阅读说明：本技术 粉粒体供给装置及方法、树脂成形装置及成形品制造方法 (Powder supply device and method, resin molding device and molded product manufacturing method ) 是由 法兼一贵 于 2019-04-10 设计创作，主要内容包括：本发明提供一种粉粒体供给装置,其通过使存在粉粒体的粉粒体供给路振动而使粉粒体移动并自设置于粉粒体供给路的喷出口对供给对象物供给粉粒体。本发明又提供一种树脂成形装置、粉粒体供给方法、及树脂成形品的制造方法。粉粒体供给装置包括：振动部,使粉粒体供给路振动；测量部,测量粉粒体对供给对象物的供给量；以及控制部,以供给量成为所指定的目标量的方式控制振动部的振动。控制部在供给开始后的第1阶段中以连续地供给粉粒体的方式控制振动部,并且在第1阶段之后的第2阶段中以间歇地供给粉粒体的方式控制振动部。(The invention provides a powder and granular material supply device, which moves powder and granular material by vibrating a powder and granular material supply path in which the powder and granular material exists and supplies the powder and granular material to a supply object from a spray outlet arranged on the powder and granular material supply path. The invention also provides a resin molding apparatus, a powder and granular material supply method, and a method for manufacturing a resin molded product. The powder and granular material supply device includes: a vibration unit configured to vibrate the powder/granular material supply path; a measuring unit for measuring the supply amount of the powder or granule to the supply object; and a control unit that controls the vibration of the vibration unit so that the supply amount becomes the specified target amount. The control unit controls the vibration unit to continuously supply the powder and/or granular material in a 1 st stage after the start of supply, and controls the vibration unit to intermittently supply the powder and/or granular material in a 2 nd stage after the 1 st stage.)

1. A powder and granular material supply device for supplying a powder and granular material to a supply target from an ejection port provided in a powder and granular material supply path by moving the powder and granular material by vibrating the powder and granular material supply path in which the powder and granular material is present, the device comprising:

a vibrating section for vibrating the powder/granular material supply path;

a measuring unit that measures a supply amount of the powder or granule to the supply target object; and

a control unit for controlling the vibration of the vibration unit so that the supply amount becomes a predetermined target amount

The control unit controls the vibration unit to continuously supply the powder or granule in a 1 st stage after the start of supply, and controls the vibration unit to repeatedly vibrate for a predetermined period and stop for a predetermined period in a 2 nd stage after the 1 st stage.

2. The powder/granular material supply device according to claim 1, wherein: the control unit gives a pulse-like command value to the vibration unit in the 2 nd stage.

3. The powder and granular material supply apparatus according to claim 1 or 2, wherein: the control unit determines the magnitude of the command value in the 2 nd stage based on the magnitude of the command value given to the vibration unit in the 1 st stage.

4. The powder/granular material supply device according to claim 1, wherein: the 2 nd stage includes a 1 st sub-stage and a 2 nd sub-stage following the 1 st sub-stage,

the control unit controls the vibration unit in the 1 st sub-stage and the 2 nd sub-stage such that the supply amount per unit time in the 2 nd sub-stage is smaller than the supply amount per unit time in the 1 st sub-stage.

5. The powder/granular material supply device according to claim 4, wherein: the control unit causes the period in which the command value is given to the vibration unit in the 2 nd sub-stage to be longer than the period in which the command value is given to the vibration unit in the 1 st sub-stage.

6. The powder/granular material supply device according to claim 4 or 5, wherein: the control unit reduces the magnitude of the command value given to the oscillating unit in the 2 nd sub-stage from the magnitude of the command value given to the oscillating unit in the 1 st sub-stage.

7. A resin molding apparatus characterized by comprising: the powder and granular material supply apparatus according to any one of claims 1 to 6; and

and a compression molding unit for compression molding the granular resin material supplied from the granular powder supply device.

8. A powder and granular material supply method for supplying a predetermined target amount of powder and granular material to a supply target from an ejection port provided in a powder and granular material supply path through movement of the powder and granular material by vibrating the powder and granular material supply path in which the powder and granular material is present, the method comprising:

vibrating a vibrating section associated with the powder/granular material supply path so as to continuously supply the powder/granular material in a 1 st stage after the start of supply; and

and a step of vibrating the vibrating unit so as to intermittently supply the powder or granule until the supply amount of the powder or granule to the supply target reaches the target amount in a 2 nd stage after the 1 st stage.

9. The powder/granular material supply method according to claim 8, characterized in that: the step of vibrating the vibrating portion in the 2 nd stage includes a step of giving a pulse-like command value to the vibrating portion.

10. The powder/granular material supply method according to claim 8 or 9, characterized in that: the magnitude of the command value in the 2 nd stage is decided based on the magnitude of the command value given to the vibrating portion in the 1 st stage.

11. The powder/granular material supply method according to claim 8, characterized in that: the 2 nd stage includes a 1 st sub-stage and a 2 nd sub-stage following the 1 st sub-stage,

the step of vibrating the vibrating portion in the 2 nd phase includes a step of controlling the vibrating portion in the 1 st sub-phase and the 2 nd sub-phase so that a supply amount per unit time in the 2 nd sub-phase is smaller than a supply amount per unit time in the 1 st sub-phase.

12. The powder/granular material supply method according to claim 11, characterized in that: the period for giving the command value to the vibration unit in the 2 nd sub-phase is set longer than the period for giving the command value to the vibration unit in the 1 st sub-phase.

13. The powder/granular material supply method according to claim 11 or 12, characterized in that: the magnitude of the command value given to the vibration unit in the 2 nd sub-stage is set smaller than the magnitude of the command value given to the vibration unit in the 1 st sub-stage.

14. A method for producing a resin molded article, comprising: the method for supplying powder according to any one of claims 8 to 13; and

and a step of compression molding the supplied granular resin material.

Technical Field

The present invention relates to a powder/granular material supply device for supplying powder/granular material, a resin molding device using the powder/granular material supply device, a powder/granular material supply method in the powder/granular material supply device, and a method for producing a resin molded product using the powder/granular material supply method.

Background

In order to protect electronic parts such as Integrated Circuits (ICs) from the environment of light, heat, moisture, and the like, the electronic parts are generally sealed with resin. A resin portion (resin sealing portion) for sealing the electronic component is also referred to as a "package (package) portion".

A typical method of resin sealing is compression molding using a mold including a lower mold and an upper mold. More specifically, a resin material in the form of pellets is supplied to a cavity (cavity) of a lower mold, a substrate on which an electronic component is mounted on an upper mold, and then the lower mold and the upper mold are heated and are clamped together to perform molding.

