阅读说明：本技术 Kdp晶体飞切加工的吸气式自排屑系统及使用方法 (Air suction type self-chip removal system for KDP crystal fly-cutting processing and use method ) 是由 付鹏强 高松 王义文 张强 张飞虎 于 2019-12-06 设计创作，主要内容包括：本发明涉及一种KDP晶体飞切加工的吸气式自排屑系统,该系统包括收集装置、吸嘴、管道和转接装置,收集装置由负压产生装置、PLC控制系统与切屑收集箱组成,负压产生装置在系统管路中产生负压,并作为系统负压来源,切屑收集箱收集并储存切屑；转接装置固定在机床顶部；连接在随动管道上吸嘴可以设有不同形状开口；管道分为随动管道与固定管道,随动管道随刀盘与电机转动用于连接吸嘴与转接装置,固定管道固定在机床上用于连接转接装置与收集装置；切屑粉末在负压的作用下沿管道及各装置进入收集装置中。本发明解决了KDP晶体切削中粉末飞溅及粉末对晶体划伤的问题,该系统结构简洁紧凑,操作便捷,排屑效果好。(The invention relates to a suction type self-chip removal system for KDP crystal fly-cutting processing, which comprises a collecting device, a suction nozzle, a pipeline and a switching device, wherein the collecting device consists of a negative pressure generating device, a PLC (programmable logic controller) control system and a chip collecting box; the switching device is fixed on the top of the machine tool; the suction nozzle connected to the follow-up pipeline can be provided with openings with different shapes; the pipeline is divided into a follow-up pipeline and a fixed pipeline, the follow-up pipeline rotates along with the cutter disc and the motor and is used for connecting the suction nozzle and the switching device, and the fixed pipeline is fixed on the machine tool and is used for connecting the switching device and the collecting device; the chip powder enters the collecting device along the pipeline and each device under the action of negative pressure. The invention solves the problems of powder splashing and crystal scratching caused by powder in KDP crystal cutting, and the system has the advantages of simple and compact structure, convenient operation and good chip removal effect.)

1. The utility model provides a KDP crystal flies to cut formula of breathing in of processing from chip removal system which characterized in that: the system comprises: a collecting device (1), a suction nozzle (4), a follow-up pipeline (5), a switching device (7) and a fixed pipeline (8), the collecting device 1 consists of a negative pressure generating device (1-1), a chip collecting device (1-2) and a PLC control system (1-3), a suction nozzle (4) is arranged on the side surface of the milling cutter (3), the suction nozzle (4) is connected with a follow-up pipeline (5), the follow-up pipeline (5) penetrates through a middle hole of a milling machine driving mechanism (6) to be connected with a switching device (7), the switching device (7) is connected with the collecting device (1) through a fixed pipeline (8), the fixed pipeline (8) is fixed on a machine tool, and during the work of the machine tool, KDP crystal cutting powder is sucked by the suction nozzle (4) under the action of negative pressure, and finally enters the collecting device (1) through the suction nozzle (4), the follow-up pipeline (5), the switching device (7) and the fixed pipeline (8).

2. The aspirated self-chip removal system for fly-cutting processing of a KDP crystal according to claim 1, characterized in that: the negative pressure generating device (1-1) is used for generating negative pressure in a system pipeline and is used as a system negative pressure source.

3. The aspirated self-chip removal system for fly-cutting processing of a KDP crystal according to claim 1, characterized in that: the PLC control system (1-3) is used for controlling the negative pressure.

4. The aspirated self-chip removal system for fly-cutting processing of a KDP crystal according to claim 1, characterized in that: the switching device (7) is fixed on the top of the machine tool.

5. The aspirated self-chip removal system for fly-cutting processing of a KDP crystal according to claim 1, characterized in that: the collecting device (1) absorbs KDP crystals in an air-breathing manner.

