High-strength composite board and preparation method thereof

文档序号:147565 发布日期:2021-10-26 浏览:52次 中文

阅读说明:本技术 高强度复合板材及其制备方法 (High-strength composite board and preparation method thereof ) 是由 谭志均 杨剑波 杨宇 谭自成 于 2021-07-12 设计创作,主要内容包括:本发明属于复合板材的制备领域,公开一种高强度复合板材及其制备方法。包括上下面板层以及位于两者之间的骨架支撑层,骨架支撑层包括第一和第二支撑骨架;第一支撑骨架为网格状结构,包括至少两层横向支撑架和若干个纵向支撑架,每层横向支撑架由若干个横向支撑架间隔平行排列组成,纵向支撑架自下面板层向上依次纵向贯穿每层横向支撑架直至上面板层下表面,纵向支撑架之间呈前后、左右间隔均匀分布;第二支撑骨架设置在上面板层与最上层的横向支撑架之间以及下面板层与最下层的横向支撑架之间;骨架支撑层的空隙中填充有树脂泡沫层。本发明骨架支撑层分布更密实,具有更强的抗冲击性,当板材受到撞击时,不易坍塌,整个板材的使用寿命得到延长。(The invention belongs to the field of preparation of composite boards, and discloses a high-strength composite board and a preparation method thereof. The structure comprises an upper panel layer, a lower panel layer and a framework supporting layer positioned between the upper panel layer and the lower panel layer, wherein the framework supporting layer comprises a first supporting framework and a second supporting framework; the first supporting framework is of a latticed structure and comprises at least two layers of transverse supporting frames and a plurality of longitudinal supporting frames, each layer of transverse supporting frame is formed by arranging the plurality of transverse supporting frames in parallel at intervals, the longitudinal supporting frames sequentially and longitudinally penetrate through each layer of transverse supporting frame from a lower plate layer to the lower surface of an upper plate layer from top to bottom, and the longitudinal supporting frames are uniformly distributed at intervals from front to back and from left to right; the second supporting framework is arranged between the upper panel layer and the transverse supporting frame on the uppermost layer and between the lower panel layer and the transverse supporting frame on the lowermost layer; the gaps of the framework supporting layer are filled with resin foam layers. The framework supporting layer is more densely distributed and has stronger impact resistance, when the plate is impacted, the plate is not easy to collapse, and the service life of the whole plate is prolonged.)

1. High strength composite board, its characterized in that: the structure comprises an upper panel layer, a lower panel layer and a framework supporting layer positioned between the upper panel layer and the lower panel layer, wherein the framework supporting layer comprises a first supporting framework and a second supporting framework; the first supporting framework is of a latticed structure, the latticed structure comprises at least two layers of transverse supporting frames and a plurality of longitudinal supporting frames, each layer of transverse supporting frame is formed by arranging the plurality of transverse supporting frames in parallel at intervals, the longitudinal supporting frames sequentially and longitudinally penetrate through each layer of transverse supporting frame from the upper surface of the lower plate layer to the lower surface of the upper plate layer from top to bottom, and the longitudinal supporting frames are uniformly distributed at intervals from front to back and from left to right; the second supporting framework is arranged between the upper panel layer and the transverse supporting frame on the uppermost layer and between the lower panel layer and the transverse supporting frame on the lowermost layer; a resin foam layer is filled in the gap of the framework supporting layer; the upper panel layer, the lower panel layer and the framework supporting layer are made of fiber reinforced resin matrix composite materials, and resin in the resin foam layer is the same as resin in the fiber reinforced resin matrix composite materials.

2. The high strength composite panel according to claim 1, wherein: the longitudinal section of the second supporting framework is rectangular or arched.

3. The high strength composite panel according to claim 1, wherein: the fiber in the fiber reinforced resin matrix composite material is glass fiber, carbon fiber, boron fiber or aramid fiber, and the resin is unsaturated polyester, vinyl resin, polyurethane resin, epoxy resin or phenolic resin.

