper edge of the film expanding table is provided with a film expanding edge cut into a round angle shape, the film expanding edge is horizontally arranged in the stroke of the lifting mechanism, the lower edge of the film expanding table is sleeved with a bearing and movably embedded on a carrying table, and the carrying table is carried on the carrying mechanism.

In a preferred embodiment of the invention, the lifting mechanism consists of a servo screw rod lifter and a synchronous lifting platform, the servo screw rod lifter is at least provided with two servo screw rod lifters and symmetrically erected at two sides of the synchronous lifting platform, the outer edge of the synchronous lifting platform is matched and connected with at least four groups of vertical linear rails which are vertically and symmetrically distributed, and the servo screw rod lifter is in transmission connection with the synchronous lifting platform through a ball nut.

In a preferred embodiment of the present invention, the diaphragm fixture is composed of an upper ring and a lower ring which are coaxially connected and integrally formed, and the diameter of the upper ring is larger than that of the lower ring;

the upper ring surface is provided with a abdicating groove passing through the center of the upper ring along the stroke line diameter of the material picking mechanism, the upper ring surface taking the abdicating groove as a central axis is symmetrically provided with a flat-mouth material groove, the depth of the abdicating groove is greater than that of the flat-mouth material groove, and a pair of semi-annular pressing blocks covering the flat-mouth material groove are arranged on the two symmetrical outer sides of the flat-mouth material groove;

the peripheral surface of the lower ring is sleeved with two pairs of bearings, and the diaphragm jig is borne on the lifting mechanism through the bearings on the peripheral surface of the lower ring.

In a preferred embodiment of the invention, a pair of membrane ring limiting columns are convexly arranged in the flat trough at two sides of the abdicating trough.

In a preferred embodiment of the invention, the material picking mechanism consists of a linear module, a switching arm and an air claw, wherein the linear module horizontally externally connects the switching arm, the air claw is arranged at the tail end of the switching arm, and the size and the position of the air claw are matched with those of the film expanding mechanism.

In a preferred embodiment of the invention, a toothed ring is sleeved at the joint of the upper ring and the lower ring, a synchronous belt is connected to the toothed ring in a tensioning manner, and the synchronous belt is in transmission connection with a servo motor so that the diaphragm fixture can rotate 360 degrees.

The invention has the beneficial effects that: according to the automatic expanding and feeding mechanism for the wafer bottom film of the chip sorting machine, provided by the invention, wafers are loaded through the material picking mechanism, the chip gaps are expanded through the film expanding mechanism, defective chips are found for the sorting machine by means of the carrying mechanism to complete stripping and blanking, and the automatic expanding and feeding mechanism has the advantages of high chip separation degree, high sorting and positioning speed, high automation degree and the like.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:

FIG. 1 is a block diagram of an automatic expanding and feeding mechanism for a wafer carrier film of a chip handler according to a preferred embodiment of the present invention;

FIG. 2 is a diagram of a film expanding mechanism of a preferred embodiment of an automatic expanding and feeding mechanism for a wafer bottom film of a chip handler of the present invention;

FIG. 3 is a diagram of a film expanding table of an embodiment of an automatic expanding and feeding mechanism for a wafer bottom film of a chip handler of the present invention;

FIG. 4 is a diagram of the lifting mechanism of the preferred embodiment of the automatic expanding and feeding mechanism for wafer carrier film of the chip handler of the present invention;

FIG. 5 is a diagram of a film fixture of a wafer carrier film automatic expanding and feeding mechanism of a chip handler according to a preferred embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1-5, embodiments of the present invention include:

the utility model provides an automatic expansion of chip sorter wafer basement membrane and feed mechanism, is including setting up pick up material mechanism 1 on the platform, expanding membrane mechanism 2 and transport mechanism 3, pick up material mechanism 1 and arrange and be equipped with along the journey along the line and expand membrane mechanism 2, expand membrane mechanism 2 and bear on transport mechanism 3 along x, y axial arrangement, expand membrane mechanism 2 and comprise by expanding membrane platform 201, elevating system 202 and membrane tool 203, membrane tool 203 activity erects on elevating system 202 and concentric setting is in expand the periphery of membrane platform 201.

The film expanding platform 201 is cylindrical, the upper edge of the film expanding platform 201 is provided with a film expanding edge 2011 cut into a round angle shape, the film expanding edge 2011 is horizontally arranged in the stroke of the lifting mechanism 202, the lower edge of the film expanding platform 201 is sleeved with a bearing and movably embedded on a carrying platform, and the carrying platform is carried on the carrying mechanism 3.

