阅读说明：本技术 基于机械声学的无线全集成柔性可拉伸人工喉及制备方法 (Wireless fully-integrated flexible stretchable artificial larynx based on mechanical acoustics and preparation method thereof ) 是由 高立波 王卫东 徐洪成 郑维昊 陆洋 于 2021-09-22 设计创作，主要内容包括：本发明公开了一种基于机械声学的无线全集成柔性可拉伸人工喉及制备方法,包括：底层弹性体制备、蛇形电极层和PI网络层刻蚀、转移覆有PI的蛇形电极层、制备隔离绝缘层、芯片层、被动器件层和蛇形电极层低温回流焊、顶层器件封装和导电凝胶电极制备与集成。通过蛇形网络电极阵列感应表皮微弱肌电信号实现对喉咙附近的神经信号进行分析,结合加速度传感器对声音、运动、呼吸、心率等机械振动实现捕获。解决医疗器件与人体不能完美集成的缺陷,保障人体信息采集不失真。(The invention discloses a wireless fully-integrated flexible stretchable artificial larynx based on mechanical acoustics and a preparation method thereof, wherein the method comprises the following steps: preparing a bottom layer elastomer, etching a snakelike electrode layer and a PI network layer, transferring the snakelike electrode layer coated with PI, preparing an isolation insulating layer, a chip layer, a passive device layer and the snakelike electrode layer, performing low-temperature reflow soldering, packaging a top layer device, and preparing and integrating a conductive gel electrode. The neural signals near the throat are analyzed by sensing the weak skin electromyographic signals through the snake-shaped network electrode array, and the acceleration sensor is combined to capture mechanical vibration such as sound, motion, respiration and heart rate. The defect that medical devices and human bodies cannot be integrated perfectly is overcome, and human body information acquisition is guaranteed not to be distorted.)

1. A preparation method of a wireless fully-integrated flexible stretchable artificial larynx based on mechanical acoustics is characterized by comprising the following steps:

s1, bottom layer elastomer preparation:

pretreating a glass slide, preparing a silica gel elastomer, spin-coating the silica gel elastomer on the glass slide, and curing a silica gel film to obtain a bottom layer elastomer;

s2, etching the snake-shaped electrode layer and the PI network layer:

preparing a PDMS mixture, and spin-coating the PDMS mixture on a clean glass slide;

removing bubbles by vacuum filtration, and heating the PDMS film at constant temperature for curing to obtain the glass slide coated with the PDMS film;

spin-coating a PI solution on the clean copper foil to obtain a copper foil coated with PI;

fixing the PI-attached copper foil on a PDMS film of the prepared glass slide, and hot-stamping the PI-attached copper foil;

placing the PDMS film for fixing the copper foil under ultraviolet light for curing;

placing the glass slide with the fixed PI copper foil under an ultraviolet laser, performing circular cutting, laser etching and residue stripping according to the designed structure profile to obtain a snake-shaped electrode layer with a PI network layer coated on the surface;

s3, transfer of PI coated serpentine electrode layer:

adhering the snakelike electrode layer coated with the PI network layer by using a water-soluble adhesive tape, adhering one surface of the transferred snakelike electrode layer coated with the PI and the adhesive tape to the bottom layer elastomer, and irradiating under ultraviolet light; after soaking in deionized water, washing the conductive structure on the surface of the silica gel elastomer, and drying to obtain a PI snake-shaped electrode layer bonded on the silica gel elastomer;

s4, preparing an isolation insulating layer:

etching a PET (polyethylene terephthalate) mask plate at the bottom of each chip in the chip layer, aligning and attaching the etched PET mask plate with the snake-shaped electrode, coating a layer of silica gel elastomer on the surface of the PET, peeling off the PET mask plate, and curing at normal temperature to obtain an isolation insulating layer;

s5, low-temperature reflow soldering of the chip layer, the passive device layer and the snake-shaped electrode layer:

etching the snakelike electrode layer by using ultraviolet laser to form a metal screen plate with a hollow structure, placing chips of the chip layer and the passive device layer at corresponding pin positions, and heating and curing to obtain a flexible circuit welded with the chip layer and the passive device layer;

s6, packaging the top-level device:

carrying out plasma treatment on the flexible circuit, adhering water soluble adhesive tapes with the same area at the electrode, pouring the flexible circuit by using a bottom layer elastomer, and curing at normal temperature to obtain a top layer packaging device;

s7, preparing and integrating a conductive gel electrode:

stripping the water-soluble adhesive tape at the electromyographic signal acquisition electrode to form a hollowed-out electrode; and filling the hollow electrode with hydrogel liquid, and curing under ultraviolet light to obtain the flexible stretchable artificial larynx with the conductive gel electrode.

2. The preparation method of the wireless fully-integrated flexible stretchable artificial larynx based on the mechanical acoustics is characterized in that the Ecoflex 00-30A and the B glue are mixed according to the mass ratio of (0.5-1.5): 1 by the silica gel elastomer; spin-coating at a rotation speed of 300-1000 r/min for 10-30 s.

3. The preparation method of the wireless fully-integrated flexible stretchable artificial larynx based on the mechanical acoustics is characterized in that the PDMS mixture is mixed with the silicone elastomer curing agent according to the mass ratio of (10-20): 1.

