阅读说明：本技术 Daf膜及其制备方法、芯片封装结构 (DAF film, preparation method thereof and chip packaging structure ) 是由 任济平 于 2020-05-29 设计创作，主要内容包括：本申请公开了一种DAF膜及其制备方法、芯片封装结构,所述DAF膜包括第一胶面、第二胶面和中间高导热层,中间高导热层中设置有支撑体,用于防止芯片发生倾斜。本申请通过在DAF膜中添加支撑体,支撑体提供了有效地支撑,保证芯片在受力挤压DAF膜时,避免了由于受力不均匀而导致芯片倾斜。本发明的DAF膜通过支撑体的加入,实现了装片时,芯片始终保持水平,且不改变本身的黏著性,可用于高速晶圆贴覆处理,提高了芯片封装质量和效率。(The application discloses DAF membrane and preparation method, chip package structure thereof, DAF membrane includes first gluey face, second gluey face and middle high heat-conducting layer, is provided with the supporter in the middle high heat-conducting layer for prevent that the chip from taking place the slope. This application is through adding the supporter in the DAF membrane, and the supporter provides and supports effectively, guarantees that the chip when atress extrusion DAF membrane, has avoided because the atress is inhomogeneous and lead to the chip slope. The DAF film disclosed by the invention has the advantages that the chips are always kept horizontal during chip mounting through the addition of the supporting body, the self adhesiveness is not changed, the DAF film can be used for high-speed wafer pasting treatment, and the chip packaging quality and efficiency are improved.)

1. A DAF film suitable for use in a die attach process, comprising:

the first glue surface, the second glue surface and the middle high heat conduction layer are provided with a support body for preventing the chip from inclining.

2. The DAF film of claim 1, wherein the support body comprises a plurality of high thermal conductivity spheres, and wherein the high thermal conductivity spheres are all the same shape and size.

3. The DAF membrane of claim 1, wherein the support comprises a plurality of resin spheres of the same shape and size.

4. The DAF membrane of any of claims 1-3, wherein the support is uniformly laid between the first glue side and the second glue side.

5. The DAF membrane of any of claims 1-3, wherein the support has a melting point of not less than 150 ℃ and not more than 200 ℃.

6. A method for preparing a DAF film according to any one of claims 1 to 5, comprising:

adding the support body into the middle high heat conduction layer to form a middle layer;

and paving the first adhesive surface on the surface of the intermediate layer to obtain the DAF film.

7. The method according to claim 6, wherein the step of adding the support to the intermediate high thermal conductive layer to form an intermediate layer comprises:

laying the support body on the second glue surface;

and pouring high-thermal-conductivity resin liquid into the gap of the support body to obtain the intermediate layer.

8. The preparation method according to claim 6, wherein the process of adding the support to the intermediate high thermal conductive layer to form the intermediate layer specifically comprises:

paving a layer of high-thermal-conductivity resin liquid on the second glue surface to obtain a first sub-middle layer;

paving the support body on the first sub-middle layer to obtain a second sub-middle layer;

and pouring high-thermal-conductivity resin liquid into the second intermediate layer to obtain the intermediate layer.

9. The preparation method according to claim 6, wherein the process of adding a support body to the middle high thermal conductive layer to form the middle layer specifically comprises:

adding the support into the high-thermal-conductivity resin liquid and uniformly mixing to obtain a mixture;

and uniformly paving the mixture on the second adhesive surface to obtain the intermediate layer.

10. A chip packaging structure comprising the DAF film of any one of claims 1 to 5, a chip, and a substrate, wherein the chip is bonded to the substrate through the DAF film.

Technical Field

The invention relates to the technical field of semiconductor packaging, in particular to a DAF film, a preparation method thereof and a chip packaging structure.

Background

In the chip packaging process, DAF film (Die attach film) is a commonly used key material. The DAF film is used for cutting and separating the chips together during the laser cutting process of the chip packaging process, and peeling off the chips, so that the cut chips (Die) can be adhered to the film without scattered arrangement caused by cutting. In the wafer bonding process, after the wafer is sucked by the suction nozzle, the wafer is bonded on the substrate through the DAF film.

The existing DAF film comprises a first adhesive surface, a second adhesive surface and an intermediate layer high-thermal-conductivity resin layer, wherein the first adhesive surface is adhered to a chip, and the second adhesive surface is adhered to a substrate. In the chip mounting process, the chip is difficult to control to keep horizontal due to the influence of factors such as hand equipment, a jig and the like. For example: as shown in FIG. 1, after the suction nozzle sucks the chip, the chip 22 is adhered to the substrate 33 through the DAF film 11, and in the chip mounting process, when the suction nozzle is locally contacted with the chip, the pressure F is applied to the chip, so that the stress on the chip is uneven, the chip and the DAF film are inclined, and the chip packaging quality is affected.

