阅读说明：本技术 采用具有摩擦增强图案的周边表面在湿式化学工艺期间接触基板的压模制品 (Stamper article for contacting a substrate during a wet chemical process using a peripheral surface having a friction enhancing pattern ) 是由 戴维·阿尔瓦雷斯 吉米·K·阿特金森 于 2016-01-15 设计创作，主要内容包括：公开了采用具有摩擦增强图案的周边表面在湿式化学工艺期间接触基板的压模制品。例如环形主体的制品可借助压模技术形成。通过包含图案化表面作为环形主体的外周边的一部分,所述环形主体和基板之间的摩擦接触可被增强,因为与湿式化学工艺相关联的减少摩擦的流体可被导引而离开所述环形主体与所述基板之间的所期望之摩擦接触区域。如此,摩擦接触可被增强,并且所述基板可有效地在湿式化学工艺期间被定位并被移动,以改善工艺的效率。(A stamper article is disclosed that contacts a substrate during a wet chemical process using a peripheral surface having a friction enhancing pattern. Articles such as annular bodies may be formed by compression molding techniques. By including a patterned surface as part of the outer periphery of the ring-shaped body, the frictional contact between the ring-shaped body and the substrate may be enhanced, as the friction-reducing fluid associated with the wet chemical process may be directed away from the desired frictional contact area between the ring-shaped body and the substrate. As such, the frictional contact may be enhanced and the substrate may be effectively positioned and moved during the wet chemical process to improve the efficiency of the process.)

1. An article in rotatable communication with a substrate during substrate cleaning, the article comprising:

an annular body comprising a first sidewall, a second sidewall opposite the first sidewall, and an outer peripheral surface connecting the first sidewall and the second sidewall, wherein the outer peripheral surface comprises at least one patterned surface comprising at least one groove, and the at least one groove forms a cyclic pattern that occurs along the outer periphery at a frequency range of 30 cycles per inch to 150 cycles per inch.

2. The article of claim 1, wherein the annular body has an outer diameter in a range between twenty millimeters and one hundred fifty millimeters.

3. The article of claim 1, wherein the at least one patterned surface comprises a first patterned surface facing a second patterned surface located in circumferentially-located depressions of the outer peripheral surface.

4. The article of claim 1, wherein the at least one groove comprises a plurality of grooves spaced along the outer peripheral surface.

5. The article of claim 1, further comprising a generating gear projecting radially to the top as part of the outer peripheral surface.

6. The article of claim 1, wherein the at least one groove has a depth ranging from five to fifty microns.

7. An article in rotatable communication with a substrate during substrate cleaning, the article comprising:

an annular body comprising a first sidewall, a second sidewall opposite the first sidewall, and an outer peripheral surface connecting the first sidewall and the second sidewall, wherein the outer peripheral surface comprises at least one patterned surface comprising at least one groove, and the at least one groove comprises intersections at which the at least one groove intersects itself.

8. The article of claim 7, wherein the annular body has an outer diameter in a range between twenty millimeters and one hundred fifty millimeters.

9. The article of claim 7, wherein the at least one patterned surface comprises a first patterned surface facing a second patterned surface located in circumferentially-located depressions of the outer peripheral surface.

10. The article of claim 7, wherein the at least one groove comprises a plurality of grooves spaced along the outer peripheral surface.

11. The article of claim 7, further comprising a plurality of gears projecting radially to the top as part of the outer peripheral surface.

12. The article of claim 7, wherein the at least one first groove has a depth ranging from five to fifty microns.

13. A substrate cleaning module to support chemical mechanical polishing of a substrate, comprising:

a housing containing a cleaning solution;

a motorized brush that cleans a surface of the substrate with the cleaning solution; and

a plurality of substrate rollers configured to receive and apply torque to a side edge of the substrate, wherein each of the plurality of substrate rollers comprises a first annular body comprising a first sidewall, a second sidewall opposite the first sidewall, and an outer peripheral surface connecting the first sidewall and the second sidewall, wherein the outer peripheral surface comprises at least one first patterned surface comprising at least one first groove, and the at least one first groove forms a cyclical pattern that occurs along the outer periphery at a frequency range of 30 cycles per inch to 150 cycles per inch, and the at least one first patterned surface abuts the substrate during cleaning of the substrate.

14. The substrate cleaning module of claim 13, wherein the first annular body has an outer diameter in a range between twenty millimeters and one hundred fifty millimeters.

15. The substrate cleaning module of claim 13, wherein the at least one first slot includes intersection points at which the at least one first slot intersects itself.