Further, the lifting mechanism 202 is composed of a servo lead screw lifter 2021 and a synchronous lifting platform 2022, the servo lead screw lifter 2021 is at least provided with two sets of the servo lead screw lifter 2021 and symmetrically erected at two sides of the synchronous lifting platform 2022, the outer edge of the synchronous lifting platform 2022 is connected with at least four sets of vertical linear rails 2023 which are vertically and symmetrically distributed, and the servo lead screw lifter 2021 is connected with the synchronous lifting platform 2022 through ball nut transmission.

Further, the membrane jig 203 is composed of an upper ring 2031 and a lower ring 2032 which are formed integrally and coaxially connected, wherein the diameter of the upper ring 2031 is larger than that of the lower ring 2032;

the surface of the upper ring 2031 is provided with an abdicating groove 20311 passing through the circle center of the upper ring 2031 along the route of the material picking mechanism 1, the surface of the upper ring 2031 taking the abdicating groove 20311 as the center axis is symmetrically provided with a flat groove 20312, the depth of the abdicating groove 20311 is larger than that of the flat groove 20312, and a pair of semi-annular pressing blocks 20313 covering the flat groove 20312 is arranged at the two symmetrical outer sides of the flat groove 20312;

two pairs of bearings are sleeved on the circumferential surface of the lower ring 2032, and the diaphragm jig 203 is borne on the lifting mechanism 202 through the bearings on the circumferential surface of the lower ring 2032.

Further, a pair of membrane ring limiting columns 20314 is convexly arranged in the flat trough 20312 on two sides of the concession trough 20311.

Further, the material picking mechanism 1 is composed of a linear module 101, a transfer arm 102 and an air claw 103, the linear module 101 is horizontally connected with the transfer arm 102 externally, the air claw 103 is arranged at the tail end of the transfer arm 102, and the size and the position of the air claw 103 are matched with the film expanding mechanism 2.

Further, a toothed ring 20315 is sleeved at the joint of the upper ring 2031 and the lower ring 2032, the toothed ring 20315 is connected with a synchronous belt 20316 in a tensioning manner, and the synchronous belt 20316 is connected to a servo motor 20317 in a transmission manner so that the membrane jig 203 can rotate in 360 degrees.

As shown in fig. 2, a wafer 1001 cut into individual chips is attached to a film base 1000, and the edge of the film base 1000 is sealed on a die attach ring 1002. After the mechanism is started, the lifting mechanism 202 lifts the membrane jig 203 to the highest position, and the horizontal height of the membrane expansion ridge 2011 is lower than that of the flat trough 20312; then the material picking mechanism 1 clamps a piece of wafer 1001 with a film from the upstream, wherein the chuck of the air claw 103 is clamped on the film fixing ring 1002 and moves horizontally along with the linear module 101, then the air claw 103 passes through the abdicating groove 20311, the horizontal height of the middle seam of the chuck of the air claw 103 is matched with the horizontal height of the flat trough 20312, so that the wafer 1001 clamped by the air claw 103 is smoothly moved into the flat trough 20312 and stopped by the film ring limiting column 20314 in the flat trough 20312, and then the air claw 103 resets;

after the above processes are completed, the initial loading and feeding of the wafer 1001 disc is completed, then the jacking mechanism drives the membrane jig 203 to vertically run downwards, the membrane expanding edge 2011 passively pushes the membrane substrate 1000 in the descending process, so that the membrane substrate 1000 is tightened and expanded, a gap appears in each expanded chip, the acting force between two adjacent chips disappears, and the chip taking operation is not influenced by the interference of the adjacent chips;

before taking the wafer, the mechanism controls the servo motor 20317 to drive the membrane fixture 203 to rotate according to the coordinate parameters and the image recognition result, controls the carrying mechanism 3 to drive the membrane expanding mechanism 2 to translate along the x axis and the y axis, so that the target chip on the wafer 1001 is moved to the designated position of a downstream material taking device through the x axis translation action, the y axis translation action and the rotation translation action, and finally the sorter obtains the target defect chip and peels the target defect chip from the membrane substrate 1000.

In summary, the invention provides an automatic expanding and feeding mechanism for a bottom film of a wafer 1001 of a chip sorting machine, the wafer 1001 is loaded through a material picking mechanism 1, a chip gap is expanded through a film expanding mechanism 2, and a defective chip is found for the sorting machine by a carrying mechanism 3 to complete stripping and blanking, and the automatic expanding and feeding mechanism has the advantages of high chip separation degree, high sorting and positioning speed, high automation degree and the like.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.