阅读说明：本技术 一种位置压力传感器模组 (Position pressure sensor module ) 是由 不公告发明人 于 2019-10-14 设计创作，主要内容包括：本发明公开了一种位置压力传感器模组,具体涉及一种传感器,尤其是位置压力传感器模组的设计改进方面。包括压力传感器层、电容介质层、触控传感器层、玻璃基材、OCA胶层、框胶、传感器接口电路。通过压力传感器测量待测点的压力,压力产生的形变致使电容介质层触发触控传感器电容值发生变化,测定测量点的位置。本发明的有益效果是,能同时测量位置及压力。(The invention discloses a position pressure sensor module, particularly relates to a sensor, and particularly relates to the design improvement aspect of the position pressure sensor module. The touch control panel comprises a pressure sensor layer, a capacitance dielectric layer, a touch control sensor layer, a glass substrate, an OCA (optical clear adhesive) layer, frame glue and a sensor interface circuit. The pressure of the point to be measured is measured through the pressure sensor, and the capacitance value of the touch sensor is triggered to change due to deformation generated by the pressure, so that the position of the measuring point is measured. The invention has the beneficial effect that the position and the pressure can be measured simultaneously.)

1. The utility model provides a position pressure sensor module which characterized in that:

the touch control panel comprises a pressure sensor layer, a capacitance dielectric layer, a touch control sensor layer, a glass substrate, an OCA (optical clear adhesive) layer, frame glue and a sensor interface circuit;

the pressure sensor layer is positioned on the outermost layer and is attached to the capacitance medium layer after being packaged;

the capacitance medium layer can cause the capacitance value of the touch sensor layer to change;

the glass substrate is formed by bonding an upper glass substrate and a lower glass substrate together through an OCA adhesive layer;

the touch sensor layer is etched on the lower surface of the substrate on the glass substrate through an OGS scheme;

the frame glue wraps the whole vertical surface formed by the pressure sensor layer, the capacitance dielectric layer, the touch sensor layer and the glass substrate.

2. The position pressure sensor module as set forth in claim 1, wherein:

the preferable scheme of the pressure sensor layer is a film pressure sensor, and the output end of the pressure sensor layer is welded on a bonding pad of a sensor interface circuit;

the capacitor dielectric layer is OCA glue doped with the capacitor dielectric.

3. The position pressure sensor module as set forth in claim 1, wherein:

the sensor interface circuit is a flexible FPC and is provided with a touch IC, and the touch sensor is bonded by hot pressing and used for detecting and transmitting data and providing an external interface.

Technical Field

The invention discloses a position pressure sensor module, particularly relates to a sensor, and particularly relates to the design improvement aspect of the position pressure sensor module.

Background

Pressure sensors are often used to measure pressure, and touch sensors can be used to sense position. When the device is used independently, the data to be measured can be well given, and the difficulty is how to measure the two groups of data simultaneously. A position pressure sensor module can simultaneously measure a feedback position and pressure through a specific structure of the position pressure sensor module.

Disclosure of Invention

In order to solve the above disadvantages, the invention discloses a position pressure sensor module.

In order to achieve the purpose, the invention adopts the following technical scheme:

the invention discloses a position pressure sensor module, which is characterized in that: the touch control panel comprises a pressure sensor layer, a capacitance dielectric layer, a touch control sensor layer, a glass substrate, an OCA (optical clear adhesive) layer, frame glue and a sensor interface circuit; the pressure sensor layer is positioned on the outermost layer and is attached to the capacitance medium layer after being packaged; the capacitance medium layer can cause the capacitance value of the touch sensor layer to change; the glass substrate is formed by bonding an upper glass substrate and a lower glass substrate together through an OCA adhesive layer; the touch sensor layer is etched on the lower surface of the substrate on the glass substrate through an OGS scheme; the frame glue wraps the whole vertical surface formed by the pressure sensor layer, the capacitance dielectric layer, the touch sensor layer and the glass substrate. The preferable scheme of the pressure sensor layer is a film pressure sensor, and the output end of the pressure sensor layer is welded on a bonding pad of a sensor interface circuit; the capacitor dielectric layer is OCA glue doped with the capacitor dielectric. The sensor interface circuit is a flexible FPC and is provided with a touch IC, and the touch sensor is bonded by hot pressing and used for detecting and transmitting data and providing an external interface.

The invention has the beneficial effect that the position and the pressure can be measured simultaneously.

Drawings

FIG. 1 is a schematic view of a position pressure sensor module;

mark 1 is a pressure sensor layer, mark 2 is a capacitance dielectric layer, mark 301 is a glass substrate upper substrate, mark 302 is a glass substrate lower substrate, mark 4 is an OCA glue layer, mark 5 is frame glue, and mark 6 is a sensor interface circuit.

Detailed Description

The invention will be described in detail with reference to the drawings and specific embodiments, which are illustrative of the invention and are not to be construed as limiting the invention.