16. The substrate cleaning module of claim 13, wherein the at least one first patterned surface comprises a first surface facing a second surface located in a circumferentially located depression of the outer peripheral surface.

17. The substrate cleaning module of claim 13, wherein the at least one first groove comprises a plurality of grooves spaced along the outer peripheral surface.

18. The substrate cleaning module of claim 13, further comprising a plurality of gears projecting radially to the top as part of the outer peripheral surface.

19. The substrate cleaning module of claim 13, further comprising:

a sensor wheel supporting the substrate during cleaning, the sensor wheel configured to passively rotate with the substrate, and the sensor wheel coupled to a sensor to monitor a rotational speed, wherein the sensor wheel includes a second annular body comprising at least one second patterned surface having at least one second groove, wherein the at least one second patterned surface abuts the substrate during cleaning of the substrate.

20. The substrate cleaning module of claim 13, wherein the at least one first groove has a depth ranging from five to fifty microns.

Technical Field

Embodiments of the present disclosure relate generally to the manufacture of semiconductor devices, and more particularly to substrate cleaning in chemical mechanical polishing.

Background

Chemical Mechanical Polishing (CMP), also known as Chemical Mechanical planarization, is a process commonly used to fabricate integrated circuits on silicon wafers (or "substrates"). The CMP polishing process can remove unwanted topography (topographies) and material from partially processed substrates to create a planar surface on the substrate for subsequent processing. The CMP polishing process may utilize an abrasive and/or chemically active polishing solution (sometimes referred to as slurry) on one or more rotating polishing pads that are pressed against the surface of the substrate. A cleaning process may occur after the CMP polishing process to remove residual polishing solution and/or particles generated by polishing and remaining on the substrate. This removal prevents the formation of defects on the substrate that may be scratched or otherwise damaged by residual polishing solution and/or particles.

The cleaning process may include washing the front and back surfaces of the substrate using a wash brush (scrubber brush) supplied with a cleaning solution. The wash brush may be forced against the substrate as the substrate rotates to achieve sufficient cleaning efficiency and integrity. The substrate is rotated by substrate rollers that receive side edges of the substrate and utilize frictional contact against the side edges to apply torque (torque) from a drive system that supplies power to the substrate rollers. Monitoring rotation of the substrate during cleaning is accomplished with a sensor wheel (sensor wheel) configured to passively rotate while in frictional contact with the substrate during cleaning. Maintaining effective frictional contact between the substrate and the substrate roller, and between the substrate and the sensor wheel, ensures effective cleaning of the substrate and consistent cleaning between the substrates. Sometimes, the frictional contact will decline as the substrate roller and sensor wheel change over time and are exposed to the cleaning solution. New methods are needed to maintain frictional contact so that the substrate can be reliably rotated and moved during cleaning so that defects associated with insufficient particle removal and/or insufficient polishing solution removal can be avoided.

Disclosure of Invention

Embodiments disclosed herein include stamper articles that employ a peripheral surface having a friction enhancing pattern to contact a substrate during a wet chemical process. Articles such as annular bodies may be formed by compression molding techniques. By including the patterned surface as part of the outer peripheral surface of the annular body, frictional contact between the annular body and the substrate may be enhanced, as the friction-reducing fluid associated with the wet chemical process may be directed away from the desired frictional contact area between the annular body and the substrate. As such, during the wet chemical process, the frictional contact may be enhanced and the substrate may be effectively positioned and moved to improve the efficiency of the process.

In one embodiment, an article in rotatable communication with a circular substrate during substrate cleaning is disclosed. The article includes an annular body including a compression mold seam (compression mold seam) and having a central axis. The annular body includes a first sidewall, a second sidewall opposite the first sidewall, and an outer peripheral surface connecting the first sidewall and the second sidewall. The outer peripheral surface includes at least one patterned surface comprising at least one groove, and the at least one groove has a depth ranging from five (5) to fifty (50) microns. As such, the ring-shaped body may be used to establish a more efficient contact with the substrate to improve positioning of the substrate during wet chemical processes, such as substrate cleaning after Chemical Mechanical Polishing (CMP).

In another embodiment, a method for providing an article in rotatable communication with a circular substrate during substrate cleaning is disclosed. The method includes placing a material in an interior volume of a stamper, wherein the stamper includes at least one mold surface defining the interior volume. The method further comprises the following steps: together with at least one mold surface and material, form an annular body having a central axis. The annular body includes a first sidewall, a second sidewall opposite the first sidewall, and an outer peripheral surface connecting the first sidewall and the second sidewall. The outer peripheral surface comprises at least one patterned surface comprising at least one groove. The method also includes hardening or resting the material to produce an article. As such, more efficient frictional contact between the ring body and the substrate may be facilitated during wet chemical processes (e.g., substrate cleaning) to reduce the occurrence of substrate defects.

