阅读说明：本技术 不含六价铬的蚀刻锰回收系统 (Hexavalent chromium-free etching manganese recovery system ) 是由 马克·鲍曼 丹尼尔·莱西 格里·沃格尔波尔 于 2018-07-10 设计创作，主要内容包括：本发明提供了用于回收锰蚀刻剂溶液的方法,其中收集并蒸发用于在蚀刻非导电基板之后冲洗或中和基板的处理溶液,以提供浓缩的处理溶液,该溶液被进料回到锰蚀刻剂溶液或酸冲洗液中。(The present invention provides a method for recovering a manganese etchant solution, wherein a process solution used for rinsing or neutralizing a substrate after etching a non-conductive substrate is collected and evaporated to provide a concentrated process solution which is fed back into the manganese etchant solution or acid rinse.)

1. A method for recovering a manganese etchant solution, the method comprising:

neutralizing a non-conductive substrate with a neutralizing agent after etching the substrate with an etchant solution, wherein the neutralizing agent comprises a solution comprising an acid and an oxidizing agent;

removing at least a portion of the treatment solution from the neutralizing agent or manganese-containing purge to an evaporator assembly;

evaporating the treatment solution in the evaporator assembly to remove water to form a concentrated treatment solution; and

adding the concentrated treatment solution to the etchant solution or acid rinse.

2. The method of claim 1, wherein the concentrated treatment solution is concentrated to greater than or equal to about 2 g/LMn.

3. The method of claim 1, wherein the evaporator assembly further comprises an atmospheric evaporator or a vacuum evaporator.

4. The method of claim 1, wherein the evaporator assembly further comprises an evaporation treatment tank.

5. The method of claim 1, wherein the evaporation treatment tank is operated under temperature control and under controlled air treatment.

6. The method of claim 5, wherein the temperature is about 155 ° F to about 180 ° F.

7. The method of claim 5, wherein the controlled air treatment is at a flow rate of about 1880lb/hr to about 2090 lb/hr.

8. The method of claim 6, wherein the controlled air treatment is at a flow rate of about 1880lb/hr to about 2090 lb/hr.

9. The method of claim 1, wherein the treatment solution comprises a source of manganese ions.

10. A method for recovering a manganese etchant solution, the method comprising:

after etching a non-conductive substrate with an etchant solution, optionally rinsing in an acid-based rinse and then neutralizing the substrate with a neutralizing agent, wherein the neutralizing agent comprises at least one of an acid and an oxidizing agent;

concentrating at least a portion of the treatment solution to a concentration similar to the etchant solution; and

feeding the concentrated treatment solution into the etchant solution or acid rinse.

11. The method of claim 10, wherein the concentrated treatment solution is concentrated to greater than or equal to about 2g/L Mn.

12. The method of claim 10, wherein the treatment solution comprises a solution comprising the one or more acids and manganese ions.

13. The method of claim 10, wherein at least a portion of the treatment solution is transferred to an evaporative treatment tank for concentrating the treatment solution.

14. The method of claim 13, wherein the evaporation treatment tank is part of an evaporator assembly, the evaporator assembly further comprising an atmospheric evaporator or a vacuum evaporator.

15. The method of claim 13, wherein the evaporation treatment tank is operated under temperature control and under controlled air treatment.

16. The method of claim 10, wherein the treatment solution comprises a source of manganese ions.

17. The method of claim 16, wherein the temperature is about 155 ° F to about 180 ° F.

18. The method of claim 16, wherein the controlled air treatment is at a flow rate of about 1880lb/hr to about 2090 lb/hr.

19. The method of claim 17, wherein the controlled air treatment is at a flow rate of about 1880lb/hr to about 2090 lb/hr.

20. An evaporation system for recovering a manganese etchant solution, the evaporation system comprising:

an evaporator assembly, wherein the evaporator assembly is configured to evaporate water from a process solution to form a concentrated process solution, wherein the evaporator assembly is connected to a process tank configured for use in an electroless metallization process, wherein the process tank contains a process solution configured to be transferred into the evaporation tank.

