阅读说明：本技术 引线保持构件及电动致动器 (Lead wire holding member and electric actuator ) 是由 桥本幸子 于 2021-03-25 设计创作，主要内容包括：本发明提供一种引线保持构件及电动致动器,可容易地且在短时间内进行将引线焊接在基板上的作业。引线保持构件包括：引线通路部,覆盖引线的至少一部分；以及固定部,以所述引线的导体在搭载电子零件的基板的表面上表露出的方式,固定所述引线通路部,其中,所述引线通路部包括以既定的角度进行弯曲的弯曲部。(The invention provides a lead holding member and an electric actuator, which can easily perform the operation of welding a lead on a substrate in a short time. The lead holding member includes: a lead path portion covering at least a part of the lead; and a fixing portion that fixes the lead path portion such that a conductor of the lead is exposed on a surface of a substrate on which an electronic component is mounted, wherein the lead path portion includes a bent portion bent at a predetermined angle.)

1. A lead holding member, comprising:

a lead path portion covering at least a part of the lead; and

a fixing portion for fixing the lead path portion so that the conductor of the lead is exposed on the surface of the substrate on which the electronic component is mounted,

wherein the lead path portion includes: a bending part bent at a predetermined angle.

2. The lead holding member according to claim 1,

the lead path portion includes: a protruding portion covering a portion of the substrate,

the protruding portion has: an opposing surface opposing a part of the substrate,

the lead is sandwiched by a portion of the substrate covered by the protruding portion and the facing surface of the protruding portion.

3. The lead holding member according to claim 2,

the lead path portion includes: parallel passages extending toward and parallel to the facing surface.

4. The lead holding member according to any one of claims 1 to 3,

the lead path portion includes: a first lead holding member and a second lead holding member superposed and fixed on the first lead holding member,

the lead path portion includes:

a first passage portion formed in the first lead holding member;

a second passage portion formed by the second lead holding member overlapping the first lead holding member; and

a third passage portion formed in the second lead holding member,

wherein the bent portion is formed at a portion where the second passage portion and the third passage portion are connected.

5. The lead holding member according to claim 4,

the lead wire includes: the conductor and a covering portion covering the conductor,

the first passage portion has: a first section connected to the second passage portion, and a second section connected to the first section,

wherein a dimension of the second section in a diameter direction of the lead is smaller than a diameter of a covered portion of the lead and larger than the conductor of the lead.

6. The lead holding member according to claim 5,

the area of the second passage portion in the diameter direction of the lead is smaller than the area of the lead in a state where the conductor is covered with the covering portion.

7. The lead holding member according to any one of claims 4 to 6,

the first lead path portion has a concave portion or a convex portion,

the second lead holding member has: and a convex portion or a concave portion fitted with the concave portion or the convex portion of the first lead holding member.

8. The lead holding member according to any one of claims 4 to 7,

the first lead holding member has the fixing portion.

9. The lead holding member according to any one of claims 4 to 8,

the second wire holding member is detachable from the first wire holding member.

10. The lead holding member according to any one of claims 4 to 9,

the first lead holding member is detachable from the substrate.

11. The lead holding member according to any one of claims 1 to 10,

the lead path portion can hold a plurality of leads.

12. An electric actuator, comprising:

a substrate on which electronic components are mounted;

a lead holding member according to any one of claims 1 to 11;

a lead wire soldered to the substrate using the lead holding member; and

and an actuator unit connected to the substrate and receiving at least one of a signal and power supply from the substrate.

Technical Field

The present invention relates to a lead holding member and an electric actuator using the same.

Background

For example, patent document 1 discloses a structure in which a lead is soldered to a circuit board. In patent document 1, a connection terminal is mounted on a circuit board, and a lead is soldered to the connection terminal. The lead is soldered to the circuit board via the connection terminal.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent application laid-open No. Hei 4-162377

Disclosure of Invention

[ problems to be solved by the invention ]

However, in the structure of patent document 1, in order to solder the lead to the connection terminal, a hand pressing the lead, a hand holding the solder, and a hand holding the soldering iron are required. In addition, since the bonding is performed while the leads are pressed one by one, a long time is required for the bonding operation.

In view of the above-described problems, an object of the present invention is to provide a lead holding member that can easily perform a work of soldering a lead to a substrate in a short time.

