阅读说明：本技术 3d-nand器件中用于字线分离的方法 (Method for word line separation in 3D-NAND device ) 是由 陈一宏 段子青 A·B·玛里克 K·陈 于 2018-05-22 设计创作，主要内容包括：描述半导体器件(例如,3D-NAND)中字线分离的方法。金属膜沉积在字线中及在间隔开的氧化物层的堆叠的表面上。通过高温氧化及蚀刻氧化物,或通过以单层方式氧化表面及蚀刻氧化物的低温原子层蚀刻,来移除金属膜。在移除金属覆盖层之后,字线被金属膜填充。(Methods of word line separation in semiconductor devices (e.g., 3D-NAND) are described. A metal film is deposited in the word lines and on the surface of the stack of spaced apart oxide layers. The metal film is removed by high temperature oxidation and etching of the oxide, or by low temperature atomic layer etching that oxidizes the surface in a single layer and etches the oxide. After removing the metal capping layer, the word line is filled with a metal film.)

1. A method of processing a substrate, the method comprising:

providing a substrate having a stack of spaced apart oxide layers with gaps therebetween, the stack having a top and sides, each gap forming a word line;

depositing metal on the stack such that the metal fills the gaps and covers the top and the sides of the stack with a thickness of a metal cover layer;

oxidizing the metal to a depth of about a thickness of the capping layer to form a metal oxide on the top and sides of the stack and leave the metal in the gap as a word line; and

etching the metal oxide from the top and the sides of the stack, leaving the metal in the word line.

2. A method of processing a substrate, the method comprising:

providing a substrate having a stack of spaced apart oxide layers with gaps therebetween, the stack having a top and sides, each gap forming a word line;

depositing metal on the stack such that the metal fills the gaps and covers the top and the sides of the stack with a thickness of a metal cover layer; and

repeating the steps of oxidizing the surface of the metal to form a metal oxide and etching the metal oxide from the stack until the metal cap layer is removed, leaving the metal in the gap as a wordline.

3. The method of claim 1 or claim 2, wherein the metal comprises tungsten and the metal oxide comprises tungsten oxide.

4. The method of claim 1 or 2, wherein the metal consists essentially of tungsten.

5. The method of claim 1 or 2, further comprising the step of forming a barrier layer on the oxide layer, and the metal film is deposited on the barrier layer.

6. The method of claim 5, wherein the barrier layer comprises TiN, the TiN being about thick

7. A method as claimed in claim 1 or 2, wherein there are more than 50 word lines.

8. The method of claim 1 or 2, wherein after etching the metal oxide, the metal capping layer is removed and the metal in the gap for forming a wordline is substantially flush with the side of the stack.

9. The method of claim 1 or 2, wherein the oxidizing and etching occur at a temperature of greater than or equal to about 400 ℃.

10. The method of claim 1 or 2, wherein the step of etching the metal oxide comprises the steps of: exposing the metal oxide to a metal halide etchant.

11. The method of claim 10, wherein the step of oxidizing the surface of the metal comprises the steps of: exposing the metal to O₂。

12. A method of processing a substrate, the method comprising:

providing a substrate having a stack of spaced apart oxide layers with gaps therebetween, the stack having a top and sides, each gap forming a word line;

optionally forming a barrier layer on the spaced-apart oxide layer, the barrier layer comprising TiN, the TiN having a thickness of about

depositing tungsten on the stack such that the tungsten fills the gaps and covers the top and the sides of the stack with a thickness of tungsten capping layer; and

repeating the steps of oxidizing a surface of the tungsten to form tungsten oxide and etching the tungsten oxide from the stack until the tungsten capping layer is removed, leaving the tungsten in the gap substantially flush with the sides of the stack, the step of oxidizing the surface comprising exposure to O₂And the step of etching the tungsten oxide includes exposure to WCl₅Or WCl₆One or more of the above-mentioned (a) or (b),

wherein the steps of depositing the tungsten, oxidizing the tungsten, and etching the tungsten oxide occur at a temperature less than or equal to about 400 ℃.

