阅读说明：本技术 一种印制电路板多轴协同盲铣方法及装置 (Multi-axis collaborative blind milling method and device for printed circuit board ) 是由 李长生 田德琴 方笑求 沈兴林 于 2021-08-04 设计创作，主要内容包括：本发明涉及印刷电路板加工技术领域,具体为一种印制电路板多轴协同盲铣方法,包括如下加工步骤：拉平台：在工作台面上铺设垫板；使得主轴距离垫板上表面的基准高度保持统一；盲铣调试：盲铣过程中,跟踪测量各盲槽深度,当首次出现盲槽符合深度及精度要求时,以该盲槽对应的垫板厚度为基准厚度；贴胶纸：测量其余未达到加工深度要求的电路板盲槽深度,计算出深度差,根据深度差,在对应垫板位置上贴上一层或多层胶纸；直至所有主轴下加工出的盲槽深度一致；本发明在充分利用多轴共同作业条件下,仍然实现每个轴生产的产品槽深度(或余厚)精度满足+/-0.1mm的要求,提高了生产效率、降低了生产成本,并且操作简单、实用、高效。(The invention relates to the technical field of printed circuit board processing, in particular to a multi-axis collaborative blind milling method for a printed circuit board, which comprises the following processing steps: pulling the platform: laying a base plate on the working table; the reference height of the main shaft from the upper surface of the base plate is kept uniform; blind milling and debugging: in the blind milling process, the depth of each blind groove is tracked and measured, and when the blind groove is formed for the first time and meets the requirements of depth and precision, the thickness of a base plate corresponding to the blind groove is taken as the reference thickness; pasting gummed paper: measuring the depth of the blind grooves of the rest circuit boards which do not reach the processing depth requirement, calculating the depth difference, and sticking one or more layers of adhesive paper on the corresponding backing plate according to the depth difference; until the depths of the blind grooves machined under all the main shafts are consistent; the invention still realizes that the groove depth (or residual thickness) precision of the product produced by each shaft meets the requirement of +/-0.1mm under the condition of fully utilizing the common operation of multiple shafts, improves the production efficiency, reduces the production cost, and has simple, practical and efficient operation.)

1. A multi-axis collaborative blind milling method for a printed circuit board is characterized by comprising the following processing steps:

pulling the platform: laying a base plate (5) on a working table top (4) of the multi-axis milling machine in an area corresponding to each main shaft (1), measuring the reference height of each main shaft (1) from the base plate (5), and flattening the upper surface of the base plate (5) according to the measurement result; the reference height of the main shaft (1) from the upper surface of the base plate (5) is kept uniform; arranging the circuit board (3) on the corresponding backing plate (5);

blind milling and debugging: according to the depth requirement of the blind groove, a milling cutter (2) on a main shaft (1) is utilized to carry out blind milling on a circuit board (3) to form the blind groove; in the blind milling process, the depth of each blind groove is tracked and measured, and when the blind groove is formed for the first time and meets the requirements of depth and precision, the thickness of the base plate (5) corresponding to the blind groove is taken as the reference thickness;

pasting gummed paper: measuring the depths of other blind grooves which do not reach the processing depth requirement, and calculating the depth difference; according to the depth difference, one or more layers of gummed paper (6) are pasted on the position of the backing plate (5) corresponding to the bottom of the blind groove to supplement the corresponding depth difference, and the position of the circuit board (3) is lifted; the blind grooves at different positions of the circuit board (3) corresponding to the lower part of the main shaft (1) are the same in the method for pasting the gummed paper;

and (3) measurement correction: the steps of blind milling debugging and gummed paper pasting are repeated, the number of layers of the gummed paper (6) is increased or reduced, and the corresponding depth difference is corrected until the depths of the blind grooves processed under all the main shafts (1) are consistent;

mass production: and using the milling machine which finishes the measurement correction for blind milling batch processing of the circuit board.

2. The multi-axis coordinated blind milling method for the printed circuit board as claimed in claim 1, wherein the length and width dimensions of the backing plate (5) are larger than those of the corresponding circuit board (3).

3. The multi-axis coordinated blind milling method for the printed circuit board as claimed in claim 1, wherein the thickness of the gummed paper is 0.1 mm.