4. The method for preparing a high-strength composite board according to any one of claims 1 to 3, comprising the steps of:

(1) cutting the 1# fiber felt, the 2# fiber felt and the 3# fiber felt, wherein the number, the shape and the size of the 1# fiber felt, the 2# fiber felt and the 3# fiber felt respectively correspond to the transverse support frame, the longitudinal support frame and the second support frame; splicing a No. 1 fiber felt, a No. 2 fiber felt and a No. 3 fiber felt according to the composition form of the first supporting framework and the second supporting framework to form a frame structure; the fibers in the No. 1 fiber felt, the No. 2 fiber felt and the No. 3 fiber felt are the same as the fibers in the fiber reinforced resin matrix composite material;

(2) sequentially laying a layer of release film and a layer of prepreg on a bottom plate of the mold from bottom to top, then placing the frame structure obtained in the step (1) above the prepreg, sequentially laying a layer of prepreg and a layer of release film on the top of the frame structure, and closing the mold after the placement is finished; the prepreg is a fiber reinforced resin based prepreg corresponding to the fiber reinforced resin based composite material;

(3) preparing resin foam slurry, and injecting the resin foam slurry into the blank of the frame structure from a feed inlet on the side surface of the mould in a vacuum infusion mode; the resin in the resin foam slurry is the same as the resin in the fiber reinforced resin matrix composite material;

(4) and pressurizing and curing to obtain the high-strength composite board.

5. The method of manufacturing a high-strength composite board according to claim 4, wherein: in the step (2), the release film is a PET film, a PE film, a PI film or an OPP film.

6. The method of manufacturing a high-strength composite board according to claim 4, wherein: in the step (4), the pressure curing is carried out for 1 to 10 hours under the conditions of 0.5 to 5 Mpa and 50 to 150 ℃.

7. The method of manufacturing a high-strength composite board according to claim 4, wherein: in the step (3), the resin foam slurry is uniformly mixed by resin, a curing agent, hollow microspheres, an expandable microsphere foaming agent and a diluent according to the mass ratio of 100: 2-70: 5-30: 1-5; the curing agent is methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride, dodecenyl succinic anhydride, dicyandiamide and derivatives thereof, diamino diphenyl sulfone, a polyether diamine type curing agent, isophthalic acid hydrazide, isocyanate modified imidazole, methyl ethyl ketone peroxide, cyclohexanone peroxide or benzoyl peroxide, and the diluent is one or more of allyl glycidyl ether AGE501, n-butyl glycidyl ether, phenyl glycidyl ether, glycidyl methacrylate, allyl glycidyl ether, ethylene glycol diglycidyl ether and dodecyl glycidyl ether.

Technical Field

The invention belongs to the field of preparation of composite boards, and particularly relates to a high-strength composite board and a preparation method thereof.

Background

The common light composite board is made by using a fiber reinforced composite material as a panel layer and a foam material as a sandwich layer in a bonding mode, and although the characteristics of light weight and heat preservation are realized, the panel layer and the sandwich layer are layered due to lower bonding strength, and the carriage board has poor compression resistance and impact resistance due to no load-bearing structure, so that the use is influenced. With continuous research, the existing method for increasing the load-bearing structure in the carriage plate is to arrange a support column as a framework support layer, and although the mode plays a role in improving the load-bearing performance of the plate to a certain extent, the framework support structure is often distributed less in the plate, so that the mechanical performance of the carriage plate is unbalanced, and the phenomena of layering and local plate collapse are easily caused due to low bonding strength of a sandwich layer and a panel layer and no load-bearing structure.

Disclosure of Invention

In view of the above-mentioned drawbacks and disadvantages of the prior art, an object of the present invention is to provide a high-strength composite board and a method for manufacturing the same.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