Technical Field

Embodiments of the present disclosure generally relate to methods of filling gaps or features in semiconductor devices. More particularly, embodiments of the present disclosure relate to methods of gap filling using tungsten in three-dimensional semiconductor devices.

Background

The semiconductor and electronics processing industries continue to strive for greater production rates while improving the uniformity of layers deposited on substrates having greater surface areas. These same factors combined with new materials also provide higher integration of circuits per substrate area. As circuit integration increases, the need for greater uniformity with respect to layer thickness and process control also increases. As a result, various techniques have been developed to deposit layers on substrates in a cost-effective manner while maintaining control over the properties of the layers.

V-NAND or 3D-NAND (three dimensional NAND gate) structures are used in flash memory applications. V-NAND devices are vertically stacked NAND structures having a large number of cells arranged in blocks. Gate-last word line formation is currently the dominant process flow in 3D-NAND manufacturing. Prior to the formation of the word lines, the substrate is a layered oxide stack supported by memory strings. The gap spaces are filled with tungsten using CVD or ALD. The top/sidewalls of the memory stack are also coated with tungsten. Tungsten is removed from the top/sidewalls of the stack by an etching process (e.g., a Reactive Ion Etching (RIE) process or a radical-based etching process) such that tungsten is only present within the interstitial spaces and each tungsten fill is completely separated from the other tungsten fills. However, due to loading effects of the etch process, the separation etch often causes different word line recess (stress) at the top of the stack than at the bottom. This difference becomes more pronounced as the oxide stack increases.

Accordingly, there is a need in the art for a method for wordline separation in a three-dimensional structured device.

Disclosure of Invention

One or more embodiments of the present disclosure are directed to a method of processing a substrate. A substrate is provided having a stack of spaced oxide layers with gaps therebetween. The stack has a top and sides, and each gap may form a word line. A metal is deposited over the stack such that the metal fills gaps and covers the top and sides of the stack with a thickness of a metal overburden (metal). The metal is oxidized to a depth of about the thickness of the capping layer to form a metal oxide on the top and sides of the stack and to leave the metal in the gap as a word line. The metal oxide is etched from the top and sides of the stack, leaving metal in the word lines.

Further embodiments of the present disclosure are directed to methods of processing a substrate. A substrate is provided having a stack of spaced oxide layers with gaps therebetween. The stack has a top and sides, and each gap may form a word line. Depositing metal on the stack such that the metal fills gaps and covers the top and sides of the stack with a thickness of a metal capping layer. Repeatedly oxidizing a surface of the metal to form a metal oxide and etching the metal oxide from the stack until the metal cap layer is removed, leaving the metal in the gap as a word line.

Further embodiments of the present disclosure are directed to methods of processing a substrate. A substrate is provided having a stack of spaced oxide layers with gaps therebetween. The stack has a top and sides, and each gap may form a word line. A barrier layer is optionally formed on the spaced oxide layers. The barrier layer comprises TiN, TiN is about

To aboutIn the range of (1). Tungsten is deposited over the stack such that the tungsten fills the gaps and covers the top and sides of the stack with the thickness of the tungsten capping layer. The surface of the tungsten oxide is repeatedly oxidized to form the tungsten oxide and the surface of the tungsten oxide is etched to remove the tungsten capping layer. Tungsten in the gaps is left substantially flush with the sides of the stack. The step of oxidizing the surface comprises exposure to O₂And the step of etching the tungsten oxide includes exposure to WCl₅Or WCl₆One or more of the above. The tungsten deposition, tungsten oxidation, and etching tungsten oxide occur at a temperature less than or equal to about 400 ℃.

Drawings

So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. The drawings illustrate only typical embodiments of the disclosure and are therefore not to be considered limiting, for the disclosure may admit to other equally effective embodiments.

