阅读说明：本技术 衬底处理装置和方法 (Substrate processing apparatus and method ) 是由 T·马利南 V·基尔皮 M·普达斯 于 2017-06-21 设计创作，主要内容包括：一种衬底处理装置,包括密封压力容器,诸如原子层沉积ALD装置；流体入口组件,被附接到密封压力容器的壁,该流体入口组件具有穿过壁的流体入口管；以及弹性元件,在流体入口组件中的流体入口管周围,从而将入口管耦合到壁,其中弹性元件的内部表面和外部表面中的一个表面受到在压力容器内主导的压力并且另一表面受到环境压力,以及其中流体入口管防止被携带到内部的流体与所述弹性元件接触；以及一种相关方法。(A substrate processing apparatus comprising a sealed pressure vessel, such as an atomic layer deposition, ALD, apparatus; a fluid inlet assembly attached to a wall of the sealed pressure vessel, the fluid inlet assembly having a fluid inlet tube passing through the wall; and a resilient element around the fluid inlet tube in the fluid inlet assembly, thereby coupling the inlet tube to the wall, wherein one of the inner and outer surfaces of the resilient element is subjected to a pressure prevailing within the pressure vessel and the other surface is subjected to an ambient pressure, and wherein the fluid inlet tube prevents fluid carried to the interior from contacting the resilient element; and an associated method.)

1. A substrate processing apparatus, comprising:

sealing the pressure vessel;

a fluid inlet assembly attached to a wall of the sealed pressure vessel, the fluid inlet assembly having a fluid inlet tube passing through the wall, the apparatus further comprising:

a resilient element around the fluid inlet tube in the fluid inlet assembly, thereby coupling the inlet tube to the wall, wherein one of an inner surface and an outer surface of the resilient element is subjected to a pressure prevailing within the pressure vessel and the other surface is subjected to an ambient pressure, and wherein the fluid inlet tube prevents fluid carried to the interior from contacting the resilient element.

2. The apparatus of claim 1, wherein the resilient element is configured to deform under displacement between fixed parts of an apparatus or assembly.

3. The apparatus of claim 1 or 2, wherein the sealed pressure vessel forms an outer chamber surrounding an inner chamber, the inner chamber being a sealed reaction chamber.

4. The apparatus according to any one of the preceding claims, wherein the resilient element is configured to induce a mechanical pressure on the inlet tube.

5. The apparatus of claim 4, wherein the mechanical pressure is directed inward toward the reaction chamber.

6. The device according to any one of the preceding claims, wherein the inlet tube is formed by two tubes arranged to slide inside each other.

7. The apparatus of claim 6, wherein the reaction chamber comprises a collar that locks the inlet tube in its position.

8. The device of any one of the preceding claims, wherein the inlet tube is arranged to be detached by removing at least a portion of the inlet tube inwardly through the interior of the device.

9. The device of any one of the preceding claims 1 to 7, wherein the inlet tube is arranged to be disassembled by removing at least a portion of the inlet tube outwardly in a direction away from the device.

10. The apparatus according to any one of the preceding claims, wherein the inlet tube is arranged in a fixed position relative to a reaction chamber wall.

11. The apparatus according to any one of the preceding claims, wherein the inlet tube is arranged in a rotatable position with respect to the reaction chamber wall.

12. The device according to any one of the preceding claims, wherein the inlet tube is equipped with a heat distribution element to distribute heat along the inlet tube.

13. The apparatus of claim 12, wherein the heat distribution element extends over a feed-through point of the wall of the sealed pressure vessel.

14. The apparatus of claim 3, wherein the point of contact at which the inlet tube meets the reaction chamber is a non-permanent fixed point.