[ means for solving problems ]

A lead holding member of an embodiment of the present invention includes: a lead path portion covering at least a part of the lead; and a fixing portion that fixes the lead path portion such that a conductor of the lead is exposed on a surface of a substrate on which an electronic component is mounted, wherein the lead path portion includes a bent portion bent at a predetermined angle. The predetermined angle also includes a case where the angle changes slowly (continuously). That is, the bending of the bent portion of the lead passage portion also includes a state in which the orientation of the lead changes gradually in the lead passage portion.

According to the lead holding member of the present invention, since the lead passage portion is fixed to the substrate, the lead can be held and fixed to the substrate in a state where the bonding portion of the lead (the conductor or core wire of the lead) is exposed on the substrate. Since the lead can be fixed at the bonding position, a hand for pressing the lead is not required during the bonding operation. That is, the hand necessary for the soldering work is a hand for holding solder and a hand for holding a soldering iron. As a result, the work of bonding the lead to the substrate can be easily performed. Further, since the lead passage portion has the bent portion, the lead is less likely to fall off compared to a case where the bent portion is not provided (a case where the lead extends in a straight lead passage). Even if tension is applied to the lead, the tension can be received by the bent portion of the lead passage portion, and thus the load applied to the bonding portion can be reduced. Therefore, the lead can be prevented from falling off or the welded portion can be prevented from being damaged.

The wire path portion may also have a protruding portion covering a portion of the substrate. The protruding portion may also have an opposing surface that opposes a portion of the substrate. The lead may be held between the surface of the substrate facing the protruding portion and a portion of the substrate covered by the protruding portion.

According to the above configuration, since at least a part of the substrate is covered with the protruding portion of the lead path portion, there is a portion where the lead path portion overlaps the substrate. Since the lead is sandwiched between the lead passage portion and the substrate, the lead can be firmly held. The state of holding the lead wire can be maintained, and the operation of soldering the lead wire to the substrate is facilitated.

The lead path portion may also have: parallel passages extending toward and parallel to the facing surface.

According to the above configuration, since the lead passage portion extends in parallel with the surface of the substrate on the facing surface, the lead extends in substantially parallel with the substrate in the vicinity of the facing surface. Therefore, the lead is soldered along the surface of the substrate. As a result, the lead passage portion (lead holding member) can be miniaturized. In particular, the height of the bonding portion can be reduced, and the dimension of the lead path portion (lead holding member) in the height direction can be reduced. Therefore, the entire product (for example, the electric oil pump) including the lead holding member can also be downsized.

The lead path portion may also include: the wire fixing device comprises a first wire holding member and a second wire holding member overlapped and fixed with the first wire holding member. The lead path portion may also include: a first passage portion formed in the first lead holding member, a second passage portion formed by the second lead holding member being overlapped with the first lead holding member, and a third passage portion formed in the second lead holding member. The bent portion may be formed at a portion where the second passage portion and the third passage portion are connected.

According to the above configuration, when the second wire holding member is overlapped and fixed with the first wire holding member, the wire passage portion is formed. Since the bent portion of the lead passage portion is formed at a portion where the two members are connected (a portion where the second passage portion is connected to the third passage portion), when the angle of the bent portion is changed, for example, only the second lead holding member may be replaced. Therefore, the orientation of the lead can be easily changed. Since only the first and second lead holding members are connected, assembly is also easy. In the second passage portion, the second wire holding member is overlapped and fixed with the first wire holding member, and therefore the wire (vertically) can be held between the first wire holding member and the second wire holding member. Therefore, the lead wire has good retention. By including two members, the lead can easily pass through the lead holding member even if there is a bent portion.

The lead may include: the conductor and a covering portion covering the conductor. The first passage portion may have a first section connected to the second passage portion and a second section connected to the first section. The second section may have a dimension in a diameter direction of the lead smaller than a diameter of a covered portion of the lead and larger than the conductor of the lead.

According to the above configuration, when the lead wire passes through the first passage portion, the coating portion (the film portion) cannot pass through the small-diameter passage portion. Only the conductor (core wire) of the lead passes through the small-diameter via portion and reaches the pad of the substrate. The lead can be positioned in the lead passage portion. Since the coating portion of the lead is not exposed on the substrate, the coating portion of the lead is not erroneously melted at the time of soldering.

The area of the second passage portion in the diameter direction of the lead may be smaller than the area of the lead in a state where the conductor is covered with the covering portion.

According to the above configuration, since the cross-sectional area of the second passage portion is smaller than the cross-sectional area of the lead, the second passage portion presses the outer diameter of the lead. The second passage portion presses the covered portion of the lead.

The first lead passage portion may have a concave portion or a convex portion, and the second lead holding member may have a convex portion or a concave portion fitted with the concave portion or the convex portion of the first lead holding member.