Disclosure of Invention

In view of the above-mentioned defects or shortcomings in the prior art, it is desirable to provide a DAF film, a method for manufacturing the same, and a chip packaging structure, which can achieve that a chip and a substrate are always parallel and do not tilt in a chip bonding process.

In a first aspect, the present invention provides a DAF film suitable for a die attach process, including:

the first glue face, the second glue face and middle high heat-conducting layer, middle high heat-conducting layer include the supporter for prevent that the chip from taking place the slope.

Alternatively, the support body includes a plurality of high thermal conductivity spheres, and the plurality of high thermal conductivity spheres are all the same in shape and size.

Alternatively, the support body includes a plurality of resin balls having the same shape and size.

As an alternative, the support body is uniformly laid between the first rubber surface and the second rubber surface

Alternatively, the melting point of the support is not lower than 150 ℃ and not higher than 200 ℃.

In a second aspect, the present invention provides a method for preparing a DAF film, for preparing the DAF film of the first aspect, including:

adding a support body into the middle high heat conduction layer to form a middle layer;

and spreading the first glue surface on the surface of the intermediate layer to obtain the DAF film.

Alternatively, the process of adding the support to the middle high thermal conductive layer to form the middle layer includes:

spreading the upper support body on the second glue surface;

and pouring high-heat-conductivity resin liquid into the gap of the support body to obtain the intermediate layer.

As an alternative, the process of adding the support body to the middle high thermal conductive layer to form the middle layer specifically includes:

paving a layer of high-thermal-conductivity resin liquid on the second glue surface to obtain a first sub-interlayer;

laying a support on the first sub-interlayer to obtain a second sub-interlayer;

and pouring high-thermal-conductivity resin liquid into the second intermediate layer to obtain the intermediate layer.

As an alternative, the process of adding the support body to the middle high thermal conductive layer to form the middle layer specifically includes:

adding the support into the high-thermal-conductivity resin liquid and uniformly mixing to obtain a mixture;

and uniformly paving the mixture on the second glue surface to obtain the middle layer.

In a third aspect, the present invention provides a chip package structure, including the DAF film of the first aspect, a chip, and a substrate, where the chip is bonded to the substrate through the DAF film.

According to the DAF film, the preparation method thereof and the chip packaging structure, the support body is added in the DAF film, so that the DAF film can provide effective support when a chip is stressed and extruded, and the chip is prevented from inclining due to uneven stress. The DAF film disclosed by the invention has the advantages that the chips are always kept horizontal during chip mounting through the addition of the supporting body, the adhesiveness of the DAF film is not changed, the DAF film can be used for high-speed wafer pasting treatment, and the chip packaging quality and efficiency are improved.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

FIG. 1 is a schematic structural view of a conventional DAF film bonded to a chip;

FIG. 2 is a schematic structural diagram of a DAF film according to an embodiment of the present invention;

FIG. 3 is a schematic structural view of the DAF film of the present invention after being bonded to a chip;

fig. 4 is a flow chart of a DAF preparation method according to another embodiment of the present invention.

In the figure, 1, a first rubber surface, 2, a second rubber surface, 3, a middle high heat conduction layer and 4, a support body;

DAF film, 22 chip, 33 substrate.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

The chip and the DAF film are bonded together to form the DAF patch, and the conventional DAF patch can be directly bonded with the substrate due to the fact that the DAF film is arranged on the back surface of the chip. However, in the conventional DAF film, the chip is inclined relative to the substrate due to uneven stress on the chip in the bonding process. The packaging quality of the chip is reduced, and the yield and the packaging efficiency are reduced.

In view of the above problems, an embodiment of the present application provides a DAF film suitable for die attach, as shown in fig. 2, including:

the first glue surface 1, the second glue surface 2 and the middle high heat conduction layer 3, wherein the middle high heat conduction layer 3 is provided with a support body 4 for preventing the chip from inclining.

It should be noted that:

the DAF film is a wafer bonding film, and the chip is placed on the substrate through the DAF film by external action, as shown in fig. 3, in the embodiment, a support is added to the middle high thermal conductive layer of the DAF film, so that the chip 22 can be ensured to be still kept in a horizontal parallel relationship with the substrate without any inclination after being bonded on the substrate 33 through the DAF film under the condition of uneven stress. The support body in the embodiment can ensure that the chip does not incline because the DAF film can deform under external force extrusion, imbalance formed by external force extrusion can be overcome after the support body is added, the support body limits the position relation between the chip and the substrate in the process of bonding the chip, and the support body can not deform due to local stress of the chip, so that the support body can ensure that the chip does not incline. Compared with the existing DAF film, the DAF film of the embodiment is beneficial to controlling the levelness of the chip and improving the packaging quality of the chip.