15. The device of claim 14, wherein the contact points are sealed and/or reinforced.

16. A method in a substrate processing apparatus, comprising:

providing to the sealed pressure vessel: a fluid inlet assembly attached to a wall of the sealed pressure vessel, the fluid inlet assembly having a fluid inlet tube passing through the wall; and a resilient element around the fluid inlet tube in the fluid inlet assembly, thereby coupling the inlet tube to the wall, wherein one of an inner surface and an outer surface of the resilient element is subjected to a pressure prevailing within the pressure vessel and the other surface is subjected to an ambient pressure, and wherein the fluid inlet tube prevents fluid carried to the interior from contacting the resilient element, the method further comprising:

-inducing a mechanical pressure on the inlet pipe via the contraction of the elastic element, the mechanical pressure being directed towards the interior of the pressure vessel.

17. The method of claim 16, wherein the mechanical pressure is caused by a pressure differential between the pressure prevailing within the pressure vessel and the ambient pressure.

Technical Field

The present invention generally relates to substrate processing reactors and methods of operating the same. More particularly, but not exclusively, the invention relates to an Atomic Layer Deposition (ALD) reactor.

Background

This section illustrates useful background information and is not an admission that any of the technology described herein represents prior art.

Various substrate processing apparatuses, such as deposition reactors, typically have components that are in different pressure zones (from ambient pressure to vacuum pressure). The vacuum components are usually adapted to the magnitude of the ambient pressure, and differences in temperature and pressure will cause deformations in undesired locations. Chemical inlet pipes, in particular to chambers (chambers) that are under reduced pressure, are usually led from or via an ambient pressure area and in most cases via an area with a set of different temperatures, which will cause significant stress to the chemical inlet pipe, which may be a critical location for failure. An example of the entry of chemicals into the chamber is shown in US 8,741,062B 1.

Disclosure of Invention

It is an aim of certain embodiments of the present invention to provide an improved apparatus having a fluid inlet assembly, or at least to provide an alternative to the prior art.

According to a first exemplary aspect of the present invention, there is provided a substrate processing apparatus comprising:

sealing the pressure vessel;

a fluid inlet assembly attached to a wall of the sealed pressure vessel, the fluid inlet assembly having a fluid inlet tube passing through the wall, the apparatus further comprising:

a resilient element around a fluid inlet tube in the fluid inlet assembly, thereby coupling the inlet tube to the wall, wherein one of an inner surface and an outer surface of the resilient element is subjected to a pressure prevailing within the pressure vessel and the other surface is subjected to an ambient pressure, and wherein the fluid inlet tube prevents fluid carried to the interior from contacting the resilient element.

In certain example embodiments, the devices of the present disclosure provide pressure-regulated inlet clamping. In certain example embodiments, the resilient element is configured to: is pressed against the pressure vessel due to the pressure difference between the ambient pressure and the pressure prevailing inside the interior of the pressure vessel.

In certain example embodiments, the pressure vessel is sealed meaning that the reaction vessel is a closed or closable chamber.

In certain example embodiments, the resilient element is configured to deform under displacement between fixed parts of the device or assembly. In certain example embodiments, the resilient element is airtight or mostly airtight. When the elastic element is only largely airtight, the gas leakage through the element is preferably only a small leakage to maintain separate pressure areas.

In certain example embodiments, the sealed pressure vessel forms an outer chamber surrounding an inner chamber, which is a sealed reaction chamber.

In certain example embodiments, the fluid inlet assembly is attached to the reaction chamber wall. In certain example embodiments, the fluid inlet assembly is attached to an outer chamber surrounding the reaction chamber. Thus, depending on the implementation, the sealed pressure vessel described above may refer to an outer chamber or to a reaction chamber (with or without an outer chamber surrounding it).

In certain example embodiments, the inlet tube is arranged to be disassembled by removing at least a portion of the inlet tube inwardly through the interior (or reaction chamber) of the apparatus.

In certain example embodiments, the inlet tube is arranged to be disassembled by removing at least a portion of the inlet tube outwardly in a direction away from the apparatus (or reaction chamber).

In certain example embodiments, the inlet tube is arranged in a fixed position relative to the reaction chamber wall. In such embodiments, the inlet tube may be arranged to deform or bend at other points or joints.

