阅读说明：本技术 一种基于大数据的多功能通讯芯片检测系统 (Multifunctional communication chip detection system based on big data ) 是由 李庆先 刘良江 宋文涛 向德 朱宪宇 王晋威 易大志 刘青 陈岳飞 于 2021-08-11 设计创作，主要内容包括：本发明提供了一种基于大数据的多功能通讯芯片检测系统,与现有技术相比较,本发明的所述检测系统包括对通讯芯片进行固定的固定座、吸取所述芯片进一步转移至所述固定座的转移模块、对所述芯片的结构进行检测进一步评价所述芯片质量的结构检测模块、对所述芯片进行预定激励输入进一步接收所述芯片对应的输出信号进一步检测所述芯片的内部电路的连接情况的连接检测模块和通过对所述芯片进行的数据发送时长进行检测进一步获得所述芯片功能性指标的功能检测模块。本发明通过对不同规格的芯片进行适应性夹持同时对所述芯片进行多功能质量检测进而有效提高芯片的质检筛查效率。(Compared with the prior art, the detection system comprises a fixed seat for fixing a communication chip, a transfer module for absorbing the chip and further transferring the chip to the fixed seat, a structure detection module for detecting the structure of the chip and further evaluating the quality of the chip, a connection detection module for performing preset excitation input on the chip and further receiving an output signal corresponding to the chip and further detecting the connection condition of an internal circuit of the chip, and a function detection module for further obtaining the functional index of the chip by detecting the data sending duration of the chip. The chip quality inspection and screening method and the chip quality inspection and screening device can effectively improve the quality inspection and screening efficiency of the chips by adaptively clamping the chips with different specifications and simultaneously carrying out multifunctional quality inspection on the chips.)

1. The multifunctional communication chip detection system based on big data is characterized by comprising a fixing seat for fixing a communication chip, a transfer module for absorbing the chip and further transferring the chip to the fixing seat, a structure detection module for detecting the structure of the chip and further evaluating the quality of the chip, a connection detection module for performing preset excitation input on the chip and further receiving an output signal corresponding to the chip to further detect the connection condition of an internal circuit of the chip, and a function detection module for further obtaining the functional index of the chip by detecting the data sending duration of the chip.

2. The multifunctional communication chip detection system of claim 1, wherein the fixing base comprises a base, a fixing groove disposed on the base and adapted to fix the chip, an adaptive unit for driving a cross section of an inner cavity of the fixing groove to change so as to adapt to fixing different chips, infrared sensors uniformly distributed on an inner wall of the fixing groove, and a first signal receiving terminal for receiving sensing signals of the infrared sensors.

3. The system for detecting a multifunctional communication chip of claim 2, wherein the transferring module comprises an absorption head movably disposed on the fixing base and absorbing and fixing the chip, a fixing end movably fixing the absorption head above the base, and a displacement driving module driving the absorption head to displace relative to the base so as to sequentially displace the chip fixed by the absorption head above the fixing groove and a lifting module driving the fixing base to move up and down relative to the absorption head so as to further transfer the chip fixed by the absorption head to the fixing groove.

4. The multifunctional communication chip detection system of claim 3, wherein the adaptive unit comprises a sliding plate movably disposed at one end of the inner wall of the fixed groove and sliding in cooperation with one pair of oppositely disposed inner walls of the fixed groove, a driving unit for driving the sliding plate to move in the fixed groove, and a limiting unit embedded at the other end of the inner wall of the fixed groove in a uniform part and cooperating with the sliding plate to further fix the chips of different specifications.

5. The system for inspecting multifunctional communication chips as claimed in claim 4, wherein said structure inspection module comprises a transparent wall disposed on the bottom wall of each of said fixing grooves, an optical generator disposed on said base and irradiating with a predetermined intensity of light signals toward the opening of said fixing groove, a camera device disposed on the upper end of the bottom wall of said fixing groove for capturing a picture of said chip at a fixed position, and a processing unit for receiving said picture information captured by said camera device and analyzing and processing said picture to further obtain the integrity of said chip.