21. The evaporation system of claim 20, wherein the evaporator assembly further comprises an evaporation treatment tank.

22. The evaporation system of claim 20, wherein the evaporator assembly discharges the treatment solution when the treatment solution is concentrated to greater than or equal to about 2g/L Mn.

23. The evaporation system of claim 20, wherein the treatment solution comprises a source of manganese ions.

24. The evaporation system of claim 20, wherein the treatment solution further comprises an acid.

Technical Field

The present disclosure relates to hexavalent chromium free etched manganese recovery systems.

Background

This section provides background information related to the present disclosure that is not necessarily prior art.

Many conventional processes for metallizing non-conductive substrates include etching the substrate, followed by activation, and then electroless metallization. Electroless metallization renders the non-conductive substrate conductive, allowing for a subsequent conventional electroplating process. In many such processes, etching of the substrate is accomplished by immersing the non-conductive substrate in a chromic acid-sulfuric acid mixture.

Many such etching processes primarily utilize hexavalent chromium. However, over the past few years, the use of hexavalent chromium etchants has declined due to the health risks posed by hexavalent chromium. Other methods, however, avoid the complete use of chromium in the etchant solution and migration to other solutions, including manganese-based etchant solutions. Mn etchant solutions have other unique challenges. There is a continuing need to further reduce the costs associated with Mn etchant solutions.

Disclosure of Invention

This section provides a general summary of the disclosure, and does not fully disclose its full scope or all of its features.

The present technology provides a method for recovering manganese used in a manganese etchant process. The method includes neutralizing the substrate with a neutralizer solution after etching the non-conductive substrate with the etchant solution. The neutralizer solution comprises a solution of an acid and an oxidizer. At least a portion of the used neutralizer solution or manganese containing rinse solution (referred to herein as the treatment solution) is removed and sent to an evaporation treatment tank where the treatment solution is evaporated to remove any oxidants and concentrates from the remaining used treatment solution. The concentrated treatment solution is added to the etchant or acid rinse solution. In other embodiments, the concentrated treatment solution is concentrated to greater than or equal to about 2g/L Mn. In other embodiments, the evaporator assembly comprises an atmospheric evaporator or a vacuum evaporator. In other embodiments, the evaporator assembly comprises an evaporation treatment tank. In other embodiments, the evaporation treatment tank is heated and treated with vigorous air treatment. In various embodiments, the etchant solution comprises a source of manganese ions.

The present technology also provides a method of recovering a manganese etchant solution for use in manganese etching. The method includes neutralizing the substrate with a neutralizer solution after etching the non-conductive substrate with the etchant solution. The neutralizer solution includes at least one of an acid and an oxidizer. At least a portion of the treatment solution is concentrated to the concentration of the etchant solution. The concentrated process solution is fed to the etchant process. In other embodiments, the concentrated treatment solution is concentrated to greater than or equal to about 2 g/LMn. In other embodiments, the neutralizer solution comprises an acid and an oxidizer. In even further embodiments, at least a portion of the treatment solution is transferred to an evaporator treatment tank to concentrate the treatment solution. The evaporator assembly may also include an atmospheric evaporator or a vacuum evaporator. In other embodiments, the evaporator assembly can further comprise an evaporation treatment tank. In other such embodiments, the evaporative treatment bath may be heated and treated using a vigorous air treatment. In other embodiments, the etchant solution comprises a source of manganese ions.

The present technology also provides an evaporation system for recovering manganese etchant solution. The evaporation system includes an evaporator assembly, and the evaporator assembly is configured to evaporate water from the treatment solution to form a concentrated treatment solution. The evaporator assembly is transferably connected to a processing bath configured for use in an electroless metallization process. The processing tank contains a processing solution configured to be transferred into the evaporation tank. In other embodiments, the evaporator assembly further comprises an evaporation treatment tank. In other such embodiments, the evaporative treatment bath further comprises a heater and an air agitator. In other embodiments, the evaporator assembly discharges the concentrated treatment solution when the concentrated treatment solution is concentrated to greater than or equal to about 2g/L Mn. In even further embodiments, the evaporator assembly discharges the concentrated process solution into a tank during the etchant process. The etchant treatment may include a source of manganese ions. In various embodiments, the treatment solution comprises an acid.

Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

Drawings

The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

FIG. 1 shows a flow diagram of a method for preparing an electroless metallized substrate;

FIG. 2 illustrates a representative vaporization assembly according to the present disclosure;

figure 3 shows a flow diagram of a vaporizer assembly on a conventional manganese ion source.

Fig. 4 illustrates a flow diagram of a method for the vaporizer to collect from the acid rinse to provide an etchant bath and/or acid rinse.

Figure 5 shows process parameters for an example of manganese recovery using an evaporation assembly that uses an acid rinse as a source of manganese ions.

FIG. 6 is a graph depicting results of the embodiment of FIG. 4;

FIG. 7 shows a flow diagram of a method for the vaporizer to collect from the neutralizer treatment to provide an acid rinse.

FIG. 8 shows process parameters of another example of manganese recovery using an evaporation assembly, and

fig. 9 is a graph depicting results of the embodiment of fig. 7.

Corresponding reference characters indicate corresponding parts throughout the several views of the drawings.

Detailed Description

Exemplary embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous specific details are set forth, such as examples of specific compositions, components, devices, and methods, in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that should not be construed to limit the scope of the disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" may also be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" are inclusive and therefore specify the presence of stated features, elements, components, steps, integers, operations, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. While the open-ended term "comprising" should be understood as a non-limiting term used to describe and claim the various embodiments set forth herein, in certain aspects the term may alternatively be understood as a more limiting and limiting term, such as "consisting of or" consisting essentially of. Thus, for any given embodiment that recites a composition, material, component, element, feature, integer, operation, and/or method step, the disclosure also specifically includes embodiments that consist of, or consist essentially of, the aforementioned composition, material, component, element, feature, integer, operation, and/or method step. In the case of "consisting of", alternative embodiments do not include any additional compositions, materials, components, elements, features, integers, operations, and/or method steps, while in the case of "consisting essentially of", such embodiments do not include any additional compositions, materials, components, elements, features, integers, operations, and/or method steps that substantially affect the basic and novel features, but may be included in the embodiments without substantially affecting the basic and novel features.

Unless specifically stated to be performed in a sequential order, any method steps, processes, and operations described herein should not be construed as necessarily requiring their performance in the particular order discussed or illustrated. It is also to be understood that additional or alternative steps may be employed unless otherwise indicated.

When a component, element, or layer is referred to as being "on," "engaged to," "connected to," or "coupled to" another element or layer, it can be directly on, engaged, connected, or coupled to the other element, or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between," "adjacent" and "directly adjacent," etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

For ease of description, spatially and temporally relative terms, such as "before", "after", "inside", "outside", "below", "under", "over", and the like, may be used herein to describe one element or feature's relationship to another element or feature, as illustrated. In addition to the orientations shown in the figures, spatial or temporal relative terms may be intended to encompass different orientations of the device or system in use or operation.

Throughout this disclosure, numerical values represent approximate measurements or limitations of the ranges, to encompass minor deviations from the given values and embodiments having about the mentioned values as well as those having exactly the mentioned values. All numerical values (e.g., amounts or conditions) of parameters in this specification, including the appended claims, are to be understood as being modified in all instances by the term "about", whether or not "about" actually appears before the numerical value. "about" means that the value allows some slight imprecision (with some approach to determining exactness in the value; about or fairly close to the value; nearly). If the imprecision provided by "about" is not otherwise understood in the art with this ordinary meaning, then "about" as used herein at least refers to variations that can result from ordinary methods of measuring and using such parameters.

Further, the disclosure of a range includes disclosure of all values and ranges further divided throughout the range, including the endpoints and sub-ranges given for the range. As used herein, unless otherwise specified, ranges include the endpoints and include all disclosures of different values and ranges further divided throughout the range. Thus, for example, a range of "a to B" or "about a to about B" includes a and B.

Exemplary embodiments will now be described more fully with reference to the accompanying drawings.