As a technique for supplying a resin material for such resin sealing, for example, japanese patent laying-open No. 2013-042017 discloses a resin molding (mold) device including a resin supply portion that supplies a resin for resin molding a workpiece taken out from the workpiece supply portion. More specifically, the resin input portion 52 includes: a trough (rough) 53 for receiving the granular resin supplied from the hopper (hopper) 51; and an electromagnetic feeder (electromagnetic feeder)54 for vibrating the trough 53 to feed the granular resin to the workpiece W. The electromagnetic feeder 54 is formed by: the pair of vibrating plates are vibrated in a predetermined direction to feed the granular resin in the trough 53. The resin input portion 52 is formed as follows: the trough 53 is vibrated in a predetermined direction by the electromagnetic feeder 54 to convey the granular resin, and when the electronic balance 56 provided in the work mounting portion 55 measures a predetermined weight smaller than the amount of the supplied resin, the electromagnetic feeder 54 is stopped from being driven. Here, the predetermined weight is set by taking the amount of resin dropped from the hopper 53 to the workpiece W after the electromagnetic feeder 54 is stopped into account. Thus, the amount of the particulate resin supplied from the resin supply portion 52 to the workpiece W can be measured within a predetermined error range and stably supplied (see [0051], [0052], [0058], and [ fig. 8] of japanese patent laid-open No. 2013-042017).

Further, although not a technique for resin sealing electronic components, for example, japanese patent laid-open No. h 11-160138 discloses a technique for supplying powder at a constant flow rate over a long period of time. More specifically, a configuration is disclosed in which the duty ratio (duty ratio) is changed by adjusting the time ratio of driving at the resonance frequency when adjusting the powder conveyance amount (cutting amount) or adjusting the powder flow rate. The self-driving circuit 60 intermittently applies a driving voltage and a driving current to the vibrator 10 (see [0029], [0033], [0034] and the like of japanese patent laid-open No. h 11-160138).

Disclosure of Invention

In order to improve the efficiency of packaging electronic components in a finished product, it is required to reduce the thickness of a packaging portion (resin sealing portion) of the electronic component. For such a demand, the supply amount of the resin material to the cavity needs to be controlled with higher accuracy.

In the resin molding apparatus disclosed in japanese patent laid-open publication No. 2013-042017, the stop time (timing) of the electromagnetic feeder 54 is controlled by estimating the amount of resin falling after the electromagnetic feeder 54 is stopped, and it is difficult to improve the accuracy of the control of the supply amount.

In addition, japanese patent laid-open No. h 11-160138 is directed to a technique for supplying powder at a fixed flow rate over a long period of time, and it is not assumed at all that the supply amount is controlled in the batch processing.

The supply of the powder and granular material with high accuracy is required not only to reduce the thickness of a sealing portion (resin sealing portion) of an electronic component but also in many other fields.

The present invention has been made to solve the above problems, and an object of the present invention is to provide an apparatus and a method capable of controlling the supply amount of particulate materials such as granular resin materials with higher accuracy.

According to one aspect of the present invention, there is provided a powder and granular material supply device that moves a powder and granular material by vibrating a powder and granular material supply path in which the powder and granular material is present and supplies the powder and granular material to a supply target from a discharge port provided in the powder and granular material supply path. The powder and granular material supply device includes: a vibration unit configured to vibrate the powder/granular material supply path; a measuring unit for measuring the supply amount of the powder or granule to the supply object; and a control unit that controls the vibration of the vibration unit so that the supply amount becomes the specified target amount. The control unit controls the vibration unit to continuously supply the powder and/or granular material in a 1 st stage after the start of supply, and controls the vibration unit to intermittently supply the powder and/or granular material in a 2 nd stage after the 1 st stage.

A resin forming apparatus according to another aspect of the present invention includes: the powder and granular material supply device; and a compression molding unit for compression molding the granular resin material supplied from the granular material supply device.

According to still another aspect of the present invention, there is provided a powder and granular material supply method for supplying a predetermined target amount of powder and granular material to a supply target from an ejection port provided in a powder and granular material supply path while moving the powder and granular material by vibrating the powder and granular material supply path in which the powder and granular material is present. The powder/granular material supply method includes: vibrating a vibrating section associated with a powder/granular material supply path so as to continuously supply the powder/granular material in a 1 st stage after the start of supply; and a step of vibrating the vibrating section so as to intermittently supply the powder or granule until the supply amount of the powder or granule to the supply target reaches a target amount in a 2 nd stage after the 1 st stage.

A method for producing a resin molded article according to still another aspect of the present invention includes: a step of the powder/granular material supply method; and a step of compression molding the supplied granular resin material.

These and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description, which is to be read in connection with the accompanying drawings.

Drawings

Fig. 1 is a schematic diagram showing an example of the overall configuration of a resin molding apparatus according to the present embodiment.

Fig. 2 is a schematic diagram showing an example of the overall configuration of a resin material supply device constituting a resin molding device according to the present embodiment.

Fig. 3 is a schematic diagram showing an example of a hardware (hardware) configuration of a control unit constituting the resin material supply device according to the present embodiment.

Fig. 4 is a time chart (time chart) for explaining a supply control method of a resin material in the resin material supply device according to the present embodiment.

Fig. 5 is a flowchart (flow chart) showing an example of processing in the 1 st stage of the supply control method of the resin material in the resin material supply device according to the present embodiment.

Fig. 6 is a block diagram showing a functional configuration corresponding to the processing in the 1 st stage of the supply control method of the resin material in the resin material supply device according to the present embodiment.

Fig. 7 is a flowchart showing an example of the processing in the 2 nd stage of the supply control method of the resin material in the resin material supply device according to the present embodiment.

Fig. 8 is a block diagram showing a functional configuration corresponding to the processing in the 2 nd stage of the supply control method of the resin material in the resin material supply device according to the present embodiment.

Fig. 9(a) to 9(C) are timing charts showing examples of command values output in the 2 nd stage of the modification according to the present embodiment.

Fig. 10 is a flowchart showing an example of processing in stage 2 of the method for controlling supply of the resin material in the resin material supply device according to the modification of the present embodiment.

[ description of symbols ]

1: resin molding apparatus

10: resin material supply device

11: oblique silo

12: material groove

13: trough feeder

14: measuring part

15: resin material conveying tray

16: resin material discharge part

17: material storage device

20: resin material conveying part

30: compression molding part

31: receiving module

32: forming module

33: delivery module

36: main conveying device

37: auxiliary conveying device

100: control unit

102: input unit

104: output unit

106: main memory

108: optical drive

108A: recording medium

110: processor with a memory having a plurality of memory cells

112: network interface

114: interface of measuring part

116: vibrating part interface

118: internal bus

120：HDD

121: discharge port

122: general purpose OS

124: real-time OS

126: HMI program

128: control program

151: concave part

171: supply port

172: hopper feeder

201: stage 1

202: stage 2

210: deviation calculating part

212: PID calculation unit

214. 216, 234: selection part

218: instruction value holding unit

220: time-meter

222: difference device

224: differentiator

226. 236: comparison part

230: pulse generating part

232: amplifying part

241: sub-stage 1

242: sub-stage 2

311: substrate receiving part

331: resin molded product holding part

P: resin material

S: substrate

S1-S16: step (ii) of

T: resin molded article

T1, T2: output period

t1, t2, t 3: time of day

Td, Td1, Td 2: width of time

Y1, Y2: size of instruction value

Detailed Description

Embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding portions are denoted by the same reference numerals, and description thereof will not be repeated.

