阅读说明：本技术 具有激光剥离容易性及高耐热性的聚酰胺酸树脂的制造方法及利用其制造的聚酰亚胺膜 (Method for producing polyamic acid resin having ease of laser peeling and high heat resistance, and polyimide film produced by using same ) 是由 姜镇洙 金镇慕 安龙昊 韩丞镇 于 2017-08-07 设计创作，主要内容包括：本发明涉及具有激光剥离容易性及高耐热性的聚酰胺酸树脂的制造方法及利用由此制造的聚酰胺树脂制造的聚酰亚胺膜,具体而言,与玻璃等的粘合力维持在适定水平,能在低能量进行激光剥离而能无薄膜的损伤(卷曲(curl),缺陷(defect),破损等)地进行剥离,制造具有高耐热性的聚酰胺酸树脂,利用其制造的聚酰亚胺膜可有用地适用于柔性的显示基板材料,半导体材料等。(The present invention relates to a method for producing a polyamic acid resin having ease of laser peeling and high heat resistance, and a polyimide film produced from the polyamide resin produced by the method, and more particularly, to a method for producing a polyamic acid resin having high heat resistance, which can maintain adhesion to glass or the like at a proper level, can be subjected to laser peeling at low energy, and can be peeled without damage (curl, defect, breakage, etc.) of a thin film, and a polyimide film produced by the method can be usefully applied to a flexible display substrate material, a semiconductor material, or the like.)