In certain example embodiments, the inlet tube is arranged in a rotatable position relative to the reaction chamber wall. In such embodiments, the inlet tube may be arranged to deform or bend at other points or joints.

In certain example embodiments, the resilient element is configured to induce a mechanical pressure on the inlet tube.

In certain example embodiments, the mechanical pressure is directed inward toward the reaction chamber.

In certain example embodiments, the inlet tube is formed by two tubes arranged to slide inside each other.

In certain exemplary embodiments, the reaction chamber comprises a collar that locks the inlet tube in its position.

In certain example embodiments, the inlet tube is equipped with a heat distribution element to distribute heat along the inlet tube. In certain example embodiments, the heat distribution element extends over the entire longitudinal distance of the inlet tube. In certain example embodiments, the heat distribution element extends over only a portion of the entire longitudinal distance of the inlet tube. In certain example embodiments, the heat distribution element is formed from a single component. In certain example embodiments, the heat distribution element is formed from multiple components. In certain example embodiments, the heat distribution element is or includes an active heater element. In certain example embodiments, the heat distribution element is positioned in an ambient pressure condition. In certain example embodiments, the heat distribution element is positioned on the vacuum side (of the pressure vessel).

In certain example embodiments, the heat distribution element extends above a feed-through point of the wall of the sealed pressure vessel.

In certain exemplary embodiments, the contact point where the inlet tube meets the reaction chamber is a non-permanent fixation point.

In certain example embodiments, the contact points are sealed and/or reinforced.

According to a second example aspect of the invention, there is provided a method comprising:

providing to the sealed pressure vessel: a fluid inlet assembly attached to a wall of the sealed pressure vessel, the fluid inlet assembly having a fluid inlet tube passing through the wall; and a resilient element around the fluid inlet tube in the fluid inlet assembly, thereby coupling the inlet tube to the wall, wherein one of an inner surface and an outer surface of the resilient element is subjected to a pressure prevailing within the pressure vessel and the other surface is subjected to an ambient pressure, and wherein the fluid inlet tube prevents fluid carried to the interior from contacting the resilient element, the method further comprising:

the mechanical pressure on the inlet pipe is caused via the contraction of the elastic element, which is directed towards the interior of the pressure vessel.

In certain example embodiments, the mechanical pressure is caused by a pressure difference between a pressure prevailing within the pressure vessel and an ambient pressure.

The foregoing has described various non-limiting exemplary aspects and embodiments of the present invention. The above embodiments are merely illustrative of selected aspects or steps that may be used to implement the present invention. Some embodiments are presented with reference to only some example aspects of the invention. It should be appreciated that corresponding embodiments may also be applied to other example aspects. Any suitable combination of the embodiments may be formed.

Drawings

The invention will now be described, by way of example only, with reference to the accompanying drawings, in which:

FIG. 1 illustrates components of a substrate processing apparatus according to certain example embodiments of the invention;

FIG. 2 shows an enlarged cross-sectional view of the fluid inlet assembly of FIG. 1;

FIG. 3 illustrates a cross-sectional view of a fluid inlet assembly according to another example embodiment of the invention;

FIG. 4 illustrates certain components disclosed in the foregoing embodiments;

FIGS. 5a and 5b illustrate the operation of a mechanical limiter according to certain example embodiments of the invention;

FIG. 6 illustrates a cross-sectional view of a fluid inlet assembly according to yet another example embodiment of the invention;

FIG. 7 illustrates a cross-sectional view of a fluid inlet assembly according to yet another example embodiment of the invention;

FIG. 8 illustrates a cross-sectional view of a fluid inlet assembly according to yet another example embodiment of the invention; and

FIG. 9 illustrates another cross-sectional view of a point of contact between an inlet tube and a reaction chamber wall, according to certain example embodiments.

Detailed Description

In the following description, an Atomic Layer Deposition (ALD) technique is used as an example. However, the present invention is not intended to be limited to ALD techniques, but may be employed in a variety of substrate processing apparatus employing different temperature and/or pressure ranges, for example, in a Chemical Vapor Deposition (CVD) reactor. The substrate processing apparatus may be a vacuum deposition apparatus. Alternatively, the invention may be applied to devices that perform non-deposition processes, such as sintering or etching, e.g. Atomic Layer Etching (ALE).

