阅读说明：本技术 镍钯金与化镍金并用设备及其控制方法 (Nickel-palladium-gold and nickel-gold melting combined equipment and control method thereof ) 是由 李齐良 杜波 于 2020-04-26 设计创作，主要内容包括：本发明属于线路板制造技术领域,涉及一种镍钯金与化镍金并用设备及其控制方法,设备包括线形的线路板挂架的转运装置,以及在转运装置下方沿着运输方向依次设置的预浸槽、活化槽、第一水洗槽、后浸槽、第二水洗槽、化镍槽、第三水洗槽、钯槽、第四水洗槽和第一金槽,所述转运装置可被控制进入各个槽的顺序；控制方法为转运装置以镍钯金和化镍金两种制程为区分,分别按序浸入所需的槽内。本设备让镍钯金和化镍金制程的大多数槽体共用,并且能切换两种工作状态,节省了设备投入,提高了设备稼动率,并大幅度减少公司药水、清洁用水、电、人工、废水处理等成本支出。(The invention belongs to the technical field of circuit board manufacturing, and relates to a nickel-palladium-gold and nickel-gold combination device and a control method thereof, wherein the device comprises a linear circuit board hanger transfer device, and a pre-soaking tank, an activation tank, a first rinsing tank, a post-soaking tank, a second rinsing tank, a nickel-gold combination tank, a third rinsing tank, a palladium tank, a fourth rinsing tank and a first gold tank which are sequentially arranged below the transfer device along the transport direction, wherein the transfer device can be controlled to enter the sequence of each tank; the control method is that the transfer device uses two processes of nickel-palladium-gold and nickel-gold melting as distinction and is respectively immersed into the required groove in sequence. The equipment shares most of the groove bodies manufactured by the nickel-palladium-gold and nickel-gold melting processes, can switch two working states, saves equipment investment, improves equipment utilization rate, and greatly reduces cost expenditure of company liquid medicine, clean water, electricity, manpower, wastewater treatment and the like.)

1. A nickel palladium gold and nickel gold melting combined equipment is characterized in that: the circuit board rack comprises a linear transfer device of a circuit board rack, and a presoaking tank, an activation tank, a first rinsing tank, a post-soaking tank, a second rinsing tank, a nickel-plating tank, a third rinsing tank, a palladium tank, a fourth rinsing tank, a first gold tank and a second gold tank which are sequentially arranged along the conveying direction below the transfer device, wherein the transfer device can be controlled to enter the sequence of each tank.

2. The nickel-palladium-gold and nickel-gold combination device as claimed in claim 1, wherein: and a gold recovery tank and a fifth washing tank are also arranged behind the second gold tank.

3. The nickel-palladium-gold and nickel-gold combination device as claimed in claim 1, wherein: the front end of the pre-soaking tank is also provided with a micro-etching tank, a seventh rinsing tank, a pickling tank and an eighth rinsing tank which are connected in sequence.

4. The nickel-palladium-gold and nickel-gold combination device as claimed in claim 3, wherein: the front end of the micro-etching tank is also provided with a degreasing tank, a hot water washing tank and a sixth washing tank which are connected in sequence.

5. A control method of the apparatus for combining NiPdAu with NiAu according to any one of claims 1 to 4, wherein the control method comprises the following steps: when the equipment carries out a nickel-palladium-gold process, the circuit board hanging rack carried by the transfer device is sequentially immersed into the pre-soaking tank, the activation tank, the first rinsing tank, the post-soaking tank, the second rinsing tank, the nickel-plating tank, the third rinsing tank, the palladium tank, the fourth rinsing tank and the first gold tank; when the equipment carries out a nickel-gold melting process, the transfer device carries the circuit board hanger to be sequentially immersed into the presoaking tank, the activation tank, the first rinsing tank, the nickel melting tank, the third rinsing tank and the second gold tank.

Technical Field

The invention relates to the technical field of circuit board manufacturing, in particular to nickel-palladium-gold and nickel-gold melting combined equipment and a control method thereof.

Background

Electroless Nickel Gold (ENIG) is prepared by replacing palladium on the surface of copper by a chemical reaction, then plating a Nickel-phosphorus alloy layer on the basis of palladium core, and then plating a Gold layer on the surface of Nickel by a replacement reaction.

