阅读说明：本技术 非易失霍尔传感器及其制造方法、测试方法 (Nonvolatile Hall sensor and manufacturing method and testing method thereof ) 是由 范林杰 毕津顺 徐彦楠 习凯 刘明 于 2020-03-26 设计创作，主要内容包括：本发明公开了一种非易失霍尔传感器及其制造方法、测试方法,所述非易失霍尔传感器包括：半导体衬底,所述半导体衬底包括源区、漏区以及设置在所述源区和所述漏区之间的沟道区；设置在所述沟道区上的第一绝缘层；设置在所述第一绝缘层上的阻变材料层,所述阻变材料层的材料和所述第一绝缘层的材料不同；设置在所述阻变材料层上的第二绝缘层,所述第二绝缘层的材料和所述阻变材料层的材料不同；设置在所述第二绝缘层上的栅极。本发明提供的非易失霍尔传感器,可以存储霍尔电压信号,不需要额外的电路检测、分析和存储霍尔电压信号。(The invention discloses a nonvolatile Hall sensor and a manufacturing method and a testing method thereof, wherein the nonvolatile Hall sensor comprises the following components: the semiconductor device comprises a semiconductor substrate, a first electrode and a second electrode, wherein the semiconductor substrate comprises a source region, a drain region and a channel region arranged between the source region and the drain region; a first insulating layer disposed on the channel region; a resistive material layer disposed on the first insulating layer, the resistive material layer being made of a different material than the first insulating layer; the second insulating layer is arranged on the resistance change material layer, and the material of the second insulating layer is different from that of the resistance change material layer; a gate electrode disposed on the second insulating layer. The nonvolatile Hall sensor provided by the invention can store Hall voltage signals without additional circuits for detecting, analyzing and storing the Hall voltage signals.)

1. A non-volatile hall sensor, comprising:

the semiconductor device comprises a semiconductor substrate, a first electrode and a second electrode, wherein the semiconductor substrate comprises a source region, a drain region and a channel region arranged between the source region and the drain region;

a first insulating layer disposed on the channel region;

a resistive material layer disposed on the first insulating layer, the resistive material layer being made of a different material than the first insulating layer;

the second insulating layer is arranged on the resistance change material layer, and the material of the second insulating layer is different from that of the resistance change material layer;

a gate electrode disposed on the second insulating layer.

2. The non-volatile hall sensor of claim 1 wherein the material of the first insulating layer is SiO₂And a high-K material, the first insulating layer having a thickness of 10 to 15 nm.

3. The non-volatile hall sensor of claim 1 wherein the material of the second insulating layer is SiO₂And heightK material, the second insulating layer having a thickness of 10 to 15 nanometers.

4. The non-volatile hall sensor of claim 1 wherein the resistive switching material layer is made of TiO_x、HfO_xAnd TaO_xAt least one of materials, wherein the resistive material layer has a thickness of 20 to 30 nm.

5. The non-volatile hall sensor of claim 1 wherein the gate is made of polysilicon and has a thickness of 40 to 60 nanometers.

6. A method of manufacturing a non-volatile hall sensor, comprising:

providing a semiconductor substrate, wherein the semiconductor substrate comprises a source region, a drain region and a channel region arranged between the source region and the drain region;

forming a first insulating layer on the channel region;

forming a resistive material layer on the first insulating layer, wherein the material of the resistive material layer is different from that of the first insulating layer;

forming a second insulating layer on the resistive material layer, wherein the material of the second insulating layer is different from that of the resistive material layer;

and forming a gate electrode on the second insulating layer.

7. The method of manufacturing a non-volatile hall sensor of claim 6 wherein forming a resistive switching material layer on the first insulating layer comprises:

and forming the resistance change material layer on the first insulating layer by adopting an atomic layer deposition process.

8. The method of manufacturing a non-volatile hall sensor of claim 6 wherein the forming a second insulating layer over the resistive switching material layer comprises:

and forming the second insulating layer on the resistance change material layer by adopting a thermal oxidation process.