In the present specification, the term "powder or granule" is a term including aggregates of objects having an arbitrary particle diameter. The "powder" is a concept including "powder" and has a characteristic of being fluid as an aggregate. That is, in the present specification, the term "powder and granular material" includes aggregates that move or deform when receiving any external force.

In the following description, a granular resin material is assumed as a typical example of the powder and granular material, and a resin material supply device that supplies the granular resin material only by a predetermined weight is assumed as a typical example of the powder and granular material supply device. The powder and granular material supplied by the powder and granular material supply device of the present invention is not limited to the granular resin material, and can be applied to any material or substance.

< A. example of the overall Structure of the resin Molding apparatus 1

First, an overall configuration example of a resin molding apparatus 1 including the resin material supply apparatus 10 according to the present embodiment will be described. Typically, the resin molding apparatus 1 according to the present embodiment is used as an apparatus for resin-sealing an electronic component by molding a resin on an exposed surface of a substrate on which the electronic component is disposed. The resin molding apparatus 1 may be configured as a part of an apparatus for manufacturing electronic components.

Fig. 1 is a schematic diagram showing an example of the overall configuration of a resin molding apparatus 1 according to the present embodiment. Referring to fig. 1, a resin molding apparatus 1 receives a substrate S to be subjected to resin molding and a granular resin material P as a material for molding the resin from the outside, and supplies a resin molded product T as the substrate S on which the resin is molded to the next step.

More specifically, the resin molding apparatus 1 includes: a receiving module 31, one or more forming modules 32, and a delivery module 33. The resin molding apparatus 1 further includes a main conveyance device 36 disposed so as to penetrate the receiving module 31, the one or more molding modules 32, and the delivery module 33. The main conveyance device 36 conveys the substrate S, the resin material conveyance section 20, and the resin molded product T.

A sub-conveyance device 37 extending in a direction perpendicular to the main conveyance device 36 is provided in each of the receiving module 31, the one or more forming modules 32, and the delivery module 33. At the intersection of the main conveying device 36 and each sub-conveying device 37, the conveying direction of the substrate S, the resin material conveying section 20, and the resin molded article T can be changed.

The receiving module 31 receives the substrate S and the resin material P from the outside and supplies them to the molding module 32. The reception module 31 has: a substrate receiving portion 311 for receiving a substrate S; and a resin material supply device 10 for receiving the resin material P from the outside and supplying the received resin material P to the resin material conveying part 20.

The resin material supply device 10 supplies a predetermined weight of the resin material P from the ejection port 121. In the following description, the weight specified in advance will also be referred to as a "target amount". The target amount is specified by a management device or the like, not shown, in accordance with the kind of the substrate S to be subjected to resin molding. In each supply operation, the weight of the resin material P supplied to the supply target is also referred to as a "supply amount". That is, the resin material supply device 10 adjusts the discharge amount of the resin material P from the discharge port 121 so that the supply amount becomes a target value. The phrase "the supply amount becomes the target value" does not mean that the supply amount strictly matches the target value, but may include a case where the supply amount is within a range of a degree that the supply amount is substantially free from a problem with respect to the target value.

The resin material transfer section 20 is provided with a resin material transfer tray 15 having a concave portion 151 on a flat surface thereof, the concave portion corresponding to the size of the substrate S. The resin material transfer tray 15 is an example of a supply target to which the resin material P is supplied from the resin material supply device 10. The resin material conveying unit 20 is relatively moved with respect to the ejection port 121 of the resin material supply device 10 so that the resin material P dropped from the ejection port 121 of the resin material supply device 10 uniformly spreads in the concave portion 151 of the resin material conveying tray 15. The resin material conveying unit 20 is conveyed to the molding module 32 when the filling of the resin material P into the concave portion 151 of the resin material conveying tray 15 is completed.

Each molding module 32 has a compression molding portion 30 for molding a resin on the substrate S. The compression molding unit 30 performs compression molding using a granular resin material P as a powder or granules supplied from the resin material supply device 10.

More specifically, the compression molding section 30 has a molding die including a lower die and an upper die. The resin material P is supplied from the resin material supply device 10 to the lower die of the compression molding section 30, and the substrate S is mounted on the upper die of the compression molding section 30 by a substrate conveying section (not shown). The compression molding unit 30 heats the lower mold and the upper mold and closes them to mold the resin on the substrate S. That is, the resin molded article T is manufactured by clamping.

The delivery module 33 holds the resin molded article T manufactured by the molding module 32. More specifically, the delivery module 33 includes a resin molded product holding portion 331 for holding the resin molded product T. The resin molded product holding portion 331 supplies the held resin molded product T to the next step and the like in response to a request from the next step and the like.

In fig. 1, the resin molding apparatus 1 including three molding modules 32 is illustrated, but the number of molding modules 32 may be arbitrarily determined according to the performance required for the resin molding apparatus 1. In particular, since the resin molding apparatus 1 according to the present embodiment is modularized for each function, the molding modules 32 can be arbitrarily increased or decreased even after the resin molding apparatus 1 is assembled and the resin molded article T starts to be manufactured.

< B. example of the constitution of the resin material supply device 10

Next, an overall configuration example of the resin material supply device 10 constituting the resin molding device 1 according to the present embodiment will be described.

Fig. 2 is a schematic diagram showing an example of the overall configuration of the resin material supply device 10 constituting the resin molding device 1 according to the present embodiment. Referring to fig. 2, the resin material supply device 10 includes: a stocker (stocker)17 that receives the resin material P of the powder and granular material from the outside; a chute (trough) 11 disposed at the lower part of the stocker 17; and a trough 12 communicating with the chute 11.

The hopper 17 accommodates the resin material P supplied from the outside. A supply port 171 as a hole for supplying the resin material P to the chute 11 and a stocker feeder (stocker feeder)172 for vibrating the stocker 17 are provided at a lower portion of the stocker 17. In accordance with a command from the control section 100, the hopper feeder 172 vibrates, thereby imparting vibration to the resin material P in the hopper 17, and as a result, a part of the resin material P in the hopper 17 is supplied to the chute 11 through the supply port 171.

Fig. 2 shows an example of a configuration in which the control unit 100 controls the vibration of the hopper feeder 172, but the vibration control of the hopper feeder 172 may be realized by using a control unit different from the control unit 100.

The trough 12 corresponds to a powder and granular material supply path for supplying a granular resin material P, which is a typical example of powder and granular materials. One end of the trough 12 is connected to the chute 11 so as to communicate with the chute 11, and the other end of the trough 12 is provided with a discharge port 121. The resin material P is supplied to the resin material conveyance tray 15, which is an example of a supply target, through the discharge port 121. In a steady state, the resin material P supplied from the hopper 17 is present inside the chute 11 and the chute 12.

The resin material supply device 10 includes a trough feeder 13 as a vibration unit for vibrating the trough 12. Further, the chute 11 may be vibrated in addition to the chute 12 by the vibration of the chute feeder 13. When the resin material P is supplied, the resin material conveyance tray 15 is disposed directly below the discharge port 121 by the resin material conveyance unit 20.