According to this configuration, the first and second lead holding members are fixed to each other by fitting the concave portion and the convex portion. When tension is applied to the lead wire, the load due to the tension is transmitted from the lead wire to the second lead holding member and then from the second lead holding member to the fitting portion of the concave-convex portion, so that the load on the welding portion of the lead wire is reduced, and the lead wire is prevented from falling off or breaking at the welding portion.

The first lead holding member may also have the fixing portion. According to the above configuration, the second wire holding member is superposed and fixed on the first wire holding member, the first wire holding member is fixed to the substrate via the fixing portion, and the wire passes through the wire passage portion, so that the entire fixation of the substrate, the wire, and the wire passage portion is strengthened.

The second wire holding member is also detachable from the first wire holding member. According to the above configuration, after the welding operation is completed, the second lead holding member is not required, and therefore, the second lead holding member can be detached from the first lead holding member.

The first lead holding member is also detachable from the substrate. According to the above configuration, after the soldering operation is completed, the first lead holding member is not required, and therefore, the first lead holding member can be detached from the substrate.

The lead path portion may also hold a plurality of leads. According to the above configuration, since the plurality of leads are held by one lead passage portion, the efficiency of the welding operation is improved as compared with the case where the leads are held one by one.

An electric actuator of another embodiment of the present invention includes: the electronic component mounting apparatus includes a substrate on which an electronic component is mounted, the lead holding member, a lead soldered to the substrate using the lead holding member, and an actuator unit connected to the substrate and receiving at least one of a signal and a power supply from the substrate.

[ Effect of the invention ]

According to the lead holding member of the present invention, the work of bonding the lead to the substrate can be easily performed in a short time.

Drawings

Fig. 1 is a schematic diagram showing a state in which an electric oil pump according to a first embodiment of the present invention is mounted on a transmission.

Fig. 2 is a perspective view showing an appearance of the electric oil pump and the lead wire.

Fig. 3 is a perspective view showing a state where the pump mounting portion is removed from the state of fig. 2.

Fig. 4 is a perspective view of the electric oil pump as viewed from the X-axis direction.

Fig. 5 is a perspective view of the electric oil pump viewed from a direction in which the lead wire outlet is visible.

Fig. 6 is a perspective view showing a state where the cover is removed from the state of fig. 4, and shows the lead wire holding member of the first embodiment.

Fig. 7 is a perspective view showing a state where the second housing is detached from the state of fig. 6.

Fig. 8 is a perspective view showing a lead extending from a substrate and a lead holding member fixing the lead with respect to the substrate.

Fig. 9 is a perspective view of the substrate, the lead, and the lead holding member in the state of fig. 7 as viewed from below.

Fig. 10 is a view seen from the X-axis direction after the second lead holding member is detached from the state of fig. 6.

Fig. 11 is a diagram showing a structure of a lead.

Fig. 12 is a perspective view of only the substrate and the lead holding member as viewed from below after the lead is detached from the state of fig. 8.

Fig. 13 is a perspective view of the first lead holding member.

Fig. 14 is a perspective view of the substrate and the second lead holding member viewed from below after the first lead holding member is detached from the state of fig. 12.

Fig. 15 is a perspective view of the second lead holding member as viewed from the X-axis direction.

Fig. 16 is a view of the second lead holding member as viewed from the X-axis direction.

Fig. 17 is a view of the second lead holding member as viewed from the Z-axis direction.

Fig. 18 is a view showing a state in which the second wire holding member of fig. 17 is overlapped with the first wire holding member.

Fig. 19 is an enlarged view of the XIX portion of fig. 18.

Fig. 20 is a perspective view of the substrate and the lead in the state of fig. 8 viewed from another angle.

Fig. 21 is a perspective view of the lead outlet as viewed from the Z-axis direction.

Fig. 22 is a view showing a state in which the cover member is removed from the lead outlet in the state of fig. 21.

Fig. 23 is a perspective sectional view taken along line XXIII-XXIII in fig. 22.

Fig. 24 is a perspective view of the sealing member.

Fig. 25 is a view of the lead holding member of the second embodiment as viewed in the-X axis direction.

Fig. 26 is a view corresponding to fig. 8, and is a perspective view of the lead holding member of the second embodiment as viewed in the-X axis direction.

Fig. 27 is a view corresponding to fig. 9, and is a perspective view of the substrate and the lead holding member as viewed in the + X axis direction.

Fig. 28 is a perspective view of the first lead holding member of the second embodiment viewed in the + X axis direction.