Fig. 1 illustrates a stack of oxide layers in which word lines are to be formed, in accordance with one or more embodiments of the present disclosure;

FIG. 2 illustrates a metal film formed over the stack of oxide layers of FIG. 1;

fig. 3A and 3B illustrate a high temperature oxidation and etching process in accordance with one or more embodiments of the present disclosure; and

fig. 4A-4D illustrate a low temperature oxidation and etching process in accordance with one or more embodiments of the present disclosure.

Detailed Description

Before describing several exemplary embodiments of the present disclosure, it is to be understood that the present disclosure is not limited to the details of construction or process steps set forth in the following description. The disclosure is capable of other embodiments and of being practiced or of being carried out in various ways.

As used herein, "substrate" refers to any substrate or material surface formed on a substrate on which film processing is performed during the manufacturing process. For example, depending on the application, the surface of the substrate on which processing may be performed comprises materials such as silicon, silicon oxide, strained silicon, silicon-on-insulator (SOI), carbon-doped silicon oxide, amorphous silicon, doped silicon, germanium, gallium arsenide, glass, sapphire, and any other materials such as metals, metal nitrides, metal alloys, and other conductive materials. Substrates include, but are not limited to, semiconductor wafers. The substrate may be exposed to a pretreatment process to polish, etch, reduce, oxidize, hydroxylate, anneal, UV cure, e-beam cure and/or bake the substrate surface. In addition to film processing directly on the surface of the substrate itself, in the present disclosure, any of the disclosed film processing steps may also be performed on an underlayer formed on the substrate as disclosed in more detail below, and the term "substrate surface" is intended to encompass such an underlayer as indicated above and below. Thus, for example, where a film/layer or a portion of a film/layer has been deposited onto a substrate surface, the exposed surface of the newly deposited film/layer becomes the substrate surface.

One or more embodiments of the present disclosure advantageously provide a method of depositing a tungsten film in a gap of a three-dimensional structure. Some embodiments of the present disclosure advantageously provide methods of depositing conformal tungsten oxide films and selective tungsten oxide removal. Some embodiments advantageously provide methods of filling the lateral features of the V-NAND by a high quality tungsten film having a uniform thickness from the top to the bottom of the oxide stack.

One or more embodiments of the present disclosure are directed to methods of wordline isolation based on highly conformal metal (e.g., tungsten) oxidation and highly selective metal oxide (e.g., tungsten oxide) removal. The methods may use high or low temperature processes.

Referring to fig. 1, a substrate 10 has a stack 12 of several layers thereon. The substrate 10 may be any suitable substrate material and is not limited to the same material as any of the individual layers. For example, in some embodiments, the substrate is an oxide, nitride, or metal layer. The stack 12 has a plurality of oxide layers 14, the oxide layers 14 being spaced apart from one another to form gaps 16 between the oxide layers 14, such that each gap forms a word line or shell for the word line to be formed. The stack 12 has a top 13 and sides 15.

The stack 12 may have any suitable number of oxide layers 14 or gaps 16. In some embodiments, greater than or equal to about 10, 20, 30, 40, 50, 60, 70, 80, 90, or 100 gaps 16 are formed in the stack 12, which gaps 16 may be used to form the same number of wordlines. The number of gaps 16 is measured on either side of the memory string 11 connecting all of the individual oxide layers 14. In some embodiments, the number of gaps 16 is a multiple of 2. In some embodiments, the number of gaps is equal to 2ⁿWherein n is any positive integer. In some embodiments, the number of gaps 16 is about 96.