9. A method for testing a non-volatile hall sensor, said hall sensor being a non-volatile hall sensor according to any of claims 1 to 5 or obtained by a manufacturing method according to any of claims 6 to 8, said method comprising:

performing a first pressing operation to form a current in the resistive material layer, the first pressing operation including: grounding the source region, the drain region and the semiconductor substrate, and applying a voltage to two end faces of the resistive material layer to form a voltage difference between the two end faces, wherein the two end faces are perpendicular to the length direction of the channel region;

maintaining the first pressing operation, and applying a first magnetic field to the resistive material layer to form a hall effect, wherein the first magnetic field is perpendicular to the current direction;

and canceling the first pressing operation and the first magnetic field, and performing a second pressing operation, wherein the second pressing operation comprises: grounding the source region and the semiconductor substrate, and applying voltage to the grid electrode and the drain region to form drain-source current;

and maintaining the second pressing operation and detecting the drain-source current.

10. The method of claim 9, further comprising, after said detecting the drain-source current:

canceling the second pressure application operation and performing the first pressure application operation;

and maintaining the first pressing operation, and applying a second magnetic field to the resistive switching material layer, wherein the direction of the second magnetic field is opposite to that of the first magnetic field.

Technical Field

The invention relates to the technical field of sensors, in particular to a nonvolatile Hall sensor and a manufacturing method and a testing method thereof.

Background

A hall sensor is a magnetic field sensor made according to the hall effect. In 1879, hall discovered the hall effect when studying the conductive mechanism of metals. It is found through continuous research that the characteristics of the hall sensor are not high and are excluded due to the high electron concentration of the metal material and the low mobility of the insulator material. Due to the large resistivity of semiconductor materials, the moderate carrier (electron and hole) mobility becomes the first choice for hall sensors. The Hall sensor can be manufactured by adopting a standard semiconductor process, has the advantages of low cost, high integration level, mature technology, lower power consumption and the like, and is widely applied to the aspects of geomagnetic detection, mobile communication, navigation system, GPS communication and the like.

At present, when the Hall sensor works, the sensing of the magnetic field and the storage of the voltage signal are separated. After the magnetic field sensed by the hall sensor is converted into a hall voltage signal, an additional circuit is needed to analyze and store the voltage signal, which may not only cause signal distortion in the transmission process, but also increase the complexity of the hall sensor structure.

Disclosure of Invention

The invention aims to solve the problem that the existing Hall sensor needs an additional circuit to analyze and store Hall voltage signals.

The invention is realized by the following technical scheme:

a non-volatile hall sensor comprising:

the semiconductor device comprises a semiconductor substrate, a first electrode and a second electrode, wherein the semiconductor substrate comprises a source region, a drain region and a channel region arranged between the source region and the drain region;

a first insulating layer disposed on the channel region;

a resistive material layer disposed on the first insulating layer, the resistive material layer being made of a different material than the first insulating layer;

the second insulating layer is arranged on the resistance change material layer, and the material of the second insulating layer is different from that of the resistance change material layer;

a gate electrode disposed on the second insulating layer.

Optionally, the material of the first insulating layer is SiO₂And a high-K material, the first insulating layer having a thickness of 10 to 15 nm.

Optionally, the material of the second insulating layer is SiO₂And a high-K material, the second insulating layer having a thickness of 10 to 15 nm.

Optionally, the resistance change material layer is made of TiO_x、HfO_xAnd TaO_xAt least one of materials, wherein the resistive material layer has a thickness of 20 to 30 nm.

Optionally, the gate is made of polysilicon, and the thickness of the gate is 40 nm to 60 nm.

Based on the same inventive concept, the invention also provides a manufacturing method of the nonvolatile Hall sensor, which comprises the following steps:

providing a semiconductor substrate, wherein the semiconductor substrate comprises a source region, a drain region and a channel region arranged between the source region and the drain region;

forming a first insulating layer on the channel region;

forming a resistive material layer on the first insulating layer, wherein the material of the resistive material layer is different from that of the first insulating layer;

forming a second insulating layer on the resistive material layer, wherein the material of the second insulating layer is different from that of the resistive material layer;

and forming a gate electrode on the second insulating layer.

Optionally, the forming of the resistive material layer on the first insulating layer includes:

and forming the resistance change material layer on the first insulating layer by adopting an atomic layer deposition process.

