阅读说明：本技术 进气装置及半导体处理设备 (Air inlet device and semiconductor processing equipment ) 是由 李一吾 于 2019-11-29 设计创作，主要内容包括：本发明提供一种进气装置及半导体处理设备,进气装置用于半导体处理设备,进气装置包括：进气模块以及匀流板,匀流板位于进气模块的进气端,该进气装置还包括：固定结构,设置在匀流板的远离进气模块的一侧,固定结构能够在所处环境的温度上升时发生形变,以向匀流板施加使之固定在进气模块上的推力。通过本发明,避免了使用螺钉等固定方式对匀流板的损坏,也避免了匀流板与进气模块之间的安装不匹配问题,提高了机台工艺的一致性。(The invention provides an air inlet device and a semiconductor processing device, wherein the air inlet device is used for the semiconductor processing device and comprises: intake module and flow homogenizing plate, flow homogenizing plate are located the inlet end of intake module, and this air inlet unit still includes: the fixing structure is arranged on one side, far away from the air inlet module, of the flow equalizing plate and can deform when the temperature of the environment rises so as to apply thrust to the flow equalizing plate, so that the flow equalizing plate is fixed on the air inlet module. According to the invention, the damage to the uniform flow plate by using fixing modes such as screws and the like is avoided, the problem of mismatching of the installation between the uniform flow plate and the air inlet module is also avoided, and the process consistency of the machine table is improved.)

1. An air inlet device for a semiconductor processing apparatus, the air inlet device comprising an air inlet module and an even flow plate, the even flow plate being located at an air inlet end of the air inlet module, the air inlet device further comprising:

the fixing structure is arranged on one side of the flow equalizing plate far away from the air inlet module and can deform when the temperature of the environment rises so as to apply thrust to the flow equalizing plate to enable the flow equalizing plate to be fixed on the air inlet module.

2. The air intake apparatus of claim 1, wherein the fixing structure comprises at least two fixing pieces, the at least two fixing pieces being stacked in sequence in a direction away from the flow equalizing plate; and the thermal expansion coefficients of at least two fixing pieces in the at least two fixing pieces are different.

3. The intake apparatus of claim 2, wherein the at least two fixtures have a greater coefficient of thermal expansion for fixtures further away from the flow equalizer plate.

4. The air intake apparatus according to claim 2, wherein each of adjacent two of the fixing members are crimped or bonded to each other.

5. The air intake device according to claim 2, wherein the number of the fixing members is two, and the two fixing members are a first fixing member and a second fixing member which are sequentially stacked in a direction away from the flow equalizing plate, wherein the first fixing member includes a first upper section and a first lower section which are vertically arranged; the second fixing piece comprises a second upper subsection and a second lower subsection which are arranged along the vertical direction; wherein the first and second upper sections are attached to each other; the first lower subsection and the second lower subsection are separated from each other and form an included angle.

6. An air inlet arrangement according to claim 5, wherein the included angle is in the range 0 ° to 180 °.

7. An air inlet arrangement according to any one of claims 2 to 6 wherein the material used for each fixing element includes: a metallic material.

8. The air inlet device according to claim 5, characterized in that the material adopted by the second fixing member is any one of manganese-nickel-copper alloy, nickel-chromium-iron alloy, nickel-manganese-iron alloy and nickel; the first fixing piece is made of materials including: a nickel-iron alloy.

9. The air inlet arrangement of claim 1, wherein the plurality of securing structures are circumferentially disposed around an edge of the flow distribution plate and are offset from all of the air outlets of the flow distribution plate.

10. A semiconductor processing apparatus, comprising: a reaction chamber, further comprising: the intake device according to any one of claims 1 to 9, wherein the fixing structure is provided between the flow distribution plate and the reaction chamber, and the fixing structure is deformed to apply a pushing force to the flow distribution plate to fix the flow distribution plate to the intake module when a temperature of the reaction chamber rises.

Technical Field

The invention relates to the field of semiconductor manufacturing, in particular to an air inlet device and semiconductor processing equipment.

