阅读说明：本技术 可大幅度调节冷却能力的晶圆加热器 (Wafer heater capable of greatly adjusting cooling capacity ) 是由 游利 贾坤良 于 2021-07-19 设计创作，主要内容包括：本发明公开了可大幅度调节冷却能力的晶圆加热器,包括上板,上板内孔顶面嵌设有铠装加热管,上板中部设置有测温热电偶；所述上板内孔里从上向下依次设置有盖板、冷却板和支撑轴；支撑轴上轴肩A卡设在上板下端,下轴肩B端面均匀设置有多个导向块；冷却板包括冷却管安装板和石墨匀热层上盖,冷却管安装板内设置有冷却管路,石墨匀热层上盖内设置有石墨匀热层,冷却板中部均布有多个调节螺栓；调节螺栓向下穿过支撑轴内孔和导向块卡槽,多个调节螺栓由固定块固定。本发明结构巧妙合理,方便调节冷却板与加热管距离,适用于多种工艺环境,能大幅度调节晶圆加热器的冷却能力,有效提升了生产效率,大幅降低了成本,提高了使用寿命。(The invention discloses a wafer heater capable of greatly adjusting cooling capacity, which comprises an upper plate, wherein an armored heating pipe is embedded on the top surface of an inner hole of the upper plate, and a temperature thermocouple is arranged in the middle of the upper plate; a cover plate, a cooling plate and a support shaft are sequentially arranged in the inner hole of the upper plate from top to bottom; an upper shaft shoulder A of the supporting shaft is clamped at the lower end of the upper plate, and a plurality of guide blocks are uniformly arranged on the end face of a lower shaft shoulder B; the cooling plate comprises a cooling pipe mounting plate and a graphite uniform-heating layer upper cover, a cooling pipeline is arranged in the cooling pipe mounting plate, a graphite uniform-heating layer is arranged in the graphite uniform-heating layer upper cover, and a plurality of adjusting bolts are uniformly distributed in the middle of the cooling plate; the adjusting bolts downwards penetrate through the inner hole of the supporting shaft and the clamping grooves of the guide blocks, and the adjusting bolts are fixed by the fixing blocks. The wafer heater has the advantages of ingenious and reasonable structure, convenience in adjusting the distance between the cooling plate and the heating pipe, suitability for various process environments, capability of greatly adjusting the cooling capacity of the wafer heater, effective improvement of production efficiency, substantial reduction of cost and improvement of service life.)

1. Can adjust wafer heater of cooling capacity by a wide margin, including upper plate (1), its characterized in that: the top surface of the inner hole of the upper plate (1) is embedded with an armored heating pipe (4), and the middle part of the upper plate (1) is provided with a temperature thermocouple (6); a cover plate (5), a cooling plate (2) and a support shaft (3) are sequentially arranged in an inner hole of the upper plate (1) from top to bottom; an upper shaft shoulder A of the supporting shaft (3) is clamped at the lower end of the upper plate (1), and a plurality of guide blocks (3-4) are uniformly arranged on the end face of a lower shaft shoulder B; the cooling plate (2) comprises a cooling pipe mounting plate (2-5) and a graphite uniform heat layer upper cover (2-6), a cooling pipeline (2-1) is arranged in the cooling pipe mounting plate (2-5), and a graphite uniform heat layer lower cover (2-7), a graphite uniform heat layer (2-2) and a graphite uniform heat layer upper cover (2-6) are sequentially arranged on the top surface of the cooling pipe mounting plate (2-5) upwards; a plurality of adjusting bolts (2-3) are uniformly distributed at the bottom of the cooling pipe mounting plate (2-5); the adjusting bolts (2-3) downwards penetrate through the inner hole of the supporting shaft (3) and the clamping grooves of the guide blocks (3-4), and the adjusting bolts (2-3) are fixed by the fixing blocks (2-4).