In accordance with a command from the control unit 100, the trough feeder 13 vibrates, thereby imparting vibration to the resin material P in the trough 12, and as a result, the resin material P in the trough 12 is supplied to the concave portion 151 of the resin material conveyance tray 15 through the discharge port 121.

In this way, in the resin material supply device 10, the trough 12 (powder/granular material supply path) in which the granular resin material P (powder/granular material) is present is vibrated to move the resin material P, and the resin material P is supplied from the discharge port 121 provided in the trough 12 to the resin material conveyance tray 15 (supply target).

The resin material discharge portion 16 is disposed below the position where the resin material transfer tray 15 and the resin material transfer portion 20 are disposed vertically below the discharge port 121. The resin material discharge unit 16 is a container that receives the resin material P when the resin material P is discharged without being supplied to the resin material conveyance tray 15.

Here, an operation when the resin material P is loaded on the resin material conveyance tray 15 will be described. The resin material conveying unit 20 disposes the resin material conveying tray 15 at a position between the discharge port 121 and the resin material discharge unit 16. The resin material transfer part 20 can move the resin material transfer tray 15 substantially horizontally so as to dispose an arbitrary position of the resin material transfer tray 15 directly below the ejection port 121. After the resin material P is loaded, the resin material conveying unit 20 conveys the resin material conveying tray 15 to the upper portion of the lower mold of the compression molding unit 30 (see fig. 1).

In the case where the resin material P is discharged without being supplied to the resin material conveyance tray 15, the resin material conveyance unit 20 separates the resin material conveyance tray 15 from a position just below the discharge port 121, thereby discharging the resin material P to the resin material discharge unit 16.

Further, the resin material discharge portion 16 is not always disposed directly below the discharge port 121, but the resin material discharge portion 16 can be moved to the position directly below the discharge port 121 when the resin material P is discharged.

The resin material supply device 10 further includes a measurement unit 14 that is associated with the chute 11 and the chute 12 and measures the amount of the resin material P supplied to the supply target object.

Since the resin material P in the trough 12 is discharged from the discharge port 121 by the vibration of the trough feeder 13, the measurement value by the measuring unit 14 decreases unless the resin material P supplied from the hopper 17 is supplied. The supply amount of the resin material P can be measured based on the difference between the measurement value from the measurement unit 14 before the trough feeder 13 starts to vibrate and the measurement value from the measurement unit 14 after the trough feeder 13 finishes vibrating. The amount of change per unit time of the measurement value from the measurement unit 14 corresponds to the feeding speed of the resin material P.

The control unit 100 controls the trough feeder 13 based on the measurement value from the measurement unit 14 so that the supply amount of the resin material P becomes a predetermined target amount. More specifically, the control unit 100 adjusts a command value given to the trough feeder 13.

In the resin material supply device 10 shown in fig. 2, the measuring unit 14 for measuring the weight of the chute 11 and the chute 12 is used, but a measuring unit for measuring the weight of the resin material conveyance tray 15 may be disposed in addition to the measuring unit 14 or instead of the measuring unit 14. In this case, the supply amount of the resin material P may be measured based on the difference between the measurement values of the measuring unit before the vibration of the trough feeder 13 is started and after the vibration is completed. Further, the feeding speed of the resin material P may be calculated based on the amount of change per unit time.

In this manner, in the resin material supply device 10, the granular resin material P (a typical example of the powder or granule) supplied from the storage container 17 to the inclined chute 11 is moved toward the discharge port 121 provided at one end of the chute 12 by the vibration of the chute 12 serving as a supply path of the powder or granule. Then, the resin material P drops from the ejection port 121 and is supplied to the supply object. The supply amount of the resin material P to the supply object can be adjusted as follows: the vibration of the trough feeder 13 as a vibration section is controlled based on the measurement value by the measurement section 14.

< C. example of configuration of control section 100

Next, a configuration example of the control unit 100 constituting the resin material supply device 10 will be described.

The control portion 100 according to the present embodiment performs at least control related to the supply of the resin material P by the resin material supply device 10. The control unit 100 may further perform control related to the conveyance of the resin material conveying unit 20. Further, the control unit 100 may perform the overall control of the resin molding apparatus 1 (see fig. 1). In this case, the control related to the supply of the resin material P by the resin material supply device 10 can be implemented as a part of the control executed by the control section 100.

The control unit 100 can be realized by using a control device such as a Programmable Logic Controller (PLC), or can be realized by using an industrial personal computer.

Fig. 3 is a schematic diagram showing an example of a hardware configuration of the control unit 100 constituting the resin material supply device 10 according to the present embodiment. Fig. 3 shows a typical example of a configuration of a control unit 100 using an industrial personal computer having a general architecture (architecture). The control unit 100 executes a general-purpose Operating System (OS) and a real-time OS, respectively, thereby satisfying a Human-Machine Interface (HMI) function, a communication function, and a control function requiring real-time performance.

The control section 100 includes an input section 102, an output section 104, a main memory 106, an optical Drive 108, a processor 110, a Hard Disk Drive (HDD) 120, a network interface 112, a measurement section interface 114, and a vibration section interface 116 as main components (components). These components are connected in such a manner that data can be exchanged with each other via an internal bus 118.

The input unit 102 is a member that receives an operation from a user, and typically includes a keyboard, a touch panel, a mouse, a track ball (track ball), and the like. The output unit 104 is a means for outputting the processing result and the like in the control unit 100 to the outside, and typically includes a display, a printer, various indicators (indicators), and the like. The main Memory 106 includes a Dynamic Random Access Memory (DRAM) or the like, and holds codes of programs executed in the processor 110 or various work data (work data) necessary for executing the programs.

The processor 110 is a processing main body that reads out a program stored in the HDD120 and executes processing on input data. The processor 110 is configured to execute a general-purpose OS and various applications (applications) operating on the general-purpose OS, and a real-time OS and various applications operating on the real-time OS, respectively, in parallel. For example, the processor 110 may be implemented by any one of a configuration including a plurality of processors (a so-called "multiprocessor"), a configuration including a plurality of cores (cores) in a single processor (a so-called "multi-core"), and a configuration having features of both the multiprocessor and the multi-core.

The HDD120 is a storage unit, and typically stores a general-purpose OS 122, a real-time OS 124, an HMI program 126, and a control program 128. HMI program 126 acts within the execution environment of the general purpose OS 122 to primarily effect processing related to the exchange of users. The control program 128 operates in an execution environment of the real-time OS 124, and controls each component constituting the resin material supply apparatus 10.

Various programs executed by the control unit 100 are stored in a recording medium 108A such as a high-density Read-Only disk (DVD-ROM) and can be distributed. The content of the recording medium 108A is read by the optical drive 108 and mounted (install) on the HDD 120. That is, one aspect of the present invention includes a program for realizing the control unit 100 and some recording medium storing the program. As these recording media, in addition to optical recording media, magnetic recording media, magneto-optical recording media, semiconductor recording media, and the like can be used.

