阅读说明：本技术 一种高频线路反向电镀工艺 (A kind of reversed electroplating technology of HF link ) 是由 孙静晨 于 2019-08-14 设计创作，主要内容包括：本发明公开了一种高频线路反向电镀工艺,包括电镀前处理、电镀、电镀后处理和废水回收系统,所述电镀前处理包括除灰、除油、水洗、酸化、水洗,所述电镀包括反向电镀、选择性电镀、缝隙填充和水洗,所述电镀后处理包括烘干和上油,所述废水回收系统包括收集管道、收集箱、废水净化处理和再利用装置。本发明电镀前处理能够有效提高线路板的电镀质量,同时采用的电镀能够对线路板进行多样电镀,缝隙填充能够提高线路板的使用寿命,设置有废水回收系统节约能源,降低成本,本发明工序简单,生产效率和产品合格率高。(The invention discloses a kind of reversed electroplating technologies of HF link, including pre-electroplating treatment, plating, plating post-processing and sewage recovering system, the pre-electroplating treatment includes ash disposal, oil removing, washing, acidification, washing, the plating includes reversed plating, selective electroplating, gap filling and washing, the plating post-processing includes drying and oils, and the sewage recovering system includes collection conduit, collecting box, wastewater purification and reuse means.Pre-electroplating treatment of the present invention can effectively improve the electroplating quality of wiring board, the plating used simultaneously can carry out various plating to wiring board, gap filling can be improved the service life of wiring board, it is energy saving to be provided with sewage recovering system, reduce cost, process of the present invention is simple, and production efficiency and product qualification rate are high.)

1. a kind of reversed electroplating technology of HF link, it is characterised in that: including pre-electroplating treatment, plating, plating post-processing and give up Water reclamation system, the pre-electroplating treatment include ash disposal, oil removing, washing, acidification, washing, and the plating includes reversed plating, choosing The plating of selecting property, gap filling and washing, the plating post-processing include drying and oil, and the sewage recovering system includes collecting Pipeline, collecting box, wastewater purification and reuse means.

2. the reversed electroplating technology of a kind of HF link according to claim 1, it is characterised in that: the ash disposal passes through dedusting Machine is dusted operation, first then carries out wiring board hot dipping under 60-70 DEG C of hot water by ultrasonic oil removal machine before oil removing Removal operation, degreaser concentration are 3%, and temperature is 45-50 DEG C, ultrasonic frequency 25kHz, carry out water to wiring board after oil removing It washes.

3. the reversed electroplating technology of a kind of HF link according to claim 1, it is characterised in that: the acidification includes by line Road plate, which is placed on to impregnate in the sulfuric acid that concentration is 10-15%, carries out PCB surface polishing；Wiring board is carried out after the completion of acidification Washing.

4. the reversed electroplating technology of a kind of HF link according to claim 1, it is characterised in that: the plating can choose Reversed plating and selective electroplating, reversed plating use Reverse pulse plating, and when selective electroplating is protected by protecting film to be not required to The position to be electroplated, protecting film carry out pad pasting to wiring board by laminator, protecting film are torn after the completion of plating.

5. the reversed electroplating technology of a kind of HF link according to claim 1, it is characterised in that: the gap filling includes Gap on wiring board after the completion of plating is filled, the leakproofness of enhancement line plate enhances the corrosion resistance of coating simultaneously, Wiring board is washed after the completion of gap filling.

6. the reversed electroplating technology of a kind of HF link according to claim 1, it is characterised in that: the drying includes will be electric The wiring board washed after plating is put into drying box, is dried in 50-60 DEG C of temperature of environment.

7. the reversed electroplating technology of a kind of HF link according to claim 1, it is characterised in that: described to oil including to baking One layer of preservative oil of PCB surface brushing after dry protects wiring board.

