阅读说明：本技术 具有高Dk和低Df特性的高频高速粘结片及制备方法 (High-frequency high-speed bonding sheet with high Dk and low Df characteristics and preparation method thereof ) 是由 李建辉 林志铭 杜伯贤 李莺 于 2018-06-28 设计创作，主要内容包括：本发明公开了一种具有高Dk和低Df特性的高频高速粘结片,包括芯层,芯层包括若干介电胶层,介电胶层包括第一介电胶层和第二介电胶层中的至少一种,第一介电胶层是指Dk值6-30且Df值0.002-0.020的胶层,第二介电胶层是指Dk值15-100且Df值0.002-0.020的胶层,且所第二介电胶层的Dk值大于第一介电胶层的Dk值；芯层的总厚度≤20mil；第一介电胶层和第二介电胶层的厚度均为5-75μm。本发明的激光钻孔工艺更佳、小孔径不易有内缩的状况、较低的吸湿性、较高的绝缘性、高尺寸安定性、优异的热稳定性、高Dk及低Df特性、电性更佳,具备厚膜制作技术,另外接口更为单纯、成本更为低廉以用于多层FPC结构中。(The invention discloses a high-frequency high-speed bonding sheet with high Dk and low Df characteristics, which comprises a core layer, wherein the core layer comprises a plurality of dielectric adhesive layers, each dielectric adhesive layer comprises at least one of a first dielectric adhesive layer and a second dielectric adhesive layer, the first dielectric adhesive layer is an adhesive layer with a Dk value of 6-30 and a Df value of 0.002-0.020, the second dielectric adhesive layer is an adhesive layer with a Dk value of 15-100 and a Df value of 0.002-0.020, and the Dk value of the second dielectric adhesive layer is greater than that of the first dielectric adhesive layer; the total thickness of the core layer is less than or equal to 20 mil; the thickness of the first dielectric glue layer and the second dielectric glue layer is 5-75 μm. The laser drilling process is better, the small aperture is not easy to shrink, the hygroscopicity is lower, the insulativity is higher, the size stability is high, the thermal stability is excellent, the Dk and Df characteristics are high, the electrical property is better, the thick film manufacturing technology is provided, in addition, the interface is simpler, and the cost is lower, so that the laser drilling process can be used in a multi-layer FPC structure.)

1. A high-frequency high-speed bonding sheet having high Dk and low Df characteristics, characterized in that: the adhesive comprises a core layer, wherein the core layer comprises a plurality of dielectric adhesive layers, the dielectric adhesive layers comprise at least one of a first dielectric adhesive layer and a second dielectric adhesive layer, the first dielectric adhesive layer is an adhesive layer with a Dk value of 6-30 and a Df value of 0.002-0.020, the second dielectric adhesive layer is an adhesive layer with a Dk value of 15-100 and a Df value of 0.002-0.020, and the Dk value of the second dielectric adhesive layer is greater than that of the first dielectric adhesive layer; the core layer has Dk value of 6-100 and Df value of 0.002-0.020;

the total thickness of the core layer is less than or equal to 20 mil;

the thickness of the first dielectric adhesive layer and the thickness of the second dielectric adhesive layer are both 5-75 μm.

2. High frequency high speed bonding sheet with high Dk and low Df characteristics according to claim 1, characterized in that: the core layer further comprises a high molecular polymer thin film layer, the dielectric glue layer is provided with at least two layers, and the high molecular polymer thin film layer is located between the dielectric glue layers; the thickness of the high molecular polymer film layer is 5-200 μm.

3. High frequency high speed bonding sheet with high Dk and low Df characteristics according to claim 1, characterized in that: the bonding sheet is one of the following three structures:

the bonding sheet is of a single-layer structure, and the core layer is composed of a first dielectric adhesive layer;

the bonding sheet is of a three-layer structure, the core layer further comprises a high polymer film layer, the core layer is composed of two first dielectric adhesive layers and one high polymer film layer, and the high polymer film layer is located between the two first dielectric adhesive layers;

the bonding sheet is of a five-layer structure, the core layer further comprises a high polymer thin film layer, the core layer is composed of two layers, namely a first dielectric adhesive layer, two layers, a second dielectric adhesive layer and one layer, the high polymer thin film layer is composed of the core layer, and the core layer is sequentially composed of the first dielectric adhesive layer, the second dielectric adhesive layer, the high polymer thin film layer, the second dielectric adhesive layer and the first dielectric adhesive layer.

