Novel design realization device of dustproof heat-conducting flame-retardant memory bar

文档序号:1556510 发布日期:2020-01-21 浏览:11次 中文

阅读说明:本技术 一种防尘导热阻燃内存条新型设计实现装置 (Novel design realization device of dustproof heat-conducting flame-retardant memory bar ) 是由 不公告发明人 于 2018-07-15 设计创作,主要内容包括:本发明专利涉及一种防尘导热阻燃内存条新型设计实现装置,所述装置内存条通过U型内存插槽模具将硅胶注入,使得硅胶完全环绕依附于内存条之上,形成固定防尘导热硅胶,该固定防尘导热硅胶属于一次生产永久使用装置。固定防尘导热硅胶安装于内存条的内存的金手指和内存颗粒的中间,即金手指上方、内存颗粒下方,物理尺寸为133mm×5mm×5mm,当内存条安装于内存插槽内时,固定防尘导热硅胶刚好盖住内存插槽。所述装置的固定防尘导热硅胶部件,采用吸附性能高、热稳定性好和化学性质稳定等特点的硅胶材料,有着优良的导热阻燃的特性。(The invention relates to a novel design realization device for a dustproof heat-conducting flame-retardant memory bank. The fixed dustproof heat conduction silica gel is arranged between a golden finger of a memory of the memory bank and memory particles, namely above the golden finger and below the memory particles, and has physical dimensions of 133mm multiplied by 5mm, and when the memory bank is arranged in the memory slot, the fixed dustproof heat conduction silica gel just covers the memory slot. The fixed dustproof heat-conducting silica gel part of the device adopts silica gel materials with the characteristics of high adsorption performance, good thermal stability, stable chemical property and the like, and has excellent heat-conducting and flame-retardant characteristics.)

1. The utility model provides a novel design realization device of fire-retardant memory strip of dustproof heat conduction, its characterized in that, the device contains memory strip (10), memory granule (11), fixed dustproof heat conduction silica gel (12), golden finger (13), memory slot (20).

2. The novel design implementation device of the dustproof heat-conducting flame-retardant memory bar according to claim 1, wherein the dustproof heat-conducting silica gel (12) is fixedly installed below the memory particles (11) of the memory bar (10) and above the golden finger (13).

3. The novel design realization device of dustproof heat-conducting flame-retardant memory bank according to claim 1, characterized in that the device fixes the dustproof heat-conducting silica gel (12) and the memory bank (10) as an integral device, which is not detachable and replaceable.

4. The novel design implementation device of the dustproof, heat-conducting and flame-retardant memory bank according to claim 1, wherein the physical size of the fixed dustproof, heat-conducting silica gel (12) is 133mm x 5mm, and when the memory bank (10) is installed in the memory slot (20), the fixed dustproof, heat-conducting silica gel (12) just covers the memory slot (20).

Technical Field

The patent of the invention relates to the field of computer memories.

Background

The computer is commonly called as a computer, and is modern intelligent electronic equipment capable of automatically processing mass data at high speed according to program operation. A computer that is composed of a hardware system and a software system and does not have any software installed is called a bare metal. The computer can be divided into five types, namely a super computer, an industrial control computer, a network computer (comprising a server and a workstation), a personal computer (a desktop computer) and an embedded computer, and more advanced computers comprise a biological computer, a photon computer, a quantum computer and the like.

The memory bank is an indispensable component of the computer, and the CPU can address the memory through the data bus. Historically, computer motherboards have main memories, and memory banks are extensions of the main memories. The subsequent computer mainboard has no main memory, and the CPU completely depends on the memory bank. All content on external memory must go through internal memory to be functional. After the memory bank is used for a period of time, a lot of dust exists on the surface, the golden finger can also generate an oxide layer, the dust on the memory bank can cause the computer to crash, the blue screen is used for restarting, the golden finger which can burn out the memory seriously can cause the memory to be scrapped, and meanwhile, the memory slot of the mainboard can also be damaged. In view of this, a new design implementation apparatus for a dustproof, heat-conducting and flame-retardant memory bank is needed.

SUMMARY OF THE PATENT FOR INVENTION

The invention relates to a novel design realization device for a dustproof heat-conducting flame-retardant memory bank.

The fixed dustproof heat conduction silica gel is arranged between a golden finger of a memory of the memory bank and memory particles, namely above the golden finger and below the memory particles, and has physical dimensions of 133mm multiplied by 5mm, and when the memory bank is arranged in the memory slot, the fixed dustproof heat conduction silica gel just covers the memory slot.

The fixed dustproof heat-conducting silica gel part of the device adopts silica gel materials with the characteristics of high adsorption performance, good thermal stability, stable chemical property and the like, and has excellent heat-conducting and flame-retardant characteristics.

Drawings

Fig. 1 is a schematic structural view of a novel design implementation device for a dustproof heat-conducting flame-retardant memory bank.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a novel design implementation device for a dustproof, heat-conducting and flame-retardant memory bank according to the present invention.

The utility model provides a novel design realization device of fire-retardant memory strip of dustproof heat conduction, its characterized in that, the device contains memory strip (10), memory granule (11), fixed dustproof heat conduction silica gel (12), golden finger (13), memory slot (20).

The utility model provides a novel design realization device of fire-retardant DRAM of dustproof heat conduction, its characterized in that, install memory granule (11) below of memory stick (10), the top of golden finger (13), fixed dustproof heat conduction silica gel (12) of installation.

The utility model provides a novel design realization device of fire-retardant DRAM of dustproof heat conduction, its characterized in that, fixed dustproof heat conduction silica gel (12) of device and DRAM (10) equipment as an organic whole, can not dismantle and change.

The utility model provides a novel design realization device of fire-retardant memory strip of dustproof heat conduction, its characterized in that, the physical dimension of the fixed dustproof heat conduction silica gel (12) of device is 133mm 5mm, when memory strip (10) were installed in memory slot (20), fixed dustproof heat conduction silica gel (12) just covered memory slot (20).

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention should be included in the scope of the present invention.

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