阅读说明：本技术 模具监测红外传感器 (Die monitoring infrared sensor ) 是由 杨成 潘志祥 季阳 于 2021-09-16 设计创作，主要内容包括：本发明涉及模具加工技术领域的模具监测红外传感器,包括外壳、散热风扇、集成电路板、固定导流板、隔热垫片和外壳底板,集成电路板竖直固定安装在固定导流板的顶面,集成电路板包括主控模块、红外模块和通信串口模块,外壳的前端面开设有红外窗口,红外模块为红外处理PCB板,红外处理PCB板包括若干个红外接收管和红外发射头,实现模生产的智能计数功能,并实现数据的采集与实时传输实现监控模具生产的数据、定位信息、保密生产和设备稼动率的功能,同时可以将监控的数据上传至网络平台实时共享,实现智能物联网加工生产化。(The invention relates to a die monitoring infrared sensor in the technical field of die processing, which comprises a shell, a cooling fan, an integrated circuit board, a fixed guide plate, a heat insulation gasket and a shell bottom plate, wherein the integrated circuit board is vertically and fixedly installed on the top surface of the fixed guide plate and comprises a main control module, an infrared module and a communication serial port module, an infrared window is formed in the front end surface of the shell, the infrared module is an infrared processing PCB (printed circuit board), the infrared processing PCB comprises a plurality of infrared receiving tubes and infrared transmitting heads, the intelligent counting function of die production is realized, the functions of monitoring data, positioning information, confidential production and equipment utilization rate of die production are realized by data acquisition and real-time transmission, and simultaneously the monitored data can be uploaded to a network platform to be shared in real time, so that the processing and production of an intelligent internet of things are realized.)

1. Mould monitoring infrared sensor, its characterized in that: the mould monitoring infrared sensor comprises a shell, a cooling fan, an integrated circuit board, a fixed guide plate, a heat insulation gasket and a shell bottom plate, the fixed guide plate, the heat insulation gasket and the shell bottom plate are in butt joint combination through a first fixing mechanism, the integrated circuit board is vertically and fixedly installed on the top surface of the fixed guide plate, the shell and the fixed guide plate are in butt joint combination through a second fixing mechanism, the integrated circuit board comprises a main control module, an infrared module and a communication serial port module, an infrared window is formed in the front end face of the shell, the infrared module is an infrared processing PCB, and the infrared processing PCB comprises a plurality of infrared receiving tubes and an infrared transmitting head.

2. The mold monitoring infrared sensor of claim 1, wherein: the first fixing mechanism comprises a buckle platform, a first buckle groove and a second buckle groove, the buckle platform is located at four corners of the bottom plate of the shell, the first buckle groove is located at four corners corresponding to the heat insulation gasket, and the second buckle groove is located at four corners corresponding to the fixed guide plate.

3. The mold monitoring infrared sensor of claim 1, wherein: and a baffle is arranged in the middle of the fixed guide plate.

4. The mold monitoring infrared sensor of claim 1, wherein: the fixed guide plate is internally provided with an air guide groove, the cooling fan is positioned at the top of the air guide groove, the front end face of the fixed guide plate is provided with a first air outlet hole, and the first air outlet hole is communicated with the air guide groove.

5. The mold monitoring infrared sensor of claim 1, wherein: the two fixing mechanisms comprise positioning columns and positioning holes, the positioning columns are located at the tail parts of the fixed guide plates, and the positioning holes are located in the shell.

6. The mold monitoring infrared sensor of claim 1, wherein: the preceding terminal surface of shell is equipped with second exhaust wind hole, and the top surface of shell is equipped with pilot lamp, power source, a plurality of installation screw hole and air intake, and the air intake is located radiator fan's top.

7. The mold monitoring infrared sensor of claim 6, wherein: the both sides of shell bottom plate are equipped with and install the corresponding screw hole of screw hole, and fixed guide plate and thermal-insulated gasket all are equipped with and keep away the mouth with the corresponding screw of installation screw hole.

Technical Field

The invention relates to the technical field of die processing, in particular to a die monitoring infrared sensor.