As shown in fig. 2, metal 20 is deposited on the stack 12. Metal 20 fills gaps 16 to form word lines 19. Metal 20 is formed around stack 12 such that metal 20 covers top 13 and sides 15 of stack 12 with the thickness of metal overlayer 22. The capping layer 22 is a material deposited outside the gap 16. The capping layer may have any suitable thickness depending on the process used to deposit the metal 20. In some embodiments, the thickness of the cover layer 22 is about

To about

In the range of (1). In some embodiments, the thickness of the cover layer 22 is greater than or equal to about

Or

The metal 20 may be any suitable metal for use in wordline applications. In some embodiments, the metal film comprises tungsten. In some embodiments, the metal film does not include tungsten. In some embodiments, the metal film consists essentially of tungsten. As used in this regard, the term "consisting essentially of tungsten" means that the composition of the bulk metal film is greater than or equal to about 95%, 98%, or 99% tungsten by atomic basis. The bulk metal film does not contain surface portions of the metal 20 that may contact another surface (e.g., an oxide surface) or be open for further processing, as these regions may have some small atomic diffusion with adjacent materials or some surface portion (mobility) like hydride termination.

The metal 20 may be deposited by any suitable technique, including, but not limited to, Chemical Vapor Deposition (CVD) or Atomic Layer Deposition (ALD). Metal 20 is deposited within the gap spaces and at the top/sidewalls of the memory stack.

Referring to fig. 3A and 3B, a high temperature oxidation with a low temperature etch process is shown. In fig. 3A, the metal 20 is oxidized to a metal oxide 25 to a depth of about the thickness of the capping layer 22. Substantially all of the capping layer 22 may be oxidized in a one step oxidation process. The oxidation of the capping layer may be affected by, for example, oxidizing gas flow, oxidizing gas partial pressure, wafer temperature, and process time to form a highly conformal oxidation of the metal capping layer 22.

The oxidizing gas may be any suitable oxidizing gas that can react with the deposited metal 20. Suitable oxidizing gases include, but are not limited to, O₂、O₃、H₂O、H₂O₂、NO、NO₂Or a combination thereof. In some embodiments, the oxidizing gas comprises O₂Or O₃One or more of the above. In some embodiments, the oxidizing gas consists essentially of O₂Or O₃One or more of the above. As used in this manner, the term "a,the term "consisting essentially of … …" means that the oxidizing component of the oxidizing gas is greater than or equal to about 95%, 98%, or 99% of the species. The oxidizing gas may comprise an inert gas, a diluent gas, or a carrier gas. For example, the oxidizing gas may be mixed with Ar, He or N₂Co-flowing or with Ar, He or N₂One or more of the above.

Some embodiments of the metal oxide 25 include tungsten oxide (WO)_x). In some embodiments, the metal oxide 25 is a derivative of the metal 20, which may or may not include oxygen. Suitable derivatives of the metal film include, but are not limited to, nitrides, borides, carbides, oxynitrides (oxynitrides), oxyborodes (oxyborides), oxycarbides (oxycarbarbides), carbonitrides (carbonitrides), borocarbides (borocarbonitrides), boronitrides (bororonitrides), borocarbonitrides (borooxycarbonitrides), oxycarbonitrides (oxycarbonitrides), oxycarbonitrides (oxynitrides), borooxycarbonitrides (borooxycarbarbides), and borooxynitrides (borooxynitrides). Those skilled in the art will appreciate that the deposited metal film may have an atomic number that is not stoichiometric with the metal film. For example, the film designated WO may have varying amounts of tungsten and oxygen. The WO film may for example be 90 at% tungsten. WO for describing tungsten oxide films means that the films include tungsten atoms and oxygen atoms, and should not be considered to limit the films to a particular composition. In some embodiments, the film consists essentially of the indicated atoms. For example, a film consisting essentially of WO means that the composition of the film is greater than or equal to about 95%, 98%, or 99% of tungsten atoms and oxygen atoms.

In the processes shown in fig. 3A and 3B, the oxidation process occurs at a high temperature. As used in this regard, the term "high temperature" means a temperature of greater than or equal to about 400 ℃, 450 ℃, 500 ℃, 550 ℃, 600 ℃, 650 ℃, 700 ℃, 750 ℃, 800 ℃, or 850 ℃. In some embodiments, the temperature of the oxidation process is in the range of about 400 ℃ to about 950 ℃, or in the range of about 450 ℃ to about 900 ℃, or in the range of about 500 ℃ to about 850 ℃.

