阅读说明：本技术 一种多功能连接器件及蓝牙穿戴设备 (Multifunctional connecting device and Bluetooth wearable equipment ) 是由 李俊忠 于 2021-02-05 设计创作，主要内容包括：本发明公开一种多功能充电连接器件,设置在电路板上,设有基体,所述基体包括顶面以及与所述顶面垂直的侧面,使得所述基体内部形成MIC密封腔,所述MIC密封腔的开口向下,所述MIC密封腔的开口的形状和大小与电路板上的MIC模块的形状和大小吻合,使得所述基体能够罩在所述MIC模块上,将所述MIC模块容置在所述MIC密封腔的内部。本发明的多功能充电连接器件设有一个采用绝缘材料制成的基体,基体的侧面设有侧连接件,基体的底部设有与电路板配合的焊盘或引脚,方便电路板通过基体与其他器件立体连接；基体的内部还设有MIC密封腔和与密封腔配合的导音孔,能够密封设置在电路板上的MIC器件,省去了使用MIC专用的硅胶密封套。(The invention discloses a multifunctional charging connecting device which is arranged on a circuit board and is provided with a substrate, wherein the substrate comprises a top surface and a side surface vertical to the top surface, so that an MIC (many integrated core) sealed cavity is formed in the substrate, the opening of the MIC sealed cavity faces downwards, and the shape and the size of the opening of the MIC sealed cavity are matched with those of an MIC module on the circuit board, so that the substrate can cover the MIC module and the MIC module is accommodated in the MIC sealed cavity. The multifunctional charging connector is provided with a base body made of insulating materials, a side connecting piece is arranged on the side face of the base body, and a bonding pad or a pin matched with a circuit board is arranged at the bottom of the base body, so that the circuit board can be conveniently and three-dimensionally connected with other devices through the base body; the inside of base member still is equipped with MIC sealed chamber and leads the sound hole with sealed chamber complex, can seal the MIC device that sets up on the circuit board, has saved and has used the dedicated silica gel seal cover of MIC.)

1. A multifunctional connecting device is arranged on a circuit board and is characterized in that a base body (1) is arranged, an MIC (many integrated core) sealed cavity (13) is arranged inside the base body (1), the opening of the MIC sealed cavity (13) faces downwards, and the shape and the size of the opening of the MIC sealed cavity (13) are matched with those of an MIC module on the circuit board, so that the base body (1) can cover the MIC module and the MIC module is accommodated inside the MIC sealed cavity (13); the inner wall of the MIC sealed cavity (13) is provided with a sound guiding hole (131), and the sound guiding hole (131) penetrates through the inner wall of the corresponding MIC sealed cavity (13) from the outer surface of the base body (1); the outer surface of the base body (1) is provided with side connecting pieces (2) which are convenient to be connected with other devices, and more than one side connecting piece (2) is arranged; the lower surface that base member (1) and circuit board meet is equipped with a bottom connecting piece (3) that is convenient for base member (1) and circuit board and components and parts to be connected, be equipped with metal wiring (4) on base member (1), side connecting piece (2), bottom connecting piece (3) and the components and parts that set up on base member (1) pass through two liang of connections of metal wiring (4).

2. Multifunctional connector device according to claim 1, characterized in that the base body (1) is made of an insulating material comprising one or more of plastic, ceramic or glass.

3. Multifunction connection device according to claim 1, characterized in that the bottom connections (3) and the metal lines (4) are made of any one of gold, silver, copper, tungsten, silver palladium alloy, molybdenum manganese alloy, the bottom connections (3) being one or both of pads or pins.

4. Multifunction connection device according to claim 3, characterized in that the bottom connection (3) and the metal track (4) are provided to the base body (1) by one of etching, plating, printing or laser direct structuring processes.

5. Multifunctional connecting device according to claim 1, characterized in that the side connecting pieces (2) are copper cylinders, two of which are arranged in a horizontal direction on one side of the base body (1).

6. The multi-function connector according to claim 1, wherein said base (1) is a rectangular parallelepiped, and said sound guide hole (131) penetrates from one side surface of said base (1) to an inner wall of the MIC capsule (13) corresponding to said side surface in a horizontal direction.

7. Multifunction connection device according to claim 1, characterized in that an ESD ground is also provided on the base body (1).