Background

The chemical vapor deposition epitaxial growth is to convey reaction gas into a reaction chamber, react the reaction gas by heating and the like, grow atoms and deposit the atoms on a substrate of the reaction chamber, and grow a single crystal layer.

In the epitaxial growth process, the main parameters to be controlled are the substrate temperature, the reaction gas flow rate, and the like. The thickness and the resistivity uniformity are important indexes in the preparation of the thin film. The temperature of the substrate has great influence on the crystal completeness and growth rate of the epitaxial layer, the reaction gas flow rate on the growth speed, the resistivity, the uniformity of the thickness of the epitaxial layer and the like.

Disclosure of Invention

The invention aims to solve at least one technical problem in the prior art, and provides an air inlet device and semiconductor processing equipment.

In order to achieve the object of the present invention, there is provided a gas inlet device for a semiconductor processing apparatus, the gas inlet device including a gas inlet module and a flow equalizing plate, the flow equalizing plate being located at a gas inlet end of the gas inlet module, the gas inlet device further including:

the fixing structure is arranged on one side of the flow equalizing plate far away from the air inlet module and can deform when the temperature of the environment rises so as to apply thrust to the flow equalizing plate to enable the flow equalizing plate to be fixed on the air inlet module.

Preferably, the fixing structure comprises at least two fixing pieces, and the at least two fixing pieces are sequentially stacked along the direction far away from the uniform flow plate; and the thermal expansion coefficients of at least two fixing pieces in the at least two fixing pieces are different.

Preferably, of the at least two fixing members, the farther away from the flow equalizing plate, the larger the thermal expansion coefficient of the fixing member.

Preferably, each adjacent two of the fixing members are pressed or bonded to each other.

Preferably, the number of the fixing pieces is two, and the two fixing pieces are respectively a first fixing piece and a second fixing piece which are sequentially stacked along a direction far away from the uniform flow plate, wherein the first fixing piece comprises a first upper branch part and a first lower branch part which are arranged along a vertical direction; the second fixing piece comprises a second upper subsection and a second lower subsection which are arranged along the vertical direction; wherein the first and second upper sections are attached to each other; the first lower subsection and the second lower subsection are separated from each other and form an included angle.

Preferably, the included angle ranges from 0 degrees to 180 degrees.

Preferably, the material used for each of the fixing members includes: a metallic material.

Preferably, the second fixing part is made of any one of manganese-nickel-copper alloy, nickel-chromium-iron alloy, nickel-manganese-iron alloy and nickel; the first fixing piece is made of materials including: a nickel-iron alloy.

Preferably, the number of the fixing structures is multiple, and the fixing structures are located around the edge of the flow equalizing plate and staggered with all the air outlets of the flow equalizing plate.

A semiconductor processing apparatus, comprising: a reaction chamber, further comprising:

the air inlet device described in the present application, wherein the fixing structure is disposed between the flow equalizing plate and the reaction chamber, and when the temperature of the reaction chamber rises, the fixing structure deforms and applies a thrust to the flow equalizing plate to fix the flow equalizing plate on the air inlet module.

The invention has the following beneficial effects:

according to the technical scheme of the air inlet device and the semiconductor processing equipment, the fixing structure is arranged on one side of the flow equalizing plate, which is far away from the air inlet module, and can deform when the temperature of the environment where the fixing structure is located rises, and the thrust for fixing the flow equalizing plate on the air inlet module is applied to the flow equalizing plate.

Drawings

Fig. 1 is a schematic structural diagram of an air intake device according to an embodiment of the present invention;

FIG. 2 is a schematic structural view of a fastening structure according to an embodiment of the present invention;

FIG. 3 is a schematic view of the fixing structure of the embodiment of the present invention without deformation;

FIG. 4 is a schematic view of a deformed fastening structure according to an embodiment of the present invention;

FIG. 5 is a schematic structural view of a fixing structure according to another embodiment of the present invention;

FIG. 6 is a schematic structural view of a fixing structure according to still another embodiment of the present invention;

FIG. 7 is a schematic view of the engagement of the fixing structure with the flow distribution plate according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of a semiconductor processing apparatus according to an embodiment of the present invention.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the following describes the air inlet device and the semiconductor processing equipment provided by the present invention in detail with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of an air inlet device according to an embodiment of the present invention, in which the air inlet device is used in a semiconductor processing apparatus, the air inlet device includes: the air intake module 1, the uniform flow plate 2 and the fixed structure 3.