The pressure during the oxidation process may be in a range from about 0.1 torr to about 760 torr. The process time (exposure time) may range from about 0.1 seconds to 12 hours. The pressure and process time may be affected by the temperature during the oxidation process.

In some embodiments, the metal 20 of the capping layer 22 is oxidized to form a metal oxide 25 on the top 13 and sides 15 of the stack 12, while leaving the metal 20 in the gap 16 to form the word line 19. In some embodiments, substantially all of the metal 20 in the gap 16 remains after oxidation. As used in this manner, the term "substantially all" means that the metal 20 is oxidized to the side 15 of the stack 12And (4) the following steps.

Referring to fig. 3B, metal oxide 25 formed from capping layer 22 is etched from top 13 and sides 15 of stack 12 to leave metal 20 in gaps 14 as word lines 19. The etching process of some embodiments is a selective etching process that will remove the metal oxide 25 without substantially affecting the metal 20.

In some embodiments, the etchant comprises a metal halide etchant. The etchant of some embodiments consists essentially of a metal halide etchant. As used in this regard, the term "consisting essentially of a metal halide etchant" means that the specified metal halide etchant species constitutes 95%, 98%, or 99% (excluding inert, diluent, or carrier gases) of the total metal halide etchant species. The metal halide etchant may have the same metal species as the metal oxide 25 or a different metal species. In some embodiments, the metal halide etchant comprises the same metal species as the metal oxide 25.

In some embodiments, the metal halide etchant includes a halogen atom consisting essentially of chlorine. As used in this regard, the term "consisting essentially of chlorine" means that the chlorine constitutes greater than or equal to about 95%, 98%, or 99% of the halogen atoms in the metal halide etchant on an atomic basis.

In some embodiments, the metal halide etchant includes WCl₅Or WCl₆One or more of the above. In some embodiments, the metal halide etchant consists essentially ofWCl₅Or WCl₆One or more of the above. As used in this regard, the term "consisting essentially of … …" means that the species constitutes greater than or equal to about 95%, 98%, or 99% of the metal halide on a molar basis.

The etch temperature of some embodiments is lower than the temperature during oxidation. In some embodiments, the etching temperature is in the range of about 300 ℃ to about 600 ℃, or in the range of about 400 ℃ to about 500 ℃. In some embodiments, the etching temperature is less than or equal to about 600 ℃, 550 ℃, 500 ℃, 450 ℃, 400 ℃, or 350 ℃. In some embodiments, the temperature during etching is greater than or equal to about 50 ℃, 75 ℃, 100 ℃, 125 ℃, or 150 ℃ lower than the temperature during oxidation. In some embodiments, both oxidation and etching occur at a temperature greater than or equal to about 400 ℃.

After etching the metal oxide 25, the metal cap layer 22 is removed and the metal 20 remaining in the gap 14 as the word line 19 is substantially flush with the side 15 of the stack 12. As used in this manner, the term "substantially flush" means that the word lines 19 within the gap 16 are at the sides 15 of the stack 12

And (4) the following steps.

The embodiment shown in fig. 3A and 3B illustrates a high temperature oxidation-low temperature etching process. The embodiment shown in fig. 4A-4D illustrates a low temperature oxidation and etching process. Some differences between these processes include, but are not limited to, lower temperature oxidation and slower removal of the capping layer.

After the stack 12 has formed the metal 20 with the capping layer 22 (as shown in fig. 2), the removal of the capping layer may be performed by an atomic layer etch type process. An atomic layer etch process may include multiple repeated processes that modify the surface to be etched and then volatilize or remove the modified surface, exposing a new surface underneath.