6. The multifunctional communication chip detection system of claim 5, wherein the connection detection module comprises current input units fixed on the base and respectively connected to the current channels of the chip for current transmission; the detection module is used for detecting and calculating a voltage value corresponding to the channel when the current signal flows through the current channel; and the first analysis unit is used for comparing the detection voltage value obtained by the detection module with a preset normal voltage value range to further determine the connection condition of the internal circuit of the chip.

7. The multifunctional communication chip detection system of claim 6, wherein the function detection module is a control unit connected in series with a receiver unit of the chip for further driving the chip to transmit signals with a predetermined excitation signal, a receiving unit connected in series with a transmitter unit of the chip for further receiving corresponding signals transmitted by the chip, a monitoring unit for monitoring a time difference between the excitation signal transmission time of the control unit and the corresponding signal reception time of the receiving unit, and a second analysis unit for comparing the time difference of the monitoring unit with a preset reception time threshold to further obtain the performance quality parameters of the chip.

8. A computer-readable storage medium, characterized in that the computer-readable storage medium includes a processing method program of the multifunctional communication chip detection system, and when the multifunctional communication chip detection system is executed, the steps of calculating, processing and controlling the communication chip detection system as claimed in claim 7 are realized.

Technical Field

The invention relates to the technical field of chip detection, in particular to a multifunctional communication chip detection system based on big data.

Background

With the development of large-scale integrated circuits, circuits are more and more complex, the required test time is longer and longer, the problem to be solved in the field is that the test time is saved, and the simultaneous test quantity for performing parallel test on a plurality of chips is increased. Testing of chips is especially important to chip design companies, where economic reimbursement or loss of credit is very costly if a functionally defective chip is sold to a customer.

The experiment team browses and researches a large amount of related recorded data aiming at the quality detection technology of the multifunctional chip and the working characteristics of the communication chip for a long time, simultaneously depends on related resources, carries out a large amount of related experiments, finds existing prior art such as JP2012189396A, WO2020083066A1, WO2018165923A1 and CN102967822B through a large amount of retrieval, and discloses an automatic detection method and a detection system of an RS-485 chip in the prior art, wherein the detection system comprises a microprocessor and a programmable logic chip. The detection method comprises the following steps: sending an electric signal to the RS-485 chip, sending the electric signal after the RS-485 chip receives the electric signal, and judging whether the RS-485 chip has a fault or not by detecting the consistency of the electric signal received by the RS-485 chip and the sent electric signal; when the electrical signal received by the RS-485 chip is inconsistent with the electrical signal sent by the RS-485 chip, a fault exists. However, the prior art communication chip detection device has a single test target and a complex and time-consuming detection process.

In order to solve the ubiquitous low efficiency of testing in the field; the test parameters are single; the invention is made for the problems that the adaptability fixation of chips with different models cannot be tested, and the like.

Disclosure of Invention

The invention aims to provide a multifunctional communication chip detection system based on big data aiming at the defects in the field at present.

In order to overcome the defects of the prior art, the invention adopts the following technical scheme:

optionally, the detection system includes a fixing base for fixing a through chip, a transfer module for sucking the chip and further transferring the chip to the fixing base, a structure detection module for detecting the structure of the chip and further evaluating the quality of the chip, a connection detection module for performing predetermined excitation input on the chip and further receiving an output signal corresponding to the chip to further detect the connection condition of an internal circuit of the chip, and a function detection module for further obtaining the functional index of the chip by detecting the data sending duration of the chip.

Optionally, the fixing base includes the base, set up on the base and right the chip carries out fixed recess of adaptation, drive the cross section of the inside cavity of fixed recess changes in order to be adapted to the difference the chip carries out the adaptability unit that fixes, evenly distributed set up in the infrared sensor of fixed recess inner wall and receipt infrared sensor's sensing signal's first signal receiving terminal.