The basis of the ALD growth mechanism is known to the person skilled in the art. ALD is a special chemical deposition method based on the sequential introduction of at least two reactive precursor species to at least one substrate. However, it should be understood that when using, for example, photon enhanced ALD or plasma assisted ALD (e.g., PEALD), one of these reactive precursors may be replaced by energy, resulting in a single precursor ALD process. For example, deposition of a pure element such as a metal requires only one precursor. When the precursor chemistry contains two elements of a binary material to be deposited, a binary compound (such as an oxide) can be generated with one precursor. Thin films grown by ALD are dense, non-porous and of uniform thickness.

Fig. 1 illustrates components of a substrate processing apparatus 100 according to some example embodiments of the invention. The reaction space 112 is a defined volume within the reaction chamber. The desired substrate processing (i.e., the desired chemical reaction) occurs at the surface of the substrate 101 in the reaction space 112. In certain example embodiments, during processing, the substrate 101 is supported by a substrate holder 110 within the reaction chamber.

The reaction chamber is a pressure vessel defined by reaction chamber wall(s) 130. In certain example embodiments, as shown in fig. 1, the apparatus 100 includes an additional pressure vessel, i.e., an outer chamber. The outer chamber surrounds the reaction chamber, closing off an intermediate space 114 between the reaction chamber wall 130 and an outer chamber (outer) wall 140.

During processing, the reaction space 112 within the reaction chamber is under vacuum. In case the apparatus 100 is a deposition reactor, such as an ALD or CVD reactor, the pressure within the reaction chamber/reaction space 112 may be, for example, 1 μ bar to 0.1bar, or more preferably 0.1 to 1 mbar. In certain exemplary embodiments, the intermediate space 114 has a pressure that is higher than the pressure in the reaction chamber (such as about 10 mbar). The intermediate space 114 may contain a heater. For example, the pressure device prevents the reactive chemical from coming into contact with the heater.

The ambient conditions (temperature, pressure) are generally dominant outside of the outer chamber wall 140. The space outside of the outer chamber wall 140 where the ambient temperature and the ambient pressure prevail is denoted by reference numeral 116.

The fluid inlet assembly 120 is attached to the outer chamber wall 140 to provide the desired chemistry to the reaction space 112 (although in other embodiments, such as embodiments lacking an outer chamber, a corresponding fluid inlet assembly may alternatively be attached to the reaction chamber wall 130).

Fig. 2 shows an enlarged cross-sectional view of the fluid inlet assembly 120. The fluid inlet assembly 120 is attached at one end to the fluid inlet tube 201 and at the other end to the exterior surface of the chamber wall 140. In a practical embodiment, the fluid inlet assembly comprises a first end piece 209 at a first end of the assembly and a second end piece 206 at an opposite end of the assembly. The end pieces 206, 209 may be flanges or the like. Fluid inlet tube 201 penetrates chamber wall 140 within assembly 120. Fluid inlet assembly 120 further includes a resilient element 205, resilient element 205 surrounding fluid inlet tube 201, thereby coupling the inlet tube to wall 140. The resilient element 205 may be airtight or mostly airtight. In a practical embodiment, the resilient element 205 is positioned between the end pieces 206, 209. The end piece or flange 206 may be attached to the chamber wall 140 by fastening elements, such as bolts 207. The end portion 209 may be attached to the fluid inlet tube 201 by, for example, a VCR (vacuum coupled radiation) connection. The vacuum gap around the fluid inlet tube 201 extends through the outer chamber wall 140 into the space within the assembly 120, which is bounded by the interior surface of the resilient element 205. Thus, the inner surface of the elastic element 205 is subjected to the pressure prevailing in the intermediate space 114, and the outer surface of the elastic element 205 is subjected to the ambient pressure. In the depicted solution, the inner surface is also to some extent subjected to the pressure of the reaction space 112.