Fig. 29 is a perspective view of the first lead holding member of the second embodiment viewed in the-X axis direction.

Fig. 30 is a perspective view of the second lead holding member of the second embodiment viewed in the-X axis direction.

Fig. 31 is a perspective view of the second lead holding member of the second embodiment viewed in the + X axis direction.

FIG. 32 is a cross-sectional view taken along line XXXII-XXXII in FIG. 25.

Fig. 33 is a sectional perspective view of fig. 32, which is turned upside down.

[ description of symbols ]

1. 1a, 1 b: lead wire

2: core wire (conductor)

3: lead holding member

4: substrate

4 b: upper surface of

4 c: edge

5: fixing part

6: extension part

8: lead path part

10: coating part

11: first channel part

12: second path part

25: electronic component

100: electric oil pump

101: lead path part

103: lead holding member

105: fixing part

180: bending part

Detailed Description

Hereinafter, an electric oil pump according to an embodiment of the present invention will be described with reference to the drawings. The scope of the present invention is not limited to the following embodiments, and can be arbitrarily changed within the scope of the technical idea of the present invention. In the drawings below, in order to facilitate understanding of the respective structures, the scale, the number, and the like of the respective structures may be different from those of the actual structures. In the present specification, the term "parallel" includes not only completely parallel but also a case of being slightly inclined. The electric oil pump is an example of an electric actuator.

In the drawings, an XYZ coordinate system is appropriately represented as a three-dimensional orthogonal coordinate system. In the XYZ coordinate system, the Z-axis direction is the vertical direction. In fig. 1 and 2, the electric oil pump 100 is disposed in a lateral direction. The X-axis direction is a direction orthogonal to the Z-axis direction, and is a height direction (vertical direction) of the electric oil pump. The Y-axis direction is a direction orthogonal to both the X-axis direction and the Z-axis direction.

In the following description, the height direction (X-axis direction) of the electric oil pump is referred to as the pump vertical direction. The positive side (+ X side) in the X axis direction with respect to a certain object is sometimes referred to as "upper side", and the negative side (-X side) in the X axis direction with respect to a certain object is sometimes referred to as "lower side" (for example, upper and lower sides of a substrate). The expressions of the front-back direction, the front side, the rear side, the right side, the left side, and the like are used for simplicity of explanation, and do not limit the actual positional relationship or direction.

< first embodiment >

Fig. 1 is a schematic diagram showing a state in which an electric oil pump 100 according to the present embodiment is mounted on a lower portion of a transmission 200. The electric oil pump 100 is provided in an oil pan 300 that is long in the Z-axis direction. The oil pan 300 stores oil 400 therein. Reference numeral 400a denotes the oil level of the oil 400. The plurality of lead wires 1 extend from the electric oil pump 100 in the Z-axis direction along the transmission 200. A plurality of leads 1 extend in the lead guide tube 500. The upper end of the lead 1 is located on the oil surface 400 a. A connector 600 is provided at the upper end of the lead 1. The connector 600 is connected to a control device (not shown) that controls the transmission 200. In fig. 1, the Z-axis direction is a direction in which the lead 1 extends.

Fig. 2 is a perspective view showing the external appearance of the electric oil pump 100 and the lead 1 according to the present embodiment. The electric oil pump 100 has a substantially cylindrical shape. The direction of the central axis (central axis) 51 of the electric oil pump 100 is the longitudinal direction (X-axis direction) of the electric oil pump 100. The electric oil pump 100 includes a first housing 56 at the center and a second housing 57 on the left side of the first housing 56, as viewed in the X-axis direction. Further, the electric oil pump 100 has a pump housing 58 on the right side of the first housing 56. A motor (not shown) is provided in the first housing 56. The first housing 56 is a housing that houses the motor, and therefore may also be referred to as a motor housing. The second housing 57 is a housing for housing the substrate 4 (fig. 6), and therefore may be referred to as a substrate housing.

The electric oil pump 100 has a pump mount 59 beside the pump housing 58. Electric oil pump 100 is mounted to transmission 200 via pump mounting portion 59.

Fig. 3 shows a state in which the pump attachment portion 59 is removed from the state of fig. 2. As shown in fig. 3, the pump housing 58 has a substantially square cross section perpendicular to the pump center axis 51 (X-axis direction). The pump housing 58 is provided with a rotor 54a that rotates together with the shaft 52, and a stator 54b that surrounds the rotor 54 a. The rotor 54a rotates eccentrically with respect to the stator 54b, and oil can be pumped. The shaft 52 is rotated by a motor within the first housing 56. In the present embodiment, the rotor 54a, the stator 54b, and the pump housing 58 are collectively referred to as a pump section 54. The first casing 56 as a motor casing and the motor provided in the first casing 56 are collectively referred to as a motor unit 53.