Optionally, the transfer module including the activity set up in on the fixing base and right the chip adsorbs fixed adsorption head, will the adsorption head activity is fixed in the stiff end of base top and drive the adsorption head is relative the base carries out the displacement and further will the chip that the adsorption head was fixed is located in proper order the displacement drive module and the drive of fixed recess top the fixing base is relative the adsorption head carries out elevating movement and further will the adsorption head is fixed the chip shifts to the lifting module of fixed recess.

Optionally, the adaptive unit includes a sliding plate movably disposed at one end of the inner wall of the fixed groove and sliding in cooperation with one pair of inner walls of the fixed groove, a driving unit for driving the sliding plate to move in the fixed groove, and a limiting unit, wherein an even portion of the limiting unit is embedded in the other end of the inner wall of the fixed groove and is disposed in cooperation with the sliding plate to further fix the chips of different specifications.

Optionally, the structure detection module includes a transparent wall disposed on each bottom wall of the fixing groove, an optical generator disposed on the base and irradiating towards the opening of the fixing groove with a predetermined intensity of optical signals, a camera device disposed at an upper end of the bottom wall of the fixing groove for taking pictures of the chip from the fixing position, and a processing unit for receiving the picture information acquired by the camera device, analyzing and processing the pictures, and further acquiring the integrity of the chip.

Optionally, the connection detection module includes a current input unit fixed on the base and respectively connected to the chip current channel for current transmission, and a first analysis unit for comparing a detection voltage value obtained by the detection module with a preset normal voltage value range to further determine the connection condition of the internal circuit of the communication chip by the detection module for detecting and calculating a voltage value corresponding to the channel when the current signal flows through the current channel.

Optionally, the function detection module is a control unit connected in series with the receiver unit of the communication chip and further driving the communication chip to transmit a signal with a predetermined excitation signal, a receiving unit connected in series with the transmitter unit of the communication chip and further receiving a corresponding signal transmitted by the communication chip, a monitoring unit monitoring a time difference between the excitation signal transmission time of the control unit and the corresponding signal reception time of the receiving unit, and a second analysis unit comparing the monitoring unit with a preset reception time threshold to further obtain a performance quality parameter of the communication chip.

The invention further provides a computer-readable storage medium, which includes a processing method program of the multifunctional communication chip detection system, and when the multifunctional communication chip detection system is executed, the processing method program of the multifunctional communication chip detection system realizes the calculation processing and control steps of the communication chip detection system.

The beneficial effects obtained by the invention are as follows:

1. the invention realizes the quantitative transfer and synchronous test of the communication chip of the production line and effectively improves the quality monitoring and screening efficiency of the communication chip.

2. The invention realizes the automatic adjustment of the structure of the fixing groove for fixing the chip, further realizes the adaptive fixation of the chips with different shapes and specifications, and improves the practicability of the detection system.

3. The invention can effectively carry out automatic detection on the structure quality of the chip by carrying out image processing on the chip.

Drawings

The invention will be further understood from the following description in conjunction with the accompanying drawings. The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the embodiments. Like reference numerals designate corresponding parts throughout the different views.

FIG. 1 is a schematic block diagram of a multifunctional communication chip detection system according to the present invention.

FIG. 2 is a schematic block diagram of a function detection module according to the present invention.

FIG. 3 is a schematic diagram of one of the structures of the detection system of the present invention.

FIG. 4 is a schematic structural view of yet another structure of the detection system of the present invention.

FIG. 5 is an experimental schematic diagram of the multifunctional communication chip detection system of the present invention.

1-a drag chain; 2-a drive unit; 3-an adsorption head; 4-a support bar; 5-a base; 6-fixing the groove; 7-a fixed end; 8-sliding of the ball screw.

Detailed Description

In order to make the objects and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the following embodiments; it should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. Other systems, methods, and/or features of the present embodiments will become apparent to those skilled in the art upon review of the following detailed description. It is intended that all such additional systems, methods, features and advantages be included within this description, be within the scope of the invention, and be protected by the accompanying claims. Additional features of the disclosed embodiments are described in, and will be apparent from, the detailed description that follows.

The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the device or assembly referred to must have a specific orientation.