As mentioned above, during operation of the substrate processing apparatus 100, the pressure within the intermediate space 114 is different from the ambient pressure. This pressure differential causes the elastic element 205 to contract (i.e., deform), causing the inlet tube 201 to push itself toward the reaction chamber.

When the volumes 112 and 114 are pressurized to ambient pressure (e.g. during a maintenance phase), this causes the elastic element 205 to regain its original length, which has the effect of retracting the inlet tube 201 outwards. This also reduces the stiffness of the resilient element 205, thereby enabling the resilient element 205 to be moved in any direction or angle to facilitate removal of one or more components from the device when desired.

In certain example embodiments, such as shown in fig. 2, the fluid inlet tube 201 is formed from two tubes: a tube 201 and a larger diameter tube 202. The fluid inlet pipe 201 enters the interior of the larger diameter pipe 202, travels a certain (short) distance within the larger diameter pipe and then breaks. Thus, the tubes 201 and 202 overlap for a certain distance. The larger diameter tubes extend from the discontinuity to the reactor chamber wall 130. As illustrated by the double arrow in fig. 2, the fit between the tubes 201 and 202 is a tight fit, allowing the tube 201 to slide in a horizontal direction just inside the larger diameter tube 202 when the inlet device 120 contracts or elongates due to pressure changes. The larger diameter tube 202 has a radial extension 211, the radial extension 211 locking the position of the tube 202. The larger diameter tubes 202 may be pushed from the direction of the reaction chamber to a position where the radial extensions contact the reaction chamber walls 130 and prevent further horizontal movement of the tubes 202. The collar 212 may be lowered on the other side of the radial extension, preventing the tube 202 from moving backwards, thereby locking the tube 202 in its horizontal position. During maintenance, the tube 202 may be pulled out via the reaction chamber.

In certain example embodiments, the inlet device 120 includes one or more mechanical limiters 208 that limit horizontal movement of the inlet device 120, particularly horizontal movement of the resilient element 205. The mechanical limiter 208 may be implemented as a separate bar element that does not necessarily have rotational symmetry. The limiter(s) can be attached between end pieces 206 and 209.

In certain example embodiments, the inlet device 120 includes a tubular thermal conductor 204 around the tube 201. In certain example embodiments, the inlet device 120 includes an additional tubular thermal conductor 203 around the tube 202. Thermal conductors 203 and 204 may receive heat from one or more heaters or they may themselves be active heaters. In certain example embodiments, there is a heat distribution element on top of the heater element around the inlet tubes 201 and/or 202. In certain example embodiments, the thermal conductor(s) are used to balance the temperature difference and generate a preferred thermal gradient. The heating of the inlet tube increases the temperature of the incoming fluid before it reaches the substrate 101. In certain example embodiments, the chemical source connected to the tube 201 is a heated source. In these embodiments, the entire path from the heated source to the substrate should be heated to avoid the generation of cold spots.

The depicted fluid inlet assembly 120 provides pressure-regulated inlet clamping. For example, the resilient element 205 may be implemented by a tube having a corrugated form (such as a bellows), or in some example embodiments by a spring. As mentioned, the inlet assembly 120 is configured to be pressed against the reaction chamber or another pressure vessel due to a pressure difference between ambient pressure and the pressure prevailing within the pressure vessel. It should be noted, however, that the described deformation (contraction or elongation action) of the fluid inlet assembly 120 or the resilient element 205 may be actuated by other components (such as by a mechanical actuator) in other example embodiments. In these embodiments, for example, an electric motor(s) or shape memory alloy may be used to effect the actuation.