The flow equalizing plate 2 is located at a gas inlet end of the gas inlet module 1, specifically, the gas inlet end of the gas inlet module 1 is a communication part of the gas inlet module 1 and the reaction chamber, and is used for conveying the process gas to the reaction chamber, a fixing groove is arranged at the communication part, and the flow equalizing plate 2 is located in the fixing groove.

The fixed structure 3 is arranged on one side of the flow equalizing plate 2 far away from the air inlet module 1, and the fixed structure 3 can deform when the temperature of the environment rises so as to apply thrust to the flow equalizing plate 2 to fix the flow equalizing plate on the air inlet module 1. As shown in fig. 1, a flow equalizing plate 2 is embedded in an air inlet end of an air inlet module 1, a fixing structure 3 is disposed outside the flow equalizing plate 2 and opposite to a surface of the flow equalizing plate 2 not in contact with the air inlet module 1, and the fixing structure 3 is deformed to apply a thrust directed to the air inlet module 1 to the surface of the flow equalizing plate 2 not in contact with the air inlet module 1, so that the flow equalizing plate 2 is fixed on the air inlet module 1.

According to the air inlet device provided by the embodiment of the invention, the fixing structure is arranged on one side of the flow equalizing plate far away from the air inlet module, the fixing structure can deform when the temperature of the environment where the fixing structure is located rises, and the thrust for fixing the flow equalizing plate on the air inlet module is applied to the flow equalizing plate.

Specifically, the fixing structure 3 can have various structures, as shown in fig. 2, which is a schematic structural diagram of the fixing structure in an embodiment of the present invention, in fig. 2, the fixing structure 3 includes at least two fixing members 31, and at least two fixing members 31 are sequentially stacked in a direction away from the flow equalizing plate 2; and the thermal expansion coefficients of at least two fixing members 31 are different among the at least two fixing members 31. In this embodiment, since the thermal expansion coefficients of the at least two fixing members are different, the at least two fixing members deform due to the change of curvature caused by the rise of the ambient temperature, and apply a thrust force to the flow equalizing plate to fix the flow equalizing plate on the air intake module.

Further, of the at least two fixing members 31, the farther away from the flow equalizing plate 2, the larger the coefficient of thermal expansion of the fixing member 31. In fig. 2, the larger the thermal expansion coefficient of the fixing member 31 away from the flow equalizing plate 2. Because of different thermal expansion coefficients, when the temperature rises, the fixing piece 31 with the large outer thermal expansion coefficient bends towards the side of the fixing piece 31 with the small thermal expansion coefficient to apply thrust to the flow equalizing plate, and the air inlet module can simply and conveniently fix the flow equalizing plate.

Specifically, each adjacent two fixing pieces 31 are crimped or bonded to each other. In the embodiment, the two adjacent fixing pieces are pressed or bonded with each other, so that the arrangement is simple and the realization is convenient.

Specifically, the material used for each fixing member 31 includes: a metallic material.

As shown in fig. 3 and fig. 4, which are schematic diagrams of the fixing structure not deformed and the fixing structure deformed according to the embodiment of the present invention, the fixing structure 3 may be a composite material composed of two or more metal materials with different thermal expansion coefficients, and due to the different thermal expansion coefficients of the layers, when the temperature rises, the deformation of the second fixing member 33 is greater than the deformation of the first fixing member 32, so that the whole fixing structure 3 is bent toward the first fixing member 32, and the curvature of the composite material is changed to generate the deformation.