In another embodiment, a substrate cleaning module is disclosed that supports chemical mechanical polishing of a substrate. The module may include a housing containing a cleaning solution. The module may also include a motorized brush to clean the surface of the substrate with the cleaning solution. The module may also include a sensor wheel to support the substrate during cleaning. A sensor wheel is configured to passively rotate with the substrate, and the sensor wheel is coupled to a sensor to monitor a rotational speed. The sensor wheel includes a first annular body including a die seam and having a central axis, the first annular body including at least one first patterned surface having at least one groove. The at least one groove has a depth ranging from five (5) to fifty (50) microns. The at least one first patterned surface abuts the substrate during cleaning of the substrate. The module also includes a plurality of substrate rollers configured to receive and apply torque to a side edge of a substrate. Each of the plurality of substrate rollers includes a second annular body including a die seam and having a central axis. The second annular body includes a second outer peripheral surface. The second outer perimeter surface includes at least one second patterned surface comprising at least one second groove, and the at least one second groove has a depth ranging from five (5) to fifty (50) microns. The at least one second patterned surface is proximate to the substrate during cleaning of the substrate. Thus, the substrate can be cleaned more efficiently.

Additional features and advantages will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the embodiments described herein, including the detailed description which follows, the claims, as well as the appended drawings.

It is to be understood that both the foregoing general description and the following detailed description are of embodiments, and are intended to provide an overview or framework for understanding the nature and character of the disclosure. The accompanying drawings are included to provide a further understanding, and are incorporated in and constitute a part of this specification. The drawings illustrate various embodiments and together with the description serve to explain the principles and operations of the disclosed concepts.

Drawings

So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.

FIG. 1 is a schematic top view of an exemplary cleaning module;

FIG. 2 is a schematic cross-sectional view of a brush box unit (brush box unit) of the cleaning module of FIG. 1, depicting a sensor wheel and a substrate roller in frictional contact with a substrate during cleaning (an example of a wet chemical process);

FIGS. 3A and 3B are schematic top views of the brush box unit of FIG. 2 with the wash brush assembly in a retracted position and a cleaning position, respectively;

FIGS. 4A and 4B are an exploded top perspective view and a side cross-sectional view, respectively, of the sensor wheel of FIG. 2, wherein the sensor wheel includes a hub (hub), a flange, and an annular body;

FIG. 4C is a front view of the annular body of the sensor wheel of FIG. 4A, showing the gear projecting radially to the top as part of the outer peripheral surface;

FIG. 4D is an enlarged view of one of the tops of FIG. 4C, depicting at least one groove of the at least one patterned surface;

FIG. 4E is a top view of the top of FIG. 4D;

FIGS. 5A and 5B are a top perspective exploded view and a side sectional view, respectively, of one of the substrate rollers of FIG. 2, wherein each substrate roller includes a hub, a flange, and an annular body;

FIGS. 5C-5E are side, front and side cross-sectional views, respectively, of the ring-shaped body of FIG. 5A;

FIG. 5F is a right side sectional view of the ring body of FIG. 5A, with the left side sectional view being identical to the right side sectional view;

FIG. 5G is a cross-sectional view through one of the slots of the at least one slot of FIG. 5F;

FIG. 6 depicts a flow diagram of an exemplary method for providing an article in rotatable communication with a substrate during substrate cleaning;

FIG. 7A is a schematic top perspective view of an exemplary stamper depicting an internal volume of the stamper;

FIG. 7B is a side schematic view of the stamp of FIG. 7A with material disposed in the interior volume;

FIG. 7C is a schematic top perspective view of an annular body formed by the die of FIG. 7A;

FIG. 8A is a schematic top perspective view of a stamper depicting an internal volume of the stamper;

FIG. 8B is a side schematic view of the stamper of FIG. 8A with material disposed in the interior volume; and

FIG. 8C is a schematic top perspective view of an annular body formed by the die of FIG. 8A.

To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It will be appreciated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

Detailed Description

Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein some, but not all embodiments are shown. Indeed, the concepts may be embodied in many different forms and should not be construed as limited herein. Wherever possible, the same reference numbers will be used to refer to similar elements or components.