4. The preparation method of the fully integrated wireless flexible stretchable artificial larynx based on the mechanical acoustics is characterized in that the step S2 is that a glass slide coated with PDMS is rotated on a spin coater at a rotating speed of 500-1000 r/min for 10-30S;

heating for 1-3 h at the temperature of 60-110 ℃ to cure the PDMS film;

spin-coating PI solution, and rotating at 2000-4000 r/min for 10-30 s;

the copper foil with the PI is hot-pressed for 0.5-2 h at the pressure of 10-30N and the temperature of 80-150 ℃, and is fixed on the PDMS film of the glass slide;

curing for 10-30 min under the condition of 10-30W of ultraviolet light power;

and carrying out 5-20 times of circular cutting when the power of the ultraviolet light reaches 3-5W and the cutting speed is 100-600 mm/min.

5. The preparation method of the wireless fully-integrated flexible stretchable artificial larynx according to the mechanical-acoustic-based claim 1, wherein in the step S3, the snake-shaped electrode layer coated with the PI is adhered to the silicone membrane after being irradiated for 10-30 min under the power condition of 5-20W of ultraviolet light.

6. The preparation method of the wireless fully integrated flexible stretchable artificial larynx based on the mechanical acoustics is characterized in that in the step S5, the heating temperature for heating, curing and heating is 140-210 ℃, and the heating time is 5-15 min.

7. The preparation method of the wireless fully integrated flexible stretchable artificial larynx based on the mechanical acoustics is characterized in that in the step S6, the flexible circuit is processed by plasma with the power of 60-100W and the processing time is 3-6 min.

8. The method for preparing a wireless fully integrated flexible stretchable artificial larynx according to the mechanical acoustics is characterized in that in the step S7, 2-ketoglutaric acid, acrylamide, lithium chloride, dimethyl-trisulfopropyl ammonium hydroxide and ionized water are mixed according to the mass ratio of 1 (5-3) (200-600) (1500-2500) (3000-4000) to prepare the hydrogel liquid.

9. The preparation method of the wireless fully integrated flexible stretchable artificial larynx based on the mechano-acoustic technology according to the claim 1, characterized in that in the step S7, the artificial larynx is cured for 2-5 h under the power condition of 10-30W ultraviolet light.

10. The wireless fully-integrated flexible stretchable artificial larynx based on the mechanical acoustics prepared by the method of any one of claims 1 to 9, is characterized by comprising a top layer elastomer, a bottom layer elastomer, a conductive gel electrode, a chip layer, a passive device layer, an isolation insulating layer, a snake-shaped electrode layer and a polyimide PI network layer, wherein the PI network layer and the snake-shaped electrode layer are bonded on the bottom layer elastomer, the isolation insulating layer, the passive device layer and the chip layer are printed on the snake-shaped electrode layer, and the top layer elastomer and the conductive gel electrode are packaged above the welded chip layer and the passive device layer;

in the chip layer, power management chip, acceleration sensor chip, BLE bluetooth transmission module, low-power consumption crystal oscillator and flesh electrical signal acquisition chip are connected respectively to the master control MCU chip, and lithium cell, master control MCU chip, acceleration sensor chip, BLE bluetooth transmission module and flesh electrical signal acquisition chip are connected respectively to the power management chip.

Technical Field

The invention relates to a method for preparing a vibration of the root of a human throat, skin electromyographic signal acquisition and a wireless fully-integrated flexible stretchable device, belonging to the technical field of front-edge crossed manufacturing of flexible electronics and medical instruments.

Background

The human throat can provide abundant human body sign information under the vibration of skeletal muscles and rib bones of the chest, and the human body sign information mainly comprises sound vibration, skin electromyographic signals, heart impact and respiration. The vital vibration signals with the frequency within 0.1-1000 Hz are beneficial to describing the dynamic characteristics and physiological characteristics of a human body, and have profound scientific significance in the aspects of biological information monitoring of clinical medical treatment, sports physical sign health, family medical care and the like. However, the currently developed biomedical professional devices are difficult to capture stable vital signs from human throat, mainly because the throat structure is composed of a support with a cartilage structure and a muscle group, the structure is complex, the muscle activity frequency is high, the installation of the sensing device is difficult, and the signal-to-noise ratio is too low, thereby causing the problem of difficult device monitoring. In recent years, the frequent occurrence of throat diseases caused by environmental problems is limited by limited medical resources and high cost, and conventionally, the mode of performing communication diagnosis between a hospital and a face has failed to satisfy the rapidly increasing requirements for health and health care in terms of time and resource utilization, so that the portable equipment for home health care becomes particularly important.

Based on the above two points, there is an urgent need for a non-invasive, fully flexible, multifunctional monitoring device convenient to integrate with human throat to monitor human body physical sign information in real time, solve the defect that medical devices and human body can not be perfectly integrated, ensure that human body information acquisition is not distorted, and provide a new idea for next-generation medical treatment and health development.

Disclosure of Invention

In order to solve the defects in the prior art, the invention aims to solve the defects in the prior art and provide a wireless fully-integrated flexible stretchable artificial larynx based on mechanical acoustics and a preparation method thereof.

The invention is realized by the following technical scheme.