4. The method for multi-axis coordinated blind milling of the printed circuit board according to claim 1, wherein the backing plate (5) is a medium density wood fiber backing plate.

5. The device applied to the multi-axis coordinated blind milling method for the printed circuit boards is characterized by comprising a sliding seat (902) which is arranged above a working table (4) and can move transversely and longitudinally;

a paper pasting device (7) and a paper unloading device (8) are arranged at the lower end of the sliding seat (902), the paper pasting device (7) and the paper unloading device (8) both comprise a sleeve (703) connected with the sliding seat (902), and a telescopic mechanism (702) is arranged in the sleeve (703); mounting discs (707) are arranged on two sides of the sleeve (703); a glue paper roll (708) is arranged on the mounting disc (707) of the sticker device (7); an adhesive tape roll (808) is arranged on a mounting disc (707) of the paper discharging device (8); the lower end of a telescopic mechanism (702) of the paster device (7) is connected with a paster head; the paper pasting machine head comprises a paper cutting pressing sleeve (713), and a paper pasting pressing head (715) is connected in the paper cutting pressing sleeve (713) through a compression spring (714); the lower end of a telescopic mechanism (702) of the paper unloading device (8) is connected with a paper unloading machine head; the paper discharge head comprises a rubberizing pressure head (815); the back of the adhesive tape unreeled from the adhesive tape roll (708) is mounted on the sticker pressure head (715); the back of the adhesive tape unwound from the adhesive tape roll (808) is mounted on the adhesive tape sticking pressure head (815).

6. The device for the multi-axis coordinated blind milling method of the printed circuit board is characterized in that one mounting disc (707) of the paper pasting device (7) is provided with a paper adhesive tape roll (708), and the other mounting disc (707) is provided with a paper adhesive tape winding disc (709); the other end of the adhesive tape unreeled from the adhesive tape roll (708) is wound on the adhesive tape winding disc (709).

7. The device for the multi-axis coordinated blind milling method of the printed circuit board according to claim 5 is characterized in that one mounting disc (707) on the paper unloading device (8) is provided with an adhesive tape roll (808), and the other mounting disc (707) is provided with an adhesive tape winding disc (809); the other end of the adhesive tape unreeled from the adhesive tape roll (808) is wound on the adhesive tape winding disc (809).

8. The device for the multi-axis coordinated blind milling method of the printed circuit board according to claim 5 is characterized in that tensioning wheels (711) are arranged on two sides of the sleeve (703).

9. The device for the multi-axis coordinated blind milling method of the printed circuit board as claimed in claim 5, wherein the mounting disc (707) is arranged on the rotating shaft (705); a driven wheel (706) is coaxially arranged at the other end of the rotating shaft (705); a driving motor (718) is arranged on the sleeve (703); a motor shaft of the driving motor (718) is provided with a driving wheel (716); a transmission belt (717) is arranged between the driven wheel (706) and the driving wheel (716).

10. The device for the multi-axis coordinated blind milling method of the printed circuit board is characterized in that the two sides of the working platform (4) are provided with transverse rails (13), and a longitudinal beam (9) is arranged between the transverse rails (13); vertical beams (11) are arranged at two ends of the bottom surface of the longitudinal beam (9); the lower end of the vertical beam (11) is arranged on the transverse track (13) through a traveling mechanism (12); a screw rod (901) is arranged in the longitudinal beam (9); the sliding base (902) is arranged on the screw rod (901).

Technical Field

The invention relates to the technical field of printed circuit board processing, in particular to a multi-axis collaborative blind milling method and a multi-axis collaborative blind milling device for a printed circuit board.

Background

Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The printed circuit board is generally denoted as "PCB". The printed circuit board is mainly designed in a layout mode, and the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate. The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board.

The prior processing flow chart of the printed circuit board is shown in figure 1, and the printed circuit board is packaged and delivered after cutting, drilling, copper deposition, full-board electroplating, outer-layer pattern electroplating, outer-layer etching, AOI, solder resistance, character forming, testing and FQC.

Various step grooves are often required to be designed in the printed circuit board, the step grooves are blind grooves, in batch processing, a multi-shaft milling machine is generally adopted for blind milling processing, so that efficient production is achieved, as shown in fig. 2, during blind milling processing, the circuit board is fixed on a working table of the milling machine, and then the horizontal position and the lifting position of the milling cutter are automatically adjusted through a machine tool, so that processing of the blind grooves is achieved. In the processing process of the circuit board, the blind milling process is generally in the molding step.