The first embodiment is as follows:

the embodiment constructs a detection system which automatically transfers the communication chip to be detected to a corresponding detection platform for adaptive fixed detection;

the utility model provides a multi-functional communication chip detecting system based on big data, detecting system includes and carries out the fixing base fixed to leading to the chip, absorbs the chip further shifts to the transfer module of fixing base, right the structure of chip detects further evaluation the structure detection module of chip quality, right the chip carries out predetermined excitation input and further receives the output signal that the chip corresponds further detects the connection detection module of the internal circuit's of chip connection condition and through carrying out the detection on the data transmission duration that the chip carries out further obtain the functional index of chip detection module, the fixing base includes the base, set up on the base and to the chip carries out the fixed recess of adaptation, drive the cross section of fixed recess internal cavity changes in order to adapt to different the adaptive unit that the chip fixed, The chip transferring device comprises an infrared sensor and a first signal receiving end, wherein the infrared sensor is uniformly distributed on the inner wall of the fixed groove, the first signal receiving end is used for receiving a sensing signal of the infrared sensor, the transferring module comprises an adsorption head, a fixed end and a lifting module, the adsorption head is movably arranged on the fixed seat and is used for adsorbing and fixing a chip, the fixed end is movably fixed on the upper portion of the base, the lifting module is used for driving the adsorption head to move relative to the base, the base is further used for displacing the chip fixed by the adsorption head to be further sequentially positioned above the fixed groove, the lifting module is used for driving the fixed seat to move relative to the adsorption head to further transfer the chip fixed by the adsorption head to the fixed groove, the adaptive unit comprises a sliding plate, a sliding plate and a sliding plate, the sliding plate is movably arranged at one end of the inner wall of the fixed groove and is matched with one pair of the inner walls of the fixed groove which are oppositely arranged, The structure detection module comprises a transparent wall arranged on the bottom wall of each fixed groove, an optical generator arranged on the base and irradiating towards the opening of the fixed groove by optical signals with preset intensity, a camera device arranged at the upper end of the bottom wall of the fixed groove and used for extracting pictures of the chips at fixed positions, and a processing unit for receiving the picture information acquired by the camera device and analyzing and processing the pictures to further acquire the integrality of the chips, wherein the connection detection module comprises a current input unit, a current output unit and a current output unit, wherein the current input unit is fixed on the base and respectively connected with the current channels of the chips for current transmission, The detection module used for detecting and calculating the voltage value corresponding to the channel when the current signal flows through the current channel compares the detection voltage value obtained by the detection module with a preset normal voltage value range to further determine the connection condition of the internal circuit of the communication chip, the function detection module is a control unit which is connected in series with a receiver unit of the communication chip and further drives the communication chip to send signals by a preset excitation signal, a receiving unit which is connected in series with a transmitter unit of the communication chip and further receives corresponding signals sent by the communication chip, a monitoring unit which monitors the time difference between the transmission time of the excitation signal of the control unit and the corresponding signal receiving time of the receiving unit, and a second analysis unit which compares the monitoring unit with a preset receiving time threshold value to further obtain the performance quality parameters of the communication chip, the invention also provides a computer readable storage medium, which comprises a processing method program of the multifunctional communication chip detection system, and when the multifunctional communication chip detection system is executed, the processing method program of the multifunctional communication chip detection system realizes the calculation processing and control steps of the communication chip detection system;