The support body 4 in this embodiment may be a single body, or may be composed of a plurality of single bodies having the same specification. When the support body is an integral body, the surface area of the support body should be the same as the areas of the first adhesive surface and the second adhesive surface, and the surface area of the support body is completely contacted with the first adhesive surface and the second adhesive surface, so that in the suction nozzle chip-mounting process, the chip is uniformly supported by the support body after being contacted with the first adhesive surface. When the supporting body is a plurality of monomers with the same specification, the supporting body is uniformly laid between the first rubber surface and the second rubber surface, and each monomer can be arranged mutually and closely and also can be arranged at intervals. The same specification means that the shape and size of each single body are the same. The shape of the support is not limited, and may be a cube, a sphere, a cylinder, or the like.

As a preferred embodiment, the support body 4 comprises a plurality of high thermal conductivity spheres, and the high thermal conductivity of the support body facilitates the uniform heating of the DAF patch during laser cutting; the sphere is beneficial to the support body to be evenly stressed everywhere after the pressure is applied to the chip, and the support body is not easy to incline.

As a practical manner, the melting point of the support 4 is not lower than 150 ℃ and not higher than 200 ℃. The embodiment is beneficial to preventing the DAF film from melting in the laser cutting process, and the support body 4 is melted and integrated with the first adhesive surface and the second adhesive surface during the subsequent high-temperature treatment of the chip, so that no layering is generated. The support 4 may be a polymer resin ball, a rubber ball, or a plastic ball.

In a preferred embodiment, the support body is uniformly laid between the first glue side and the second glue side.

As a preferred embodiment, the support body 4 includes a plurality of resin balls having the same shape and size.

As an achievable embodiment, the resin balls are uniformly laid between the first glue side 1 and the second glue side 2. The uniform laying of resin balls is favorable for chip and DAF membrane bonding back for stress is even everywhere, keeps the chip parallel and level, does not take place the slope.

The thickness of the DAF film depends on the diameter of the resin spheres. It will also be appreciated that the size of the resin spheres is defined according to the desired thickness of the DAF film.

In one aspect, another embodiment of the present application discloses a method for preparing a DAF film, as shown in fig. 4, specifically including the following steps:

s100, adding the support body into the middle high heat conduction layer to form a middle layer;

s200, paving the first adhesive surface on the surface of the middle layer to obtain the DAF film.

The preparation method of the embodiment is simple in process and convenient to operate.

As a realizable mode, the process of adding the support body into the middle high heat conduction layer to form the middle layer specifically comprises the following steps:

spreading the upper support body on the second glue surface;

and pouring high-heat-conductivity resin liquid into the gap of the support body to obtain the intermediate layer.

In the embodiment, the support body is paved firstly to facilitate operation, the support body also has a positioning function, and then the high-heat-conductivity resin liquid is poured into the gap of the support body to fill the gap between the support bodies, so that the middle layer is relatively stable, and all parts are uniformly stressed.

As a realizable mode, the process of adding the support body into the middle high heat conduction layer to form the middle layer specifically comprises the following steps:

paving a layer of high-thermal-conductivity resin liquid on the second glue surface to obtain a first sub-interlayer;

laying a support on the first sub-interlayer to obtain a second sub-interlayer;

and (4) pouring high-thermal-conductivity resin liquid into the second sub-interlayer to obtain the interlayer.

The high heat conduction resin liquid is paved for the first time in the embodiment, so that the support body can be well bonded on the second rubber surface, and the gap filled by the high heat conduction resin liquid for the second time ensures that the middle layer is relatively stable and the stress is uniform.

As a realizable mode, the process of adding the support body into the middle high heat conduction layer to form the middle layer specifically comprises the following steps:

adding the support into the high-thermal-conductivity resin liquid, and uniformly mixing to obtain a mixture;

the mixture was spread on the second glue side to obtain an intermediate layer.

The embodiment is simple and convenient to operate, the one-step forming is realized, and the prepared intermediate layer is more stable.

In a third aspect, another embodiment of the present application discloses a chip packaging structure, which includes the DAF film of the first aspect and a substrate, and a chip is bonded to the substrate through the DAF film.

The chip packaging structure of this embodiment, DAF membrane make the chip at the in-process that the atress pushed down, even the chip atress is inhomogeneous, the condition of slope does not take place yet, and chip and base plate remain parallel all the time. The support body in the DAF film is beneficial to relieving uneven stress of the chip caused by local stress, and meanwhile, the support body can solve the problem that the high-heat-conductivity resin liquid is easy to deform under pressure. The chip packaging structure of the embodiment ensures more reliable packaging of the chip and improves the production and processing efficiency.

In summary, according to the DAF film, the preparation method thereof and the chip packaging structure provided by the invention, the support is added in the DAF film, so that the DAF film can provide effective support when the chip is stressed and extruded, and the chip is prevented from inclining due to uneven stress. The DAF film disclosed by the invention has the advantages that the chips are always kept horizontal during chip mounting through the addition of the supporting body, the adhesiveness of the DAF film is not changed, the DAF film can be used for high-speed wafer pasting treatment, and the chip packaging quality and efficiency are improved. The preparation method of the DAF film is simple and easy to operate.

The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.