2. The wafer heater with greatly adjustable cooling capacity of claim 1, wherein: the top surface of the upper plate (1) is uniformly provided with a plurality of small bosses (1-2) and air-homogenizing grooves (1-6), the bottom surface of the upper plate (1) is provided with an inner hole (1-8), the top surface of the inner hole (1-8) is provided with an installation groove (1-5) of an armored heating pipe (4), the opening surface of the inner hole (1-8) is provided with a stepped hole of an installation support shaft (3), the top surface of the inner hole of the upper plate (1) extends downwards to form a plurality of upright columns (1-7), top needle holes (1-4) are formed in the upright columns (1-7), and the top needle holes (1-4) extend to the top surfaces of the small bosses (1-2) towards the top surface of the upper plate (1).

3. The wafer heater with greatly adjustable cooling capacity of claim 1, wherein: two temperature measuring heads are arranged inside the temperature measuring thermocouple (6), and the distance between the top surface of the temperature measuring thermocouple (6) and the top surface of the upper plate (1) is 2-3 mm.

4. The wafer heater with greatly adjustable cooling capacity of claim 2, wherein: the depth of the inner hole (1-8) is 10-20 mm greater than the sum of the thicknesses of the cooling pipe mounting plate (2-5), the graphite uniform heating layer upper cover (2-6) and the cover plate (5).

5. The wafer heater with greatly adjustable cooling capacity of claim 1, wherein: the adjusting bolt (2-3) is connected with the cooling plate (2) through threads; waist-shaped clamping grooves for radially limiting the adjusting bolts (2-3) are arranged on the guide blocks (3-4).

6. The wafer heater with greatly adjustable cooling capacity of claim 1, wherein: the adjusting bolts (2-3), the fixing blocks (2-4) and the guide blocks (3-4) are in clearance fit.

7. The wafer heater with greatly adjustable cooling capacity of claim 1, wherein: the upper plate (1) and the support shaft (3) are welded by laser, and a nickel plating layer of 15-25 micrometers is arranged on the periphery of the upper plate (1) and the periphery of the support shaft (3).

8. The wafer heater with greatly adjustable cooling capacity of claim 1, wherein: the cooling pipe mounting plate (2-5) is made of stainless steel, the graphite uniform heat layer upper cover (2-6) is made of copper, and the cooling pipe mounting plate (2-5) is connected with the graphite uniform heat layer upper cover (2-6) through brazing.

9. The wafer heater with greatly adjustable cooling capacity of claim 2, wherein: the top surface of the upper plate (1) except the top surface of the small boss (1-2) is subjected to sand blasting treatment to Ra 3-5; the top surface of the small boss (1-2) is ground to ensure that the roughness Ra0.4 is less.

Technical Field

The invention relates to the field of semiconductor chip processing, in particular to a PECVD wafer heater capable of greatly adjusting cooling capacity.

Background

With the rapid development of semiconductor chip technology, the semiconductor foundry industry is competitive, semiconductor production equipment faces the challenge of various processes, the original equipment needs to be processed more advanced, a wafer factory needs lower cost competitive advantage, the existing equipment needs to meet the diversified customer process requirements, the diversified competition can be adapted, and the industry keeps ahead.

The (PECVD) wafer heater is a key device for processing semiconductor chips, plays a role in bearing and adsorbing wafers and providing heating, can continuously absorb heat in the process along with the increase of the power of a radio frequency process, causes the temperature of the wafer heater to continuously rise, cannot effectively adjust the cooling efficiency of the heater, prolongs the time for the heater to reach stable temperature, causes the reduction of the production efficiency of the semiconductor chips (IC) and seriously affects the product quality,

because the temperature of the wafer heater cannot be kept stable, the process is unstable, scrapping is difficult to prevent, an expensive heater also cannot adapt to a higher-level radio frequency process, complicated heater replacement operation needs to be carried out according to different processes, the heater is poor in universality and high in cost, and therefore an improvement method is needed to control the temperature of the wafer heater, the wafer heater is guaranteed not to be affected by the process with continuously improved power, heat generated by radio frequency is counteracted timely, IC production efficiency is improved, and cost is reduced.