Fig. 4 is a perspective view of the electric oil pump 100 viewed in the-X axis direction. The second housing 57 includes an inverted P-shaped lid 81 and a second housing body 82 whose upper portion is closed by the lid 81. The second housing 57 has a lead outlet 70. The lead 1 extends from the lead exit 70 in the Z-axis direction. The second case body 82 has a substantially annular portion 63, and a lead drawing portion 66 extending in the Z-axis direction from the annular portion 63.

Fig. 5 is a perspective view of the electric oil pump 100 viewed from a direction in which the lead wire outlet 70 is visible. The lead wire 1 extends from the lead wire outlet 70 to the outside of the electric oil pump 100. The lead 1 includes a lead 1a having a small diameter and a lead 1b having a large diameter.

Fig. 6 shows a state in which the lid portion 81 of the second housing 57 is removed from the state of fig. 4. As shown in fig. 6, the substrate 4 is provided in the second casing 57 (i.e., in the second casing body 82). The base plate 4 is fixed to the second case body 82 by two bolts 33.

The second housing body 82 has a substantially annular side surface 60 extending in a direction parallel to the X axis, and an extended side surface 64 linearly extended from the side surface 60 in a tangential direction (in a direction parallel to the Z axis). The annular portion 63 of the second housing body 82 is formed by a generally annular side surface 60 (fig. 4). The substrate 4 is disposed in the annular portion 63 of the second case body 82. The lead 1a extends from the substrate 4 toward the lead outlet 70. The second case body 82 has a lead drawing portion 66, and the lead 1 is drawn out from the substrate 4 to the outside of the second case 57 along the extension side surface 64 by the lead drawing portion 66. The extended side surface 64 is a part of the lead-out portion 66.

The second housing body 82 has a bottom portion 61 having substantially the same shape as the second housing lid portion 81. The second housing body 82 has a predetermined height (depth) in the X-axis direction by the bottom portion 61 and the side surface 60, and houses the substrate 4. In the present embodiment, the substrate accommodating portion 62 is formed by the bottom portion 61 and the side surface 60. The lead drawing portion 66 extends from the substrate accommodating portion 62 in the Z-axis direction.

The lead 1a is drawn out to the outside of the second case 57 along the extended side surface 64. That is, the lead 1 is not extended radially outward (in a direction parallel to the Z axis) from the axial center axis 51 of the electric oil pump 100, but is offset from the radial direction and extended in a direction parallel to the radial direction (offset rightward in fig. 6). Therefore, even if there is an obstacle in the direction from the shaft center axis 51 toward the radial outside (the direction parallel to the Z axis) in the vicinity of the outside of the second case 57, the lead wire 1a does not pass around the obstacle. Therefore, the space of the installation site of the electric oil pump 100 can be effectively utilized.

Fig. 7 shows a state where the second housing 57 is detached from the state of fig. 6. That is, fig. 7 shows the first case 56 (motor case), the substrate 4 located above the first case 56, the lead holding member 3, the lead 1a extending from the substrate 4, the lead 1b passing through the side of the substrate 4, and the lead exit holding portion 74 holding the lead 1(1a, 1b) at the lead exit 70. The lead outlet holding portion 74 includes a sealing member 76 and a cover member 78. The lead 1 is mounted on the substrate 4 via a lead holding member 3. The upper surface 55 of the first housing 56 is a surface perpendicular to the X-axis direction.

Fig. 8 shows a substrate 4, a lead 1a extending from the substrate 4, and a lead holding member 3 fixing the lead 1a to the substrate 4. Fig. 9 is a perspective view of the substrate 4 and the lead 1 in the state of fig. 7 as viewed from below. The wire holding member 3 has a first wire holding member 15 and a second wire holding member 16 overlapping the first wire holding member 15. Fig. 10 is a view seen from the X-axis direction after the second lead holding member 16 (the first lead holding member 15 is left intact) of the lead holding member 3 is removed from the state of fig. 6. As can be seen from fig. 10, the substrate 4 and the first lead holding member 15 are fixed to the second case 57 by bolts 33. By loosening the bolt 33, the first lead holding member 15 can be detached from the second housing 57. The base plate 4 has a side 4c on the side near the extended side 64. The substrate 4 and the first lead holding member 15 are fastened together by a bolt 33 near the side 4 c.