the high-strength composite board comprises an upper panel layer, a lower panel layer and a framework supporting layer positioned between the upper panel layer and the lower panel layer, wherein the framework supporting layer comprises a first supporting framework and a second supporting framework; the first supporting framework is of a latticed structure, the latticed structure comprises at least two layers of transverse supporting frames and a plurality of longitudinal supporting frames, each layer of transverse supporting frame is formed by arranging the plurality of transverse supporting frames in parallel at intervals, the longitudinal supporting frames sequentially and longitudinally penetrate through each layer of transverse supporting frame from the upper surface of the lower plate layer to the lower surface of the upper plate layer from top to bottom, and the longitudinal supporting frames are uniformly distributed at intervals from front to back and from left to right; the second supporting framework is arranged between the upper panel layer and the transverse supporting frame on the uppermost layer and between the lower panel layer and the transverse supporting frame on the lowermost layer; a resin foam layer is filled in the gap of the framework supporting layer; the upper panel layer, the lower panel layer and the framework supporting layer are made of fiber reinforced resin matrix composite materials, and resin in the resin foam layer is the same as resin in the fiber reinforced resin matrix composite materials.

Preferably, the longitudinal section of the second supporting framework is rectangular or arched.

Preferably, the fiber in the fiber reinforced resin matrix composite is glass fiber, carbon fiber, boron fiber or aramid fiber, and the resin is unsaturated polyester, vinyl resin, polyurethane resin, epoxy resin or phenolic resin.

The preparation method comprises the following steps:

(1) cutting the 1# fiber felt, the 2# fiber felt and the 3# fiber felt, wherein the number, the shape and the size of the 1# fiber felt, the 2# fiber felt and the 3# fiber felt respectively correspond to the transverse support frame, the longitudinal support frame and the second support frame; splicing a No. 1 fiber felt, a No. 2 fiber felt and a No. 3 fiber felt according to the composition form of the first supporting framework and the second supporting framework to form a frame structure; the fibers in the No. 1 fiber felt, the No. 2 fiber felt and the No. 3 fiber felt are the same as the fibers in the fiber reinforced resin matrix composite material;

(2) sequentially laying a layer of release film and a layer of prepreg on a bottom plate of the mold from bottom to top, then placing the frame structure obtained in the step (1) above the prepreg, sequentially laying a layer of prepreg and a layer of release film on the top of the frame structure, and closing the mold after the placement is finished; the prepreg is a fiber reinforced resin based prepreg corresponding to the fiber reinforced resin based composite material;

(3) preparing resin foam slurry, and injecting the resin foam slurry into the blank of the frame structure from a feed inlet on the side surface of the mould in a vacuum infusion mode; the resin in the resin foam slurry is the same as the resin in the fiber reinforced resin matrix composite material;

(4) and pressurizing and curing to obtain the high-strength composite board.

Preferably, in the step (2), the release film is a PET film, a PE film, a PI film or an OPP film.

Preferably, in the step (4), the pressure curing is carried out for 1 to 10 hours under the conditions of 0.5 to 5 Mpa and 50 to 150 ℃.

Preferably, in the step (3), the resin foam slurry is uniformly mixed by resin, a curing agent, hollow microspheres, an expandable microsphere foaming agent and a diluent according to the mass ratio of 100: 2-70: 5-30: 1-5; the curing agent is methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride, dodecenyl succinic anhydride, dicyandiamide and derivatives thereof, diamino diphenyl sulfone, a polyether diamine type curing agent, isophthalic acid hydrazide, isocyanate modified imidazole, methyl ethyl ketone peroxide, cyclohexanone peroxide or benzoyl peroxide, and the diluent is one or more of allyl glycidyl ether AGE501, n-butyl glycidyl ether, phenyl glycidyl ether, glycidyl methacrylate, allyl glycidyl ether, ethylene glycol diglycidyl ether and dodecyl glycidyl ether.

The fiber reinforced resin matrix composite and the fiber reinforced resin matrix prepreg can be prepared according to the prior art or obtained by commercial purchase. The fiber reinforced resin-based prepreg is a semi-finished product of a fiber reinforced resin-based composite material.

Has the advantages that:

in the composite board, the framework supporting layer is more densely distributed, has stronger impact resistance and uniform mechanical property distribution, and is not easy to collapse when the board is impacted, so that the service life of the whole board is prolonged; meanwhile, the composite board framework supporting layer and the resin foam layer are integrally cured to form the whole board, the preparation process is simple, and the whole board is directly formed by using a compression molding die, so that the composite board framework supporting layer has high practicability, and the application of the structure on a carriage body is expanded.