4. High frequency high speed bonding sheet with high Dk and low Df characteristics according to claim 1, characterized in that: still include from the type layer, it is located from the type layer the surface of sandwich layer.

5. The high frequency high speed bonding sheet with high Dk and low Df characteristics according to claim 2, wherein: the thicknesses of the first dielectric adhesive layer and the second dielectric adhesive layer are both 15-50 μm; the thickness of the high molecular polymer film layer is 5-25 μm; the total thickness of the core layer is 2-10 mil.

6. High frequency high speed bonding sheet with high Dk and low Df characteristics according to claim 1, characterized in that: the first dielectric adhesive layer and the second dielectric adhesive layer both comprise at least one of a component A and a component B; the sum of the proportions of the components A is 5-98% (weight percentage) of the total solid content of the dielectric adhesive layer, and the component B is 5-80% (weight percentage) of the total solid content of the dielectric adhesive layer;

the component A comprises at least one of sintered silicon dioxide, ferroelectric ceramic powder, conductive powder, teflon, fluorine resin and phosphorus flame retardant;

the component B comprises at least one of high molecular polymer resin and high molecular resin.

7. The high frequency high speed bonding sheet with high Dk and low Df characteristics according to claim 6, wherein: the ferroelectric ceramic powder is BaTiO₃、SrTiO₃And Ba (Sr) TiO₃At least one of; wherein the sum of the ferroelectric ceramic powder is 0-90% (weight percentage) of the total solid content of the dielectric adhesive layer;

the conductive powder is at least one of transition metal powder, transition metal alloy powder, carbon black, carbon fiber and metal oxide, wherein the sum of the proportions of the conductive powder is 0-45% (weight percentage) of the total solid content of the dielectric adhesive layer.

8. The high frequency high speed bonding sheet with high Dk and low Df characteristics according to claim 7, wherein: the sum of the proportions of the ferroelectric ceramic powder in the first dielectric adhesive layer is 0 to 75 percent (weight percentage) of the total solid content of the first dielectric adhesive layer; the sum of the proportions of the ferroelectric ceramic powder in the second dielectric adhesive layer is 30-90% (weight percentage) of the total solid content of the second dielectric adhesive layer;

the sum of the proportions of the conductive powder in the first dielectric adhesive layer is 0 to 15 percent (weight percentage) of the total solid content of the first dielectric adhesive layer; the sum of the proportions of the conductive powder in the second dielectric adhesive layer is 0-45% (weight percentage) of the total solid content of the second dielectric adhesive layer.

9. The high frequency high speed bonding sheet with high Dk and low Df characteristics according to claim 6, wherein: the proportion of the sintered silicon dioxide of the first dielectric glue layer and the second dielectric glue layer is 0-45% (weight percentage) of the total solid content of the dielectric glue layer, the proportion of the teflon is 0-45% (weight percentage) of the total solid content of the dielectric glue layer, the proportion of the fluorine resin is 0-45% (weight percentage) of the total solid content of the dielectric glue layer, and the proportion of the phosphorus flame retardant is 0-45% (weight percentage) of the total solid content of the dielectric glue layer.

10. A method for preparing a high frequency high speed bonding sheet having high Dk and low Df characteristics according to claim 3, wherein: the bonding sheet further comprises a release layer, the release layer is located on the surface of the core layer, and the preparation method is one of the following three methods:

the method comprises the following steps: the method comprises the following steps: wherein the bonding sheet is of a single-layer structure;

step one, coating a precursor of a first dielectric adhesive layer on the surface of a release layer, pre-drying the release layer at the temperature of 50-130 ℃ by a coating oven, then laminating another release layer, and rolling to obtain a semi-finished product A;

step two, curing the semi-finished product A at the low temperature of 50 ℃ for 21 hours to obtain a finished product bonding sheet;

the second method comprises the following steps: the method comprises the following steps: wherein the bonding sheet is of a three-layer structure;

step one, coating a precursor of a first dielectric adhesive layer on a high molecular polymer film layer, pre-drying the precursor at the temperature of 50-130 ℃ in a coating oven, then pressing a release layer, and rolling to obtain a semi-finished product B;