the detection system further comprises a conveyor belt for conveying the chips to be detected, the chips to be detected are arranged on the conveyor belt at certain intervals, the fixing seat comprises a base, a fixing groove, an adaptive unit, an infrared sensor and a first signal receiving end, the fixing groove is arranged on the base and used for fixing the chips in an adaptive mode, the cross section of the cavity in the fixing groove is driven to change so as to be suitable for fixing the chips, the infrared sensor is arranged on the edge of the inner wall of the fixing groove in an evenly distributed mode, the first signal receiving end is used for receiving sensing signals of the infrared sensor, the adaptive unit comprises a sliding plate, a driving unit and an even part, the sliding plate is movably arranged at one end of the inner wall of the fixing groove and matched with one opposite inner wall of the fixing groove to slide, the sliding plate is driven to move in the fixing groove, the even part is embedded in the fixing groove, the other end of the fixing groove is matched with the sliding plate to be arranged to further match with the chips of different specifications, and the driving unit is arranged at the other end of the fixing groove A limiting unit for fixing the sheet, wherein the sliding plate is arranged to have opposite ends matched with the inner wall of the fixed groove correspondingly and oppositely, the adjacent two ends of the fixed groove are respectively provided with an open slot matched with the sliding plate and the limiting unit, the sliding plate and the limiting unit realize relative displacement in the fixed groove through the open slots so as to adjust the fixed area of the chip, the bottom end side of the open slot is positioned on the same horizontal plane with the bottom surface of the fixed groove, the open slots respectively comprise a first open slot matched with the sliding plate to slide and a second open slot matched with the limiting unit to slide, the driving unit is an electric telescopic rod, one end of the driving unit is fixedly arranged in the base through a mounting seat, and the other end of the driving unit is fixedly connected to the sliding plate through a coupler so as to drive the sliding plate to be close to the inner wall of the groove oppositely arranged to the first open slot, the limiting unit comprises a plurality of sliding pieces which are arranged in a blocky structure and slide in a matching way with the second open slot, wherein each sliding piece is correspondingly driven by at least one telescopic driving rod to move, the length of each sliding piece is set by a person skilled in the art according to the specification of a chip, and is not limited in the process, the electric telescopic rod drives the sliding plate to clamp one opposite end of the chip, further the telescopic driving rod drives a part of the sliding piece with corresponding length to extend out, so that two combined length direction ends of the part of the sliding pieces are respectively matched with the sliding plate and the fixed groove wall arranged opposite to the sliding plate to slide, and the size of a hollow cavity in the fixed groove is further limited to be used for storing chips with different specifications;

the transfer module comprises an adsorption head which is movably arranged on the fixed seat and is used for adsorbing and fixing the chip, a fixed end which is used for movably fixing the adsorption head above the base, a displacement driving module which is used for driving the adsorption head to displace relative to the base so as to further position the chip fixed by the adsorption head above the fixed groove, and a lifting module which is used for driving the fixed seat to move up and down relative to the adsorption head so as to further transfer the chip fixed by the adsorption head to the fixed groove, wherein the adsorption head comprises a shell, a plurality of miniature suckers which are arranged at the bottom end of the shell and are opposite to the fixed seat, connecting holes which are arranged at the top ends of the miniature suckers, vent pipes which are embedded in the shell and are connected with the connecting holes, and a negative pressure generating device which is respectively connected with the vent pipes so as to provide negative pressure for the suckers to adsorb and fix the chip, wherein the negative pressure sending device is a vacuum generator in the prior art, which is not repeated herein, the fixed end is a fixed block connected with the housing and slidably fitted in the displacement driving module, the fixed block comprises at least two independent unit fixed blocks, the adsorption head is fixed on the unit fixed block arranged near the base, the displacement driving module comprises a fixed beam transversely arranged at the upper ends of the conveyor belt and the base, a plurality of support rods for supporting and fixing the fixed beam at the upper end of the base, a ball screw sliding table fixedly arranged at the upper end of the fixed beam through bolts and respectively matched with different fixed blocks and driving the fixed block to displace in the limit track, a limit track arranged at the upper end of the base for limiting the driving direction of the displacement driving module, and a drag chain arranged in the limit track in a matched manner and used for dragging and fixedly protecting the movement of the fixed block, the lifting module is a telescopic device which is connected with at least two unit fixing blocks to drive relative distance change between the unit fixing blocks to further drive the transfer module to move towards the base, wherein the telescopic device can select electric appliances with telescopic functions such as a screw rod lifter, an electric telescopic rod, a linear motor and the like by a person skilled in the art according to actual requirements without limitation, and the ball screw sliding table is matched with and drives a plurality of fixing blocks at intervals to synchronously drive the transfer module to corresponding positions of the conveyor belt and the base to pick up and release chips;