The side 4c is a portion closest to the lead drawing portion 66 among the portions of the substrate 4. Since the lead 1a extends from the side closest to the lead drawing portion 66 among the portions of the substrate 4 toward the lead drawing portion 66, the volume of the substrate accommodating portion 62 around which the lead 1a is wound is not required. Therefore, the second casing 57 as a whole can be downsized.

Fig. 11 is a diagram showing the structure of the lead 1 a. As shown in fig. 11, the lead 1a includes a core wire 2 and a covered portion 10 covering the core wire 2. Lead 1a has a diameter D2. The core wire 2 of the lead 1a is a conductor of the lead 1 a. Fig. 12 is a perspective view of only the substrate 4 and the lead holding member 3 as viewed from below after the lead 1a is detached from the state of fig. 8. Fig. 13 is a perspective view of the first lead holding member 15. Fig. 14 is a perspective view of the substrate 4 and the second lead holding member 16 viewed from below after the first lead holding member 15 is detached from the state of fig. 12.

In fig. 8, the direction in which the core wires 2 of the lead 1a extend from the lead holding member 3 toward the substrate 4 side is referred to as the-Z-axis direction, and the opposite direction is referred to as the + Z-axis direction. As shown in fig. 8, the core wires 2 of the lead 1a extend from the lead holding member 3 in the-Z-axis direction on the upper surface 4b of the substrate 4. That is, the lead holding member 3 covers a part of the lead 1a, and holds the lead 1a so that the core wire (conductor) 2 of the lead 1a is exposed on the surface. The lead holding member 3 is provided along a side 4c of the substrate 4 (in fig. 8, the side 4c is covered with the lead holding member 3). The direction along the side 4c is referred to as the longitudinal direction of the lead holding member 3.

In the present embodiment, the lead holding member 3 includes a first lead holding member 15 and a second lead holding member 16. The first lead holding member 15 has an end 28 in the longitudinal direction standing in the X-axis direction, and the end 28 is formed with a rectangular hole 22. The second wire holding member 16 is overlapped with the first wire holding member 15 from above and fixed to the first wire holding member 15. More specifically, when the second lead holding member 16 is overlapped with the first lead holding member 15 from above, the claw portions 24 of the both end portions 16a of the second lead holding member 16 are fitted into the rectangular holes 22 of the first lead holding member 15, and the second lead holding member 16 is fixed to the first lead holding member 15. The second lead holding member 16 is provided so as to cover the side 4c of the substrate 4. The rectangular hole 22 and the claw portion 24 can be said to be fitting portions, respectively. The fitting of the rectangular hole 22 and the claw portion 24 is Snap-fit (Snap-fit) in the present embodiment. Since the fitting of the rectangular hole 22 and the claw portion 24 is snap-fit, the second lead holding member 16 can be detached from the first lead holding member 15.

As shown in fig. 12, the first lead holding member 15 is provided so as to cover the side 4c of the substrate 4 from below. The first lead holding member 15 has two fixing portions 5 extending in the-Z axis direction along the lower surface 4a of the substrate 4, and is fixed to the substrate 4 by the fixing portions 5. A plurality of electronic components 25 (e.g., hall sensors 25a, resistors 25b, etc.) are mounted on the lower surface 4a of the substrate 4.

As shown in fig. 13, the first lead holding member 15 has a base portion 21 that extends in the longitudinal direction of the first lead holding member 15 and contacts the lower surface 4a of the substrate 4. Further, horizontal surface portions 26 extending in a direction perpendicular to the longitudinal direction of the base portion 21 are formed at both ends of the base portion 21. The horizontal plane portion 26 is located in the vicinity of the rectangular hole 22. A fixing portion 5 having a hole 5a is formed at the-Z-axis direction end of the horizontal surface portion 26. An end 28 is formed on the outer side of the horizontal surface portion 26 so as to stand from the horizontal surface portion. End 28 is a vertical face of first lead holding member 15. The hole 5a of the fixing portion 5 is a hole through which a fastening member (bolt 33) for fixing the first lead holding member 15 to the substrate 4 passes. The first lead holding member 15 has an inclined portion 23 extending obliquely upward from the base portion 21 in the + Z axis direction. The inclined portion 23 has two openings 23 a. Since the first lead holding member 15 has the opening 23a, it has elasticity as compared with the case without the opening 23 a. A flat surface portion 19 is provided at the upper end of the inclined portion 23.