For the above reasons, it is necessary to take Plasma Enhanced Chemical Vapor Deposition (PECVD) as a research object to research how to overcome the existing problems by design optimization with the improvement of process requirements.

Disclosure of Invention

The present invention has been made to solve the above problems, and an object of the present invention is to provide a wafer heater capable of greatly adjusting the cooling capacity.

In order to achieve the technical purpose and achieve the technical requirements, the invention adopts the technical scheme that: a wafer heater capable of greatly adjusting cooling capacity comprises an upper plate and is characterized in that: the top surface of the inner hole of the upper plate is embedded with an armored heating pipe, and the middle part of the upper plate is provided with a temperature thermocouple; a cover plate, a cooling plate and a support shaft are sequentially arranged in the inner hole of the upper plate from top to bottom; the upper shaft shoulder A of the supporting shaft is clamped at the lower end of the upper plate, and the end face of the lower shaft shoulder B is uniformly provided with a plurality of guide blocks; the cooling plate comprises a cooling pipe mounting plate and a graphite uniform-heat layer upper cover, a cooling pipeline is arranged in the cooling pipe mounting plate, and a graphite uniform-heat layer lower cover, a graphite uniform-heat layer and a graphite uniform-heat layer upper cover are sequentially arranged on the top surface of the cooling pipe mounting plate upwards; a plurality of adjusting bolts are uniformly distributed at the bottom of the cooling pipe mounting plate; the adjusting bolts downwards penetrate through the inner hole of the supporting shaft and the clamping grooves of the guide blocks, and the adjusting bolts are fixed by the fixing blocks.

Preferably: the utility model discloses an installation structure of armor heating pipe, including upper plate top surface, upper plate top surface equipartition has a plurality of little bosss and even gas slot, the upper plate bottom surface is provided with the hole, and the hole top surface is provided with the installation slot of armor heating pipe, and hole oral area is provided with the shoulder hole of installation back shaft, upper plate hole top surface downwardly extending has a plurality of stands, be provided with the thimble hole in the stand, the thimble hole extends to little boss top surface to the upper plate top surface.

Preferably: two temperature measuring heads are arranged in the temperature measuring thermocouple, and the distance between the top surface of the temperature measuring thermocouple and the top surface of the upper plate is 2-3 mm.

Preferably: the depth of the inner hole is 10-20 mm larger than the sum of the thicknesses of the cooling pipe mounting plate, the graphite uniform heating layer upper cover and the cover plate.

Preferably: the adjusting bolt is connected with the cooling plate through threads; and a waist-shaped clamping groove for radially limiting the adjusting bolt is arranged on the guide block.

Preferably: the adjusting bolt, the fixing block and the guide block are in clearance fit.

Preferably: the upper plate and the support shaft are welded by laser, and 15-25 micron nickel-plated layers are arranged on the peripheries of the upper plate and the support shaft.

Preferably: the cooling pipe mounting plate is made of stainless steel, the graphite uniform heating layer upper cover is made of copper, and the cooling pipe mounting plate is connected with the graphite uniform heating layer upper cover through brazing.

Preferably: the top surface of the upper plate 1 except the top surface of the small boss 1-2 is subjected to sand blasting treatment to Ra 3-5; and grinding the top surfaces of the small bosses 1-2 to ensure that the roughness is within Ra0.4.

The invention has the beneficial effects that:

1. the cooling plate is internally provided with an adjusting structure, so that the distance between the cooling plate and the heating pipe can be conveniently adjusted, the cooling plate is suitable for various process environments, the adjusting range is large, the cooling capacity of the wafer heater can be greatly adjusted, the production efficiency is effectively improved, and the cost is greatly reduced.

2. Two temperature measuring heads are arranged in the thermocouple and used for measuring temperature and monitoring temperature change, and the temperature of the wafer is controlled more accurately.