when the chip detection system is used for detecting, the communication chip to be detected is transmitted by the conveyor belt, the displacement driving module correspondingly and sequentially drives the transfer module to be above the conveyor belt and further drives the sucker of the adsorption head to be in contact with the communication chip by the lifting module, the vacuum generating device further drives the sucker to adsorb and fix the chip, the displacement driving module and the lifting module are further matched to transfer the chip adsorbed and fixed by the adsorption head to the fixing groove corresponding to the base, and the fixing groove adjusts the size of the hollow cavity according to the size of the communication chip to realize that the communication chips with different specifications and sizes are fixed in an adaptive mode.

The second embodiment, in conjunction with fig. 1-5, in addition to the contents of the above embodiments, is that:

the function detection module comprises a control unit, a receiving unit, a monitoring unit and a second analysis unit, wherein the control unit is connected with a receiver unit of the communication chip in series and further drives the communication chip to transmit signals by a preset excitation signal, the receiving unit is connected with a transmitter unit of the communication chip in series and further receives corresponding signals transmitted by the communication chip, the monitoring unit monitors the time difference between the excitation signal transmission time of the control unit and the corresponding signal receiving time of the receiving unit, namely the signal transmission time of the communication chip, and the second analysis unit compares the monitoring unit with a preset receiving time threshold value to further obtain performance quality parameters of the communication chip, wherein the monitoring unit, the control unit, the receiving unit and the second analysis unit can be replaced by an upper computer, and the upper computer is programmed by technicians in the field and is provided with corresponding control instructions to further detect the signal transmission time of the chip, the control unit is respectively connected with a communication chip to be tested through a first transmission line, the receiving unit is connected with the communication chip through a second transmission line, at least two first mechanical arms and at least two second mechanical arms are respectively and correspondingly arranged on the base and close to each fixing groove end, the first mechanical arms are fixed on the connecting ends of the first transmission lines through fixing elements and control the connection of the connecting ends of the first transmission lines and the communication chip, the second mechanical arms correspondingly clamp the wiring ends of the second transmission lines and control the connection of the wiring ends of the second transmission lines and the communication chip, and further automatic detection of the functional indexes of the communication chip by the control unit is realized, and the first mechanical arms and the second mechanical arms are intelligent mechanical arms which are pre-programmed by technicians in the field and provided with corresponding action execution instructions are not repeated, when the detection system detects the function index of the communication chip, the first mechanical arm and the second mechanical arm which are correspondingly arranged on the fixed groove are controlled and driven by the control end of the detection system to be connected with the corresponding interface end of the communication chip corresponding to the fixed groove, the control unit generates a preset excitation signal and sends the preset excitation signal to the receiver unit of the communication chip, and further the transmitter unit of the communication chip correspondingly transmits the excitation signal to the receiver unit, meanwhile, the monitoring unit monitors the signal sending time length of the communication chip, the second analysis unit stores an upper limit time threshold value provided with the signal sending time length of the communication chip, and the monitoring unit further processes and compares the numerical value detected by the monitoring unit to obtain a chip functional index parameter value corresponding to the communication chip;

connect the detection module including be fixed in on the base and connect respectively in chip current channel carries out the current input unit that current carried, be used for calculating current signal when flowing through current channel right the detection module that current channel carried out the magnitude of voltage detection will detection module and predetermine the magnitude of voltage contrast further confirm the first analysis unit of the connection condition of the internal circuit of communication chip, current input unit be set up in near fixed recess with the probe that the input that the communication chip corresponds current channel goes on carries out the electricity and connects, the probe passes through the electric lead and connects in current generator, current input unit is used for acquireing outside intensity circuit in advance and further will outside intensity circuit in advance input extremely the current input of the current channel that the communication chip corresponds, first analysis unit for correspond set up in near fixed recess through right the current channel's that corresponds of communication chip current channel's current input end, first analysis unit for corresponding set up in near fixed recess is right The output carries out voltage monitoring's probe and with the probe electricity is connected right the monitoring voltage carries out data processing's host computer, first analysis unit is set up to state the monitoring the current input end corresponds the connection continuous voltage value that the output of current channel exported, further first analysis unit with continuous voltage value change track with predetermine in the preset voltage change trend of first analysis unit compares and according to change the track with the coincidence degree of change track corresponds the acquisition the corresponding internal circuit's of chip connection condition, when coincidence degree is less than the coincidence degree of preset lower limit coincidence degree, judge when corresponding the internal circuit connection condition is unusual, the coincidence degree is higher than the coincidence degree of preset lower limit coincidence degree and judges to correspond when the internal circuit connection condition is normal.