8. Multifunctional connecting device according to claim 1, characterized in that a waterproof sealing cavity (14) is further provided inside the base body (1), the waterproof sealing cavity (14) is arranged in parallel with the MIC sealing cavity (13), and the opening of the waterproof sealing cavity (14) faces downwards.

9. Multifunction connection device according to claim 8, characterized in that the bottom connection piece (3) is arranged along the edges of the openings of the water-tight sealed cavity (14) and the MIC sealed cavity (13).

10. A bluetooth wearable device, characterized in that a multifunctional charging connection device according to any of claims 1-9 is used.

Technical Field

The invention relates to the field of integrated circuit auxiliary device design, in particular to a multifunctional connecting device and Bluetooth wearable equipment adopting the same.

Background

The assembled printed circuit board is also called PCBA board, has the advantages of small size, simple assembling process, high mounting efficiency, high circuit reliability and the like, is widely applied to various electronic devices, and is also one of Bluetooth wearable devices. In order to facilitate the use of users and improve the use experience of users, the Bluetooth wearable device is developing towards the direction of miniaturization and non-sensibilization, which also puts forward higher requirements for PCBA boards. The existing PCBA board is designed in a plane, various components are arranged on the PCBA board in a planar mode, connection with equipment outside the PCBA board is inconvenient, particularly connection between a charging and burning test point and other equipment is inconvenient, a copper column or Pogo Pin technology is generally adopted, SMT (surface mount technology) mounting is needed, and the inclined risk is caused. In addition, current bluetooth wearing equipment carries out speech control for the convenience of the user, generally still is equipped with the MIC, and the MIC adopts the paster mode to set up on PCBA board, needs extra installation silica gel cover to seal and lead the sound.

Disclosure of Invention

Aiming at the problem that the plane arrangement of components on the circuit board in the prior art is inconvenient for connecting with other equipment, the invention provides the multifunctional connecting device, the MIC sealing sleeve and the connecting device are combined together, the connecting device can be directly welded on the circuit board to be used as the connecting device, and the test point and the burning point can be arranged on the connecting device, so that the production and the assembly of the circuit board are convenient.

The technical scheme adopted by the invention for solving the technical problems is as follows: a multifunctional connector is provided with a base body, wherein an MIC (many integrated core) sealed cavity is arranged in the base body, the opening of the MIC sealed cavity is downward, and the shape and the size of the opening of the MIC sealed cavity are matched with those of an MIC module on a circuit board, so that the base body can cover the MIC module and can contain the MIC module in the MIC sealed cavity; the inner wall of the MIC sealed cavity is provided with a sound guide hole which penetrates from the outer surface of the base body to the corresponding inner wall of the MIC sealed cavity; the outer surface of the base body is provided with more than one side connecting piece which is convenient to be connected with other devices; the lower surface that the base member meets with the circuit board is equipped with the piece bottom connecting piece that is convenient for base member and circuit board and components and parts to be connected, be equipped with the metal circuit on the base member, side connecting piece, bottom connecting piece and the components and parts that set up at the base member pass through two liang of connections of metal circuit.

The technical scheme adopted by the invention for solving the technical problem further comprises the following steps:

in the multifunctional connector, the substrate is made of an insulating material, and the insulating material includes one or more of plastic, ceramic or glass.

In the multifunctional connector, the bottom connector and the metal line are made of any one of gold, silver, copper, tungsten, silver-palladium alloy and molybdenum-manganese alloy, and the bottom connector is one or two of a pad or a pin.

A multi-function connector device as described above, said bottom connector and metal traces are provided to said substrate by one of etching, plating, printing or laser direct structuring process.

According to the multifunctional connecting device, the side connecting pieces are copper columns, the number of the copper columns is two, and the copper columns are arranged on one side face of the base body along the horizontal direction.

According to the multifunctional connecting device, the base body is in a cuboid shape, and the sound guide hole penetrates through the inner wall of the MIC sealing cavity corresponding to one side face of the base body along the horizontal direction.

In the multifunctional connecting device, the substrate is further provided with an ESD grounding circuit.

According to the multifunctional connecting device, the base body is internally provided with a waterproof sealing cavity, the waterproof sealing cavity and the MIC sealing cavity are arranged in parallel, and an opening of the waterproof sealing cavity faces downwards.

In the multifunctional connector device, the bonding pads or the pins on the bottom surface of the substrate are arranged along the edge of the opening of the waterproof sealing cavity or the MIC sealing cavity.

A bluetooth wearing equipment has adopted as above arbitrary multi-functional connecting device.