Embodiments disclosed herein include compression-molded articles that employ peripheral surfaces having friction-enhancing patterns (friction-enhancing patterns) to contact a substrate during a wet chemical process. Articles such as annular bodies may be formed by compression molding techniques. By including a patterned surface as part of an outer peripheral surface of an annular body, frictional contact between the annular body and the substrate may be enhanced because friction-reducing fluids associated with wet chemical processes may be directed away from a desired frictional contact area between the annular body and the substrate. As such, during the wet chemical process, the frictional contact may be enhanced and the substrate may be effectively positioned and moved to improve the efficiency of the process.

In this regard, fig. 1 is a schematic top view of an exemplary cleaning module 100. The cleaning module 100 may be part of a Chemical Mechanical Polishing (CMP) tool and may receive a partially processed substrate 102 from a CMP polishing station (polishing station) of the CMP tool via one or more robot/transfer mechanisms (not shown). Base ofThe plate 102 may be a semiconductor wafer containing silicon, or another workpiece. The cleaning module 100 may include a megasonic (megasonic) cleaning unit 104, two brush box units 106, a spray cleaning unit 108, and a drying unit 110. The cleaning module 100 may have other suitable numbers of cells 104, 106, 108, and/or 110, and/or may additionally or alternatively have other suitable cells in addition to those depicted. A transfer device (not shown) may move the substrate 102 through the cleaning module 100, as indicated by arrow 112. Megasonic cleaning unit 104 may be configured to perform a cleaning process using megasonic energy. The two brush box units 106 may each be configured to perform a cleaning process using mechanical contact via a scrubbing action (described in more detail below in connection with fig. 2-3B). The spray cleaning unit 108 may be configured to perform a cleaning process using a pressurized liquid. In addition, the drying unit 110 may be configured to perform a drying process to quickly dry the substrate 102 after cleaning, to remove cleaning residues, and to prevent streaks and spots caused by evaporation. After processing in the drying unit 110, the substrate 102 may be returned to a CMP polishing station within a CMP tool or transported to another substrate processing tool. The cleaning module 100 may be, for example,GT^TMpart of a CMP system supplied by applied materials, inc (Santa Clara, California).

Fig. 2 is a schematic cross-sectional view of the brush box unit 206 of the cleaning module 100 of fig. 1. The brush box unit 206 includes substrate rollers 220, 222 and a sensor wheel 232 that frictionally contact the substrate 202 during cleaning. Fig. 3A and 3B are schematic top views of the brush box unit 206 of fig. 2 with the wash brush assemblies 240, 340 in retracted and cleaning positions, respectively. The brush box unit 206 may be configured to receive and clean the substrate 202 in a vertical position using the wash brush assemblies 240, 340. In some embodiments, the brush box unit 206 may include a housing 214 having a top opening 215, the top opening 215 configured to allow the substrate 202 to enter and exit the top opening 215 through a manager (not shown). The housing 214 may be configured to contain a cleaning solution therein, and may contain a drain 216. The brush box unit 206 may also include a slide cover 218, the slide cover 218 configured to cover the top opening 215 to prevent cleaning solution from spilling out and to prevent foreign particles from entering the housing 214.

The brush box unit 206 includes two substrate rollers 220, 222 positioned at a lower portion of the housing 214. The substrate rollers 220, 222 may each have recessed regions 321, 323 (see fig. 3A) configured to receive the side edges 303 of the substrate 202. The substrate rollers 220, 222 may be coupled to respective drive axles 324, 326. The drive axles 324, 326 may be coupled to a drive mechanism 328, which drive mechanism 328 may be a motor configured to rotate the substrate rollers 220, 222. The drive axle 326 may be coupled to a drive mechanism 328 via a belt assembly 330. In alternative embodiments, the substrate rollers 220, 222 may each be rotated by a different drive mechanism. During the cleaning process, the substrate rollers 220, 222 may rotate at substantially the same rate and cause the substrate 202 to rotate via frictional contact, which transfers torque from the substrate rollers 220, 222 to the substrate 202. As such, the substrate 202 may be induced to move during the cleaning process.

With continued reference to fig. 2, the brush box unit 206 also includes a sensor wheel 232, the sensor wheel 232 being positionable in a lower portion of the housing 214. The substrate 202 may be disposed on the sensor wheel 232. The sensor wheel 232 may be configured to passively rotate with the substrate 202 and to transmit the rotational speed of the substrate 202 to the rotation sensor 334 (see fig. 3A). A rotation sensor 334 may be coupled to the system controller 236 to monitor the rotation speed as a quality indicator for the cleaning process. The sensor wheel 232 may have other suitable configurations and locations. In this manner, the rotation of the substrates 202 may be monitored to ensure consistent cleaning between the substrates 202.