Embodiment three, in conjunction with fig. 1-5, in addition to the content of the above embodiments, also includes:

the structure detection module comprises a transparent wall arranged on the bottom wall of each fixed groove, an optical generator arranged on the base and irradiating towards the opening of the fixed groove by optical signals with preset intensity, a camera device arranged at the upper end of the bottom wall of the fixed groove and extracting pictures of the chip in a preset manner, and a processing unit for receiving the picture information acquired by the camera device and analyzing and processing the pictures to further acquire the integrity of the chip, wherein the optical generator comprises a visible light generator uniformly embedded in the wall of the fixed groove and a first controller respectively connected with and controlling the visible light generator to irradiate by the optical signals with preset intensity, the structure detection module further comprises reference data information corresponding to corresponding pictures acquired by technicians in the field under the same parameters of the structure detection module, the chips with complete structures are acquired by a large number of repeated experiments, wherein the processing unit comprises the steps of:

step S101, receiving a chip image shot by the camera device, comparing the chip image with preset image information, further performing identification operation on different parts of the chip image and the preset image, and further obtaining a corresponding identification track;

step S102, drawing a target image corresponding to the identification track according to preset image characteristics, wherein the preset image characteristics can refer to color characteristics;

step S103: performing marginalization processing on the target image to obtain n corresponding unit images with closed edge lines, wherein the nth unit image is represented as Sn;

step S104: respectively acquiring the number of pixel points in each unit image region, wherein the number of pixel points corresponding to the nth unit image is i;

step S105:wherein Sn is an actual area of a chip corresponding to the nth unit image, s is an area size corresponding to a unit pixel point of the unit image, α is an amplification rate when the chip image is imaged, that is, the chip image is amplified by α times when the chip image is imaged, C is a correction coefficient related to the number i of pixels, and m1 is a priority-related parameter of the correction coefficient related to the number i of pixels, wherein i is obtained by a related software calculation statistical program, and C and m1 are obtained by a neighborhood technician through a large number of repeated experimental trainings, and are not described herein again;

step S105: overlapping a target image serving as a layer with the chip image to obtain a reconstructed image, and establishing a two-dimensional coordinate on the reconstructed image to obtain a coordinate set P of the unit image of the target image layer, wherein the coordinate set of the nth unit image is Pn;

step S106: extracting Pn of a coordinate set of a corresponding unit image with Sn larger than a preset upper limit abnormal area value, and comparing the corresponding coordinate set with a two-dimensional coordinate point of a preset chip image to obtain an overlapping rate corresponding to a reference area overlapped with the Pn:

wherein the reference regions are K reference regions formed by dividing the preset image of the chip in advance by technicians in the neighborhood according to the functional regions of the chip, wherein, the corresponding two-dimensional coordinate point set in each reference area is bound and stored with the identification information of the reference area, F is a relevant correction coefficient corresponding to the overlapping rate of a preset image and the unit image, g is a priority relevant parameter of the relevant correction coefficient of the overlapping rate, Sk is the actual area of a chip corresponding to the Kth reference area overlapped with the unit image, Dk is the number of pixel points corresponding to the overlapping area corresponding to the unit image and the Kth reference area, g and F are obtained by a plurality of experimental trainings by technicians in the field, no longer described herein, Sk is parameter information preset in the processing unit, and Dk is obtained by a statistical program calculated by related software;