The invention provides a preparation method of a wireless fully-integrated flexible stretchable artificial larynx based on mechanical acoustics, which comprises the following steps of:

s1, bottom layer elastomer preparation:

pretreating a glass slide, preparing a silica gel elastomer, spin-coating the silica gel elastomer on the glass slide, and curing a silica gel film to obtain a bottom layer elastomer;

s2, etching the snake-shaped electrode layer and the PI network layer:

preparing a PDMS mixture, and spin-coating the PDMS mixture on a clean glass slide;

removing bubbles by vacuum filtration, and heating the PDMS film at constant temperature for curing to obtain the glass slide coated with the PDMS film;

spin-coating a PI solution on the clean copper foil to obtain a copper foil coated with PI;

fixing the PI-attached copper foil on a PDMS film of the prepared glass slide, and hot-stamping the PI-attached copper foil;

placing the PDMS film for fixing the copper foil under ultraviolet light for curing;

placing the glass slide with the fixed PI copper foil under an ultraviolet laser, performing circular cutting, laser etching and residue stripping according to the designed structure profile to obtain a snake-shaped electrode layer with a PI network layer coated on the surface;

s3, transfer of PI coated serpentine electrode layer:

adhering the snakelike electrode layer coated with the PI network layer by using a water-soluble adhesive tape, adhering one surface of the transferred snakelike electrode layer coated with the PI and the adhesive tape to the bottom layer elastomer, and irradiating under ultraviolet light; after soaking in deionized water, washing the conductive structure on the surface of the silica gel elastomer, and drying to obtain a PI snake-shaped electrode layer bonded on the silica gel elastomer;

s4, preparing an isolation insulating layer:

etching a PET (polyethylene terephthalate) mask plate at the bottom of each chip in the chip layer, aligning and attaching the etched PET mask plate with the snake-shaped electrode, coating a layer of silica gel elastomer on the surface of the PET, peeling off the PET mask plate, and curing at normal temperature to obtain an isolation insulating layer;

s5, low-temperature reflow soldering of the chip layer, the passive device layer and the snake-shaped electrode layer:

etching the snakelike electrode layer by using ultraviolet laser to form a metal screen plate with a hollow structure, placing chips of the chip layer and the passive device layer at corresponding pin positions, and heating and curing to obtain a flexible circuit welded with the chip layer and the passive device layer;

s6, packaging the top-level device:

carrying out plasma treatment on the flexible circuit, pouring the flexible circuit by utilizing a bottom layer elastomer, and curing at normal temperature to obtain a top layer packaging device;

s7, preparing and integrating a conductive gel electrode:

stripping the water-soluble adhesive tape at the electromyographic signal acquisition electrode to form a hollowed-out electrode; and filling the hollow electrode with hydrogel liquid, and curing under ultraviolet light to obtain the flexible stretchable artificial larynx with the conductive gel electrode.

Preferably, the Ecoflex 00-30A and the B glue are mixed according to the mass ratio of (0.5-1.5): 1 for the silica gel elastomer; spin-coating at a rotation speed of 300-1000 r/min for 10-30 s.

Preferably, the PDMS mixture is mixed with the silicone elastomer curing agent according to the mass ratio of (10-20): 1.

Preferably, in step S2, the glass slide coated with PDMS is rotated on a spin coater at a rotation speed of 500-1000 r/min for 10-30S;

heating for 1-3 h at the temperature of 60-110 ℃ to cure the PDMS film;

spin-coating PI solution, and rotating at 2000-4000 r/min for 10-30 s;

the copper foil with the PI is hot-pressed for 0.5-2 h at the pressure of 10-30N and the temperature of 80-150 ℃, and is fixed on the PDMS film of the glass slide;

curing for 10-30 min under the condition of 10-30W of ultraviolet light power;

and carrying out 5-20 times of circular cutting when the power of the ultraviolet light reaches 3-5W and the cutting speed is 100-600 mm/min.

Preferably, in step S3, the serpentine electrode layer coated with the PI is adhered to the silicone membrane by irradiating with ultraviolet light at a power of 5 to 20W for 10 to 30 min.

Preferably, in step S5, the heating temperature for heating and curing is 140-210 ℃, and the heating time is 5-15 min.

Preferably, in step S6, the flexible circuit plasma processing is performed with a power of 60-100W and a processing time of 3-6 min.

Preferably, in step S7, the hydrogel liquid is prepared by mixing 2-ketoglutaric acid, acrylamide, lithium chloride, dimethyl-trisulfopropyl ammonium hydroxide and ionized water according to the mass ratio of 1 (5-3) (200-600) (1500-2500) (3000-4000).

Preferably, in step S7, curing is carried out for 2-5 hours under the condition of 10-30W of ultraviolet light power.

The invention also provides a wireless fully-integrated flexible stretchable artificial larynx prepared by the method, which comprises a top layer elastomer, a bottom layer elastomer, a conductive gel electrode, a chip layer, a passive device layer, an isolation insulating layer, a snake-shaped electrode layer and a polyimide PI network layer, wherein the PI network layer and the snake-shaped electrode layer are bonded on the bottom layer elastomer, the isolation insulating layer, the passive device layer and the chip layer are printed on the snake-shaped electrode layer, and the top layer elastomer and the conductive gel electrode are packaged above the welded chip layer and the passive device layer;

in the chip layer, power management chip, acceleration sensor chip, BLE bluetooth transmission module, low-power consumption crystal oscillator and flesh electrical signal acquisition chip are connected respectively to the master control MCU chip, and lithium cell, master control MCU chip, acceleration sensor chip, BLE bluetooth transmission module and flesh electrical signal acquisition chip are connected respectively to the power management chip.