Fig. 3 illustrates a mode in which a plurality of programs are installed in HDD120, but these programs may be integrated as one program, or may be incorporated as a part of another program.

The network interface 112 exchanges data with an external device via a network.

The program installed on the HDD120 may be acquired from a server (server) via the network interface 112. That is, the program that realizes the control unit 100 according to the present embodiment can be downloaded and installed in the HDD120 by any method.

The measurement unit interface 114 receives the measurement value from the measurement unit 14. The vibration section interface 116 outputs command values to the stocker feeder 172 and the trough feeder 13.

In fig. 3, a configuration example in which the controller 100 according to the present embodiment is realized by executing a program by the processor 110 is described, but the present invention is not limited to this, and a configuration according to the technical level of the time when the powder and granular material supply apparatus or the powder and granular material supply method according to the present invention is actually achieved can be suitably adopted. For example, a plc (programmable Logic controller) as an industrial controller may be used instead of a general-purpose computer. Alternatively, all or part of the functions provided by the control unit 100 may be implemented by an Integrated Circuit such as a Large Scale Integrated Circuit (LSI) or an Application Specific Integrated Circuit (ASIC), or may be implemented by a reprogrammable Circuit element such as a Field-Programmable Gate Array (FPGA). Alternatively, the functions provided by the control unit 100 shown in fig. 3 may be realized by cooperation of a plurality of processing bodies. For example, a plurality of computers may be coupled to realize the functions provided by the control section 100.

All of the components shown in fig. 3 are not essential, and components that are not used in actual control, such as the optical drive 108, a mouse as an example of the input unit 102, and a printer as an example of the output unit 104, may be omitted as appropriate.

< D. method for controlling supply of resin Material P in resin Material supply apparatus 10 >

Next, a method of controlling the supply of the resin material P in the resin material supply device 10 according to the present embodiment will be described.

(d 1: summary)

The resin material supply device 10 performs supply control so as to supply a predetermined target amount of the resin material P in each supply operation. More specifically, in the supply control method according to the present embodiment, the control portion 100 controls the trough feeder 13 to continuously supply the resin material P in the 1 st stage 201 after the start of supply, and controls the trough feeder 13 to intermittently supply the resin material P in the 2 nd stage 202 after the 1 st stage 201. The 1 st stage 201 may be immediately after the start of supply.

Fig. 4 is a timing chart for explaining a supply control method of the resin material P in the resin material supply device 10 according to the present embodiment.

Referring to fig. 4, in stage 1, the magnitude of the command value given to the trough feeder 13 is controlled so that the feeding speed (i.e., the feeding amount per unit time) of the resin material P is fixed. The intensity of the vibration generated by the trough feeder 13 changes according to the magnitude of the command value. The magnitude of the command value can be calculated sequentially from the deviation between the target value of the supply speed and the actually measured value of the supply speed. Typically, the magnitude of the command value is calculated sequentially by feedback (feedback) control in which a target value of the supply speed and an actually measured value of the supply speed are input. As a typical example of the feedback control, Proportional-Integral-derivative (PID) control can be used.

The 1 st stage 201 (time t1 to time t2) is terminated when the actual result value of the supply amount of the resin material P reaches a termination determination value that is smaller than the target amount by a predetermined amount. That is, at the end of phase 1, 201, the command value is updated to zero. The termination determination value of the termination 1 st stage 201 is set to a range in which the supply amount of the resin material P does not exceed the target amount, based on the resin material P discharged from the discharge port 121 of the resin material supply device 10 after the vibration of the trough feeder 13 is stopped (i.e., the inflow after the vibration is stopped).

For ease of understanding, the waveform of the command value shown in fig. 4 is drawn substantially linearly. However, for example, when PID control is used, the waveform of the actual command value changes as follows: the feed rate is increased when the feed rate is lowered, and is decreased when the feed rate is increased.

In this way, in the 1 st stage 201, the chute feeder 13 is continuously vibrated, and thus the resin material P is continuously discharged from the discharge port 121 of the resin material supply device 10.

The 2 nd stage 202 (time t2 to time t3) corresponds to a supply amount adjustment period during which the resin material P is intermittently discharged so that the supply amount of the resin material P becomes a target amount. Typically, the trough feeder 13 is intermittently given a command value of a predetermined size. That is, the control unit 100 gives a pulse-like command value to the trough feeder 13 in the 2 nd stage.

Here, the control unit 100 may determine the magnitude of the command value in the 2 nd stage 202 based on the magnitude of the command value given to the trough feeder 13 in the 1 st stage 201 (that is, the intensity of the vibration generated by the trough feeder 13). Specifically, the magnitude of the instruction value in the 2 nd stage 202 may be made substantially equal to the magnitude of the instruction value immediately before the 1 st stage 201 ends.

The magnitude of the command value in the 2 nd stage 202 may be set to a value that is appropriate enough to be free from problems in actual use. For example, the size of the instruction value in the 2 nd stage 202 may be set to be between-50% and + 10% with respect to the size of the instruction value immediately before the end of the 1 st stage 201, and more specifically, may be set to be between two values selected from-50%, -45%, -40%, -35%, -30%, -25%, -20%, -15%, -10%, -9%, -8%, -7%, -6%, -5%, -4%, -3%, -2%, -1%, 0%, + 1%, + 2%, + 3%, + 4%, + 5%, + 6%, + 7%, +8 + 9%, + 10%, or may be set to be at least one value selected from these values.

By maintaining the continuity of the magnitude of the command value between the 1 st stage 201 and the 2 nd stage 202, the distribution state of the resin material P remaining in the trough 12 as the powder/granular-material supply path can be maintained, and thus the resin material P can be continuously discharged even when the next supply of the resin material P is started.

The 2 nd stage 202 may be divided into a plurality of stages. In each divided stage, the size of the instruction value may be different, or the length of the period during which the instruction value is output may be different.

The following describes the processing contents of the 1 st stage 201 and the 2 nd stage 202 in more detail.

(d 2: stage 1 201)

Fig. 5 is a flowchart showing an example of the processing in stage 1 of the supply control method of the resin material P in the resin material supply device 10 according to the present embodiment. Typically, each step shown in fig. 5 is realized by the processor 110 of the control unit 100 executing the control program 128.

Referring to fig. 5, the control unit 100 determines whether or not a supply start command for the resin material P is received (step S1). If the supply start command for the resin material P is not received (NO in step S1), the process of step S1 is repeated. When receiving the supply start command for the resin material P (YES in step S1), the control unit 100 sets the measurement value at this point from the measurement unit 14 as the initial measurement value (step S2). The process of step S2 corresponds to the tare removal process.

After the process of step S2 is executed, the output of the command value to the trough feeder 13 is started. That is, the control unit 100 determines a command initial value as an initial value of the command value (step S3), and outputs the command initial value determined in step S3 as the command value over a predetermined initial operation time (step S4).

The reason why the operation of fixing the command value to the command initial value is performed over the initial operation time is as follows: the supply speed of the resin material P in the initial discharge is stabilized. After the initial operation time has elapsed, the ejection of the resin material P is considered to be stable, and therefore, the feedback control is started.