step S107: acquiring identification information of a reference region corresponding to the SR maximum value in the unit region, further judging that the chip has a defect in the structure in the reference region corresponding to the maximum value, and recovering the corresponding chip for further detailed inspection;

wherein, the color feature can be selected by a person skilled in the art according to actual needs to be a color channel value corresponding to each color channel, such as an RGB color channel value, a preset image feature is used to draw a target image corresponding to an identification track, which can outline the abnormal portion of the chip, the number of pixel points of the target image can be obtained in a statistical manner, an identification starting point is selected in the outline of a unit image of the target, and the pixel points of the target image are traversed from the identification starting point, in the traversing process, when the color feature of the identified point is different from the color feature of the preset unit image, it is indicated that the identified point is not in the outline of the unit image, when the color feature of the identified point is the same as the color feature of the target unit image, it is indicated that the outline of the target image has been identified, by this manner, after all the identification points in the outline of the target unit image have been traversed, the number of identification points in the outline of the corresponding unit image can be obtained, the number of the identification points is taken as the number of pixel points of a target image, and an imaging system adopted during chip image imaging has a certain magnification, so that the part of the chip image corresponding to the chip area is an image effect obtained by amplifying the chip area, namely the pixel points in the chip image correspond to the chip area, the area of the chip unit image can be calculated according to the actual area of the chip area corresponding to the pixel points of the chip image and the number of the pixel points of the chip image imaged to the chip image, all or part of the processing steps of the processing unit can be realized by software, hardware and the combination thereof, and the processing unit can be embedded in a hardware form or independent of a processor in computer equipment, or the method can be stored in a memory of the computer device in a software form, so that the processor can call and execute the operation corresponding to each step in the processing unit;

the invention effectively performs automatic quality inspection tests on a plurality of chips by adaptively fixing the chips and automatically detecting the circuit connection, the working performance and the structure of the chips, and the invention effectively improves the detection efficiency of the chips based on the analysis and the processing of big data.

Although the invention has been described above with reference to various embodiments, it should be understood that many changes and modifications may be made without departing from the scope of the invention. That is, the methods, systems, and devices discussed above are examples. Various configurations may omit, substitute, or add various procedures or components as appropriate. For example, in alternative configurations, the methods may be performed in an order different than that described, and/or various components may be added, omitted, and/or combined. Moreover, features described with respect to certain configurations may be combined in various other configurations, as different aspects and elements of the configurations may be combined in a similar manner. Further, elements therein may be updated as technology evolves, i.e., many elements are examples and do not limit the scope of the disclosure or claims.

Although the invention has been described above with reference to various embodiments, it should be understood that many changes and modifications may be made without departing from the scope of the invention. That is, the methods, systems, and devices discussed above are examples. Various configurations may omit, substitute, or add various procedures or components as appropriate. For example, in alternative configurations, the methods may be performed in an order different than that described, and/or various components may be added, omitted, and/or combined. Moreover, features described with respect to certain configurations may be combined in various other configurations, as different aspects and elements of the configurations may be combined in a similar manner. Further, elements therein may be updated as technology evolves, i.e., many elements are examples and do not limit the scope of the disclosure or claims.

Specific details are given in the description to provide a thorough understanding of the exemplary configurations including implementations. However, configurations may be practiced without these specific details, for example, well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary detail in order to avoid obscuring the configurations. This description provides example configurations only, and does not limit the scope, applicability, or configuration of the claims. Rather, the foregoing description of the configurations will provide those skilled in the art with an enabling description for implementing the described techniques. Various changes may be made in the function and arrangement of elements without departing from the spirit or scope of the disclosure.

In conclusion, it is intended that the foregoing detailed description be regarded as illustrative rather than limiting, and that it be understood that these examples are illustrative only and are not intended to limit the scope of the invention. After reading the description of the invention, the skilled person can make various changes or modifications to the invention, and these equivalent changes and modifications also fall into the scope of the invention defined by the claims.