As shown in fig. 3, the thickness of the fixing structure 3 is d at normal temperature, and the fixing structure 3 is deformed when the temperature is increased, and as shown in fig. 4, the total thickness after bending deformation becomes X, where the total deformation amount is X-d, and the total deformation amount is determined by the difference between the thermal expansion coefficients of the second fixing member 33 and the first fixing member 32 and the operating temperature.

Further, as shown in fig. 5, which is a schematic structural diagram of a fixing member in another embodiment of the present invention, in fig. 5, two fixing members 31 are respectively a first fixing member 32 and a second fixing member 33 which are sequentially stacked in a direction away from the flow equalizing plate, wherein the first fixing member 32 includes a first upper branch 321 and a first lower branch 322 which are vertically arranged; the second fixing member 33 includes a second upper section 331 and a second lower section 332 disposed in the vertical direction; wherein the first upper subsection 321 and the second upper subsection 331 are attached to each other; the first and second lower sections 322, 332 are separated from each other and form an angle θ. Further, the end of the first lower subsection 322 far from the second lower subsection 332 can be abutted against the flow equalizing plate 2, so that the stability of the fixing structure is ensured. Further, as shown in fig. 6, which is a schematic structural view of a fixing structure in another embodiment of the present invention, the included angle θ is in a range of 0 to 180 °. In fig. 6, the second lower branch 332 of the second fixing member 33 can be configured to move relative to the second upper branch 331, so as to change the size of the included angle between the first lower branch and the second lower branch, of course, the first lower branch 322 of the first fixing member 32 can also be configured to move relative to the first upper branch 321, so that the change of the size of the included angle is realized, and the change of the size of the included angle can be convenient for the fixing structure to be stabilized in different manners, thereby ensuring the effect of the fixing structure applying the pushing force to the flow equalizing plate.

In the embodiment shown in fig. 5 and 6, the first fixing member 32 and the second fixing member 33 are sequentially stacked in a direction away from the flow distribution plate, the first fixing member 32 is closer to the flow distribution plate 2, and the material used for the first fixing member 32 includes: nickel-iron alloy; the second fixing member 33, which is located at a position far from the flow equalizing plate 2, of the second fixing member 33 is made of any one of manganese-nickel-copper alloy, nickel-chromium-iron alloy, nickel-manganese-iron alloy and nickel.

Further, as shown in fig. 7, in an embodiment of the present invention, the fixing structures are matched with the flow equalizing plate, the number of the fixing structures 3 is plural, and the plural fixing structures 3 are distributed around the edge of the flow equalizing plate 2 and are staggered from all the air outlets 21 of the flow equalizing plate 2. The air inlet device provided by the embodiment is provided with a plurality of fixing structures which are uniformly and respectively arranged around the edge of the uniform flow hole 21, so that the uniformity of the force application of the fixing structures on the uniform flow plate is ensured.

In view of the above air inlet device, the present invention provides a semiconductor processing apparatus, as shown in fig. 8, which is a schematic structural diagram of the semiconductor processing apparatus provided in an embodiment of the present invention, in the embodiment, the semiconductor processing apparatus includes: the reaction chamber 4 and the gas inlet apparatus of any of the above embodiments, wherein the fixing structure 3 is disposed between the flow equalizing plate 2 and the reaction chamber 4, and when the temperature of the reaction chamber 4 rises, the fixing structure 3 deforms, and applies a thrust force to the flow equalizing plate 2 to fix the flow equalizing plate to the gas inlet module 1.

In fig. 8, the shape of the fixing structure 3 is a deformed shape.

According to the semiconductor processing equipment provided by the embodiment of the invention, the fixing structure can deform when the temperature of the environment rises, and the thrust for fixing the flow equalizing plate on the air inlet module is applied to the flow equalizing plate.

Furthermore, this embodiment provides air inlet unit and semiconductor processing equipment, because fixed knot constructs the deformation makes the uniform flow board and the module of admitting air pastes tightly, has avoided leading to the uniform flow board to the gas flow proportion distribution variation that gets into the reaction chamber because of the clearance between the fixed slot of uniform flow board and the module of admitting air to effectual control gets into the stability of reaction chamber air distribution, and then has improved the technological effect of board.

It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.