The brush box unit 206 may also include a wash brush assembly 240, 340 (see fig. 3A, 3B), the wash brush assembly 240, 340 being positioned above the substrate rollers 220 and 222 in the housing 214. The wash brush assemblies 240, 340 may also be positioned to extend along opposite sides of the substrate 202 and may be configured to movably contact the substrate 202 during cleaning. Each wash brush assembly 240, 340 may include a cylindrical wash brush 241, the cylindrical wash brush 241 being configured to contact the substrate 202. Each cylindrical wash brush 241 may have surface cleaning features (not shown) protruding from the cylindrical wash brush 241 and may be mounted on a mandrel (mangrel) assembly 242. Each end of the spindle assembly 242 may be attached to a mounting shaft 244. One or more of the mounting shafts 244 may be coupled to a drive shaft 246 of a motor 248, which motor 248 may be configured to rotate the cylindrical wash brush 241 at a selected speed. In some embodiments, the motor 248 may be configured to rotate the cylindrical wash brush 241 at a rotational speed in the range of fifty (50) RPM to seven hundred (700) RPM. The other mounting shaft 244 may be connected to a cleaning solution supply 250, the cleaning solution supply 250 being fluidly coupled to the internal passage 243 of the mandrel assembly 242. A plurality of openings 245 formed in the spindle assembly 242 may be configured to provide cleaning solution received from the cleaning solution supply 250 to the cylindrical wash brush 241. As such, the cleaning solution may be dispensed as needed for effective cleaning of the substrate 202.

The wash brush assemblies 240, 340 may be mounted in the brush box unit 206 via openings 251 formed in the housing 214. A membrane seal 252 may be coupled around each end of the wash brush assemblies 240, 340 to seal the respective openings 251. The membrane seal 252 causes the wash brush assembly 240, 340 to move laterally within the opening 251 (as indicated by arrow 353 in fig. 3A).

In some embodiments, the brush box unit 206 may further include a pair of cleaning solution spray bars 254 (only one shown in fig. 2), the cleaning solution spray bars 254 being positioned on opposite sides of the housing 214 and above the wash brush assemblies 240, 340. Other embodiments may have more or less than two cleaning solution spray bars 254. The cleaning solution spray bar 254 may be configured to spray a cleaning solution toward each side of the substrate 202 through a plurality of nozzles 255 during cleaning of the substrate 202. The nozzles 255 may be evenly distributed along the cleaning solution spray bar 254. Other embodiments may have other suitable numbers and configurations of nozzles 255.

In some embodiments, brush box unit 206 can further include a pair of water spray bars 256 (only one shown in FIG. 2) positioned on opposite sides of housing 214 and above cleaning solution spray bars 254. Other embodiments may have more or less than two water spray bars 256. The water spray wand 256 may be configured to spray deionized water or chemicals through a plurality of spray nozzles 257 toward each side of the substrate 202 as the substrate 202 is being transferred into and/or out of the housing 214. Spray nozzles 257 may be evenly distributed along water spray bar 256. Other embodiments may have other suitable numbers and configurations of spray nozzles 257.

The brush box unit 206 may also include a positioning assembly 260, the positioning assembly 260 being configured to move the wash brush assemblies 240, 340 relative to the substrate 202. For example, fig. 3A illustrates the scrub brush assembly 240, 340 in a retracted position (i.e., moved away from the substrate 202), while fig. 3B illustrates the scrub brush assembly 240, 340 in a cleaning position (i.e., moved toward and in contact with the substrate 202).

Each wash brush assembly 240, 340 may extend through the membrane seal 252 and may be coupled on opposite ends to two pivot plates 262. The pivot plate 262 is movably coupled to a mounting block 264, and the mounting block 264 may be fixed to a support frame 266. Each pivot plate 262 is pivotable about a pivot node 268. The pivoting plates 262 coupled to each wash brush assembly 240, 340 may be coupled to each other via a synchronization lever 270, the synchronization lever 270 being configured to synchronize the movement of the two pivoting plates 262.

As shown in fig. 3A-3B, each pivot plate 262 on one side of the brush box unit 206 (i.e., the right side as shown) can be coupled to an actuator arm 372. According to one or more embodiments, the control assembly 274 may be coupled between two actuator arms 372. In some implementations, the control component 274 can be configured to extend and retract linearly to move the actuator arms 372 relative to each other. The sliding block 276 may also be coupled between the two actuator arms 372. Each actuator arm 372 may be connected to sliding block 276 by a link 277. The vertical rails 278 may be coupled to the mounting block 264. The sliding block 276 may be configured to slide vertically along the vertical track 278.