step two, coating the precursor of the first dielectric adhesive layer on the other surface of the high molecular polymer of the semi-finished product B, pre-drying at the temperature of 50-130 ℃ by a coating oven, then laminating the other release layer, and rolling to obtain a semi-finished product C;

step three, curing the semi-finished product at the temperature of 50 ℃ for 21 hours at low temperature to obtain a finished product bonding sheet;

the third method comprises the following steps: the method comprises the following steps: wherein the bonding sheet has a five-layer structure;

step one, coating a precursor of a second dielectric adhesive layer on a high molecular polymer film layer, pre-drying at the temperature of 50-130 ℃ by a coating oven, and rolling to obtain a semi-finished product D;

step two, coating the precursor of the first dielectric adhesive layer on the other surface of the second dielectric adhesive layer of the semi-finished product D, pre-drying at the temperature of 50-130 ℃ by a coating oven, then laminating a release layer, and rolling to obtain a semi-finished product E;

coating the precursor of the second dielectric adhesive layer on the other surface of the high-molecular polymer film layer of the semi-finished product E, pre-drying at the temperature of 50-130 ℃ in a coating oven, and rolling to obtain a semi-finished product F;

coating the precursor of the first dielectric adhesive layer on the other surface of the second dielectric adhesive layer of the semi-finished product F, pre-drying at the temperature of 50-130 ℃ in a coating oven, laminating the other release layer, and rolling to obtain a semi-finished product G;

and step five, curing the semi-finished product G at the low temperature of 50 ℃ for 21 hours to obtain the finished product bonding sheet.

Technical Field

The invention relates to pure glue and an adhesive sheet for a circuit board and the technical field of preparation thereof, in particular to an adhesive sheet for high-frequency high-speed transmission, which is mainly used in the field of high-frequency high-speed transmission of FPC (flexible printed circuit), such as automobile radars, global positioning satellite antennas, cellular telecommunication systems, wireless communication antennas, data link cable systems, direct broadcasting satellites, power supply back plates and the like.

Background

With the rapid development of information technology, wireless communication has become a necessity of life. The wireless communication system consists of a transmitting antenna, a receiving antenna and an antenna, wherein the antenna is responsible for the conversion of the electromagnetic energy value in the air and is an indispensable basic equipment for the communication system. In circuit design related to an antenna, passive components such as a capacitor and an inductor may be used to match the antenna. In order to meet the requirements of high performance and high frequency and high speed of signal transmission of electronic products, the number of active devices and passive devices must be increased, and the circuit and device density must be increased, which results in increased electromagnetic interference and noise. To solve this problem, the composite pure glue and bond ply (also called adhesive film, adhesive sheet) materials with high dielectric constant and low dielectric loss are the best choice for this design.

The pure glue and bond ply for high-frequency high-speed printed circuit board in the market at present have the following implementation approaches and disadvantages:

1. at least one of fluorine resin, epoxy resin, acrylic resin, urethane resin, silicone rubber resin, poly-p-xylylene resin, bismaleimide resin and polyimide resin with low dielectric constant and low dielectric loss is added, and the dielectric constant is too low to meet the requirement of a high-frequency band (>10GHz) printed circuit board.

2. The pure glue and bond ply added with low dielectric constant and low dielectric loss resin have serious glue layer retraction (retraction amount >10 μm) in the laser drilling process of downstream FPC factory because the additional added powder is not too much, otherwise, the adhesion strength is affected.

In addition, in the field of using high frequency and high speed materials in the FPC process, LCP films are mostly used as the high frequency bonding materials in the industry. The DK value of LCP is not high enough between 2.9 and 3.3, and the requirement of high Dk cannot be met. Moreover, LCP films are expensive and must be handled at higher temperatures (>280 ℃), which makes processing difficult due to the inability to use a rapid press, and after high temperature lamination, FPC has poor thickness uniformity (defect rate > 10%), poor adhesion strength to other interfaces, and higher resilience than conventional resin, which is not conducive to high density assembly of FPC boards. Other resin films, however, have problems such as poor electrical properties, poor adhesion, and poor mechanical strength, although they do not have the above problems.