Background

Injection molding is a method for producing and molding industrial products, wherein the products generally adopt rubber injection molding and plastic injection molding, and the injection molding can also be divided into injection molding and die casting methods, an injection molding machine (an injection machine or an injection molding machine for short) is a main molding device for manufacturing thermoplastic plastics or thermosetting materials into plastic products with various shapes by utilizing a plastic molding mold, and the injection molding is realized by the injection molding machine and the mold.

At present, the existing mold counter used in the industrial manufacturing industry is only a pure mechanical type. And the counting result needs to be acquired through manual acquisition, calculation and the like, and only a system can be manually input, so that errors are easy to occur, a large workload is occupied, real-time transmission cannot be realized, and the monitoring requirement of a user on mold production cannot be met.

Disclosure of Invention

The invention aims to solve the defects and provides the die monitoring infrared sensor.

In order to solve the technical problems, the invention adopts the following technical scheme:

the die monitoring infrared sensor comprises a shell, a cooling fan, an integrated circuit board, a fixed guide plate, a heat insulation gasket and a shell bottom plate, wherein the fixed guide plate, the heat insulation gasket and the shell bottom plate are in butt joint combination through a first fixing mechanism, the integrated circuit board is vertically and fixedly arranged on the top surface of the fixed guide plate, the shell and the fixed guide plate are in butt joint combination through a second fixing mechanism, the integrated circuit board comprises a main control module, an infrared module and a communication serial port module, an infrared window is arranged on the front end surface of the shell, the infrared module is an infrared processing PCB (printed circuit board), the infrared processing PCB comprises a plurality of infrared receiving tubes and infrared emitting heads, and the infrared emitting heads continuously emit infrared detection signals, in the process of opening and closing the die, the infrared signal of the infrared emission head can be reflected due to the blocking of the rear die, and the infrared receiving tube on the infrared processing PCB board can receive the reflected infrared signal. The infrared processing PCB board can pass the data received to host system module through integrated circuit board, host system receives the data that the infrared processing PCB board was passed from, judge the moving direction who blocks the object through the time of respectively receiving 3 infrared signal of reflection, receive the same transmission data that the mould opened and shut the mould and form of infrared signal time, the time is inconsistent and be interference data, judge the position that the mould was located through the concrete time of receiving infrared signal, thereby the state of analysis open and close mould, the time is more and more short, for the mould closes the mould, the time is more and more long, for the mould open mode state. The master control module records the state and time of each mold opening and closing and sends the recorded state and time to the 4G communication gateway through the communication serial module, and the 4G communication gateway uploads the data to the server for analysis and storage.

In the above description, as the preferred scheme, first fixed establishment includes buckle platform, first buckle groove and second buckle groove, and the buckle platform is located four corners of shell bottom plate, and first buckle groove is located four corners that heat insulating gasket corresponds, and second buckle groove is located four corners that fixed guide plate corresponds, and fixed guide plate, heat insulating gasket and shell bottom plate form stable structure through the butt joint combination of first fixed establishment, make the installation of fixed guide plate, heat insulating gasket and shell bottom plate rationally fix a position.

In the above description, as a preferred scheme, the middle part of the fixed guide plate is provided with a baffle plate, so that the integrated circuit board can avoid dust adhesion when the die monitors the heat dissipation of the infrared sensor.

In the above description, as a preferred scheme, an air guide groove is formed in the fixed guide plate, the heat dissipation fan is located at the top of the air guide groove, a first air outlet is formed in the front end face of the fixed guide plate, the first air outlet is communicated with the air guide groove, and the air guide groove in the fixed guide plate is cooled by the heat dissipation fan, so that the mold monitoring infrared sensor is kept in a stable working state.

In the above description, as a preferred scheme, the two fixing mechanisms include a positioning column and a positioning hole, the positioning column is located at the tail of the fixed deflector, and the positioning hole is located inside the outer shell, so that the outer shell and the fixed deflector form an internal structure which is reasonable and stable in installation.