The requirement on the depth of the blind slot in the production quality requirement of the printed circuit board is very strict, and the depth precision needs to meet the requirement of +/-0.1 mm. The method is characterized in that a 4-axis or 6-axis milling machine is generally adopted for processing the step grooves in the batch production of the printed circuit boards, the heights of milling cutters of all axes on the multi-axis milling machine are limited by the assembly precision of the machine tool, or the depths of the step grooves processed in batch cannot be unified due to slight difference of the thicknesses of the processed circuit boards, the depth control precision difference is abnormal and difficult to coordinate, and the requirement that the depth (or the residual thickness) precision of the product groove produced by each axis meets +/-0.1mm cannot be realized. If the single-shaft operation is adopted, although the uniform groove depth can be ensured, the operation production efficiency is low, and the productivity is wasted. There is currently no good solution to this problem.

Disclosure of Invention

Aiming at the problems, the invention provides a multi-shaft collaborative blind milling method for the printed circuit board, which still realizes that the groove depth (or the residual thickness) precision of a product produced by each shaft meets the requirement of +/-0.1mm under the condition of fully utilizing multi-shaft common operation, improves the production efficiency, reduces the production cost, and has simple, practical and efficient operation.

In order to achieve the purpose, the invention adopts the technical scheme that: a multi-axis cooperation blind milling method for a printed circuit board comprises the following processing steps:

pulling the platform: laying a base plate on the working table surface of the multi-axis milling machine in the area corresponding to each main shaft, measuring the reference height of each main shaft from the base plate, and flattening the upper surface of the base plate according to the measurement result; the reference height of the main shaft from the upper surface of the base plate is kept uniform; arranging the circuit board on the corresponding backing plate;

blind milling and debugging: according to the depth requirement of the blind groove, blind milling is carried out on the circuit board by using a milling cutter on the main shaft to form the blind groove; in the blind milling process, the depth of each blind groove is tracked and measured, and when the blind groove is formed for the first time and meets the requirements of depth and precision, the thickness of a base plate corresponding to the blind groove is taken as the reference thickness;

pasting gummed paper: measuring the depths of the blind grooves of the other circuit boards which do not reach the processing depth requirement, and calculating the depth difference; according to the depth difference, one or more layers of adhesive paper are attached to the position, corresponding to the bottom of the blind groove, of the base plate to supplement the corresponding depth difference, and the position of the circuit board is lifted; the blind grooves at different positions of the corresponding circuit board under the same main shaft are pasted with the gummed paper in the same way;

and (3) measurement correction: the steps of blind milling debugging and gummed paper pasting are repeated, the number of layers of the gummed paper is increased or reduced, and the corresponding depth difference is corrected until the depths of the blind grooves processed under all the main shafts are consistent;

mass production: and using the milling machine which finishes the measurement correction for blind milling batch processing of the circuit board.

As a further optimization of the above method, the length and width dimensions of the pad plate are larger than those of the corresponding circuit board.

As a further optimization of the method, the thickness of the gummed paper is 0.1 mm.

As a further optimization of the above method, the mat is a medium density wood fiber mat.

The invention also aims to provide a device applied to the multi-axis collaborative blind milling method for the printed circuit board, which can automatically paste or remove the gummed paper on the base plate, and improve the debugging efficiency of the multi-axis collaborative blind milling of the printed circuit board.

The device comprises a sliding seat which is arranged above a working table and can move transversely and longitudinally;

a paper pasting device and a paper unloading device are arranged at the lower end of the sliding seat, the paper pasting device and the paper unloading device both comprise sleeves connected with the sliding seat, and telescopic mechanisms are arranged in the sleeves; mounting discs are arranged on two sides of the sleeve; a mounting disc of the paper pasting device is provided with a glue paper roll; an adhesive tape roll is arranged on the mounting disc of the paper unloading device; the lower end of the telescopic mechanism of the paper pasting device is connected with a paper pasting machine head; the paper-cutting pressing sleeve is internally connected with a paper-cutting pressing head through a compression spring; the lower end of a telescopic mechanism of the paper unloading device is connected with a paper unloading machine head; the paper unloading machine head comprises a rubberizing pressure head; the back of the adhesive tape unreeled from the adhesive tape roll is mounted on the sticker pressure head; the back of the adhesive tape unreeled from the adhesive tape roll is hung on the adhesive tape sticking pressure head.