Drawings

FIG. 1: a schematic structural view of a first embodiment of the high-strength composite board;

FIG. 2: a schematic structural view of a second embodiment of the high-strength composite board;

the laminated floor comprises 1-an upper panel layer, 2-a lower panel layer, 31-a first supporting framework, 3101-a transverse supporting frame, 3102-a longitudinal supporting frame, 32-a second supporting framework and 4-an epoxy resin foam layer.

Detailed Description

In order to make the invention clearer and clearer, the invention is further described in detail below. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Example 1

As shown in fig. 1, the high-strength composite board includes an upper board layer 1, a lower board layer 2, and a skeleton supporting layer therebetween, where the skeleton supporting layer includes two parts, namely a first supporting skeleton 31 and a second supporting skeleton 32; the first supporting framework 31 is of a grid structure, the grid structure comprises two layers of transverse supporting frames 3101 and a plurality of longitudinal supporting frames 3102, each layer of transverse supporting frame 3101 is formed by arranging the plurality of transverse supporting frames 3101 in parallel at intervals, the longitudinal supporting frames 3102 sequentially and longitudinally penetrate through each layer of transverse supporting frame 3101 from the upper surface of the lower plate layer 2 to the lower surface of the upper plate layer 1 from the upper surface of the lower plate layer upwards, and the longitudinal supporting frames 3102 are uniformly distributed at intervals from front to back and from left to right; the longitudinal section of the second supporting framework 32 is rectangular, and the second supporting framework 32 is arranged between the upper panel layer 1 and the transverse supporting frame 3101 on the uppermost layer and between the lower panel layer 2 and the transverse supporting frame 3101 on the lowermost layer; the gap of the framework supporting layer is filled with an epoxy resin foam layer 4; the upper and lower panel layers 2 and the framework supporting layer are made of glass fiber reinforced epoxy resin matrix composite materials.

The preparation method comprises the following steps:

(1) cutting 1# fiber felt, 2# fiber felt and 3# fiber felt, wherein the number, the shape and the size of the 1# fiber felt, the 2# fiber felt and the 3# fiber felt respectively correspond to the transverse supporting frame 3101, the longitudinal supporting frame 3102 and the second supporting framework 32; splicing a 1# fiber felt, a 2# fiber felt and a 3# fiber felt according to the composition form of the first supporting framework 31 and the second supporting framework 32 to form a frame structure; the No. 1 fiber felt, the No. 2 fiber felt and the No. 3 fiber felt are glass fiber felts;

(2) sequentially laying a layer of release film and a layer of prepreg on a bottom plate of the mold from bottom to top, then placing the frame structure obtained in the step (1) above the prepreg, sequentially laying a layer of prepreg and a layer of release film on the top of the frame structure, and closing the mold after the placement is finished; the prepreg is glass fiber reinforced epoxy resin-based prepreg; the release film is a PET film;

(3) preparing resin foam slurry, wherein the resin foam slurry is prepared by mixing epoxy resin, a curing agent, hollow glass beads, an expandable microsphere foaming agent (EM 406, produced by Nippon oil and fat pharmaceutical Co., Ltd.) and a diluent according to the mass ratio of 100: 60: 20: 2: 3, the curing agent is methyl tetrahydrophthalic anhydride, and the diluent is allyl glycidyl ether; injecting resin foam slurry into the blank of the frame structure from a feed inlet on the side surface of the mould in a vacuum infusion mode;

(4) and pressurizing and curing for 5 hours at the temperature of 120 ℃ under the pressure of 0.7 Mpa to obtain the high-strength composite board.

The composite board prepared by the embodiment has the thermal conductivity coefficient of 0.026W/m.K and the compressive strength of 6.7 MPa.

Example 2

The difference from example 1 is that: as shown in fig. 2, the second support frame 32 has an arch-shaped longitudinal section; otherwise, the same procedure as in example 1 was repeated.

The composite board prepared in this example had a thermal conductivity of 0.028W/m.K and a compressive strength of 6.8 MPa.

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