As shown in fig. 14, the lower surface 4a of the substrate 4 and the lower surface 20 of the second lead holding member 16 are located on the same plane. The second lead holding member 16 has a protruding portion 6 covering a part of the substrate 4. The edge 4c of the substrate 4 and its vicinity are covered with the extension portion 6. The second lead holding member 16 has a recessed portion 18 recessed upward (X-axis direction) from a lower surface 20. When the second lead holding member 16 is overlapped with the first lead holding member 15, the recessed portion 18 is in contact with the flat portion 19 of the first lead holding member 15. Since at least a part of the substrate 4 is covered with the protruding portion 6 of the second lead holding member 16, there is a portion where the lead holding member 3 overlaps the substrate 4. Therefore, the lead 1a can be firmly held by the lead holding member 3 and the substrate 4 sandwiching the lead 1 a. By maintaining the state of the lead 1a, the work of soldering the lead 1a to the substrate 4 is facilitated.

Fig. 15 is a perspective view of the second lead holding member 16 as viewed from the-X axis direction to the + X axis direction. Fig. 16 is a view seen from the same direction as fig. 15, but is not a perspective view but a view seen in the X-axis direction. The surface of the second lead holding member 16 shown in fig. 16 is referred to as a lower surface of the second lead holding member 16. Fig. 17 is a view of the second lead holding member 16 as viewed from the + Z axis direction to the-Z axis direction. As shown in fig. 15 and 16, the second lead holding member 16 includes a linear main body 41 extending along the side 4c of the substrate 4, and end portions 42 formed at both ends of the main body 41. The body 41 and the end 42 form the extension 6. A claw portion 24 is formed on an outer surface 42a of the end portion 42. The claw portion 24 protrudes outward from the outer side surface 42 a. The second lead holding member 16 is formed with a lead passage portion 8 extending in a direction perpendicular to the longitudinal direction of the main body portion 41. In the present embodiment, 5 lead path portions 8 are formed. Each lead passage portion 8 has a first passage portion 11 and a second passage portion 12. The first passage portion 11 has a portion 9 parallel to the upper surface 4b of the substrate 4. Since the first passage portion 11 extends substantially parallel to the upper surface (front surface) 4b of the substrate 4, the lead 1a extends parallel to the substrate 4 in the lead holding member 3. Therefore, the height (dimension in the X-axis direction) of the lead holding structure (lead holding member) 3 can be reduced, and the lead holding structure 3 can be miniaturized.

As shown in fig. 17, the first passage portion 11 has a diameter D1. In the present embodiment, the diameter D1 is set to be slightly smaller than the diameter D2 of the lead wire 1 a. That is, the lead 1a can pass through the first passage portion 11, but is in an interference fit state in the first passage portion 11. The diameter of the second passage portion 12 is substantially equal to the diameter of the core wire 2 of the lead 1 a. The covering portion 10 of the lead 1a cannot pass through the second passage portion 12. The core wire 2 of the lead 1a passes through the second path portion 12 and is exposed on the upper surface 4b of the substrate 4 as shown in fig. 8. The region where the core wires 2 are exposed on the upper surface 4b of the substrate 4 is sometimes referred to as a substrate pad 4 d. In fig. 16, the length of the first path portion 11 is denoted by L1, and the length of the second path portion 12 is denoted by symbol L2.

When the lead 1a passes through the lead holding member 3, the coating portion (coating portion) 10 of the lead 1a cannot pass through the second passage portion 12. Only the conductor 2 of the lead 1a passes through the second via portion 12 and reaches the substrate 4. Therefore, the lead 1a can be positioned in the lead holding member 3. Since the coating portion 10 of the lead 1a is not exposed (exposed) on the substrate 4, the coating portion 10 of the lead 1a is not erroneously melted at the time of soldering.

As shown in fig. 15, the second lead holding member 16 has an opposing surface 7 that faces (contacts) the upper surface 4b of the substrate 4 above the lower surface 20. The lead 1a is sandwiched between the upper surface 4b of the substrate 4 and the facing surface 7 of the second lead holding member 16. The second lead holding member 16 has a lead exit surface 13 as a surface on which the lead 1a is exposed, on the upper side of the facing surface 7. The lower half of the lead exit surface 13 is a concave portion 14 recessed in the Z-axis direction. The recess 14 is depicted as an inclined surface in fig. 15. When soldering is performed, the solder can flow into the recessed portion 14 of the lead outlet surface 13, and therefore the solder does not flow to other places and can be appropriately soldered.