For example, the CN 205105448U patent proposes a composite laminated high frequency low dielectric film, the CN 205255668U patent proposes a low dielectric film, and the CN 105295753B patent proposes a high frequency adhesive glue layer structure and a preparation method thereof, the former patent is still only a high frequency adhesive material with Dk between 2.0-3.5, and cannot satisfy the requirement of highDk (Dk > 8.0).

Disclosure of Invention

In order to meet the market demand on high-frequency high-speed flexible pure glue and bond ply, the invention provides a flexible high-frequency high-speed single-layer bonding sheet and a composite multi-layer bonding sheet which have high DK, low DF, high insulation and excellent thermal stability. The high-frequency high-speed bonding sheet provided by the invention has the advantages of simple process flow for manufacturing the FPC, better laser drilling process, (small pore diameter <0.05mm) difficult retraction (retraction amount is less than or equal to 10 mu m), lower hygroscopicity, higher insulativity, high dimensional stability, good thickness uniformity, excellent thermal stability, high Dk and low Df characteristics and better electrical property, can use normal pressing parameters to match with fast press equipment or pressure transmission equipment, avoids high-temperature operation at more than 280 ℃, has cost advantage, has thick film manufacturing technology, can reach 20mil in thickness, has simpler interfaces and lower cost, is used in a multilayer FPC structure, realizes bonding and stacking among a plurality of FPCs, and is used for producing the FPC with a multilayer structure.

In order to solve the technical problems, the invention adopts a technical scheme that: the invention provides a high-frequency high-speed bonding sheet with high Dk and low Df characteristics, which comprises a core layer, wherein the core layer comprises a plurality of dielectric adhesive layers, each dielectric adhesive layer comprises at least one of a first dielectric adhesive layer and a second dielectric adhesive layer, the first dielectric adhesive layer is an adhesive layer with a Dk value of 6-30 and a Df value of 0.002-0.020, the second dielectric adhesive layer is an adhesive layer with a Dk value of 15-100 and a Df value of 0.002-0.020, and the Dk value of the second dielectric adhesive layer is greater than that of the first dielectric adhesive layer; the core layer has Dk value of 6-100 and Df value of 0.002-0.020;

the total thickness of the core layer is less than or equal to 20 mil;

the thickness of the first dielectric adhesive layer and the thickness of the second dielectric adhesive layer are both 5-75 μm.

In order to solve the technical problems, the invention adopts the further technical scheme that:

the core layer further comprises a high molecular polymer thin film layer, the dielectric glue layer is provided with at least two layers, and the high molecular polymer thin film layer is located between the dielectric glue layers; the thickness of the high molecular polymer film layer is 5-200 μm.

Further, the bonding sheet is one of the following three structures:

the bonding sheet is of a single-layer structure, and the core layer is composed of a first dielectric adhesive layer;

the bonding sheet is of a three-layer structure, the core layer further comprises a high polymer film layer, the core layer is composed of two first dielectric adhesive layers and one high polymer film layer, and the high polymer film layer is located between the two first dielectric adhesive layers;

the bonding sheet is of a five-layer structure, the core layer further comprises a high polymer thin film layer, the core layer is composed of two layers, namely a first dielectric adhesive layer, two layers, a second dielectric adhesive layer and one layer, the high polymer thin film layer is composed of the core layer, and the core layer is sequentially composed of the first dielectric adhesive layer, the second dielectric adhesive layer, the high polymer thin film layer, the second dielectric adhesive layer and the first dielectric adhesive layer.

Further, the bonding sheet further comprises a release layer, and the release layer is located on the surface of the core layer.

Furthermore, the thickness of the first dielectric adhesive layer and the second dielectric adhesive layer is 15-50 μm; the thickness of the high molecular polymer film layer is 5-25 μm; the total thickness of the core layer is 2-10 mil.

In one embodiment of the present invention, the adhesive sheet is an adhesive sheet having a water absorption of 0.01 to 0.5% and a bonding strength >0.8 kgf/cm.

Further, the first dielectric adhesive layer and the second dielectric adhesive layer both comprise at least one of a component A and a component B; the sum of the proportions of the components A is 5-98% (weight percentage) of the total solid content of the dielectric adhesive layer, and the component B is 5-80% (weight percentage) of the total solid content of the dielectric adhesive layer;

the component A comprises at least one of sintered silicon dioxide, ferroelectric ceramic powder, conductive powder, teflon, fluorine resin and phosphorus flame retardant;

the component B comprises at least one of high molecular polymer resin and high molecular resin.