The invention has the beneficial effects that: the multifunctional connecting device is provided with a base body made of insulating materials, a side connecting piece is arranged on the side face of the base body, and a bonding pad or a pin matched with a circuit board is arranged at the bottom of the base body, so that the circuit board can be conveniently and three-dimensionally connected with other devices through the base body; an MIC sealing cavity and a sound guide hole matched with the sealing cavity are further formed in the base body, an MIC device arranged on the circuit board can be sealed, and a special silica gel sealing sleeve for MIC is omitted; the surface of the base body can be paved with ESD grounding lines, antennas, touch pads and other devices by adopting processes of LDS, LTP and the like, so that the devices on the circuit board are arranged in a three-dimensional and integrated manner, the space on the circuit board can be further saved, mutual interference among the devices is avoided, and the space utilization rate of the circuit board is improved.

The invention will be further described with reference to the accompanying drawings and specific embodiments.

Drawings

FIG. 1 is a schematic perspective view of a multi-function connector of the present invention;

FIG. 2 is a schematic view of one end of the multi-function connector of the present invention;

FIG. 3 is a schematic perspective view of another angle of the multi-functional connector of the present invention;

in the figure, 1, a base body, 11, a top surface, 12, a side surface, 13, an MIC sealed cavity, 131, a sound guide hole, 14, a waterproof sealed cavity, 2, a side connecting piece, 3, a bottom connecting piece, 4 and a metal circuit.

Detailed Description

The present embodiment is a preferred embodiment of the present invention, and other principles and basic structures that are the same as or similar to the present embodiment are within the scope of the present invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.

Embodiments of the inventive multi-function connector device are shown in fig. 1-3, arranged on a circuit board for sealing an MIC module arranged on the circuit board, provided with a base 1. In this embodiment, the base body 1 is a rectangular parallelepiped, and has a top surface 11 and a side surface 12 perpendicular to the top surface 11, so that an MIC sealed cavity 13 is formed inside the base body 1, and the opening of the MIC sealed cavity 13 faces downward, so that when the base body 1 is mounted on a circuit board, the MIC sealed cavity 13 can be sealed by the circuit board. The shape and size of the opening of the MIC capsule 13 are matched with the shape and size of the MIC module on the circuit board, so that when the multifunctional connector is mounted on the circuit board, the base 1 can cover the MIC module and contain the MIC module inside the MIC capsule 13. And a sound guide hole 131 for the MIC module to receive external sound is formed in the inner wall of the MIC sealed cavity 13, and the sound guide hole 131 penetrates through the outer surface of the base body 1 to the corresponding inner wall of the MIC sealed cavity 13. In the present embodiment, in order to avoid lowering the strength of the base 1, the sound guide hole 131 penetrates from one end surface of the base 1 to the inner wall of the MIC capsule 13 corresponding to the end surface in the horizontal direction.

The outer surface of base member 1 is equipped with the side connecting piece 2 of being convenient for with other devices be connected, and side connecting piece 2 is equipped with more than one, can be according to base member 1 outward appearance shaping for the connecting piece of the different forms of seamless butt joint with base member 1 moreover. In this embodiment, the side connecting members 2 are copper cylinders, two copper cylinders are provided, the copper cylinders are disposed on the side surface 12 of one end of the substrate 1 along the horizontal direction, in order to improve the conductivity, the end surfaces of the copper cylinders are subjected to gold plating, in particular, the side connecting members 2 may further adopt Pogo Pin and other devices according to the connection requirement, and the surfaces of the devices are subjected to gold plating, silver plating, copper plating and other treatments according to the conductive effect requirement. In order to firmly install the side connecting piece 2 on the base body 1, the side connecting piece 2 is fixed on the base body 1 by adopting chemical plating or insert plating and other processes, the insert plating process is adopted in the implementation, and the side surface of the base body 1 is provided with an installation position convenient for installing a copper column.