In various aspects, the present disclosure provides methods for improving the manufacturing process of etching and metalizing non-conductive substrates. More specifically, the present disclosure provides a method of reclaiming a manganese etchant solution used to etch a non-conductive substrate. The manganese etchant solution can be used to prepare non-conductive substrates for electroless metallization, and such substrates are particularly suitable for use in components of automobiles or other vehicles, and can additionally be used in a variety of other industries and applications, including aerospace components, agricultural equipment, industrial equipment, home furnishings, and heavy machinery, as non-limiting examples. Further, the methods and materials of the present invention are particularly suited for forming lightweight corrosion resistant components for vehicles, including vehicle gussets, as well as interior and exterior decorative finishes, as non-limiting examples.

The present invention is directed to further simplifying the process for metallizing non-conductive substrates and to reducing the manufacturing and operating costs associated therewith. The metallization of non-conductive substrates typically comprises the following steps: (A) etching the substrate; (B) to make the non-conductive substrate conductive; and (C) metallizing the substrate to render it electrically conductive.

Suitable non-conductive substrates for use in accordance with the present disclosure include many different plastics, and include many plastic resins, including phenolic resins, urea-formaldehydes, polyethersulfones, polyacetals, diallyl phthalate, polyetherimides, teflon, polyaryl ethers, polycarbonates, polyphenylene oxides, mineral reinforced nylons, and polysulfones. Plastics particularly suitable for use according to the present disclosure are Acrylonitrile Butadiene Styrene (ABS) and polycarbonate acrylonitrile butadiene styrene (PC/ABS).

Referring to fig. 1, a general description of a method for metallizing a non-conductive substrate 200 is shown. Optionally, the non-conductive substrate is cleaned by a cleaning agent 202. The substrate is then rinsed in a series of one or more rinse solutions 203. The non-conductive substrate is then optionally pre-etched by pre-etch 204. Pre-etching the non-conductive substrate swells the non-conductive substrate making it easier to etch. The rinsing process of the one or more rinse solutions 205 is completed for any substrate immersed in the pre-etch solution. Whether or not the optional cleaning step and the pre-etching step occur, the non-conductive substrate is rinsed in an acid-containing rinse 206 prior to etching in the etching bath 207. The etching bath 207 includes an etchant solution containing manganese. In conventional methods, the etched substrate may be conditioned with a conditioning agent to facilitate activation. Also optionally, under conventional methods, the etched substrate may be rinsed in a solution 208 containing some or all of the acid components in the etching bath to remove any excess acid or other undesirable materials on the etched substrate. However, in many embodiments of the present disclosure, after etching, the etched substrate is not conditioned or rinsed. In contrast, after etching the non-conductive substrate, the etched substrate is neutralized in the neutralizer 209. Neutralizing any residual etchant that etches the substrate. If the etched substrate is rinsed, it can be recovered as a neutralizer by adding an oxidizer and agitating the rinse. Optionally, the etched substrate is pre-activated prior to activation. The pre-activation acts to promote absorption of the active agent. After neutralization, the etched substrate is activated by exposing the etched substrate to the activator 210. The activator 210 is typically a metal colloid or ionic solution selected from metals of transition group VIII of the periodic table of elements, and more preferably selected from palladium, platinum, iridium, rhodium, and mixtures thereof, and tin salts. Most preferably, activator 212 is palladium. The activator 212 fills the pores created by the etching, after which the etched substrate undergoes acceleration 214. Acceleration 214 removes excess material from the metal colloid, thereby ensuring that the etched substrate is metallized due to the mechanical coupling of the metal colloid with the holes of the etched substrate. After acceleration, the component is immersed in electroless nickel or electroless copper plating 216 to complete the metallization of the substrate.

In accordance with the present disclosure, there is also provided an exemplary vaporization system including a vaporizer assembly for use in conjunction with an acid rinse 208 or a neutralizing agent 209. More specifically, referring to FIG. 2, an exemplary evaporator assembly 10 according to the present disclosure is shown. The evaporator assembly 10 is composed of an evaporator treatment tank 20 and an evaporator 30.