Due to the adoption of the technical scheme, the invention has the following beneficial effects:

the wireless integrated flexible stretchable artificial larynx based on mechanical acoustics can capture various physiological and motion information of a human body, the full-stretching electrode design and the integrated flexible stretchable circuit design are favorable for improving the conformal, integration and deformation capabilities of a device and the human body under the condition of no assistance of any extra auxiliary, the perfect fit of the device and the human body is favorable for the acquisition capability of the device on wide response signals of the human body, and the wireless integrated flexible stretchable artificial larynx can be used for realizing heartbeat at a low vibration amplitude to high-frequency sound vibration.

The design method of the stretchable circuit can be applied to the design and preparation of a full-flexible integrated electronic circuit, the stretchable conductive network is prepared through micro-vector nanosecond laser engraving and unbound transfer printing, the stretchable conductive network is combined with a flexible substrate compatible with the skin modulus of a human body, the adhesion of a micro-control chip and a conductive structure is realized by using a hybrid integration manufacturing process such as reflow soldering and the like, the full integration and flexible packaging of an integral device are realized by means of integrated packaging of molding, and a new method is provided for a next-generation integrated flexible circuit.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention:

fig. 1 is an explosion schematic diagram of a wireless fully integrated flexible stretchable artificial larynx structure of the present invention.

Fig. 2 is a schematic diagram of a planar electrical design of a wireless fully integrated flexible stretchable artificial larynx.

FIG. 3 is a flow chart of the key flexible circuit manufacturing process for the stretchable artificial larynx of the present invention.

Detailed Description

The present invention will now be described in detail with reference to the drawings and specific embodiments, wherein the exemplary embodiments and descriptions of the present invention are provided to explain the present invention without limiting the invention thereto.

Referring to fig. 1, the wireless fully integrated flexible stretchable artificial throat based on mechanical acoustics provided by the embodiment of the present invention includes a top layer elastic body 1, a bottom layer elastic body 8, a conductive gel electrode 2, a chip layer 3, a passive device layer 4, an isolation insulating layer 5, a serpentine electrode layer 6, and a Polyimide (PI) network layer 7, where the PI network layer 7 and the serpentine electrode layer 6 are bonded on the bottom layer elastic body 8, the isolation insulating layer 5, the passive device layer 4, and the chip layer 3 are printed on the serpentine electrode layer 6, and the top layer elastic body 1 and the conductive gel electrode 2 are packaged above the chip layer 3 and the passive device layer 4 after being welded.

The passive device layer 4 includes a capacitor, a resistor, an inductor, and a polar diode.

The serpentine electrode layer 6 comprises myoelectric electrodes 61 and serpentine wires 62.

Referring to fig. 2, the chip layer 3 includes a lithium battery 31, a power management chip 32, a main control MCU chip 33, an acceleration sensor chip 34, a BLE bluetooth transmission module 35, a low power consumption crystal oscillator 36, and an electromyographic signal acquisition chip 37.

In this embodiment, a 3.7V lithium battery is used; the power management chip adopts a 3.7-to-3.3V chip; the main control MCU chip adopts an Atmega328P-AU chip; the acceleration sensor chip adopts an ADXL345 chip; the Bluetooth transmission module adopts a PW02 model, and the low-power crystal oscillator is an 8MHz crystal oscillator; the electromyographic signal acquisition chip adopts a BMD101 chip.

The main control MCU chip 33 is respectively connected with the power management chip 32, the acceleration sensor chip 34, the BLE Bluetooth transmission module 35, the low-power crystal oscillator 36 and the electromyographic signal acquisition chip 37, and the power management chip 32 is respectively connected with the lithium battery 31, the main control MCU chip 33, the acceleration sensor chip 34, the BLE Bluetooth transmission module 35 and the electromyographic signal acquisition chip 37.

The battery 31 inputs 3,7V voltage, and the power management chip 32 conditions the voltage into 3.3V output voltage, and the output voltage is sent to the main control MCU chip 33, the acceleration sensor chip 34, the Bluetooth transmission module 35 and the electromyogram signal acquisition chip 37; the low-power-consumption crystal oscillator 36 provides an oscillation starting waveform of 8MHz to the main control MCU chip 33; the acceleration collected by the acceleration sensor chip 34 and the myoelectric signal collected by the myoelectric signal collecting chip 37 are transmitted to the main control MCU chip 33 for processing; the main control MCU chip 33 transmits the processed digital signals to the Bluetooth transmission module 35, thereby realizing the communication with the outside.

In the embodiment, the top layer elastic body 1 and the bottom layer elastic body 8 adopt American Ecoflex 00-30 silica gel as the stretchable elastic body, and the ultralow Young modulus (60kPa) ensures the perfect matching of the modulus of the flexible substrate and the human skin. Selecting a copper foil with the thickness of 10-20 microns as a substrate of a snake-shaped electrode layer 6 for laser selective etching, and spin-coating a PI network layer 7 with the thickness of 2-4 microns on one side of the copper foil as an inducing layer for adhesion excitation of a conductive substrate and a silica gel elastomer; selecting low-temperature reflow soldering paste with the soldering temperature of only 138 degrees as soldering auxiliary materials of the snake-shaped electrode layer 6 and the chip and passive device layer 4; the transparent hydrogel conductor matrix disposed in a mixed manner is used as a conductor for the myoelectric electrode 61 to contact the skin.