That is, the control unit 100 calculates a command value based on the target value of the supply speed and the actual measurement value of the supply speed (step S5), and updates the output command value to the command value calculated in step S5 (step S6). Here, the actual measurement value of the feeding speed is calculated based on the temporal change of the measurement value from the measurement unit 14.

Then, the control portion 100 determines whether the supply amount of the resin material P reaches an end determination value (step S7). If the supply amount of the resin material P does not reach the end determination value (no in step S7), the process from step S5 onward is repeated.

On the other hand, when the supply amount of the resin material P reaches the end determination value (yes in step S7), the control unit 100 stops the output of the command value (step S8). That is, the control unit 100 updates the command value to zero. Thereby, the processing in phase 1 is ended.

In this way, in the 1 st stage 201, feedback control is performed so that the supply speed (i.e., the discharge speed) is constant, and the resin material P is continuously supplied. When the predetermined termination judgment value is reached, the feedback control is stopped.

Depending on the shapes of the trough 12 and the discharge port 121, the particle size of the resin material P, and the like, the processing of steps S2 to S4 is not necessarily required, and the calculation of the command value by the feedback control can be started immediately after step S1 is completed (processing below step S5).

Fig. 6 is a block diagram showing a functional configuration corresponding to the processing in the 1 st stage 201 of the supply control method of the resin material P in the resin material supply device 10 according to the present embodiment. Typically, each functional block shown in fig. 6 is realized by the processor 110 of the control unit 100 executing the control program 128.

Referring to fig. 6, the control unit 100 includes a deviation calculation unit 210, a PID calculation unit 212, a selection unit 214, a selection unit 216, a command value holding unit 218, a timer 220, a differentiator 222, a differentiator 224, and a comparison unit 226 as the functional configuration of the stage 1.

The deviation calculation unit 210 and the PID calculation unit 212 correspond to functional configurations for realizing feedback control (corresponding to step S5 and step S6 shown in fig. 5). The deviation calculation unit 210 calculates the deviation between the target value of the supply speed and the actual measurement value of the supply speed. The PID calculation unit 212 receives an input of the deviation of the supply speed from the deviation calculation unit 210, and calculates a command value by performing PID calculation.

The differentiator 222 corresponds to a functional configuration for calculating the supply amount of the resin material P. That is, the differentiator 222 calculates the current supply amount from the number difference between the initial measurement value, which is the measurement value of the measurement unit 14 when the supply start command of the resin material P is given, and the current measurement value of the measurement unit 14.

The differentiator 224 corresponds to a functional configuration for calculating the feeding speed of the resin material P. More specifically, the differentiator 224 calculates the time derivative of the supply amount from the differentiator 222, and outputs the calculated time derivative as an actual measurement value of the supply speed.

The selector 216, the command value holder 218, and the timer 220 correspond to functional configurations for realizing processing (corresponding to steps S3 and S4 shown in fig. 5) for outputting a command initial value across initial operating times. More specifically, the selector 216 outputs one of the command value from the command value holder 218 and the command value from the PID calculator 212 (selector 214) as the final command value in accordance with the command from the timer 220. The command value holding unit 218 holds the current command value while the valid command value is output. Therefore, when the output of the command value is stopped, the command value holding unit 218 holds the command value immediately before the stop. The command value held in the command value holding unit 218 in this manner is used as a command initial value when the next supply of the resin material P is started. The timer 220 counts up (count up) during the initial operation time when a supply start command for the resin material P is given. The timer 220 gives the selection command for outputting the command value from the command value holding unit 218 to the selection unit 216 until the initial operation time elapses, and gives the selection command for outputting the command value from the PID calculation unit 212 (selection unit 214) to the selection unit 216 when the initial operation time elapses.

The selector 214 and the comparator 226 correspond to functional configurations for realizing processing (corresponding to steps S7 and S8 shown in fig. 5) necessary for determining the end of the processing in the 1 st stage 201. More specifically, the selection unit 214 switches whether or not to output the command value from the PID calculation unit 212 as an effective command value in accordance with the command from the comparison unit 226. The comparison unit 226 compares the supply amount of the resin material P from the differentiator 222 with the termination determination value. The comparison unit 226 gives the selection unit 214 a selection command for outputting the command value from the PID calculation unit 212 until the supply amount reaches the end determination value, and gives the selection unit 214 a selection command (command value stop command) for stopping the output of the command value when the supply amount reaches the end determination value.

Fig. 6 shows only one example of the functional configuration of stage 1, but the present invention is not limited to this, and other configurations may be used as the functional configuration of stage 1 201.

(d 3: stage 2 202)

Fig. 7 is a flowchart showing an example of the processing in the 2 nd stage of the supply control method of the resin material P in the resin material supply device 10 according to the present embodiment. Typically, each step shown in fig. 7 is realized by the processor 110 of the control unit 100 executing the control program 128.

Referring to fig. 7, the control unit 100 determines the magnitude of the command value used in the 2 nd stage 202 (step S11). Typically, in step S11, the size of the instruction value immediately before the 1 st stage 201 is ended may be determined as the size of the instruction value used in the 2 nd stage 202.

Then, the control portion 100 determines whether the supply amount of the resin material P reaches the target amount (step S12). If the supply amount of the resin material P does not reach the target amount (no in step S12), the control portion 100 determines whether or not the output cycle of the command output has come (step S13).

Here, the output cycle of the output pulse-like command value and the time width of the output command value are predetermined. Instead of the output period and the time width, the output period and the duty ratio (that is, the ratio of the time width to the output period) may be predetermined.

If the output cycle of the instruction output does not come (no in step S13), the process of step S13 is repeated. When the output cycle of the command output comes (yes in step S13), the control unit 100 outputs the command value of the size determined in step S11 over a predetermined time width (step S14). Then, the processing in step S12 is repeated.

On the other hand, when the supply amount of the resin material P reaches the target amount (yes in step S12), the process in the 2 nd stage 202 is ended.

In this manner, in the 2 nd stage 202, the pulse-like command value is output, and the resin material P is intermittently discharged until the specified target amount is reached.

Fig. 8 is a block diagram showing a functional configuration corresponding to the processing in the 2 nd stage of the supply control method of the resin material P in the resin material supply device 10 according to the present embodiment. Typically, each functional block shown in fig. 8 is realized by the processor 110 of the control unit 100 executing the control program 128.

Referring to fig. 8, the control unit 100 includes a pulse generation unit 230, an amplification unit 232, a selection unit 234, a comparison unit 236, and a differentiator 222 as the functional configuration of the 2 nd stage 202.

The differentiator 222 functions as the differentiator 222 shown in fig. 6, and calculates the supply amount of the resin material P.

The pulse generating unit 230 and the amplifying unit 232 correspond to functional configurations for outputting pulse-like command values (corresponding to steps S13 and S14 shown in fig. 7). The pulse generator 230 outputs a pulse signal having a predetermined time width for each predetermined output period. The amplifier 232 adjusts the amplitude of the pulse signal from the pulse generator 230 to a predetermined command value, and generates a pulse-like command value.