Further, the ferroelectric ceramic powder is BaTiO₃、SrTiO₃And Ba (Sr) TiO₃At least one of; wherein the sum of the ferroelectric ceramic powder is 0-90% (weight percentage) of the total solid content of the dielectric adhesive layer;

the conductive powder is at least one of transition metal powder, transition metal alloy powder, carbon black, carbon fiber and metal oxide, wherein the sum of the proportions of the conductive powder is 0-45% (weight percentage) of the total solid content of the dielectric adhesive layer.

More particularly, the sum of the proportions of the ferroelectric ceramic powder in the first dielectric adhesive layer is 0-75% (weight percentage) of the total solid content of the first dielectric adhesive layer; the sum of the proportions of the ferroelectric ceramic powder in the second dielectric adhesive layer is 30-90% (weight percentage) of the total solid content of the second dielectric adhesive layer;

the sum of the proportions of the conductive powder in the first dielectric adhesive layer is 0 to 15 percent (weight percentage) of the total solid content of the first dielectric adhesive layer; the sum of the proportions of the conductive powder in the second dielectric adhesive layer is 0-45% (weight percentage) of the total solid content of the second dielectric adhesive layer.

Further, the proportion of the sintered silicon dioxide of the first dielectric glue layer and the second dielectric glue layer is 0-45% (weight percentage) of the total solid content of the dielectric glue layer, the proportion of the teflon is 0-45% (weight percentage) of the total solid content of the dielectric glue layer, the proportion of the fluorine-based resin is 0-45% (weight percentage) of the total solid content of the dielectric glue layer, and the proportion of the phosphorus-based flame retardant is 0-45% (weight percentage) of the total solid content of the dielectric glue layer.

In a preferred embodiment of the present invention, the polymer film layer is a PI, PS, PA, PAI, PEEK, PET or PEN polymer film.

The invention also provides a preparation method of the high-frequency high-speed bonding sheet with high Dk and low Df characteristics, the bonding sheet further comprises a release layer, the release layer is positioned on the surface of the core layer, and the preparation method is one of the following three methods:

the method comprises the following steps: the method comprises the following steps: wherein the bonding sheet is of a single-layer structure;

step one, coating a precursor of a first dielectric adhesive layer on the surface of a release layer, pre-drying the release layer at the temperature of 50-130 ℃ by a coating oven, then laminating another release layer, and rolling to obtain a semi-finished product A;

step two, curing the semi-finished product A at the low temperature of 50 ℃ for 21 hours to obtain a finished product bonding sheet;

the second method comprises the following steps: the method comprises the following steps: wherein the bonding sheet is of a three-layer structure;

step one, coating a precursor of a first dielectric adhesive layer on a high molecular polymer film layer, pre-drying the precursor at the temperature of 50-130 ℃ in a coating oven, then pressing a release layer, and rolling to obtain a semi-finished product B;

step two, coating the precursor of the first dielectric adhesive layer on the other surface of the high molecular polymer of the semi-finished product B, pre-drying at the temperature of 50-130 ℃ by a coating oven, then laminating the other release layer, and rolling to obtain a semi-finished product C;

step three, curing the semi-finished product at the temperature of 50 ℃ for 21 hours at low temperature to obtain a finished product bonding sheet;

the third method comprises the following steps: the method comprises the following steps: wherein the bonding sheet has a five-layer structure;

step one, coating a precursor of a second dielectric adhesive layer on a high molecular polymer film layer, pre-drying at the temperature of 50-130 ℃ by a coating oven, and rolling to obtain a semi-finished product D;

step two, coating the precursor of the first dielectric adhesive layer on the other surface of the second dielectric adhesive layer of the semi-finished product D, pre-drying at the temperature of 50-130 ℃ by a coating oven, then laminating a release layer, and rolling to obtain a semi-finished product E;

coating the precursor of the second dielectric adhesive layer on the other surface of the high-molecular polymer film layer of the semi-finished product E, pre-drying at the temperature of 50-130 ℃ in a coating oven, and rolling to obtain a semi-finished product F;

coating the precursor of the first dielectric adhesive layer on the other surface of the second dielectric adhesive layer of the semi-finished product F, pre-drying at the temperature of 50-130 ℃ in a coating oven, laminating the other release layer, and rolling to obtain a semi-finished product G;

and step five, curing the semi-finished product G at the low temperature of 50 ℃ for 21 hours to obtain the finished product bonding sheet.