Depending on the implementation, the fluid inlet assembly 120 creates a mechanically tight connection of the inlet tube against a counterpart (counter part), which may be, for example, the reaction chamber wall 130, the collar 212 and/or the larger diameter tube 202. In certain example embodiments, the elastic element 205 allows movement of the inlet tubes 201, 202 relative to the reaction chamber wall 130. In certain example embodiments, the movement is caused by stress introduced by pressure, temperature, or other structure of the device (e.g., the cover). In practice, this movement can be performed in any direction and angle. In certain example embodiments, one or more additional components (such as a pulse valve) are positioned to hang from the inlet tube without restricting movement of the resilient element 205. The resilient element 205 is not in contact with the chemical(s) being directed into the inlet tube 201. Thus, potential material leakage through the element 205 does not affect the chemical reaction within the reaction space 112.

Fig. 3 illustrates a cross-sectional view of a fluid inlet assembly 120, according to certain example embodiments of the invention. The embodiment shown corresponds to the embodiment shown in fig. 1 and 2, except that in the previously described embodiment the thermal conductor 204 positioned within the pressure region 114 has been positioned in the ambient pressure region 116. At the same time, the attachment point of the end piece 209, which engages the fluid inlet tube 201, has been shifted towards the reaction chamber. The thermal conductor 204 may alternatively be an active heater.

Fig. 4 illustrates the junction of fluid inlet tubes 201 and 202. The tube 201 is allowed to slide within the larger diameter tube 202. Fig. 4 also shows the radial extension comprised by the tube 202. Fig. 4 further illustrates a collar 212. The collar has an opening that is tight enough to allow the tube 202 to fit through, but prevents the extension 211 from fitting through, thus providing a locking effect for the tube 202.

Fig. 5a and 5b are cross-sectional views illustrating the operation of the mechanical limiter(s) 208. Fig. 5a shows the situation where the outer surface of the elastic element 205 is subjected to the same pressure as its inner surface; while figure 5b shows the situation where the pressure is lower on the inner surface side of the elastic element 205.

The example of the mechanical limiter 208 shown in fig. 5a and 5b is formed by two connected rods 208' and 208 ". Rod 208' is attached to end piece 206 and piece 208 "is attached to end piece 209. The rod 208' comprises two end stops and the rod 208 "comprises a protruding part that is allowed to move between the end stops, thus providing an end point for the longitudinal movement of the resilient element 205.

In the situation of fig. 5a, the resilient element 205 is at its normal length and the protruding part is close to the end stop closer to the end piece 209. In the case of fig. 5b, the elastic element 205 tends to contract in its longitudinal direction, and the protruding portion sets the maximum contraction limit together with the other end stop (closer to the end piece 206). Although the limiter is depicted here as limiting motion in a horizontal direction, it should be understood that depending on the implementation, an extension limiting movement in any direction may be implemented.

Fig. 6 shows a cross-sectional view of a fluid inlet assembly 120 according to yet another example embodiment of the invention. The illustrated embodiment generally corresponds to the embodiment illustrated in fig. 1 and 2. However, in this embodiment, the fluid inlet tube 201 extends all the way to the reaction chamber wall 130, and the tube 201 includes a radial extension 211. The larger diameter tube 202 is omitted.

Fig. 7 shows a cross-sectional view of a fluid inlet assembly 120 according to yet another example embodiment of the invention. The illustrated embodiment generally corresponds to the embodiment illustrated in fig. 6. However, in this embodiment, the radial extension 211 is positioned on the inlet assembly side of the reaction chamber wall 130, whereas in the embodiment shown in fig. 6, the radial extension 211 is positioned on the reaction chamber side of the reaction chamber wall 130. The contraction of the elastic element 205 presses the fluid inlet tube 201 against the reaction chamber wall 130 and/or against the reaction chamber wall 130. The radial extension 211 acts as a limiter for the longitudinal movement of the tube 201. The heater(s) 203 or the thermal conductor(s) 204 may be implemented as separate elements that are collinear with each other or stacked on top of each other. Alternatively, elements 203 and 204 may be implemented as a single element. In addition, rather than being positioned within the vacuum side, the heater 204 may also be positioned in the ambient pressure region (e.g., by positioning the heater 204 into a groove that extends along the surface of the inlet tube 201 from the ambient side, similar to that shown, for example, in fig. 3, or completely annularly surrounding the surface of the inlet tube 201). During maintenance, the inlet pipe 201 together with the assembly 120 can be pulled out from the outside (of the wall 140).