Optionally, the forming a second insulating layer on the resistive switching material layer includes:

and forming the second insulating layer on the resistance change material layer by adopting a thermal oxidation process.

Based on the same inventive concept, the invention also provides a testing method of the nonvolatile hall sensor, wherein the nonvolatile hall sensor is the nonvolatile hall sensor or the nonvolatile hall sensor obtained by adopting the manufacturing method, and the testing method comprises the following steps:

performing a first pressing operation to form a current in the resistive material layer, the first pressing operation including: grounding the source region, the drain region and the semiconductor substrate, and applying a voltage to two end faces of the resistive material layer to form a voltage difference between the two end faces, wherein the two end faces are perpendicular to the length direction of the channel region;

maintaining the first pressing operation, and applying a first magnetic field to the resistive material layer to form a hall effect, wherein the first magnetic field is perpendicular to the current direction;

and canceling the first pressing operation and the first magnetic field, and performing a second pressing operation, wherein the second pressing operation comprises: grounding the source region and the semiconductor substrate, and applying voltage to the grid electrode and the drain region to form drain-source current;

and maintaining the second pressing operation and detecting the drain-source current.

Optionally, after the detecting the drain-source current, the method further includes:

canceling the second pressure application operation and performing the first pressure application operation;

and maintaining the first pressing operation, and applying a second magnetic field to the resistive switching material layer, wherein the direction of the second magnetic field is opposite to that of the first magnetic field.

Compared with the prior art, the invention has the following advantages and beneficial effects:

the nonvolatile Hall sensor or the nonvolatile Hall sensor obtained by the manufacturing method provided by the invention comprises a semiconductor substrate, a first insulating layer, a resistance change material layer, a second insulating layer and a grid electrode. The electric charges in the resistive material layer can be captured by the traps on the upper surface and the lower surface of the resistive material layer under the action of the external voltage and the magnetic field, so that the Hall voltage signal can be stored, and the Hall voltage signal does not need to be detected, analyzed and stored by an additional circuit. The nonvolatile Hall sensor or the nonvolatile Hall sensor obtained by the manufacturing method integrates magnetic field sensing and Hall voltage signal storage, and simplifies the structure of the device; the nonvolatile Hall sensor has the nonvolatile property of storing charges, can erase the stored charges and has the advantage of repeated use; the preparation process of the nonvolatile Hall sensor is completely compatible with the traditional CMOS process, and has cost advantage.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:

fig. 1 is a schematic cross-sectional structure diagram of a nonvolatile hall sensor according to an embodiment of the present invention;

FIG. 2 is a flow chart of a test of a non-volatile Hall sensor according to an embodiment of the invention;

fig. 3 and 4 are schematic diagrams illustrating voltage and magnetic field applied to a resistive material layer when a nonvolatile hall sensor according to an embodiment of the present invention is tested;

fig. 5 to 7 are schematic diagrams illustrating changes in charge movement in a resistive material layer when the nonvolatile hall sensor according to the embodiment of the present invention is tested;

FIG. 8 shows the I before and after magnetic field detection of the non-volatile Hall sensor according to the embodiment of the invention_d-V_gSchematic diagram of transfer characteristic curve.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.

The present embodiment provides a nonvolatile hall sensor, and fig. 1 is a schematic cross-sectional structure diagram of the nonvolatile hall sensor, where the nonvolatile hall sensor includes a semiconductor substrate 11, a first insulating layer 12, a resistive material layer 13, a second insulating layer 14, and a gate 15.

Specifically, the semiconductor substrate 11 may be a silicon substrate, and includes a source region 111, a drain region 112, and a channel region 113 disposed between the source region 111 and the drain region 112.

The first insulating layer 12 is disposed on the channel region 113, and the material of the first insulating layer 12 may be SiO₂And a high-K material. Further, the thickness of the first insulating layer 12 may be 10 to 15 nm.

The resistive material layer 13 is disposed on the first insulating layer 12, and the resistive material layer 13 may be made of TiO_x、HfO_xAnd TaO_xAt least one of the materials. Further, the resistive material layer 13 may have a thickness of 20 nm to 30 nm.