Among the above-mentioned explanation, as preferred scheme, the preceding terminal surface of shell is equipped with second exhaust wind hole, and the top surface of shell is equipped with the pilot lamp, power source, a plurality of installation screw hole and air intake, and the air intake is located radiator fan's top, and the air intake makes mould monitoring infrared sensor's inner structure more penetrating with second exhaust wind hole, and the radiating effect is better, adopts the pilot lamp to make the audio-visual understanding mould monitoring infrared sensor's of user operating condition, judges whether mould monitoring infrared sensor breaks down.

In the above description, as a preferred scheme, threaded holes corresponding to the mounting screw holes are formed in two sides of the bottom plate of the housing, screw avoiding openings corresponding to the mounting screw holes are formed in the fixed guide plate and the heat insulating gasket, and the fixed guide plate and the heat insulating gasket are fixedly mounted with the matching grooves of the front mold of the mold through screws penetrating through the mounting screw holes, the screw avoiding openings and the threaded holes.

The beneficial effects produced by the invention are as follows:

the intelligent counting function of the die production is realized through infrared induction and an embedded software algorithm, the functions of monitoring the data, the positioning information, the confidential production and the equipment utilization rate of the die production are realized through data acquisition and real-time transmission, and meanwhile, the monitored data can be uploaded to a network platform to be shared in real time, so that the intelligent processing production of the Internet of things is realized.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is an exploded view of a first embodiment of the present invention;

FIG. 3 is an exploded view of a second embodiment of the present invention;

FIG. 4 is a schematic perspective view of an integrated circuit board according to the present invention;

FIG. 5 is an enlarged partial view of A in FIG. 4 according to the present invention;

FIG. 6 is a schematic view of the present invention assembled in a mold;

in the figure: 1 is the shell, 2 is radiator fan, 3 is integrated circuit board, 4 is fixed guide plate, 5 is thermal-insulated gasket, 6 is the shell bottom plate, 101 is power source, 102 is infrared window, 103 is the pilot lamp, 104 is the air intake, 105 is the installation screw hole, 106 is first exhaust vent, 201 is the baffle, 202 is the second exhaust vent, 203 is the reference column, 204 is the guide duct, 205 is first buckle groove, 301 keeps away the mouth for the screw, 302 is second buckle groove, 401 is the screw hole, 402 is the buckle platform, 7 is the infrared processing PCB board, 701 is the infrared receiver tube, 702 is the infrared emission head, 8 is main control module.

Detailed Description

In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention. The present invention is described in detail below with reference to the attached drawings.

Referring to fig. 1-6, the die monitoring infrared sensor embodied by the invention includes a housing 1, a heat dissipation fan 2, an integrated circuit board 3, a fixed guide plate 4, a heat insulation gasket 5 and a housing bottom plate 6, the fixed guide plate 4, the heat insulation gasket 5 and the housing bottom plate 6 are butt-jointed and combined by a first fixing mechanism, the integrated circuit board 3 is vertically and fixedly installed on the top surface of the fixed guide plate 4, the housing 1 and the fixed guide plate 4 are butt-jointed and combined by a second fixing mechanism, the integrated circuit board 3 includes a main control module 8, an infrared module and a communication serial port module, an infrared window 102 is opened on the front end surface of the housing 1, the infrared module is an infrared processing PCB board 7, the infrared processing PCB board 7 includes a plurality of infrared receiving tubes 701 and an infrared emitting head 702, the infrared emitting head 702 continuously emits infrared detection signals, and in the die opening and closing process of the die, the infrared detecting signals are blocked by the rear die, the infrared signal of the infrared transmitting head 702 will be reflected, and the reflected infrared signal will be received by the infrared receiving tube 701 on the infrared processing PCB board 7. The infrared processing PCB 7 can transmit the received data to the main control module 8 through the integrated circuit board 3, after the main control module 8 receives the data transmitted by the infrared processing PCB 7, the moving direction of a blocking object is judged by respectively receiving the time of 3 reflected infrared signals, the time of receiving the infrared signals is the same, the data is judged to be the transmitted data formed by opening and closing the die, the time is not the same, the data is interference data, the position of the die is judged by the specific time of receiving the infrared signals, and therefore the state of opening and closing the die is analyzed, the time is shorter and shorter, the time is longer and longer, and the state of opening and closing the die is the state of opening the die. The main control module 8 records the state and time of each mold opening and closing and sends the recorded state and time to the 4G communication gateway through the communication serial module, and the 4G communication gateway uploads the data to the server for analysis and storage.