As a further improvement of the device, one mounting disc of the paper pasting device is provided with a gummed paper roll, and the other mounting disc is provided with a gummed paper winding disc; the other end of the adhesive tape unreeled from the adhesive tape roll is wound on the adhesive tape winding disc.

As a further improvement of the device, one mounting disc on the paper unloading device is provided with an adhesive tape roll, and the other mounting disc is provided with an adhesive tape winding disc; the other end of the adhesive tape unreeled from the adhesive tape roll is wound on the adhesive tape winding disc.

As a further improvement of the device, tensioning wheels are arranged on two sides of the sleeve.

As a further improvement of the above apparatus, the mounting plate is provided on the rotary shaft; a driven wheel is coaxially arranged at the other end of the rotating shaft; the sleeve is provided with a driving motor; a motor shaft of the driving motor is provided with a driving wheel; a transmission belt is arranged between the driven wheel and the driving wheel.

As a further improvement of the device, the two sides of the working table surface are provided with transverse rails, and longitudinal beams are arranged between the transverse rails; vertical beams are arranged at two ends of the bottom surface of the longitudinal beam; the lower end of the vertical beam is arranged on the transverse track through a traveling mechanism; a screw rod is arranged in the longitudinal beam; the sliding seat is arranged on the screw rod.

Compared with the prior art, the invention has the advantages that:

1. the invention can not only fully utilize the multi-axis common operation efficiency of the multi-axis milling machine to improve the production efficiency, but also can still realize that the groove depth (or the residual thickness) precision of the circuit board produced by each axis meets the requirement of +/-0.1mm under the condition of not changing the precision of the milling machine; and the method has low cost, simple operation, practicality and high efficiency.

2. The auxiliary debugging device is specially designed for the multi-axis collaborative blind milling method of the printed circuit board, so that the positioning speed and the pasting speed of the backing plate sticker in the multi-axis collaborative blind milling process can be increased, meanwhile, the paper unloading operation of the sticker pasted to be too thick can be quickly positioned and corrected, and the efficiency of the multi-axis collaborative blind milling of the printed circuit board is further improved.

Drawings

Fig. 1 is a flow chart of a conventional printed circuit board processing process.

Fig. 2 is a schematic diagram of a blind milling of a conventional printed circuit board.

FIG. 3 is a process flow diagram of the blind milling method of the present invention.

Fig. 4 is a schematic diagram of a blind milling structure of the printed circuit board of the present invention.

FIG. 5 is a schematic view of a structure corresponding to the position of the pad under the spindle and adhered with adhesive paper.

Fig. 6 is a schematic top view of the apparatus applied to the multi-axis cooperation blind milling method for the printed circuit board.

Fig. 7 is a side cross-sectional schematic view of the present device.

Fig. 8 is a schematic structural view of the sticker apparatus.

FIG. 9 is a schematic structural view of a paper discharging device.

FIG. 10 is a schematic top view of the paper pasting device and the paper unloading device after installation.

FIG. 11 is a schematic view of a rotating shaft shared by a paper pasting device and a paper unloading device.

Fig. 12 is a schematic view of a specific structure of the traveling mechanism.

Fig. 13 is a schematic structural view of the used adhesive tape.

In the figure: 1. a main shaft; 2. milling cutters; 3. a circuit board; 4. a work table; 5. a base plate; 6. gummed paper; 7. a sticker device; 8. a paper discharging device; 9. a stringer; 10. a screw motor; 11. erecting a beam; 12 a running mechanism; 13. a transverse rail; 14. gummed paper holes; 121. a traveling motor; 122. a traveling gear; 123. a linear guide rail; 124. a rack; 125. a walking seat; 901. a screw rod; 902. a slide base; 903. a connecting plate; 701. a connecting seat; 702. a telescoping mechanism; 703. a sleeve; 704. a connecting rod; 705. a rotating shaft; 706. a driven wheel; 707. mounting a disc; 708. a gummed paper roll; 709. a gummed paper winding disc; 710. clamping a wheel set; 711. a tension wheel; 712. an auxiliary wheel; 713. cutting paper and pressing the sleeve; 714. a compression spring; 715. pasting a paper pressure head; 716. a drive wheel; 717. a transmission belt; 718. a drive motor; 719. a connecting member; 808. an adhesive tape roll; 809. a tape winding reel; 815. and (5) sticking a glue pressure head.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, specific embodiments thereof are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.