The invention has the beneficial effects that:

the bonding sheet disclosed by the invention, whether a single-layer structure (namely pure glue) or a multi-layer structure (namely bond ply), comprises a plurality of dielectric glue layers with high Dk and Df characteristics, so that the prepared bonding sheet has good electrical property, can provide voltage stabilization between chips and remove high-frequency interference, has excellent thermal stability, dimensional stability, good thickness uniformity, ultralow water absorption, better mechanical property, good flexibility, high soldering resistance, good bonding strength and good operability, can be pressed at low temperature, can use fast pressing equipment to avoid high-temperature operation above 280 ℃, and can ensure that an FPC has excellent flatness after pressing; the laser drilling preparation method is better, the small-aperture drilling (suitable for small-aperture processing smaller than 50 microns) is not easy to have the retraction condition, and the retraction amount is less than or equal to 10 microns; the film thickness is uniform during pressing, the impedance control is good, and the method is suitable for bonding of multiple layers of FPCs (flexible printed circuits) in high-frequency and high-speed transmission;

moreover, the current technology of the coating method can only coat a film with the thickness of about 50 μm at most, and the bonding sheet of the invention adopts a mode of laminating the high polymer film layer and a plurality of dielectric glue layers at intervals and a mode of coating each dielectric glue layer, so that the thickness range of the bonding sheet is wide (the thickness range of the core layer can reach 20mil), the controllability is good, the thick film preparation technology is provided, the bonding sheet with the thickness of more than 5mil can be easily obtained, and the invention still has the characteristics of high Dk and low Df under the condition of the thick film;

furthermore, test data show that the high-frequency substrate has low water absorption rate, and the water absorption rate is 0.01-0.5%;

furthermore, the adhesion strength between the first dielectric adhesive layer and other surfaces (such as a release layer or FPC) is more than 0.8 kgf/cm;

the bonding sheet with the multilayer structure comprises a high polymer film layer, wherein the high polymer film layer is a high polymer film such as PI, PS and the like, and can provide the following functions: 1) the mechanical strength of the bonding sheet is improved; 2) the damage voltage value of the bonding sheet is improved and the leakage current is prevented; 3) improving the insulation resistance of the bonding sheet; 4) the size stability of the bonding sheet is improved; 4) so that the adhesive sheet has low thermal expansion;

thirdly, the high-frequency high-speed bonding sheet with the characteristics of high Dk and low Df has simple matching structure composition, can save downstream processing procedures, and can be used for laminating a multilayer board only by tearing off the release layer and bonding and pressing the FPC to be laminated through the first conductive adhesive as the first dielectric adhesive layer has viscosity and the subsequent high strength is more than 0.8 kgf/cm; and secondly, due to the good electrical property, mechanical property and the like of the bonding sheet, the prepared multilayer FPC also has good electrical property, mechanical property and the like, and the requirement of high-frequency and high-speed transmission is met.

The foregoing description of the present invention is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clear and clear, and to implement the technical solutions according to the content of the description, the following detailed description of the preferred embodiments of the present invention is provided with the accompanying drawings.

Drawings

Fig. 1 is a schematic structural view of embodiment 1 of the present invention (the bonding sheet has a single-layer structure);

fig. 2 is a schematic structural view of embodiment 2 of the present invention (the bonding sheet has a three-layer structure);

fig. 3 is a schematic view of the structure of embodiment 3 of the present invention (the bonding sheet has a five-layer structure);

FIG. 4 is a metallographic image of a comparative example after laser drilling; (magnification 20 x 10 times)

FIG. 5 is a metallographic image of the example after laser drilling; (magnification 20 x 10 times)

The parts in the drawings are marked as follows:

the laminated film comprises a core layer 10, a high polymer film layer 101, a first dielectric adhesive layer 102, a second dielectric adhesive layer 103 and a release layer 30.

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and the present invention will be described in detail with reference to the accompanying drawings. The invention may be embodied in other different forms, i.e. it is capable of various modifications and changes without departing from the scope of the invention as disclosed.