Referring to fig. 1-3, in one embodiment, a wireless fully integrated flexible stretchable artificial larynx based on mechanical acoustics and a preparation method thereof comprises the following steps:

step 1, preparing a bottom layer elastomer:

washing a block of 6X 6cm with alcohol and deionized water respectively²Carrying out hot air blow drying for later use after 1-5 min; mixing Ecoflex 00-30A and B glue, preparing 10-30 g of silica gel elastomer by the mass fraction of (0.5-1.5) to 1, and stirring for 3-5 min by a glass rod until the materials are fully mixed; fixing the glass slide on a spin coater, inverting the prepared silica gel elastomer on the glass slide, and spin-coating for 10-30 s at the rotating speed of 300-1000 r/min; and then placing the spin-coated silica gel elastomer film in a normal temperature state for 0.5-2 h, so that the silica gel film is cured to obtain a bottom layer elastomer 8.

Step 2, etching the snake-shaped electrode layer and the PI network layer:

1) preparing Polydimethylsiloxane (PDMS) and a silica gel elastomer curing agent according to a mass ratio of (10-20): 1, and fully stirring for 3-8 min by using a glass rod;

2) another block is 6 x 6cm in size²Cleaning and blow-drying the glass slide according to the method in the step 1, uniformly coating a proper amount of PDMS mixed material on the glass slide, and then placing the glass slide coated with PDMS on a spin coater to rotate at a rotating speed of 500-1000 r/min for 10-30 s.

3) Taking the glass slide coated with the PDMS out of the spin coater, and placing the glass slide in a vacuum suction filter to remove air bubbles in the PDMS film; after the extraction is finished, placing the glass slide on a constant-temperature heating table, heating the glass slide for 1-3 hours at the temperature of 60-110 ℃ to solidify the PDMS film to obtain the glass slide coated with the PDMS film, and performing spin coating on PDMS in the step a shown in FIG. 3;

4) washing a 6X 6cm piece with alcohol²Carrying out spin coating on a copper foil with the thickness of 10-20 microns by using a spin coater to form a PI solution on one side of the copper foil, and rotating at the rotating speed of 2000-4000 r/min for 10-30 s to obtain a copper foil coated with PI;

5) fixing the copper foil attached with the PI on the PDMS film of the glass slide prepared in the step 3) by using a hot stamping machine under the conditions of 10-30N pressure and heating to 80-150 ℃ to 0.5-2 h, wherein the PI-coated copper foil is covered by hot stamping in the step b shown in figure 3;

6) curing the PDMS film with the fixed copper foil for 10-30 min under the condition of 10-30W of ultraviolet light power, and further enhancing the adhesion between the copper foil and the PDMS film;

7) and (3) placing the glass slide with the fixed PI copper foil under a 355nm ultraviolet laser B, inputting a pre-designed structural profile A, and performing 5-20 times of circular cutting by adjusting the power of the ultraviolet light to 3-5W and the cutting speed to 100-600 mm/min, as shown in step c of FIG. 3, and performing laser etching. And (e) after the cutting of the whole contour is finished, peeling off the residual copper foil by using a pair of tweezers, cleaning the residual copper foil on the surface of the PDMS, dipping a dust-free cotton swab into alcohol to clean the residual oxide on the edge of the conductive network by laser etching, and peeling off the residue in the step d shown in figure 3. And then obtaining a pre-designed snake-shaped electrode layer 6 (a snake-shaped electrode layer 6 coated with PI) with the surface coated with a PI network layer 7.

Step 3, transferring the serpentine electrode layer 6 covered with PI:

next, a 5X 6cm block was prepared²The water-soluble adhesive tape C of AQUASOL corporation, large in size, was peeled off from the protective paper on one side of the tape, and the PI-coated serpentine electrode layer 6 was completely prepared by removing the adhesive from the side of the tape and transferred to a hydrosol tape, as shown in step e of fig. 3, and the PI-coated serpentine electrode layer 6 was transferred. Then adhering one side of the transferred surface covered with the PI snakelike electrode layer 6 and the adhesive tape to the bottom layer elastic body 8 prepared in the step 1, wherein in the step f shown in figure 3, the water soluble adhesive tape C is adhered; and then irradiating for 10-30 min under the condition of 5-20W of ultraviolet light power to promote the adhesion of the PI and the silicon membrane. Then carrying the hydrosolAnd (3) soaking the silica gel elastomer in deionized water for 2-5 hours until the water-soluble adhesive tape C is completely dissolved by the deionized water, wherein the water-soluble adhesive tape C is dissolved in step g in figure 3. And then washing the conductive structure on the surface of the silica gel elastomer for 5-20 min by using deionized water, and blow-drying residual moisture around the whole conductive structure by using hot air so as to obtain the PI snake-shaped electrode layer 6 which is bonded on the silica gel elastomer 8 and is covered.