The selection unit 234 and the comparison unit 236 correspond to functional configurations for realizing processing (corresponding to step S12 shown in fig. 7) necessary for determining the end of the processing in the 2 nd stage 202. More specifically, the selection unit 234 switches whether or not to output the command value from the amplification unit 232 as a valid command value in accordance with the command from the comparison unit 236. The comparison unit 236 compares the supply amount of the resin material P from the differentiator 222 with a target amount. The comparison unit 236 gives the selection unit 234 a selection command for outputting the command value from the amplification unit 232 until the supply amount reaches the target amount, and gives the selection unit 234 a selection command (command value stop command) for stopping the output of the command value when the supply amount reaches the target amount.

Fig. 8 shows only one example of the functional configuration of the 2 nd stage 202, but the present invention is not limited to this, and other configurations may be used as the functional configuration of the 2 nd stage 202.

< E. segmentation at stage 2 202 >

In the embodiment, the 2 nd stage 202 outputs the pulse-like command value at the same output cycle and time width. That is, the supply amount per unit time in the 2 nd stage 202 is fixed. Instead of this, in the 2 nd stage 202, the supply amount per unit time may be decreased as the actual value of the supply amount of the resin material P approaches the target amount.

As an example of the process of reducing the supply amount per unit time, a case will be described below in which the 2 nd stage 202 is divided into two sections (hereinafter, referred to as "1 st sub-stage 241" and "2 nd sub-stage 242", respectively) and the command values output from the sub-stages are different. That is, the 2 nd phase 202 includes the 1 st sub-phase 241 and the 2 nd sub-phase 242 following the 1 st sub-phase 241. However, the division may be performed into more sections (for example, three or more sub-stages).

The transition condition from the 1 st sub-stage 241 to the 2 nd sub-stage 242 may be arbitrarily set, and for example, a difference between the target amount and the actual value of the supply amount of the resin material P is equal to or less than the adjustment start amount, which is the transition condition.

The control unit 100 controls the trough feeder 13 in the 1 st sub-step 241 and the 2 nd sub-step 242 so that the supply amount per unit time in the 2 nd sub-step 242 is smaller than the supply amount per unit time in the 1 st sub-step 241.

As a specific method of reducing the supply amount per unit time, at least one of the output cycle of the command output, the time width of the command output, and the size of the command output may be changed. Since the duty ratio of the command output is defined by the relative relationship between the output period and the time width, when at least one of the output period of the command output and the time width of the command output is changed, it means that the duty ratio of the command output is changed.

Fig. 9(a) to 9(C) are timing charts showing examples of command values output in the 2 nd stage 202 according to the modification of the present embodiment. In the time charts shown in fig. 9(a) to 9(C), the supply amount per unit time in the 2 nd sub-stage 242 is set smaller than the supply amount per unit time in the 1 st sub-stage 241.

Fig. 9(a) shows an example of processing for extending the output cycle of the instruction output between the 1 st sub-stage 241 and the 2 nd sub-stage 242. In the above example, the control unit 100 makes the period of giving the instruction value to the trough feeder 13 in the 2 nd sub-stage 242 longer than the period of giving the instruction value to the trough feeder 13 in the 1 st sub-stage 241. More specifically, in the 1 st sub-stage 241, a command value of the time width Td is output for each output period T1, and in the 2 nd sub-stage 242, a command value of the time width Td is output for each output period T2 (> T1).

In the 1 st sub-stage 241, the resin material P is fed at a relatively high feed rate, whereby the time required for the entire process in the 2 nd sub-stage 202 can be shortened, and in the 2 nd sub-stage 242, the resin material P is fed at a relatively low feed rate, whereby the feed amount of the resin material P can be controlled with higher accuracy.

By adopting the 2 nd stage 202 including a plurality of sub-stages, the supply amount of the resin material P can be controlled with higher accuracy while suppressing an increase in the entire processing time required for the supply processing of the resin material P.

Fig. 9(B) shows a time chart when the magnitude of the command output is changed in addition to the process of changing the output cycle as shown in fig. 9 (a). In the above example, the control unit 100 makes the magnitude of the command value given to the trough feeder 13 in the 2 nd sub-stage 242 smaller than the magnitude of the command value given to the trough feeder 13 in the 1 st sub-stage 241. More specifically, an instruction value of size Y1 with a time width Td is output for each output period T1 in the 1 st sub-phase 241, and an instruction value of size Y2 (< Y1) with a time width Td is output for each output period T2 (> T1) in the 2 nd sub-phase 242. That is, in the 2 nd sub-step 242, the vibration intensity of the trough feeder 13 is smaller than that in the 1 st sub-step 241.

In this way, the supply amount per unit time in the 2 nd sub-stage 242 is further reduced by increasing the output cycle and reducing the magnitude of the command value, and therefore, the accuracy of controlling the supply amount can be further improved as compared with the case of fig. 9 (a).

Even if the magnitude of the command value is changed in the 2 nd sub-stage 242, the amount of the resin material P supplied in the 2 nd sub-stage 242 is extremely small, and therefore, the distribution state of the resin material P remaining in the trough 12 can be ignored, and the next supply process of the resin material P can be ignored.

Fig. 9(C) shows an example of processing for shortening the time width of instruction output between the 1 st sub-stage 241 and the 2 nd sub-stage 242. In the above example, the control unit 100 makes the time width of the command value given to the trough feeder 13 in the 2 nd sub-step 242 shorter than the time width of the command value given to the trough feeder 13 in the 1 st sub-step 241. More specifically, in the 1 st sub-stage 241, a command value of a time width Td1 is output for each output period T1, and in the 2 nd sub-stage 242, a command value of a time width Td2 (< Td1) is output for each output period T1.

In the 1 st sub-stage 241, the resin material P is fed at a relatively high feed rate, whereby the time required for the entire process in the 2 nd sub-stage 202 can be shortened, and in the 2 nd sub-stage 242, the resin material P is fed at a relatively low feed rate, whereby the feed amount of the resin material P can be controlled with higher accuracy.

By adopting the 2 nd stage 202 including a plurality of sub-stages, the supply amount of the resin material P can be controlled with higher accuracy while suppressing an increase in the entire processing time required for the supply processing of the resin material P.

Fig. 9(a) to 9(C) show typical examples, and any method may be employed if the supply amount per unit time can be reduced as the actual value of the supply amount of the resin material P approaches the target amount. For example, in the 2 nd sub-stage 242 of the process shown in fig. 9(B), the output cycle may not be T2 but may be the same as the output cycle T1 of the 1 st sub-stage 241, and only the size Y2 of the command value having the time width Td may be smaller than the size Y1 of the command value of the 1 st sub-stage.

Fig. 10 is a flowchart showing an example of processing in stage 2 of the supply control method of the resin material P in the resin material supply device 10 according to the modification of the present embodiment. Typically, each step shown in fig. 10 is realized by the processor 110 of the control unit 100 executing the control program 128. Among the steps shown in fig. 10, steps that execute substantially the same processing as in fig. 7 are given the same step numbers.