Referring to fig. 3, an exemplary vaporization system according to the present disclosure is shown. A portion of the manganese ion source 102 is siphoned via a first conduit 104. A first conduit 104 directs a portion of the bath to a vacuum evaporator 106. In the vacuum evaporator 106 the part of the bath that is guided to the vacuum evaporator 106 is evaporated. Evaporation in a vacuum evaporator gives distillate water and a concentrated liquid. The concentrated liquid is directed through the second conduit 108 and fed back into the manganese ion source 102. Distillate water can be further collected, processed, and reused or discarded.

The source of manganese ions may be any of the following: a manganese-based etchant bath, a rinse that accumulates during rinsing of etched substrates, and a solution that accumulates during neutralization of etched substrates that may have been rinsed. It is also contemplated that the evaporator may evaporate any of the following: (1) at least a portion of the manganese-based etchant bath, (2) an acid collection bath after the etching stage, (3) a rinse that accumulates during rinsing of the etched substrate, and (4) a solution that accumulates during neutralization of the etched substrate before or after rinsing, or there may be a corresponding vaporizer for etching.

The first conduit 104 may comprise any medium for transferring liquid from one area to another, and may comprise, by way of non-limiting example, a pipe, tubing, a channel, a system of pipes, or any other transfer component capable of transferring liquid from one area to another. The first conduit 104 may be formed from any material that exhibits suitable acid resistance. The first conduit 104 may also include a filter for inhibiting particulates from entering the vacuum evaporator 106. The first conduit 104 may also include a pump for increasing the flow to the vacuum evaporator 106. The first conduit 104 may also include a one-way valve for inhibiting at least a portion of the manganese-based etchant bath from being returned to the manganese ion source 102 via the first conduit 104.

Manganese-based etchant baths use strong acids, and thus, suitable vacuum evaporators for use in accordance with the invention are those capable of resisting acid attack and capable of concentrating strong acids, including the following acids for use in manganese-based etchant baths: phosphoric acid, peroxymonophosphoric acid, peroxydiphosphoric acid, sulfuric acid, peroxymonosulfuric acid, and peroxydisulfuric acid, and methanesulfonic acid. While the starting concentration depends on the rate at which the substrate is rinsed and/or dragged out and/or the manganese-based etchant bath itself, suitable vacuum evaporators are constructed of materials that are resistant to corrosive acid attack at high acid concentrations (e.g., acid concentrations near the limit of how much the vacuum evaporator is currently capable of evaporating water). Non-limiting examples of suitable vacuum evaporators include single-effect evaporators, including single-effect climbing-film evaporators; multiple effect evaporators, including triple effect evaporators; and an ascending thin film vacuum evaporator. The vacuum evaporator according to the present disclosure further comprises a vacuum distillation unit comprising a rotary evaporator and a dry vacuum distillation column. Preferably, the vacuum evaporator employs a heat source to further accelerate the evaporation rate. Suitable heat sources include heat exchangers, including steam heat exchangers and oil heat exchangers. After evaporation, the concentrated acid can then be purified.

In various embodiments, the evaporator treatment tank 20 is a container for holding the treatment solution for evaporation, and may also include a heater and/or an air agitator to facilitate evaporation of the treatment solution.

In various embodiments, evaporator 30 is a vacuum evaporator. Vacuum evaporators generally operate by: the pressure in the liquid-filled container is reduced below the vapor pressure of the liquid, so that the liquid evaporates as a result.

In other various embodiments, the evaporator 30 is an atmospheric evaporator. Atmospheric evaporators are generally known as units that spray the solution to be evaporated onto a panel for evaporating the solution. The sprayer is configured to spray the solution such that a maximum amount of the surface area of the solution is exposed to air, thereby accelerating evaporation of the solution.

In a preferred embodiment, the treatment solution comprises an acid-based rinse solution for the etching process. Rinsing of the etched substrate in a dilute acid-based rinse solution containing the same acid present in the etching process allows for cleaner features while maintaining the oxidation state of any mn (vii) removed from the etching bath by the substrate.