3. The top surface of the upper plate is provided with an air-homogenizing groove and a small boss, the air-homogenizing groove prevents the wafer from sliding in the process, the process stability is ensured, the small boss ensures that a certain gap is formed between the wafer and the upper plate, and the temperature uniformity of the surface of the wafer is improved; the surface of the small boss is ground, so that the roughness is within Ra0.4, and the wafer is prevented from being scratched; the top surface of the upper plate is subjected to sand blasting treatment to Ra3-5 except the top surface of the small boss, so that the heat radiation capability is improved, and the uniformity of the wafer is improved.

4. The nickel coating layer of 15~25 microns is provided with to upper plate and back shaft periphery, guarantees good corrosion-resistant and oxidation resistance, has improved life.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a top view of FIG. 1;

FIG. 3 is a front view of the upper plate of the present invention;

FIG. 4 is a rear view of the upper plate of the present invention;

FIG. 5 is a cross-sectional view taken along line B-B of FIG. 3;

FIG. 6 is a schematic diagram of a cooling plate structure according to the present invention;

FIG. 7 is a top view of FIG. 6;

FIG. 8 is an enlarged view taken at I in FIG. 6;

FIG. 9 is a schematic view of the construction of the support shaft according to the present invention;

FIG. 10 is a schematic top view of FIG. 9;

FIG. 11 is a bottom view of FIG. 9;

in the figure: 1. the structure comprises an upper plate, 1-1 parts of an upper plate main body, 1-2 parts of a small boss, 1-3 parts of a mounting hole, 1-4 parts of a thimble hole, 1-5 parts of a mounting groove, 1-6 parts of an air homogenizing groove, 1-7 parts of a stand column, 1-8 parts of an inner hole, 2 parts of a cooling plate, 2-1 parts of a cooling pipeline, 2-2 parts of a graphite heat homogenizing layer, 2-3 parts of an adjusting bolt, 2-4 parts of a fixing block, 2-5 parts of a cooling pipe mounting plate, 2-6 parts of a graphite heat homogenizing layer upper cover, 2-7 parts of a graphite heat homogenizing layer lower cover, 3 parts of a support shaft, 3-1 parts of a support shaft main body, 3-2 parts of a seal ring mounting groove, 3-3 parts of a seal ring locking threaded hole, 3-4 parts of a guide block and 4 parts of an armored heating pipe, 5. cover plate, 6, thermocouple.

Detailed Description

The invention will be further explained with reference to the drawings.

In the figure: can adjust wafer heater of cooling capacity by a wide margin, including upper plate 1, its characterized in that: the top surface of the inner hole of the upper plate 1 is embedded with an armored heating pipe 4, and the middle part of the upper plate 1 is provided with a temperature thermocouple 6; a cover plate 5, a cooling plate 2 and a support shaft 3 are sequentially arranged in an inner hole of the upper plate 1 from top to bottom; an upper shaft shoulder A of the supporting shaft 3 is clamped at the lower end of the upper plate 1, and a plurality of guide blocks 3-4 are uniformly arranged on the end face of a lower shaft shoulder B; the cooling plate 2 comprises a cooling pipe mounting plate 2-5 and a graphite uniform heating layer upper cover 2-6, a cooling pipeline 2-1 is arranged in the cooling pipe mounting plate 2-5, and a graphite uniform heating layer lower cover 2-7, a graphite uniform heating layer 2-2 and a graphite uniform heating layer upper cover 2-6 are sequentially arranged on the top surface of the cooling pipe mounting plate 2-5 upwards; a plurality of adjusting bolts 2-3 are uniformly distributed at the bottom of the cooling pipe mounting plate 2-5; the adjusting bolts 2-3 downwards penetrate through the inner hole of the supporting shaft 3 and the clamping grooves of the guide blocks 3-4, and the adjusting bolts 2-3 are fixed by the fixing blocks 2-4.