Fig. 8 shows a cross-sectional view of a fluid inlet assembly 120 according to yet another example embodiment of the invention. The illustrated embodiment generally corresponds to the embodiment illustrated in fig. 7. However, in FIG. 8, the sealing or strengthening at the point of contact where the inlet tube meets the reaction chamber or wall 130 has been described in more detail. According to fig. 8, the fluid inlet assembly may comprise a seal 801 (such as an o-ring) between the tube 201 and the reaction chamber 130 to reduce chemical leakage into the intermediate space 114. The contact points may be implemented in various ways. Instead of or in addition to the stepped connection shown in fig. 7 and the sealing implementation shown in fig. 8, a cone-type connection, a spherical or hemispherical connection, any surface connection with a suitable corresponding shape in the chamber wall 130 may be realized. For example, the contact points may be reinforced by a step joint, a circular joint, a spherical joint, or by separate cylinders.

Fig. 9 shows an implementation in which the contact point (or junction) 901 between the inlet tube 201 and the reaction chamber wall 130 is optionally arranged. The inlet tube 201 includes a bent or spherical end and the reaction chamber or chamber wall 130 includes a recessed corresponding surface. The inlet pipe 201 is allowed to move rotationally when required at the formed joint or joint point. In certain example embodiments, the feedthrough opening through the wall 130 at the junction may have a diameter that is greater than the inner diameter of the inlet tube 201. In certain example embodiments, the joints are implemented in the interior side of the reaction chamber wall 130.

In yet another alternative embodiment, the resilient element 205 is not a separate element, but is an element that is manufactured as an integral part of the chamber 140. Furthermore, the disclosed embodiments are not intended to limit the position of the resilient element 205, but rather to limit its mechanical function to allow movement of one or more components to which the resilient element 205 is connected. In certain example embodiments, a pressure device, in which the pressure in the intermediate space 114 is higher than the pressure in the reaction chamber, prevents the reactive chemical from coming into contact with the elastic element 205.

In certain alternative embodiments, intermediate space 114 has a pressure that is higher than the pressure in ambient region 116. In this case, mechanical pressure against the inlet assembly 120 may be generated from the inside of the sealed pressure vessel or reaction chamber towards the outside.

In certain example embodiments, the mechanical pressure placed on the element 120 may be intensified, displaced, or fully generated by a mechanical actuator or by a spring load.

In certain other alternative embodiments, the substrate processing apparatus includes more than two walls, and the inlet assembly operates on each of the walls.

The description relating to any particular preceding embodiment may be directly applicable to the other disclosed embodiments. This applies both with respect to the structure and operation of the disclosed apparatus.

Without limiting the scope and definition of the patent claims, certain technical effects of one or more of the example embodiments disclosed herein are listed below. One technical effect is to provide a reduction in undesirable stresses in chemical inlet tubes and related structures. Another technical effect is inlet tube pinch, which is adjustable by pressure or other means. Another technical effect is that cold spots are avoided and heat distribution at the chamber feed-throughs is improved. Another technical effect is improved maintainability.

It should be noted that some of the functions or method steps discussed above could be performed in a different order and/or concurrently with each other. Furthermore, one or more of the above-described functions or method steps may be optional or may be combined.

The foregoing description provides a full and informative description of the best mode presently contemplated by the inventors for carrying out the invention, by way of non-limiting examples of specific embodiments and examples thereof. It is obvious to a person skilled in the art, however, that the invention is not restricted to details of the embodiments presented above, but that it can be implemented in other embodiments using equivalent means without deviating from the characteristics of the invention.

Furthermore, some of the features of the above-disclosed embodiments of this invention could be used to advantage without the corresponding use of other features. Accordingly, the foregoing description should be considered as merely illustrative of the principles of the present invention, and not in limitation thereof. The scope of the invention is therefore intended to be limited solely by the appended patent claims.