First fixed establishment includes buckle platform 402, first buckle groove 205 and second buckle groove 302, buckle platform 402 is located four corners of shell bottom plate 6, first buckle groove 205 is located four corners that heat insulating gasket 5 corresponds, second buckle groove 302 is located four corners that fixed guide plate 4 corresponds, fixed guide plate 4, heat insulating gasket 5 and shell bottom plate 6 form stable structure through the butt joint combination of first fixed establishment, make the installation of fixed guide plate 4, heat insulating gasket 5 and shell bottom plate 6 reasonable location.

The middle part of the fixed guide plate 4 is provided with a baffle 201, so that the integrated circuit board 3 can avoid the attachment of dust when the die monitors the heat dissipation of the infrared sensor.

The inside of the fixed guide plate 4 is provided with an air guide groove 204, the heat dissipation fan 2 is positioned at the top of the air guide groove 204, the front end surface of the fixed guide plate 4 is provided with a first air outlet 106, the first air outlet 106 is communicated with the air guide groove 204, and the air guide groove 204 inside the fixed guide plate 4 is cooled by air through the heat dissipation fan 2, so that the die monitoring infrared sensor is kept in a stable working state.

The two fixing mechanisms comprise positioning columns 204 and positioning holes, the positioning columns 204 are positioned at the tail parts of the fixed guide plates 4, and the positioning holes are positioned in the shell 1, so that the shell 1 and the fixed guide plates 4 form an internal structure which is reasonable and stable in installation.

The preceding terminal surface of shell 1 is equipped with second exhaust vent 202, the top surface of shell 1 is equipped with pilot lamp 103, power source 101, a plurality of installation screw hole 105 and air intake 104, air intake 104 is located radiator fan 2's top, air intake 104 makes mould monitoring infrared sensor's inner structure more penetrating with second exhaust vent 202, the radiating effect is better, adopt pilot lamp 103 to make the audio-visual understanding mould monitoring infrared sensor's of user operating condition, judge whether mould monitoring infrared sensor breaks down.

The both sides of shell bottom plate 6 are equipped with the screw hole 401 corresponding with installation screw hole 105, and fixed guide plate 4 and thermal-insulated gasket 5 all are equipped with and keep away mouthful 301 with the corresponding screw of installation screw hole 105, keep away mouthful 301 and screw hole 401 and the pairing groove fixed mounting of the front mould of mould through the screw through installation screw hole 105, screw.

The mold monitoring infrared sensor is fixedly installed inside a matching groove of a front mold of the mold through screws, the infrared emission head 702 penetrates through the infrared window 102 to continuously emit infrared detection signals, in the mold opening and closing process of the mold, the infrared signals of the infrared emission head 702 can be reflected due to blocking of a rear mold, and the infrared receiving tube 701 on the infrared processing PCB 7 can receive the reflected infrared signals. The infrared processing PCB 7 can transmit the received data to the main control module 8 through the integrated circuit board 3, after the main control module 8 receives the data transmitted by the infrared processing PCB 7, the moving direction of a blocking object is judged by respectively receiving the time of 3 reflected infrared signals, the time of receiving the infrared signals is the same, the data is judged to be the transmitted data formed by opening and closing the die, the time is not the same, the data is interference data, the position of the die is judged by the specific time of receiving the infrared signals, and therefore the state of opening and closing the die is analyzed, the time is shorter and shorter, the time is longer and longer, and the state of opening and closing the die is the state of opening the die. The main control module 8 records the opening and closing state and time of each time and sends the opening and closing state and time to the 4G communication gateway through the communication serial module, the 4G communication gateway uploads the data to the server for analysis and storage, the external power supply supplies power to the mold monitoring infrared sensor through the power interface 101 for processing, and the cooling fan 2 sucks cold air through the air inlet 104 to penetrate through the air guide groove 204 to dissipate the heat of the mold monitoring infrared sensor.

Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.