In the preferred embodiment, a plurality of small bosses 1-2 and air-homogenizing grooves 1-6 are uniformly distributed on the top surface of the upper plate 1, inner holes 1-8 are formed in the bottom surface of the upper plate 1, mounting grooves 1-5 of armored heating pipes 4 are formed in the top surfaces of the inner holes 1-8, stepped holes of mounting support shafts 3 are formed in the opening surfaces of the inner holes 1-8, a plurality of upright columns 1-7 extend downwards on the top surface of the inner hole of the upper plate 1, top pin holes 1-4 are formed in the upright columns 1-7, and the top pin holes 1-4 extend to the top surfaces of the small bosses 1-2 from the top surface of the upper plate 1.

In the preferred embodiment, two temperature measuring heads are arranged inside the temperature measuring thermocouple 6, and the distance between the top surface of the temperature measuring thermocouple 6 and the top surface of the upper plate 1 is 2-3 mm.

In the preferred embodiment, the depth of the inner hole 1-8 is 10-20 mm greater than the sum of the thicknesses of the cooling pipe mounting plate 2-5, the graphite uniform heat layer upper cover 2-6 and the cover plate 5.

In the preferred embodiment, the adjusting bolts 2-3 are connected with the cooling plate 2 through threads; and waist-shaped clamping grooves for radially limiting the adjusting bolts 2-3 are arranged on the guide blocks 3-4.

In the preferred embodiment, the adjusting bolt 2-3, the fixing block 2-4 and the guide block 3-4 are arranged in clearance fit.

In the preferred embodiment, the upper plate 1 and the support shaft 3 are welded by laser, and a nickel plating layer of 15-25 microns is arranged on the periphery of the upper plate 1 and the support shaft 3.

In the preferred embodiment, the cooling pipe mounting plate 2-5 is made of stainless steel, the graphite uniform heating layer upper cover 2-6 is made of copper, and the cooling pipe mounting plate 2-5 and the graphite uniform heating layer upper cover 2-6 are connected through brazing.

In the preferred embodiment, the top surface of the upper plate 1 except the top surface of the small boss 1-2 is subjected to sand blasting treatment to Ra 3-5; and grinding the top surfaces of the small bosses 1-2 to ensure that the roughness is within Ra0.4.

In the specific implementation, the armored heating pipe 4 with the approximate square cross section is embedded into the armored heating pipe installation grooves 1-5 of the wafer heater upper plate main body 1, a heating pipe cover plate 5 and a wafer heater upper plate main body 1 are welded together by using vacuum brazing, a cooling pipeline 2-1 is embedded in a cooling pipe mounting plate 2-5, a graphite uniform heat layer 2-2 is assembled between the cooling pipe mounting plate 2-5 and a graphite uniform heat layer upper cover 2-6 through welding, the graphite uniform heat layer upper cover 2-6 and a graphite uniform heat layer lower cover 2-7 are connected through laser welding, a combined adjusting bolt 2-3 on the cooling plate 2 is connected with a support shaft 3, the support shaft 3 is connected with the wafer heater upper plate main body 1 in a sealing mode through laser welding, and sealing vacuum is guaranteed through a sealing ring mounting groove 3-2 and a sealing ring.

The working principle, in the chip course of working, on the heat transfer to wafer heater upper plate main part 1 that is produced by the radio frequency, wafer heater temperature rises rapidly, adjust the distance of cooling plate 2 and armor heating pipe 4 through adjusting bolt 2-3 this moment, control the distance between its and armor heating pipe 4 through temperature thermocouple 6, under the effect of cooling plate 2, in time offset a large amount of heats that the radio frequency technology produced, wafer heater's temperature stability when guaranteeing the technology, use a wafer heater just can be competent at multiple process environment, need not to change the wafer heater that the price is expensive of different models, and adjust simply, effectively promoted production efficiency and guarantee the reduction by a wide margin of cost.

The above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, but not intended to limit the scope of the present invention, and all equivalent technical solutions also belong to the scope of the present invention, and the scope of the present invention should be defined by the claims.