Step 4, preparing an isolation insulating layer:

respectively etching a rectangular opening with corresponding size at the bottom of each chip of the chip layer 3 and the conductive network at the position where short circuit easily occurs by using a 355nm ultraviolet laser B to form a PET mask plate, wherein the size of the etched PET film is 5 multiplied by 6cm²And (3) aligning and attaching the etched PET mask plate and the snake-shaped electrode 6 bonded in the step (3) to each other, then coating a layer of silica gel elastomer identical to the bottom layer elastomer 8 on the surface of the PET, peeling off the PET mask plate, and curing for 0.2-1 h at normal temperature to obtain the isolation insulating layer 5.

And 5, carrying out low-temperature reflow soldering on the chip layer 3, the passive device layer 4 and the snake-shaped electrode layer 6:

according to the prepared S-shaped electrode layer 6, a 355nm ultraviolet laser B is used for etching a metal steel plate corresponding to the welding position of the S-shaped lead 62 to form a metal screen plate with a hollow structure, and the size of the metal screen plate is 5 multiplied by 6cm²Aligning the metal screen plate etched with the mesh holes with a snake-shaped lead 62, sticking the metal screen plate by utilizing the Van der Waals force of the spare silica gel which is prepared in the step 3 and is not stuck with the snake-shaped electrode layer 6, brushing a layer of soldering flux on the surface of the metal screen plate by using a brush, coating a proper amount of low-temperature reflow soldering paste, leveling by using a scraping plate to place the soldering paste at each welding position, stripping the metal screen plate, placing the chips of the chip layer 3 and the passive device layer 4 at the corresponding pin positions, placing the whole glass plate with the chip layer 3 and the passive device layer 4 in an oven, heating at the temperature of 140-210 ℃ for 5-15 min, and taking out after all welding positions are solidified to obtain the flexible circuit welded with the chip layer 3 and the passive device layer 4.

Step 6, packaging a top-layer device:

placing the completely welded circuit in a plasma treatment furnace, treating for 3-6 min at the power of 60-100W, removing hydrophobic groups on the surface, then placing the completely welded circuit in a rectangular metal mold printed in advance, attaching a layer of water-soluble adhesive tape C with the corresponding size to the surface of the stretchable electromyographic electrode to prevent the silicon gel from breaking the electromyographic signal acquisition electrode 61, pouring the flexible circuit placed in the metal mold by using the prepared bottom layer elastomer 8, and curing for 1-3 h at normal temperature to obtain the packaged packaging device comprising the top layer elastomer 1.

And 7, preparing and integrating a conductive gel electrode:

the water-soluble adhesive tape C on which the electromyographic signal acquisition electrode 61 is placed is peeled off by forceps to form a square hollow. Then, mixing 50-200 mg of 2-ketoglutaric acid, acrylamide, lithium chloride, dimethyl-trisulfopropyl ammonium hydroxide and ionized water according to the mass fraction ratio of 1 (5-3) (200-600) (1500-2500) (3000-4000), fully stirring for 2-4 h, filling the hollow part of the position of the upper electromyographic signal acquisition electrode 61 with the obtained hydrogel liquid by using a dropper, and then curing for 2-5 h under the condition of 10-30W of ultraviolet light power to obtain the flexible stretchable artificial larynx with the conductive gel electrode 2.

The preparation process according to the invention is further illustrated by the following specific examples.

Example 1

S1, bottom layer elastomer preparation:

preprocessing a glass slide, mixing Ecoflex 00-30A and B glue according to the mass ratio of 0.5:1 to prepare a silica gel elastomer, spin-coating the silica gel elastomer on the glass slide at the rotating speed of 20s at 800r/min, and curing a silica gel film to obtain a bottom layer elastomer.

S2, etching the snake-shaped electrode layer and the PI network layer:

mixing polydimethylsiloxane PDMS and a silica gel elastomer curing agent according to a mass ratio of 15:1 to prepare a PDMS mixture, and spin-coating the PDMS mixture on a clean glass slide at a rotating speed of 1000r/min for 20 s;

removing bubbles by vacuum filtration, heating at the constant temperature of 90 ℃ for 2h, and curing the PDMS film to obtain the glass slide coated with the PDMS film; rotating the cleaned copper foil for 30s at the rotating speed of 2000r/min, and spin-coating a PI solution to obtain a copper foil coated with PI; fixing the copper foil with PI on a PDMS film of the prepared glass slide, and hot-stamping the glass slide with the PI-coated copper foil at the temperature of 80 ℃ under the pressure of 30N; hot pressing for 2 h; placing the PDMS film for fixing the copper foil under ultraviolet light with power of 20W for curing for 30 min; placing the glass slide with the fixed PI copper foil under an ultraviolet laser, and performing 20 times of circular cutting at the power of ultraviolet light of 4W and the cutting speed of 100mm/min according to the designed structure profile; and (3) performing laser etching, and stripping residues to obtain the snake-shaped electrode layer with the surface covered with the PI network layer.

S3, transfer of PI coated serpentine electrode layer:

adhering the snakelike electrode layer coated with the PI network layer by using a water-soluble adhesive tape, adhering one surface of the transferred snakelike electrode layer coated with the PI and the adhesive tape to the bottom layer elastomer, placing the surface under ultraviolet light, wherein the power is 5W, and irradiating for 30 min; and after soaking in deionized water, washing the conductive structure on the surface of the silica gel elastomer, and blow-drying to obtain the PI snake-shaped electrode layer bonded on the silica gel elastomer.