The second insulating layer 14 is disposed on the resistive material layer 13, and the material of the second insulating layer 14 may be SiO₂And a high-K material. Further, the thickness of the second insulating layer 14 may be 10 nm to 15 nm.

The gate 15 is disposed on the second insulating layer 14, and the material of the gate 15 may be polysilicon. Further, the thickness of the gate electrode 15 may be 40 to 60 nm.

The material of the resistive material layer 13 is different from the material of the first insulating layer 12, and is also different from the material of the second insulating layer 14. In the process, an interface trap is formed between the upper surface of the first insulating layer 12 and the resistive material layer 13, an interface trap is formed between the lower surface of the second insulating layer 14 and the resistive material layer 13, and the formed interface trap can capture charges in the resistive material layer 13. The materials and thicknesses of the first insulating layer 12, the resistance variable material layer 13, the second insulating layer 14, and the gate electrode 15 are not limited to those described in this embodiment.

In the nonvolatile hall sensor provided by this embodiment, because the charges in the resistive material layer 13 can be captured by the traps on the upper and lower surfaces thereof under the action of the applied voltage and the magnetic field, the hall voltage signal can be stored, and no additional circuit is required to detect, analyze and store the hall voltage signal. Therefore, the nonvolatile Hall sensor integrates magnetic field sensing and Hall voltage signal storage, and the structure of the device is simplified; the nonvolatile Hall sensor has the nonvolatile property of storing charges, can erase the stored charges and has the advantage of repeated use; the preparation process of the nonvolatile Hall sensor is completely compatible with the traditional CMOS process, and has cost advantage.

Based on the same inventive concept, the present embodiment further provides a manufacturing method of a nonvolatile hall sensor, where the manufacturing method includes:

providing a semiconductor substrate, wherein the semiconductor substrate comprises a source region, a drain region and a channel region arranged between the source region and the drain region;

forming a first insulating layer on the channel region;

forming a resistive material layer on the first insulating layer, wherein the material of the resistive material layer is different from that of the first insulating layer;

forming a second insulating layer on the resistive material layer, wherein the material of the second insulating layer is different from that of the resistive material layer;

and forming a gate electrode on the second insulating layer.

Specifically, the semiconductor substrate may be a silicon substrate. The source region, the drain region, and the channel region may be formed by doping the silicon substrate.

The first insulating layer may be formed on the channel region using a Plasma Enhanced Chemical Vapor Deposition (PECVD) process or a low Pressure Chemical vapor Deposition (L PCVD) process₂And a high-K materialThe thickness of the first insulating layer may be 10 to 15 nm.

The resistive material layer may be formed on the first insulating layer using an atomic layer deposition process. The material of the resistance change material layer can be TiO_x、HfO_xAnd TaO_xAt least one of materials, and a thickness of the resistive material layer may be 20 to 30 nm.

The second insulating layer may be formed on the resistive material layer using a thermal oxidation process. The material of the second insulating layer may be SiO₂And a high-K material, the second insulating layer may have a thickness of 10 to 15 nm.

The gate may be formed on the second insulating layer using a self-aligned process. The gate may be made of polysilicon, and the thickness of the gate may be 40 nm to 60 nm.

The material of the resistive material layer is different from the material of the first insulating layer, and is also different from the material of the second insulating layer. In the process, an interface trap can be formed between the upper surface of the first insulating layer and the resistive material layer, an interface trap can be formed between the lower surface of the second insulating layer and the resistive material layer, and the formed interface trap can capture charges in the resistive material layer.

In the nonvolatile hall sensor obtained by the manufacturing method provided by the embodiment, because the charges in the resistive material layer can be captured by the traps on the upper surface and the lower surface of the resistive material layer under the action of the external voltage and the magnetic field, the hall voltage signal can be stored, and the hall voltage signal does not need to be detected, analyzed and stored by an additional circuit. Therefore, the nonvolatile Hall sensor integrates magnetic field sensing and Hall voltage signal storage, and the structure of the device is simplified; the nonvolatile Hall sensor has the nonvolatile property of storing charges, can erase the stored charges and has the advantage of repeated use; the preparation process of the nonvolatile Hall sensor is completely compatible with the traditional CMOS process, and has cost advantage.