Nickel Palladium Gold (electrode Nickel Immersion Palladium Immersion Gold, abbreviated as ENIPIG) is formed by depositing a layer of Palladium between a Nickel layer and a Gold layer, so that mutual migration between Nickel and Gold can be prevented, black PAD can not appear, the bonding capability of wire bonding is realized, the reliability of welding spots is good, multiple reflow soldering can be resisted, the storage time is excellent, and the like, and various different assembly requirements can be met correspondingly.

The two processes cannot be commonly used on equipment in the past, although the nickel palladium gold wire can also be used for producing the nickel gold plate through program change, the cost of the chemical solution in the nickel palladium gold wire gold groove is greatly different from the cost of the chemical solution in the gold groove required by the nickel gold wire, and the two processes are compared as follows:

at present, nickel-palladium gold wires in the market are produced singly and independently, the nickel-palladium gold wires mainly produce camera module series material numbers, the capacity is not fully loaded temporarily, the equipment utilization rate is about 30 percent, and the waste of the productivity is caused.

Therefore, it is necessary to provide a new structure of the apparatus to solve the above problems.

Disclosure of Invention

The invention mainly aims to provide a nickel-palladium-gold and nickel-gold combination device and a control method thereof, which can switch two manufacturing procedures of nickel-palladium-gold and nickel-gold, and save equipment investment.

The invention realizes the purpose through the following technical scheme: the utility model provides a nickel palladium gold and nickel gold use equipment together, includes the transfer device of linear circuit board stores pylon to and the presoaked bath, activation tank, first wash bowl, back dip tank, second wash bowl, nickel melting tank, third wash bowl, palladium groove, fourth wash bowl, first gold groove and the second gold groove that set gradually along the direction of transportation in transfer device below, transfer device can be controlled the order that gets into each groove.

Specifically, a gold recovery tank and a fifth washing tank are arranged behind the second gold tank.

Specifically, the front end of the pre-soaking tank is also provided with a micro-etching tank, a seventh rinsing tank, a pickling tank and an eighth rinsing tank which are connected in sequence.

Furthermore, a degreasing tank, a hot water washing tank and a sixth washing tank which are connected in sequence are further arranged at the front end of the micro-etching tank.

A control method of a device using nickel, palladium and gold and nickel and gold is as follows: when the equipment carries out a nickel-palladium-gold process, the circuit board hanging rack carried by the transfer device is sequentially immersed into the pre-soaking tank, the activation tank, the first rinsing tank, the post-soaking tank, the second rinsing tank, the nickel-plating tank, the third rinsing tank, the palladium tank, the fourth rinsing tank and the first gold tank; when the equipment carries out a nickel-gold melting process, the transfer device carries the circuit board hanger to be sequentially immersed into the presoaking tank, the activation tank, the first rinsing tank, the nickel melting tank, the third rinsing tank and the second gold tank.

Adopt above-mentioned technical scheme beneficial effect to be:

the equipment shares most of the groove bodies of the nickel-palladium-gold and nickel-gold melting processes, can switch two working states, saves equipment investment, and greatly reduces cost expenditure of liquid medicine, cleaning water, electricity, manpower, wastewater treatment and the like of companies.

Drawings

FIG. 1 is a piping diagram of an apparatus for combining NiPdAu with NiAu;

FIG. 2 is a schematic flow chart of two operation modes of the Ni-Pd-Au and Ni-Au alloy combined equipment.

The figures in the drawings represent:

1-a transfer device; 2-a pre-soaking tank; 3-activating tank; 4 a-a first water washing tank, 4 b-a second water washing tank, 4 c-a third water washing tank, 4 d-a fourth water washing tank, 4 e-a fifth water washing tank, 4 f-a sixth water washing tank, 4 g-a seventh water washing tank, and 4 h-an eighth water washing tank; 5-post-soaking the tank; 6-nickel bath; 7-a palladium tank; 8 a-first gold groove, 8 b-second gold groove; 9-gold recovery tank; 10-a degreasing tank; 11-hot water washing tank; 12-micro etching groove; 13-pickling tank.

Detailed Description

The present invention will be described in further detail with reference to specific examples.