Referring to fig. 3 to fig. 5, an embodiment of a multi-axis cooperative blind milling method for a printed circuit board includes the following processing steps:

pulling the platform: laying a base plate 5 on a working table surface 4 of the multi-axis milling machine in an area corresponding to each main shaft 1, measuring the reference height of each main shaft 1 from the base plate 5, and flattening the upper surface of the base plate 5 according to the measurement result; the reference height of the main shaft 1 from the upper surface of the backing plate 5 is kept uniform; arranging the circuit boards on the corresponding backing plates 5;

the upper surface of the backing plate 5 can be flattened to form a groove shape, so that the circuit board is fixed on the bottom surface of the groove;

wherein, the thickness of the backing plate 5 is controlled to be 1.25mm-2.5 mm;

wherein, four corners of the backing plate 5 can be detachably fixed on the working table surface 4 of the milling machine through pin shafts;

blind milling and debugging: according to the requirement of the blind groove depth of the circuit board, blind milling is carried out on the circuit board by using a milling cutter 2 on a main shaft 1 to form a blind groove; in the blind milling process, the depth of each blind groove is tracked and measured, and when the blind groove is formed for the first time and meets the requirements of depth and precision, the thickness of the base plate 5 corresponding to the blind groove is taken as the reference thickness;

wherein, the outer diameter of the milling cutter 2 is generally 1.0 mm;

in the blind milling process, stopping for many times to check the depth of each blind groove until the blind groove is formed for the first time and meets the requirements on depth and precision, wherein the precision requirement means that the depth precision of the blind groove is controlled to be +/-0.1 mm; when the blind groove meets the requirements of depth and precision for the first time, the depths of other blind grooves are necessarily lower than the specified depth;

the thickness of the base plate 5 corresponding to the blind groove is taken as a reference thickness, which means that the thickness of the base plate 5 corresponding to the blind groove is taken as a reference thickness, and the thickness of the base plate 5 corresponding to other main shafts 1 needs to be corrected;

pasting gummed paper: measuring the depths of the blind grooves of the other circuit boards which do not reach the processing depth requirement, and calculating the depth difference; according to the depth difference, one or more layers of adhesive paper 6 are pasted on the position of the backing plate 5 corresponding to the bottom of the blind groove to supplement the corresponding depth difference, and the position of the circuit board is lifted; the blind grooves at different positions of the circuit board corresponding to the lower part of the main shaft 1 are the same in the method of sticking the gummed paper;

wherein, the gummed paper can adopt crepe gummed paper, the thickness of each layer of gummed paper is 0.1mm, which just meets the precision requirement of the blind slot of the circuit board;

a plurality of blind grooves are required to be processed on one circuit board, so that after the main shaft moves, the depths of the blind grooves processed at different positions on the same circuit board are inconsistent, and one or more layers of adhesive paper 6 can be adhered to the positions of the backing plates below the corresponding circuit boards by adopting the same method to supplement the corresponding depth difference;

and (3) measurement correction: the steps of blind milling debugging and gummed paper pasting are repeated, the number of layers of gummed paper 6 is increased or reduced, and the corresponding depth difference is corrected until the depths of the blind grooves processed under all the main shafts 1 are consistent;

mass production: and using the milling machine which finishes the measurement correction for blind milling batch processing of the circuit board.

As shown in fig. 4 to 5, as a preferred embodiment of the above method, the length and width dimensions of the pad 5 are larger than those of the corresponding circuit board.

As a preferred embodiment of the above method, the gummed paper has a thickness of 0.1 mm.

As a preferred embodiment of the above method, the mat 5 is a medium density wood fiber mat.