8. the reversed electroplating technology of a kind of HF link according to claim 1, it is characterised in that: the wastewater purification Including being deacidified, being filtered to the waste water of collection and purified treatment, then by reuse means by the waste water handled again It comes into operation.

Technical field

The present invention relates to plating related fields, specially a kind of reversed electroplating technologies of HF link.

Background technique

And with the high development of high and new technology, the demand of electronic product is also increasingly increased, electronics technology is also promoted The continuous shape of enterprise is big, and order volume is more and more.In order to meet increasing demand amount, the production efficiency for improving wiring board is compeled The eyebrows and eyelashes, but the pre-processing of the electroplating technology of existing wiring board is mostly more coarse, leading to wiring board, effect is not in plating It is ideal and be easy to produce defect ware, and existing electroplating work procedure is that whole circuits are carried out to circuit board mostly, it is difficult to wiring board Selection circuit, and the most direct emission of waste water that existing electroplating technology generates are carried out, environmental pollution is caused, now designs a kind of high Frequency route reversed electroplating technology solves the above problems.

Summary of the invention

The purpose of the present invention is to provide a kind of reversed electroplating technologies of HF link, to solve to propose in above-mentioned background technique The problem of.

To achieve the above object, the invention provides the following technical scheme: a kind of reversed electroplating technology of HF link, including electricity Treatment before plating, plating, plating post-processing and sewage recovering system, the pre-electroplating treatment include ash disposal, oil removing, washing, acidification, Washing, the plating include reversed plating, selective electroplating, gap filling and washing, the plating post-processing include dry with It oils, the sewage recovering system includes collection conduit, collecting box, wastewater purification and reuse means.

Preferably, the ash disposal is dusted operation by dust removal machine, the first hot water by wiring board at 60-70 DEG C before oil removing Then lower hot dipping carries out removal operation by ultrasonic oil removal machine, degreaser concentration is 3%, and temperature is 45-50 DEG C, ultrasonic wave Frequency is 25kHz, is washed after oil removing to wiring board.

Preferably, the acidification includes being placed on wiring board to impregnate in the sulfuric acid that concentration is 10-15% to carry out wiring board Surface polishing；Wiring board is washed after the completion of acidification.

Preferably, the plating can choose reversed plating and selective electroplating, and reversed plating uses Reverse pulse plating, The position of plating is not needed when selective electroplating by protecting film protection, protecting film carries out pad pasting to wiring board by laminator, Protecting film is torn after the completion of plating.

Preferably, the gap filling includes being filled to the gap on the wiring board after the completion of plating, enhancement line The leakproofness of plate enhances the corrosion resistance of coating simultaneously, washes after the completion of gap filling to wiring board.

Preferably, the drying includes putting the wiring board washed after plating in drying box into, at 50-60 DEG C of temperature It is dried in environment.

Preferably, described to oil including being protected to one layer of preservative oil of PCB surface brushing after drying to wiring board Shield.

Preferably, the wastewater purification includes being deacidified, being filtered and purified treatment to the waste water of collection, is then led to It crosses reuse means the waste water handled comes into operation again.

Compared with prior art, the beneficial effects of the present invention are: the present invention passes through addition by the pre-electroplating treatment of setting Ash disposal and hot dipping process improve oil removal efficiency, increase acidizing process to improve the electroplating effect and quality that improve wiring board；Together When be provided with selective electroplating to improve the diversity of circuit board electroplating, increase gap filling process and come so that wiring board is in close Envelope state improves the corrosion resistance of wiring board；The sewage recovering system of setting can recycle to be produced in pre-electroplating treatment and electroplating process Raw waste water saves water resource, reduces energy consumption, saves production cost, present invention process is simple, and at low cost, effect is good, practicability By force.

Specific embodiment

The following is a clear and complete description of the technical scheme in the embodiments of the invention, it is clear that described embodiment Only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, the common skill in this field Art personnel every other embodiment obtained without making creative work belongs to the model that the present invention protects It encloses.