In another preferred embodiment, the neutralizing agent comprises a mixture of an acid and an oxidizing agent. Etching of the non-conductive substrate via the mn (vii) ion source results in reduction of the mn (vii) ions to manganese dioxide. Neutralizing the etched substrate via a mixture of an acid and an oxidizing agent achieves at least the following beneficial effects. First, manganese dioxide can adhere to the etched substrate and interfere with the mechanical connection between the metal colloid and the etched substrate, which can lead to non-uniform and poor electroless metallization and thus ultimately to poor metallization of the substrate. However, the mixture of acid and oxidant removes manganese dioxide build-up on the etched substrate, thereby ensuring adequate metallization. Second, manganese dioxide is dissolved in water soluble mn (ll) ions, which can eventually be reintroduced into the solution used to generate the mn (vii) ions.

In any evaporator assembly configuration, the evaporator assembly can evaporate any oxidant present in the treatment solution along with water. After the evaporation is complete, the evaporated treatment solution contains dissolved manganese ions and acid present in the solution. It is important that the manganese ions remain in solution after evaporation.

Finally, the evaporated treatment solution is added to the etching process tank. The evaporated process solution may need to be rebalanced before adding it to make it comparable to the solution of the etch process tank. In some particularly preferred embodiments, the etch process tank is part of a manganese-based etchant solution bath. In other preferred embodiments, the etch process tank is part of an acid-based rinse process.

It is therefore particularly preferred that the etching bath comprises an acidic bath comprising a source of mn (vii) ions and one or more acids.

In further embodiments, the etching bath 207 may also include a mn (vii) regeneration unit for oxidizing less than +7 manganese species to mn (vii). In even further embodiments, the regeneration unit can be separate from the etching bath 207, and the regenerated mn (vii) can be subsequently introduced into the etching bath 207 after regeneration in the regeneration unit.

Figures 4 and 5 show an example of the manganese recovery achievable in connection with the process, according to the description of the process above and the possible alternative embodiments adopted.

Referring to fig. 3, a process flow for an evaporator process is shown in which a first evaporator assembly is fluidly coupled to an acid rinse 208 as an input to the evaporation assembly and has the option of outputting to the acid rinse 206 or the etch bath 208. Referring to FIG. 4, parameters for an exemplary set of process conditions that produce acceptable results are shown. Figure 5 shows, in a graphically depicted manner, the recovery obtained under a series of operating conditions at the parameters.

It has been determined that for etching baths having a composition of acid matrix with a specific gravity of greater than or equal to 1.630 and a manganese concentration of greater than or equal to 2g/l, acceptable manganese recovery rates are shown in various shades of green, with the brightest shade of green being optional. The red shading shows the conditions when the recovery rate is found to be suboptimal and unacceptable.

In a non-limiting example of a purge solution that compromises the operation of the mixed acid matrix and manganese ion source at a rate that maintains production and development requirements, a vaporizer fluidly coupled to the manganese ion source is used at a pressure at or below 1.8psig to achieve the desired concentration level. The desired concentration level is a function of the process line speed and solution flow characteristics within the treatment tank. For one specific example, if the etching bath is operated at a specific gravity of 1.650, it is found that the vacuum evaporator is operated on an acid concentration washer at a pressure equal to or less than 0.8psig at a controlled temperature equal to or greater than 140 ° F for sufficiently concentrating the evaporate so that it can be reintroduced into the treatment tank.

Similarly, fig. 6 shows a process flow of a vaporizer system fluidly coupled to a neutralizer 209 as a solution source, and an acid rinse 206 or 208 as an output. Fig. 7 summarizes parameters according to the exemplary embodiment of fig. 6. Figure 7 graphically illustrates the recovery obtained under a range of parameters.

It was determined that acceptable manganese recovery rates are shown in various green shades for an acid rinse bath having a composition of about 20% -70% acid base and about 2g/l or more manganese ions with the balance water, with the brightest green shade being optional. The red shading shows the conditions when the recovery rate is found to be suboptimal and unacceptable.

The foregoing description of the embodiments has been presented for purposes of illustration and description. And is not intended to be exhaustive or limiting of the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but are interchangeable if appropriate and can be used in a selected embodiment, even if not specifically shown or described. This can likewise be varied in a number of ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.