阅读说明：本技术 Kdp晶体飞切加工的吸气式自排屑系统及使用方法 (Air suction type self-chip removal system for KDP crystal fly-cutting processing and use method ) 是由 付鹏强 高松 王义文 张强 张飞虎 于 2019-12-06 设计创作，主要内容包括：本发明涉及一种KDP晶体飞切加工的吸气式自排屑系统,该系统包括收集装置、吸嘴、管道和转接装置,收集装置由负压产生装置、PLC控制系统与切屑收集箱组成,负压产生装置在系统管路中产生负压,并作为系统负压来源,切屑收集箱收集并储存切屑；转接装置固定在机床顶部；连接在随动管道上吸嘴可以设有不同形状开口；管道分为随动管道与固定管道,随动管道随刀盘与电机转动用于连接吸嘴与转接装置,固定管道固定在机床上用于连接转接装置与收集装置；切屑粉末在负压的作用下沿管道及各装置进入收集装置中。本发明解决了KDP晶体切削中粉末飞溅及粉末对晶体划伤的问题,该系统结构简洁紧凑,操作便捷,排屑效果好。(The invention relates to a suction type self-chip removal system for KDP crystal fly-cutting processing, which comprises a collecting device, a suction nozzle, a pipeline and a switching device, wherein the collecting device consists of a negative pressure generating device, a PLC (programmable logic controller) control system and a chip collecting box; the switching device is fixed on the top of the machine tool; the suction nozzle connected to the follow-up pipeline can be provided with openings with different shapes; the pipeline is divided into a follow-up pipeline and a fixed pipeline, the follow-up pipeline rotates along with the cutter disc and the motor and is used for connecting the suction nozzle and the switching device, and the fixed pipeline is fixed on the machine tool and is used for connecting the switching device and the collecting device; the chip powder enters the collecting device along the pipeline and each device under the action of negative pressure. The invention solves the problems of powder splashing and crystal scratching caused by powder in KDP crystal cutting, and the system has the advantages of simple and compact structure, convenient operation and good chip removal effect.)

技术领域

本发明涉及一种负压吸引装置，特别是涉及一种专用于KDP晶体飞切加工吸气式自排屑系统。

背景技术

随着各向异性大口径平面晶体元件在光学领域的广泛应用，对超精密加工技术提出了新的要求，目前已经研制出采用高刚度气体静压主轴和液体静压导轨的大口径KDP晶体单点金刚石飞切超精密加工机床，但在加工KDP晶体时会引起晶体粉末飞溅，甚至留在KDP晶体表面，再次加工走刀时残留在KDP晶体表面的切屑会划伤KDP晶体从而造成加工缺陷。故需要一种设备收集KDP晶体切削加工中产生的粉末状切屑并集中处理，提高KDP晶体表面加工质量。