During the cleaning process, the control assembly 274 may be extended or retracted to move the actuator arms 372 relative to each other. Movement of actuator arm 372 may be constrained by link 277 and sliding block 276 resulting in substantially symmetrical movement. Movement of the actuator arm 372 may cause the pivot plate 262 to pivot about the pivot node 268, which may cause the wash brush assemblies 240, 340 to move in a symmetrical manner. At the same time, the synchronizing lever 270 may pivot about the pivot node 268 to transfer the movement of the pivot plate 262 from one side of the housing 214 to the other, and thus synchronize the movement of the pivot plate 262 on opposite ends of the wash brush assemblies 240, 340.

The details of the cleaning module 100 are now disclosed, and the details of the sensor wheel 232 will now be discussed. In this regard, fig. 4A and 4B are an exploded top perspective view and a side cross-sectional view, respectively, of the sensor wheel 232 of fig. 2. The sensor wheel 232 may include an annular body 400, a hub (hub)402, and a flange 404. The ring body 400 includes a first sidewall 406A, a second sidewall 406B opposite the first sidewall 406A, and an outer peripheral surface 408 connecting the first sidewall 406A and the second sidewall 406B. The ring body 400 may also include an inner surface 410 to receive a coupling surface 412 of the hub 402. The ring body 400 includes an outer peripheral surface 408, the outer peripheral surface 408 supporting the substrate 202 (fig. 2) and making frictional contact with the side edge 303 of the substrate 202. The flange 404 of the sensor wheel 232 may also be coupled to the hub 402. In general, the flange 404 and the hub 402 may be shaped to form a converging peripheral channel 414 to press the base plate 202 toward the annular body 400 to form a frictional contact. The ring body 400 may include a material containing a component having high mechanical strength and resistance to chemical degradation (degradation), such as at least one of perfluoroelastomer (perfluoroelastomer) and polyurethane (polyurethane). As such, the sensor wheel 232 may be configured to passively rotate with the substrate 202 and transmit the rate of rotation of the substrate 202 to the rotation sensor 334 (fig. 3A).

Fig. 4C is a front view of the annular body 400 of the sensor wheel 232 of fig. 4A, with fig. 4C showing the gear 416, the gear 416 protruding radially to the top 418 as part of the outer peripheral surface 408. Each top 418 may be a perimeter D1 in a range from 0.5 millimeters to 20 millimeters. The gears 416 help direct the cleaning fluid away from the top 418 to improve frictional contact with the substrate 202.

Further, fig. 4D is an enlarged view of one of the tops 418 of fig. 4C, fig. 4D depicts at least one groove 420 of at least one patterned surface 422, and fig. 4E is a top view of the top 418 of fig. 4D. The grooves 420 further improve the friction with the substrate 202 by causing the top 418 to bend and deform to better facilitate contact with the substrate 202. In addition, the grooves 420 may also assist in directing the cooling fluid away from the frictional contact area between the substrate 202 and the annular body 400 to further improve friction. The grooves 420 may have a depth D4 from five (5) to fifty (50) microns and a width D3 from five (5) to fifty (50) microns. As such, the grooves 420 may help improve frictional contact between the substrate 202 and the ring body 400 to promote more consistent cleaning between the substrates 202.

Note that the ring body 400 contains a die seam 424 (fig. 4E). The die seam 424 includes an irregular surface area resulting from material accumulation (sometimes referred to as "flash") caused by the elements of the die (discussed later) coming together. The die seam 424 may be reduced by using a material removal operation. Die seams 424 may occur at one or more locations of the ring body 400 depending on the die used.

Fig. 5A and 5B are a top perspective exploded view and a side sectional view of the substrate roller 220 of fig. 2. The substrate roller 222 will be similarly depicted. The substrate roller 220 includes an annular body 500, a hub 502, and a flange 504, which may be attached to the hub 502 by a retainer 506. The hub 502 is configured to receive torque from the drive axle 324 (fig. 3A). The hub 502 is also configured to transfer this torque to the annular body 500 utilizing, for example, the inner surface 513 of the annular body 500. The torque may then be transferred from the ring body 500 to the side edge 303 of the base plate 202 with frictional contact at the outer peripheral surface 508 of the ring body 500. The ring body 400 may comprise a material containing a mechanically strong and chemically resistant component, such as at least one of a perfluoroelastomer and polyurethane. As such, the substrate roller transfers torque to the substrate 202 in a wet process environment, which may include corrosive chemicals.