As an embodiment of an apparatus applied to the above-mentioned multi-axis coordinated blind milling method for printed circuit boards, as shown in fig. 6 to 13, the apparatus includes a carriage 902 disposed above the table top 4, which is movable laterally and longitudinally;

a paper pasting device 7 and a paper unloading device 8 are arranged at the lower end of the sliding seat 902, the paper pasting device 7 and the paper unloading device 8 both comprise a sleeve 703 connected with the sliding seat 902, and a telescopic mechanism 702 is arranged in the sleeve 703; mounting discs 707 are arranged on two sides of the sleeve 703; a glue paper roll 708 is arranged on the mounting disc 707 of the paper pasting device 7; an adhesive tape roll 808 is mounted on a mounting disc 707 of the paper discharging device 8; the lower end of the telescopic mechanism 702 of the paper pasting device 7 is connected with a paper pasting machine head; the paper pasting machine head comprises a paper cutting pressing sleeve 713, and a paper pasting pressing head 715 is connected in the paper cutting pressing sleeve 713 through a compression spring 714; the lower end of the telescopic mechanism 702 of the paper unloading device 8 is connected with a paper unloading machine head; the paper discharge head comprises a rubberizing press head 815; the back of the adhesive tape unreeled from the adhesive tape roll 708 is mounted on the sticker pressure head 715; the tape unwound from the tape roll 808 is mounted on the adhesive head 815 at the back side thereof.

The sliding seat 902 is a nut sleeve arranged on the screw 901, and the lower end of the sliding seat 902 is provided with a connecting plate 903 for installing a paper pasting device 7 and a paper unloading device 8;

wherein, the upper end of the sleeve 703 is provided with a connecting seat 701, and the connecting seat 701 is connected with a connecting plate 903 through a bolt;

the telescopic mechanism 702 may be an electric push rod, an air cylinder or an oil cylinder;

wherein, the two sides of the sleeve 703 are provided with connecting rods 704, the connecting rods 704 are provided with rotating shafts 705, one end of each rotating shaft 705 is connected with a mounting disc 707, and the other end is connected with a driven wheel 706;

the paper cutting pressing sleeve 713 may be a quadrangular or polygonal sleeve structure or a cylindrical structure, and an annular knife edge is formed at the bottom end opening of the paper cutting pressing sleeve for cutting the gummed paper; the paper-sticking pressure head 715 is a cylinder structure matched with the inner wall of the paper-cutting pressure sleeve 713, and the lower end surface is a smooth plane;

wherein, the rubberizing pressure head 815 can adopt a quadrangular structure, and the lower end surface is a smooth plane;

as a preferred embodiment of the above device, one mounting plate 707 of the sticker device 7 is provided with a sticker roll 708, and the other mounting plate 707 is provided with a sticker winding plate 709; the other end of the glue paper unreeled from the glue paper roll 708 is wound on the glue paper winding disc 709.

Wherein, the glue paper roll 708 is preferably crepe glue paper;

as a preferred embodiment of the above device, one mounting disc 707 of the paper discharging device 8 is provided with an adhesive tape roll 808, and the other mounting disc 707 is provided with an adhesive tape winding disc 809; the other end of the tape unwound from the tape roll 808 is wound on the tape winding disc 809.

The tape roll 808 may preferably be transparent adhesive; the width of the transparent adhesive tape can be slightly smaller than that of the crepe adhesive paper, so that the situation that the transparent adhesive tape is directly adhered to the base plate to cause the glue to remain on the base plate can be prevented;

in a preferred embodiment of the above device, tensioning wheels 711 are provided on both sides of the sleeve 703.

The two sides of the sleeve 703 can be further provided with clamping wheel sets 710, and the clamping wheel sets 710 are used for clamping gummed paper or adhesive tape to prevent the gummed paper or the adhesive tape from deviating; the two sides of the sleeve 703 can also be provided with auxiliary wheels 712, the auxiliary wheels 712 are arranged on the two sides of the bottom end of the sleeve 791, and the adhesive paper can be prevented from directly contacting with the bottom end surface of the sleeve 703 to influence the movement of the adhesive paper; the tensioning wheel 711 can be mounted on a mounting arm, and the other end of the mounting arm is hinged to the sleeve 703 through a torsion spring; the mounting arm generates outward tension to tension the gummed paper or the gummed tape, so that the gummed paper or the gummed tape is prevented from loosening;

as a preferred embodiment of the above apparatus, the mounting plate 707 is provided on the rotating shaft 705; a driven wheel 706 is coaxially arranged at the other end of the rotating shaft 705; a driving motor 718 is arranged on the sleeve 703; a motor shaft of the driving motor 718 is provided with a driving wheel 716; a drive belt 717 is provided between the driven wheel 706 and the drive wheel 716.