S4, preparing an isolation insulating layer:

respectively at every chip bottom sculpture PET mask plate in the chip layer, aim at the PET mask plate of sculpture and snakelike electrode and laminate, at PET surface blade coating one deck silica gel elastomer, peel off the PET mask plate, the solidification under the normal atmospheric temperature obtains isolation insulating layer.

S5, low-temperature reflow soldering of the chip layer, the passive device layer and the snake-shaped electrode layer:

and etching the snakelike electrode layer by using ultraviolet laser to form a metal screen plate with a hollow structure, placing the chips of the chip layer and the passive device layer at corresponding pin positions, and heating and curing at the temperature of 140 ℃ for 15min to obtain the flexible circuit welded with the chip layer and the passive device layer.

S6, packaging the top-level device:

carrying out plasma treatment on the flexible circuit, wherein the power is 100W, and the treatment time is 3 min; and pouring the flexible circuit by using the bottom layer elastomer, and curing at normal temperature to obtain the top layer packaging device.

S7, preparing and integrating a conductive gel electrode:

stripping the water-soluble adhesive tape at the electromyographic signal acquisition electrode to form a hollowed-out electrode; filling the hollow electrode with hydrogel liquid, wherein the hydrogel liquid is prepared by mixing 2-ketoglutaric acid, acrylamide, lithium chloride, dimethyl-trisulfopropyl ammonium hydroxide and ionic water according to the mass ratio of 1:4:400:1500: 3500; curing the mixture under the ultraviolet light with the power of 20W for 4h to obtain the flexible stretchable artificial larynx with the conductive gel electrode.

Example 2

S1, bottom layer elastomer preparation:

preprocessing a glass slide, mixing Ecoflex 00-30A and B glue according to the mass ratio of 1.0:1 to prepare a silica gel elastomer, spin-coating the silica gel elastomer on the glass slide at the rotating speed of 300r/min for 30s, and curing a silica gel film to obtain a bottom layer elastomer.

S2, etching the snake-shaped electrode layer and the PI network layer:

mixing polydimethylsiloxane PDMS and a silica gel elastomer curing agent according to a mass ratio of 10:1 to prepare a PDMS mixture, and spin-coating the PDMS mixture on a clean glass slide at a rotation speed of 700r/min for 10 s;

removing bubbles by vacuum filtration, heating at the constant temperature of 60 ℃ for 3h, and curing the PDMS film to obtain the glass slide coated with the PDMS film; rotating the cleaned copper foil for 20s at the rotating speed of 3000r/min, and spin-coating a PI solution to obtain a copper foil coated with PI; fixing the copper foil with PI on a PDMS film of the prepared glass slide, and hot-stamping the glass slide with the PI-coated copper foil at the temperature of 100 ℃ under the pressure of 20N; hot pressing for 1 h; placing the PDMS film for fixing the copper foil under ultraviolet light with the power of 30W for curing for 10 min; placing the glass slide with the fixed PI copper foil under an ultraviolet laser, and carrying out 5 times of circular cutting at the power of the ultraviolet light of 3W and the cutting speed of 600mm/min according to the designed structure profile; and (3) performing laser etching, and stripping residues to obtain the snake-shaped electrode layer with the surface covered with the PI network layer.

S3, transfer of PI coated serpentine electrode layer:

adhering the snakelike electrode layer coated with the PI network layer by using a water-soluble adhesive tape, adhering one surface of the transferred snakelike electrode layer coated with the PI and the adhesive tape to the bottom layer elastomer, placing the substrate under ultraviolet light, wherein the power is 20W, and irradiating for 20 min; and after soaking in deionized water, washing the conductive structure on the surface of the silica gel elastomer, and blow-drying to obtain the PI snake-shaped electrode layer bonded on the silica gel elastomer.

S4, preparing an isolation insulating layer:

respectively at every chip bottom sculpture PET mask plate in the chip layer, aim at the PET mask plate of sculpture and snakelike electrode and laminate, at PET surface blade coating one deck silica gel elastomer, peel off the PET mask plate, the solidification under the normal atmospheric temperature obtains isolation insulating layer.

S5, low-temperature reflow soldering of the chip layer, the passive device layer and the snake-shaped electrode layer:

and etching the snakelike electrode layer by using ultraviolet laser to form a metal screen plate with a hollow structure, placing the chips of the chip layer and the passive device layer at corresponding pin positions, and heating and curing at the temperature of 180 ℃ for 10min to obtain the flexible circuit welded with the chip layer and the passive device layer.

S6, packaging the top-level device:

carrying out plasma treatment on the flexible circuit, wherein the power is 60W, and the treatment time is 6 min; and pouring the flexible circuit by using the bottom layer elastomer, and curing at normal temperature to obtain the top layer packaging device.

S7, preparing and integrating a conductive gel electrode:

stripping the water-soluble adhesive tape at the electromyographic signal acquisition electrode to form a hollowed-out electrode; filling the hollow electrode with hydrogel liquid, wherein the hydrogel liquid is prepared by mixing 2-ketoglutaric acid, acrylamide, lithium chloride, dimethyl-trisulfopropyl ammonium hydroxide and ionic water according to the mass ratio of 1:3:200:2500: 3000; curing the mixture under ultraviolet light with the power of 30W for 2h to obtain the flexible stretchable artificial larynx with the conductive gel electrode.