Fig. 5C-5E are side, front, and side cross-sectional views, respectively, of the ring-shaped body 500 of fig. 5A including features to facilitate torque transfer to the base plate 202. The annular body 500 includes a first patterned surface 510A, the first patterned surface 510A facing a second patterned surface 510B, the second patterned surface 510B located in a circumferentially-located (circumferentially-located) recess 512 of the outer peripheral surface 508. The hub 502 and the flange 504 are shaped to form a converging peripheral channel 514 when the hub 502 and the flange 504 are coupled to the annular body 500, the converging peripheral channel 514 pressing against the side edge 303 of the base plate 202 within the circumferentially positioned recess 512. The circumferentially-located depression 512 is sized relative to the side edge 303 of the substrate 202 such that the first and second patterned surfaces 510A, 510B form an abutment (abutment) with the side edge 303 of the substrate 202. To improve the torque transmission capability of the frictional contact, the first and second patterned surfaces 510A, 510B may include at least one groove 516A, 516B, respectively.

In this regard, fig. 5F is a right side cross-sectional view of the annular body 500 of fig. 5A, with fig. 5F depicting at least one groove 516A located in the first patterned surface 510A of the annular body 500. The groove 516A may also include an intersection point 518A where the groove 516A intersects itself, thereby promoting a more efficient path for directing the cleaning fluid away from the wiping contact area. It should be noted that a cross-sectional left side view (not shown) would depict the at least one groove 516B, intersection point 518B located in the second patterned surface 510B of the annular body 500, and the cross-sectional left side view would be the same as fig. 5F. The slots 516A form a cyclical pattern that occurs along the outer periphery of the ring body 500 at a frequency ranging from 30 cycles per inch to 150 cycles per inch. As such, the slots 516A may more easily direct the cleaning fluid away from the frictional contact area between the ring body 500 and the substrate 202. The resulting support with the leading cleaning fluid away can create a more robust frictional contact between the substrate 202 and the first and second patterned surfaces 510A, 510B. As such, torque may be more efficiently transferred from the first and second patterned surfaces 510A, 510B of the ring shaped body 500 to the substrate 202, and thus the likelihood of defects may be reduced, as the substrate 202 may be less likely to slip from the substrate rollers 220, 222 during cleaning or other wet chemical processes.

The slots 516A, 516B may be of various sizes to more easily direct the cleaning fluid away from the support. Fig. 5G is a cross-sectional profile view of the at least one groove of fig. 5F. The grooves 516A, 516B may have a depth D4 from five (5) to fifty (50) microns and a width D3 from five (5) to fifty (50) microns. As such, the grooves 516A, 516B may help to improve frictional contact between the substrate 202 and the ring body 500.

It should be noted that the ring body 500 contains a die seam 520 (fig. 5F). The die seam 520 includes an irregular surface area resulting from material accumulation (sometimes referred to as "flash") caused by the elements of the die (discussed later) coming together. The die seam 520 may be reduced by using a material removal operation. Die seams 520 may occur at one or more locations of the ring body 500 depending on the die used.

Articles such as the sensor wheel 232 and the substrate rollers 220, 222 have been described that provide rotatable communication with the substrate 202 during cleaning or other wet chemical processes. An exemplary process for providing these articles is now provided. Fig. 6 depicts a flow diagram of an exemplary method 600 for providing an article in rotatable communication with a substrate during substrate cleaning (e.g., using the cleaning module 100 of fig. 1). The method 600 will be discussed using the terms discussed above.

In this regard, the method 600 includes placing a material 604 in an interior volume 606 of a stamper 608 (operation 602A of fig. 6). By way of example, fig. 7A is a schematic top perspective view of an embodiment of a stamper 608, the stamper 608 including at least one mold surface 610M, the mold surface 610M defining an internal volume 606. The mold surface 610M may include a patterned mold shape 422M, the patterned mold shape 422M being complementary to the patterned surface 422. The patterned mold shape 422M may include at least one raised mold feature 420M, the raised mold feature 420M being complementary to the at least one groove 420. Fig. 7B is a side schematic view of the stamp 608 of fig. 7A, wherein the material 604 is placed in the interior volume 606 of the stamp 608 with the application of pressure FC. As such, material 604 may be placed in a position to be shaped by die 608.

The method 600 further comprises: an annular body 400 is formed with the at least one mold surface 610M and the material 604, the annular body 400 having a central axis a0 (operation 602B of fig. 6). The ring body 400 includes a first sidewall 406A, a second sidewall 406B opposite the first sidewall 406A, and an outer peripheral surface 408, the outer peripheral surface 408 connecting the first sidewall 406A and the second sidewall 406B. The outer peripheral surface 408 of the ring body 400 includes at least one patterned surface 422, the patterned surface 422 including at least one groove 420. The method 600 may also include creating a gear 416, the gear 416 protruding radially to the top 418 as part of the outer peripheral surface 408 of the ring body 400 (operation 602C of fig. 6). The gear 416 may be efficiently produced as part of the compression molding process, as depicted in fig. 7A. Alternatively, a cutting or material removal process (not shown) may be utilized to create the gear 416.