Wherein, the driving wheel 716 and the two driven wheels 706 jointly form three vertex angles of a triangle, and the driving belt 717 is hung on the vertex angles to form a triangular structure;

as a preferred embodiment of the above device, lateral rails 13 are provided on both sides of the work top 4, and a longitudinal beam 9 is provided between the lateral rails 13; vertical beams 11 are arranged at two ends of the bottom surface of the longitudinal beam 9; the lower end of the vertical beam 11 is arranged on a transverse rail 13 through a traveling mechanism 12; a screw 901 is arranged in the longitudinal beam 9; the slide 902 is disposed on a lead screw 901.

Wherein, the walking mechanism 12 comprises a walking motor 121 arranged on a walking seat 125, and a motor shaft of the walking motor 121 is provided with a walking gear 122; linear guide rails 123 are arranged on two sides of the upper end face of the transverse rail 13, and the lower end of the walking seat 125 is arranged on the linear guide rails 123; a rack 124 is arranged in the middle of the upper end face of the transverse rail 13; the traveling gear 122 is meshed with the rack 124; the lower end of the vertical beam 11 is arranged on the walking seat 125;

the longitudinal beam 9 is a hollow beam, the screw 901 is arranged in the longitudinal beam 9, the sliding seat 902 is arranged on the screw 901, and the lower end of the sliding seat 902 extends out of a groove in the bottom surface of the longitudinal beam 9 to be connected with the connecting plate 903; connecting plate 903 is connected to connecting seat 701 by a bolt.

The invention relates to a working principle of a device applied to a multi-axis collaborative blind milling method of a printed circuit board, which comprises the following steps:

when the adhesive paper needs to be pasted on a certain position on the backing plate 5, the slide seat 902 is driven to move to the position by the walking motor 121 and the lead screw motor 10, so that the sticker pressing head 715 at the lower end of the sticker device 7 is aligned with the position where the sticker is needed, the telescopic mechanism 702 drives the sticker pressing head 715 to press the adhesive paper on the position, the telescopic mechanism 702 continues to drive the paper cutting pressing sleeve 713 to descend, the compression spring 714 is compressed, the paper cutting pressing sleeve 713 descends to the lowest position to cut the adhesive paper, so that the adhesive paper surface pressed by the sticker pressing head 715 is pasted on the backing plate and separated from the adhesive paper tape, and a cut hole is generated on the adhesive paper tape, as shown in fig. 13;

the telescoping mechanism 702 drives the sticker handpiece to ascend and retract into the sleeve 703; the driving motor 718 drives the mounting plate 707 to rotate, so that the adhesive tape moves, the end with the cut is moved away, and the adhesive tape is wound and collected by the adhesive tape winding plate 709.

When the gummed paper at a certain position on the backing plate 5 needs to be removed, the slide seat 902 is driven to move to the position by the walking motor 121 and the screw motor 10, so that the gumming pressure head 815 at the lower end of the paper unloading device 8 is aligned with the position of a sticker to be pasted, the telescoping mechanism 702 drives the gumming pressure head 815 to press the gummed tape on a gummed paper block to paste the sticker, and then the telescoping mechanism 702 drives the gumming pressure head 815 to ascend and retract into the sleeve 703; the back of the sticker block is stuck on the adhesive tape and separated from the backing plate;

the driving motor 718 drives the mounting disc 707 to rotate, so that the adhesive tape adhered with the adhesive tape piece moves and is wound and collected by the adhesive tape winding disc 809.

In the invention, the paper unloading device 8 treats the adhesive force of the adhesive tape with the adhesive force of the adhesive paper, so that the adhesive tape can stick the adhesive paper blocks, and then the adhesive paper blocks are torn off from the backing plate; the adhesive tape can be transparent adhesive tape with strong adhesive force and crepe adhesive paper.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts of the present invention. The foregoing is only a preferred embodiment of the present invention, and it should be noted that there are objectively infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes may be made without departing from the principle of the present invention, and the technical features described above may be combined in a suitable manner; such modifications, variations, combinations, or adaptations of the invention using its spirit and scope, as defined by the claims, may be directed to other uses and embodiments.