Based on the same inventive concept, the present embodiment provides a testing method of a nonvolatile hall sensor, where the nonvolatile hall sensor is the nonvolatile hall sensor provided in the foregoing embodiment, or the nonvolatile hall sensor obtained by using the manufacturing method of the foregoing embodiment.

Fig. 2 is a flow chart of the test method, which includes:

a step S21 of performing a first pressing operation to form a current in the resistance change material layer;

step S22 of maintaining the first pressing operation, and applying a first magnetic field to the resistive material layer to form a hall effect;

step S23, canceling the first pressing operation and the first magnetic field, and performing a second pressing operation;

step S24, maintaining the second pressing operation, and detecting the drain-source current.

Taking the nonvolatile hall sensor as an example, the testing method will be described in detail below.

Specifically, the first pressing operation includes: the source region 111, the drain region 112, and the semiconductor substrate 11 are grounded, and a voltage is applied to two end faces of the resistive material layer 13, which are perpendicular to the length direction of the channel region 113, to form a voltage difference between the two end faces. A voltage difference is formed between the two end faces, wherein the voltage of the left end face is higher than that of the right end face, as shown in fig. 3; it is also possible that the voltage at the right end face is higher than the voltage at the left end face, as shown in fig. 4. Under the action of the voltage difference, the resistive material layer 13 is converted from a high resistance state to a low resistance state, and the current is formed in the resistive material layer 13. The direction of the current is also different depending on the way the voltage difference is formed. If the voltage difference shown in fig. 3 is formed, the direction of the current is from left to right, as shown in fig. 5; if the voltage difference shown in fig. 4 is formed, the direction of the current is from right to left. The voltage difference is determined according to the material characteristics of the resistive material layer 13, as long as the resistive material layer 13 can be converted from a high resistance state to a low resistance state.

Maintaining the first pressing operation, the first magnetic field is applied to the resistive material layer 13, and the first magnetic field is perpendicular to the current direction. If the voltage difference shown in fig. 3 is formed, the direction of the current is from left to right, and the direction of the first magnetic field is perpendicular to the paper surface; if the voltage difference shown in fig. 4 is formed, the direction of the current is from right to left, and the direction of the first magnetic field is perpendicular to the paper surface. If the voltage difference shown in fig. 3 is formed, the positive charge moves downward and the negative charge moves upward due to the hall effect, as shown in fig. 6. When positive and negative charges are trapped by the interface traps of the resistive material layer 13 and the two insulating layers, an internal electric field pointing from the lower interface to the upper interface is formed in the resistive material layer 13, as shown in fig. 7. The magnitude of the first magnetic field may be determined by the material characteristics of the resistive material layer 13, and may be determined by deflecting electric charges in the resistive material layer 13.

And canceling the first pressing operation and the first magnetic field and carrying out the second pressing operation. The second pressing operation includes: the source region 111 and the semiconductor substrate 11 are grounded, and a voltage is applied to the gate electrode 15 and the drain region 112 to form a drain-source current. The magnitude of the voltage applied to the gate electrode 15 and the drain region 112 may be determined according to actual circumstances, as long as a normal transfer characteristic curve can be detected from the nonvolatile hall sensor.

And maintaining the second pressing operation and detecting the drain-source current. As shown in fig. 8, due to the presence of the electric field inside the resistive switching material layer 13, the threshold voltage of the nonvolatile hall sensor changes from a low threshold value to a high threshold value, so that the magnitude of the magnetic field can be detected according to different high threshold voltage values.

The testing method of the nonvolatile hall sensor provided by the embodiment can detect the working characteristics of the nonvolatile hall sensor. Further, after the detecting the drain-source current, the method may further include:

canceling the second pressure application operation and performing the first pressure application operation;

and maintaining the first pressing operation, and applying a second magnetic field to the resistive switching material layer, wherein the direction of the second magnetic field is opposite to that of the first magnetic field.

By applying the second magnetic field, the trapped positive and negative charges are recombined and the non-volatile hall sensor can be reused.

The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.