In order to facilitate the mounting of the multifunctional connector on the circuit board and the connection with other components on the circuit board, the lower edge of the side 12 of the base 1 is provided with a bottom connector 3 for facilitating the connection of the base 1 with the circuit board and the components, and the bottom connector 3 is one or two of a pad or a pin. In this embodiment, the bottom connector 3 is a bonding pad, which facilitates the direct soldering of the multi-function connector to the circuit board, and in the specific production implementation, the bonding pad or the pin can be used as the bottom connector 3 according to the requirement of the component connection. In order to facilitate connection of components arranged on the multifunctional connecting device and inside the multifunctional connecting device and components arranged on the circuit board, the base body 1 is provided with metal lines 4, and the side connecting pieces 2, the bottom connecting pieces 3 and the components arranged on the base body 1 are connected in pairs through the metal lines 4. During production, different metal lines 4 are arranged according to use requirements to be respectively connected with the components and parts and the bottom connecting piece 3, the bottom connecting piece 3 and the side connecting piece 2 or the components and the side connecting piece 2, and the side connecting piece 2 can be arranged at different positions of the base body 1 according to the use requirements to adapt to the connection requirements of different devices. After the multifunctional connector is fixed on the circuit board by welding, the components on the circuit board and on the base body 1 can be connected with other equipment through the multifunctional connector without using an additional connector.

In order to ensure the conductivity, the bottom connecting piece 3 and the metal line 4 of the multifunctional connecting device are made of any one of gold, silver, copper, tungsten, silver-palladium alloy and molybdenum-manganese alloy. In order to further ensure that the multifunctional connector is soldered to the circuit board, the surfaces of the bottom connector 3 and the metal lines 4 may be plated with a metal having excellent soldering properties, such as nickel, tin or gold.

In order to ensure the reliability of the bottom connecting piece 3 and the metal circuit 4 and avoid falling off or damage of the bottom connecting piece and the metal circuit 4 in the subsequent processing process and influence the connection of the multifunctional connecting device, the bottom connecting piece 3 and the metal circuit 4 are arranged on the base body 1 through one of etching, electroplating, printing or laser direct forming processes, and in the embodiment, the metal circuit 4 is formed on the base body 1 through the laser direct forming process.

Still be equipped with a waterproof sealing chamber 14 in the base member 1 of the multifunctional connector of this embodiment, waterproof sealing chamber 14 and MIC sealed chamber 13 parallel arrangement, the opening is downward, can cover on the components and parts of circuit board, seals up components and parts and plays waterproof dirt-proof effect. In order to improve the sealing effect, the bottom connector 3 is disposed along the edge of the opening of the waterproof sealing chamber 14 and the MIC sealing chamber 13, so that the waterproof sealing chamber 14 and the MIC sealing chamber 13 are sealed after the multifunctional connector is soldered to the circuit board.

In order to protect the circuit board and the components on the multifunctional connecting device, the base body 1 is also provided with an ESD grounding circuit, the ESD grounding circuit is connected with a shell of equipment where the multifunctional connecting device is located, the position, provided with a through hole or a gap, of the shell is provided with a grounding circuit, and the ESD grounding circuit of the multifunctional connecting device is connected with the grounding circuit on the shell, so that ESD dredging grounding protection can be formed. In addition, more components, such as an FPC antenna, a touch-sensitive pad, and the like, can be arranged on the top surface, the side surface, and the inside of the multifunctional connecting device base 1 according to the use requirements, so that the components of the whole circuit board are arranged in a three-dimensional manner, and the space utilization efficiency of the circuit board is improved.

Because the circuit board process requires, the substrate 1 needs to be made of insulating material, and because the number of components on the circuit board is large, high-voltage current may pass through the circuit board during working, and a large amount of heat is released, the material for making the substrate 1 is preferably insulating material with high insulating degree, high hardness and toughness and the first thermal expansion coefficient, such as ceramic, plastic, glass and the like. In this embodiment, the base 1 is made of ceramic, and the shape is directly formed into different arc surfaces, planes, concave surfaces and connecting member mounting positions according to the internal structure of the multifunctional connecting device and the requirement of component mounting in this embodiment.

The multifunctional connecting device is provided with a base body made of insulating materials, a side connecting piece is arranged on the side face of the base body, and a bonding pad or a pin matched with a circuit board is arranged at the bottom of the base body, so that the circuit board can be conveniently and three-dimensionally connected with other devices through the base body; an MIC sealing cavity and a sound guide hole matched with the sealing cavity are further formed in the base body, an MIC device arranged on the circuit board can be sealed, and a special silica gel sealing sleeve for MIC is omitted; the surface of the base body can be paved with ESD grounding lines, antennas, touch pads and other devices by adopting processes of LDS, LTP and the like, so that the devices on the circuit board are arranged in a three-dimensional and integrated manner, the space on the circuit board can be further saved, mutual interference among the devices is avoided, and the space utilization rate of the circuit board is improved.