The method 600 also includes hardening, cooling, and/or resting the material 604 to produce an article (e.g., the annular body 400) (operation 602D of fig. 6). Hardening, cooling, and/or resting material 604 may occur within die 608 for a specified period of time and may depend on the material 604 and dimensions used for the article. FIG. 7C is a schematic top perspective view of the annular body 400 representing the article, the annular body 400 being formed by the stamp 608 of FIG. 7A.

The method 600 may also include securing an article of manufacture (e.g., the annular body 400) to the hub 402 and flange 404 assembly (operation 602E of fig. 6). When coupled to the annular body 400, the hub 402 and the flange 404 may form a converging peripheral channel 414 (fig. 4B), the converging peripheral channel 414 leading from the exterior of the hub 402 and flange 404 assembly to the at least one predetermined patterned surface 422. In this manner, the side edge 303 of the substrate 202 may be effectively positioned to rest and frictionally contact the patterned surface 422 of the annular body 400 of the sensor wheel 232.

The method 600 may also include disposing a spindle 233 (fig. 3A) through the sensor wheel 232 (article of manufacture) and establishing frictional contact between the at least one patterned surface 422 and the substrate 202 (operation 602F of fig. 6).

Fig. 8A-8C are depictions of a method 600 that may be applied to the substrate roller 220. Fig. 8A-8C for the substrate roller 220 are similar to fig. 7A-7C for the sensor wheel 232, and differences will be primarily discussed for purposes of clarity and brevity. The method 600 includes placing a material 604 in an interior volume 806 of a stamper 808 (operation 602A of fig. 6). By way of example, fig. 8A is a schematic top perspective view of one embodiment of a stamp 808, the stamp 808 comprising at least one mold surface 803M, the mold surface 803M defining an interior volume 806. Mold surface 803M may comprise patterned shapes 810MA, 810MB, which are complementary to patterned surfaces 510A, 510B, respectively. Patterned shapes 810MA, 810MB may include at least one raised mold feature 816MA, 816MB, respectively, that is complementary to grooves 516A, 516B and intersection points 818MA, 818 MB. Fig. 8B is a side schematic view of the stamp 808 of fig. 8A, wherein the material 604 is placed in the interior volume 806 of the stamp 808 with the application of pressure FC. As such, material 604 may be placed in a position to be shaped by stamp 808.

The method 600 further comprises: an annular body 500 is formed with the at least one mold surface 803M and the material 604, the annular body 500 having a central axis a0 (operation 602B of fig. 6). The ring body 500 includes a first sidewall 515A, a second sidewall 515B opposite the first sidewall 515A, and an outer peripheral surface 508, the outer peripheral surface 508 connecting the first sidewall 515A and the second sidewall 515B. The annular body 500 may also include an inner surface 513 to connect the first sidewall 515A and the second sidewall 515B, and may be configured to receive torque from one or more drive shafts 324, 326. The outer peripheral surface 508 of the ring body 500 includes at least one patterned surface 510A, 510B within a circumferentially positioned recess 512, and the patterned surfaces 510A, 510B include at least one groove 516A, 516B, respectively. The patterned surfaces 510A, 510B may facilitate more reliable frictional contact with the substrate 202 by directing fluid away from the frictional contact. As such, the ring body 500 may be formed to effectively transfer torque to the substrate 202 in a wet processing environment.

The method 600 also includes hardening, cooling, and/or resting the material 604 to produce an article (e.g., the annular body 500) (operation 602D of fig. 6). Hardening, cooling, and/or resting material 604 may occur within die 608 for a specified period of time and may depend on the material 604 and dimensions used for the article. Fig. 8C is a schematic top perspective view of the ring-shaped body 500 representing the article, the ring-shaped body 500 being formed by the stamp 808 of fig. 8A. As such, the ring body 500 may include patterned surfaces 510A, 510B to direct fluid (e.g., cleaning fluid) away from frictional contact between the ring body 500 and the substrate 202 so that torque may be more reliably transferred between the ring body 500 and the substrate 202.

To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It will be appreciated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

Many modifications and other embodiments not set forth herein will come to mind to one skilled in the art to which these embodiments pertain having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the description and claims are not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. It is intended that the embodiments cover the modifications and variations of these embodiments provided they come within the scope of the appended claims and their equivalents. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the scope thereof, and the scope thereof is determined by the claims that follow.