Referring to fig. 10, the control unit 100 determines the magnitude of the command value used in the 2 nd stage 202 (step S11). Typically, in step S11, the size of the instruction value immediately before the 1 st stage 201 is ended may be determined as the size of the instruction value used in the 2 nd stage 202.

Then, the control portion 100 determines whether the supply amount of the resin material P reaches the target amount (step S12). If the supply amount of the resin material P does not reach the target amount (no in step S12), the control unit 100 determines whether or not the difference between the target amount and the supply amount of the resin material P is equal to or less than the adjustment start amount (step S15).

When the difference between the target amount and the supply amount of the resin material P is equal to or less than the adjustment start amount (yes in step S15), the control unit 100 changes at least one of the output cycle of the command output, the time width of the command output, and the magnitude of the command output so as to reduce the supply amount per unit time (step S16).

On the other hand, if the difference between the target amount and the supply amount of the resin material P is not equal to or less than the adjustment start amount (no in step S15), the process of step S16 is skipped.

The control unit 100 determines whether or not the output cycle of the command output set at present has come (step S13). If the output cycle of the command output set at present does not arrive (no in step S13), the process of step S13 is repeated.

When the output cycle of the command output set now arrives (yes in step S13), the control unit 100 outputs the command value of the magnitude set now over the time width set now (step S14). Then, the processing in step S12 is repeated.

On the other hand, when the supply amount of the resin material P reaches the target amount (yes in step S12), the process in the 2 nd stage 202 is ended.

< F. variation

The following modifications can be made to the above-described embodiment. The following modifications can be combined arbitrarily.

(f 1: variation of control of feed speed in stage 1 201)

In the above embodiment, the example of calculating the feeding speed of the resin material P in the 1 st stage 201 by the feedback control is shown, but a fixed command value may be output.

For example, the initial command value calculated after receiving the command to start the supply of the resin material P may be continuously output until the supply amount of the resin material P reaches the end determination value (see step S3 in fig. 5). For example, when the distribution state of the resin material P remaining in the trough 12 is stable, sufficient control performance can be obtained even when a fixed value is output as the command value.

(f 2: instruction value in stage 2 202)

In the above embodiment, as a method of intermittently supplying the resin material P, a method of outputting a command value having a pulse-like time waveform (that is, a rectangular wave) is exemplified, but the method is not limited to this, and a command value having a time waveform of a saw wave or a triangular wave, for example, may be output.

< G, attached notes >

The present embodiment includes the following technical ideas.

According to one embodiment, there is provided a powder and granular material supply device that moves a powder and granular material by vibrating a powder and granular material supply path in which the powder and granular material is present and supplies the powder and granular material to a supply target from an ejection port provided in the powder and granular material supply path. The powder and granular material supply device includes: a vibration unit configured to vibrate the powder/granular material supply path; a measuring unit for measuring the supply amount of the powder or granule to the supply object; and a control unit that controls the vibration of the vibration unit so that the supply amount becomes the specified target amount. The control unit controls the vibration unit to continuously supply the powder and/or granular material in a 1 st stage after the start of supply, and controls the vibration unit to intermittently supply the powder and/or granular material in a 2 nd stage after the 1 st stage.

The control unit may give a pulse-like command value to the vibration unit in the 2 nd stage.

The control unit may determine the magnitude of the command value in the 2 nd stage based on the magnitude of the command value given to the vibration unit in the 1 st stage.

The 2 nd stage may also include the 1 st sub-stage and a 2 nd sub-stage following the 1 st sub-stage. The control unit may control the vibration unit in the 1 st sub-stage and the 2 nd sub-stage so that the supply amount per unit time in the 2 nd sub-stage is smaller than the supply amount per unit time in the 1 st sub-stage.

The control unit may cause the period for giving the command value to the vibration unit in the 2 nd sub-stage to be longer than the period for giving the command value to the vibration unit in the 1 st sub-stage.

The control unit may be configured to set the magnitude of the command value given to the oscillating unit in the 2 nd sub-stage to be smaller than the magnitude of the command value given to the oscillating unit in the 1 st sub-stage.

A resin molding apparatus according to another embodiment includes: the powder and granular material supply device; and a compression molding unit for compression molding the granular resin material supplied from the granular material supply device.

According to still another embodiment, there is provided a powder and granular material supply method for supplying a predetermined target amount of powder and granular material to a supply target from an ejection port provided in a powder and granular material supply path while moving the powder and granular material by vibrating the powder and granular material supply path in which the powder and granular material is present. The powder/granular material supply method includes: vibrating a vibrating section associated with a powder/granular material supply path so as to continuously supply the powder/granular material in a 1 st stage after the start of supply; and a step of vibrating the vibrating section so as to intermittently supply the powder or granule until the supply amount of the powder or granule to the supply target reaches a target amount in a 2 nd stage after the 1 st stage.

The step of vibrating the vibrating portion in the 2 nd stage may include a step of giving a pulse-like command value to the vibrating portion.

The magnitude of the command value in the 2 nd stage may be determined based on the magnitude of the command value given to the vibrating portion in the 1 st stage.

The 2 nd stage may also include a 1 st sub-stage and a 2 nd sub-stage following the 1 st sub-stage. The step of vibrating the vibrating portion in the 2 nd sub-stage may include a step of controlling the vibrating portion in the 1 st sub-stage and the 2 nd sub-stage so that a supply amount per unit time in the 2 nd sub-stage is smaller than a supply amount per unit time in the 1 st sub-stage.

The period for giving the command value to the vibration portion in the 2 nd sub-stage may also be set longer than the period for giving the command value to the vibration portion in the 1 st sub-stage.

The magnitude of the command value given to the vibration unit in the 2 nd sub-stage may also be set smaller than the magnitude of the command value given to the vibration unit in the 1 st sub-stage.

A method of manufacturing a resin molded article according to still another embodiment includes: a step of the powder/granular material supply method; and a step of compression molding the supplied granular resin material.

< H. advantage >

The powder and granular material supply apparatus and the powder and granular material supply method according to the present embodiment employ the 1 st stage of controlling the vibration unit so as to continuously supply the powder and granular material, and the 2 nd stage of controlling the vibration unit so as to intermittently supply the powder and granular material. By adopting a plurality of stages in which the supply form of the powder or granule is different, the supply amount of the powder or granule can be controlled with higher accuracy.

In addition, in the case where a granular resin material is used as a typical example of the powder or granule supplied by the powder or granule supply apparatus and the powder or granule supply method according to the present embodiment, since it is possible to suppress variations in the weight of the resin material supplied in each supply operation and excessive or insufficient amounts with respect to the target amount, it is possible to achieve uniform thickness of the resin molded product.

Further, when the resin molded product is applied to sealing of electronic components, the thickness of the package can be made uniform even in a thin package.

Further, by dividing the 2 nd stage into a plurality of sub-stages and making the supply amount per unit time different, the control performance of the supply amount of the powder or granule can be further improved without extending the entire processing time required for the supply operation.

The embodiments of the present invention have been described, but the embodiments disclosed herein are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is shown by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.