Example 3

S1, bottom layer elastomer preparation:

preprocessing a glass slide, mixing Ecoflex 00-30A and B glue according to the mass ratio of 1.5:1 to prepare a silica gel elastomer, spin-coating the silica gel elastomer on the glass slide at the rotating speed of 1000r/min for 10s, and curing a silica gel film to obtain a bottom layer elastomer.

S2, etching the snake-shaped electrode layer and the PI network layer:

mixing polydimethylsiloxane PDMS and a silica gel elastomer curing agent according to a mass ratio of 20:1 to prepare a PDMS mixture, and spin-coating the PDMS mixture on a clean glass slide at a rotating speed of 500r/min for 30 s;

removing bubbles by vacuum filtration, heating at the constant temperature of 110 ℃ for 1h, and curing the PDMS film to obtain the glass slide coated with the PDMS film; rotating the cleaned copper foil for 10s at the rotating speed of 4000r/min, and spin-coating a PI solution to obtain a PI-coated copper foil; fixing the copper foil with PI on a PDMS film of the prepared glass slide, and hot-stamping the glass slide with the PI-coated copper foil at the temperature of 150 ℃ under the pressure of 10N; hot pressing for 0.5 h; placing the PDMS film for fixing the copper foil under ultraviolet light with power of 10W for curing for 20 min; placing the glass slide with the fixed PI copper foil under an ultraviolet laser, and performing 10 times of circular cutting at the power of the ultraviolet light of 5W and the cutting speed of 400mm/min according to the designed structure profile; and (3) performing laser etching, and stripping residues to obtain the snake-shaped electrode layer with the surface covered with the PI network layer.

S3, transfer of PI coated serpentine electrode layer:

adhering the snakelike electrode layer coated with the PI network layer by using a water-soluble adhesive tape, adhering one surface of the transferred snakelike electrode layer coated with the PI and the adhesive tape to the bottom layer elastomer, placing the surface under ultraviolet light with the power of 10W, and irradiating for 20 min; and after soaking in deionized water, washing the conductive structure on the surface of the silica gel elastomer, and blow-drying to obtain the PI snake-shaped electrode layer bonded on the silica gel elastomer.

S4, preparing an isolation insulating layer:

respectively at every chip bottom sculpture PET mask plate in the chip layer, aim at the PET mask plate of sculpture and snakelike electrode and laminate, at PET surface blade coating one deck silica gel elastomer, peel off the PET mask plate, the solidification under the normal atmospheric temperature obtains isolation insulating layer.

S5, low-temperature reflow soldering of the chip layer, the passive device layer and the snake-shaped electrode layer:

and etching the snakelike electrode layer by using ultraviolet laser to form a metal screen plate with a hollow structure, placing chips of the chip layer and the passive device layer at corresponding pin positions, and heating and curing at the temperature of 210 ℃ for 5min to obtain the flexible circuit welded with the chip layer and the passive device layer.

S6, packaging the top-level device:

carrying out plasma treatment on the flexible circuit, wherein the power is 80W, and the treatment time is 5 min; and pouring the flexible circuit by using the bottom layer elastomer, and curing at normal temperature to obtain the top layer packaging device.

S7, preparing and integrating a conductive gel electrode:

stripping the water-soluble adhesive tape at the electromyographic signal acquisition electrode to form a hollowed-out electrode; filling the hollow electrode with hydrogel liquid, wherein the hydrogel liquid is prepared by mixing 2-ketoglutaric acid, acrylamide, lithium chloride, dimethyl-trisulfopropyl ammonium hydroxide and ionic water according to the mass ratio of 1:5:600:2000: 4000; curing the mixture under ultraviolet light with the power of 10W for 5h to obtain the flexible stretchable artificial larynx with the conductive gel electrode.

The wireless fully-integrated flexible stretchable artificial larynx based on mechanical acoustics has the following working modes:

the acceleration sensor integrated with the artificial larynx is used for capturing the sensor micro-vibration and weak heart impact caused by the upward movement of the rib of the thoracic cavity due to the lung respiration, so that the heart rate and the respiration are accurately measured, and a novel and convenient strategy is provided for a respiration and heart rate testing method. Because artificial larynx can with throat skin perfect adaptation, based on the wide response range of acceleration sensor, realize the acquisition to throat sound vibration and human motion characteristic from this. In addition, the electromyographic electrode can acquire the electromyographic signals of the throat epidermis, so that analysis of the peripheral epidermal nerve signals of the throat can be realized, and classification and identification of the sound signals can be realized according to the regular change of the electromyographic characteristics under the condition of sound vibration.

The stretchable electronics of full flexible integration is developed based on a key process of hybrid integration, the preparation of a high-precision micro-nano electric channel is realized by designing a stretchable flexible snake-shaped network with stable mechanical property and utilizing a high-precision laser processing technology, and the problem of difficult flexible full integration of the integration of sensing, processing, wireless transmission and micro power supply is effectively solved.

The present invention is not limited to the above-mentioned embodiments, and based on the technical solutions disclosed in the present invention, those skilled in the art can make some substitutions and modifications to some technical features without creative efforts according to the disclosed technical contents, and these substitutions and modifications are all within the protection scope of the present invention.