Referring to fig. 4A, the capping layer 22 is oxidized to form a metal oxide 25 on the surface of the capping layer 22. The oxidation process may use the same reagents and parameters as the embodiment shown in fig. 3A, with some changes to allow an Atomic Layer Etch (ALE) process to occur. The oxidation process of some embodiments occurs at a temperature in the range of about 300 ℃ to about 500 ℃. In some embodiments, the oxidation occurs at a temperature of less than or equal to about 500 ℃, 450 ℃, 400 ℃, or 350 ℃. The pressure during the low temperature oxidation process may be in a range of about 0.1 torr to about 760 torr. The process or exposure time may range from about 0.001 seconds to about 60 seconds. In an atomic layer etch process, each of the oxidation and etch processes is self-limiting because the process stops once it has reacted with an active surface site. For example, once all active surface sites of the metal 20 are exposed to and react with the oxidizing agent to form a metal oxide 25 film, further oxidation will not readily occur. Similarly, once the etchant has removed the oxide film to expose the fresh metal 20 underneath, the etchant is free of further oxide to be removed.

Referring to fig. 4B, after forming a metal oxide 25 on the metal 20, the stack 12 is exposed to an etchant. The etchant and etching conditions may be the same as those shown and described with respect to fig. 3B. The metal oxide 25 layer on the metal 20 is thinner than the embodiment shown in fig. 3A and 3B so that the etching process will take less time. In some embodiments, the etchant process time is in a range of about 0.1 seconds to about 60 seconds.

In some embodiments, the temperature during the oxidation and etching processes occurs at a temperature of less than or equal to about 400 ℃. The temperature of the etching process shown in fig. 4B may be the same as the oxidation process of fig. 4A, such that the substrate containing the stack 12 may be rapidly moved from one processing region of the processing chamber to another processing region of the processing chamber to sequentially expose the substrate to the oxidation and etching conditions.

This type of ALE process may be referred to as a spatial ALE, in which various reactive gases (e.g., oxidants and etchants) are flowed into separate regions of a processing chamber and a substrate is moved between and within the regions. The different processing regions are separated by a gas curtain (gas curtain) comprising one or more purge gas streams and/or vacuum streams to prevent mixing of the oxidant and etchant in the gas phase. The ALE process may also be performed by a time domain process in which the processing chamber is filled with an oxidizing agent, purged to remove excess oxidizing agent and reaction products or byproducts, filled with an etchant, and then purged to remove excess etchant and reaction products or byproducts. In time domain processing, the substrate may remain stationary.

Fig. 4C and 4D illustrate repeated exposure to an oxidizing agent to form metal oxide 25 and to an etchant to remove the metal oxide, respectively. Although the process is shown using two cycles, those skilled in the art will appreciate that this is merely representative, and that more than two cycles may be used to remove capping layer 22 and leave metal 20 in gap 16 as word line 19.

In some embodiments, a barrier layer is formed on the oxide layer 14 prior to depositing the metal 20. The barrier layer may be any suitable barrier material. In some embodiments, the barrier layer comprises titanium nitride. In some embodiments, the barrier layer consists essentially of titanium nitride. As used in this manner, the term "consisting essentially of titanium nitride" means that the composition of the barrier layer is greater than or equal to about 95%, 98%, or 99% by atom of titanium atoms and nitrogen atoms. The thickness of the barrier layer may be any suitable thickness. In some embodiments, the barrier layer has a thickness of aboutTo about

In the range of (1).

Reference throughout this specification to "one embodiment," "certain embodiments," "one or more embodiments," or "an embodiment" means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. Thus, the appearances of the phrases such as "in one or more embodiments," "in certain embodiments," "in one embodiment," or "in an embodiment" in various places throughout this specification are not necessarily referring to the same embodiment of the disclosure. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

Although the present disclosure has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present disclosure. It will be apparent to those skilled in the art that various modifications and variations can be made in the method and apparatus of the present disclosure without departing from the spirit and scope of the disclosure. Thus, it is intended that the present disclosure encompass modifications and variations within the scope of the appended claims and equivalents thereof.