6. The use method of the air suction type self-chip removal system for the fly-cutting processing of the KDP crystal is characterized in that: the steps of the using method are as follows:

step one, a suction nozzle (4) is connected with a follow-up pipeline (5), the follow-up pipeline penetrates through a middle hole of a milling machine driving mechanism (6) to be connected with a switching device (7), and the switching device (7) is connected with a collecting device (1) through a fixed pipeline (8);

step two, starting the suction collection device (1);

step three, the suction nozzle (2) generates suction under the action of negative pressure, when the milling cutter (3) mills crystals to generate powder, the powder cuttings are sucked by the suction nozzle (4), pass through the suction nozzle (4), the follow-up pipeline (5), the switching device (7) and the fixed pipeline (8) and finally enter the collecting device (1);

and step four, closing the collecting device (1) after the processing is finished.

Technical Field

The invention relates to a negative pressure suction device, in particular to a special air suction type self-chip removal system for KDP crystal fly-cutting processing.

Background

With the wide application of anisotropic large-caliber planar crystal elements in the optical field, new requirements are put forward on the ultra-precision machining technology, and a large-caliber KDP crystal single-point diamond fly-cutting ultra-precision machining tool adopting a high-rigidity gas static pressure main shaft and a liquid static pressure guide rail is developed at present, but crystal powder is splashed when the KDP crystal is machined and even stays on the surface of the KDP crystal, and chips remained on the surface of the KDP crystal scratch the KDP crystal when the KDP crystal is machined again, so that machining defects are caused. Therefore, a device is needed for collecting and intensively treating the powder-shaped cuttings generated in the KDP crystal cutting process and improving the surface processing quality of the KDP crystal.

Disclosure of Invention

In view of this, the embodiment of the invention provides an air-breathing self-chip removal system for performing fly-cutting processing on a KDP crystal and a use method thereof, so as to solve the problems that in the prior art, crystal powder splashes when the KDP crystal is processed, even remains on the surface of the KDP crystal, and chips remaining on the surface of the KDP crystal scratch the KDP crystal when the KDP crystal is processed again, thereby causing processing defects.

A first aspect of an embodiment of the present invention provides an air-breathing self-chip-removal system for KDP crystal fly-cutting processing, where the system includes: the device comprises a collecting device, a suction nozzle, a follow-up pipeline, a switching device and a fixed pipeline, wherein the collecting device 1 consists of a negative pressure generating device, a scrap collecting device and a PLC (programmable logic controller) control system, the suction nozzle is arranged on the side surface of the milling cutter and connected with the follow-up pipeline, the follow-up pipeline penetrates through a middle hole of a milling machine driving mechanism and is connected with the switching device, the switching device is connected with the collecting device through the fixed pipeline, the fixed pipeline is fixed on a machine tool, and KDP crystal scrap powder is sucked by the suction nozzle under the action of negative pressure and finally enters the collecting device through the suction nozzle, the follow-up pipeline, the switching device and the fixed pipeline.

Further, the negative pressure generating device is used for generating negative pressure in a system pipeline and used as a system negative pressure source.

Further, the PLC control system is used for controlling the negative pressure to be high or low.

Further, the adapter device is fixed on the top of the machine tool.

Further, the collecting device absorbs KDP crystals in a gas-absorbing manner.

The second aspect of the embodiment of the invention provides a use method of an air suction type self-chip removal system for KDP crystal fly-cutting processing, which comprises the following specific steps:

step one, connecting a suction nozzle with a follow-up pipeline, wherein the follow-up pipeline penetrates through a middle hole of a milling machine driving mechanism to be connected with a switching device, and the switching device is connected with a collecting device through a fixed pipeline;

step two, starting the suction collecting device;

step three, the suction nozzle generates suction under the action of negative pressure, when the milling cutter mills the crystal to generate powder, the powder cuttings are sucked by the suction nozzle and finally enter the collecting device through the suction nozzle, the follow-up pipeline, the switching device and the fixed pipeline;

and step four, closing the collecting device after the processing is finished.

According to the embodiment of the invention, crystal cutting chips generated in the cutting process of the ultra-precise fly-cutting machine tool are sucked away in time by adopting a negative pressure air suction mode, and the system has the advantages of simple and compact structure, convenience in operation and good chip removal effect.