Fig. 18 shows a state in which the second lead holding member 16 is coupled to the first lead holding member 15 of fig. 17. In the state of fig. 18, the surface 19 of the first lead holding member 15 is in contact with the surface 17 (fig. 14) of the second lead holding member 16. As a result, a part of diameter D2 of first passage 11 is reduced by surface 19 of first lead holding member 15, and the opening size of first passage 11 is D3(D3 < D2). That is, the lead 1a passing through the first passage portion 11 is sandwiched between the first lead holding member 15 and the second lead holding member 16. Therefore, the lead 1a can be firmly held. According to the above configuration, even a lead wire having a small wire diameter can be held more reliably. In addition, the dimension in the height direction of the lead holding structure can be reduced.

Fig. 19 is an enlarged view of the XIX portion of fig. 18. As shown in fig. 19, the second wire holding member 16 has a horizontal surface portion 30 corresponding to the horizontal surface portion 26 of the first wire holding member 15, and a vertical surface portion 32 corresponding to the vertical surface portion 28 of the first wire holding member 15. The horizontal plane portion 30 is located in the vicinity of the claw portion 24. In the present embodiment, in order to avoid interference between first connection portion 27 where horizontal surface portion 26 of first lead holding member 15 is connected to vertical surface portion 28 and second connection portion 31 where horizontal surface portion 30 of second lead holding member 16 is connected to vertical surface portion 32, second connection portion 31 has notch 40. The notch portion 40 is a non-interfering portion for preventing the first connection portion 27 and the second connection portion 31 from interfering with each other. The cutout portion 40 is, for example, a chamfered portion. In addition, the non-interference portion may be provided on the first connection portion 27. Alternatively, the non-interference portion may be provided in both the first connection portion 27 and the second connection portion 31. The first connection portion 27 and the second connection portion 31 may also be referred to as corner portions.

Since the notch 40 is formed in one of the corner 27 of the first lead holding member 15 and the corner 31 of the second lead holding member 16, the two corners 27 and 31 do not interfere with each other. Since the two corner portions 27 and 31 do not interfere with each other, the first lead holding member 15 and the second lead holding member 16 can be tightly fitted to each other in the longitudinal direction of the first lead holding member 15. According to this configuration, since the play in the longitudinal direction of the first lead holding member 15 can be reduced, the holding property of the lead 1a is further improved, the lead 1a does not shift in the longitudinal direction of the first lead holding member 15 during welding, and the workability (for example, workability during welding work performed in a state where the lead 1a is held by the lead holding member 3) is good. Further, since the vibration is small, the vibration resistance during the welding operation is excellent, and the reliability of the welding quality is high.

Fig. 20 is a perspective view of the state of fig. 8 viewed from another angle. The operation of soldering the lead 1a to the upper surface 4b of the substrate 1 will be described with reference to fig. 20.

As shown in fig. 20, the core wires (conductors) 2 of the lead 1a are held by the lead holding member 3 so as to be exposed on the upper surface 4b of the substrate 4. In this state, since the lead 1a is fixed to the substrate 4, the welding operator does not need to hold the lead 1a with his or her own hand when welding the core wire 2 of the lead 1a to the upper surface 4b of the substrate 4. That is, if the lead holding member 3 of the present embodiment is used, the lead 1a can be fixed in a predetermined position with respect to the substrate 4 in advance. Therefore, the soldering operator can perform the soldering operation of the lead 1a by holding the soldering iron and the solder with his hand. Solder is attached to the region of symbol S in fig. 20. At this time, the solder in a molten state flows into the recessed portion 14 of the second lead holding member 16. The recess 14 is a portion where solder recedes. During the soldering operation, the solder stays in the concave portion 14, and therefore the solder can be prevented from flowing to a place other than the region S. The recess 14 of the present embodiment is formed by a slope.

Next, the structure in the vicinity of the lead outlet 70 will be described in detail with reference to fig. 7 and 21 to 24.

Fig. 21 is a perspective view of the lead wire exit 70 as viewed from the + Z axis direction to the-Z axis direction. A lead outlet holding member 74 is provided at the lead outlet 70 of the second housing 57. As shown in fig. 7, the lead outlet holding member 74 has a sealing member 76 and a cover member 78. The lead outlet holding member 74 is fixed to the second housing 57 by a bolt (small screw) 75.

Fig. 22 shows a state where the cover member 78 is removed from the state of fig. 21. The second housing 57 has a mounting surface (fixing surface) 73 for mounting the cover member 78 at the lead outlet 70. The mounting surface 73 is a surface perpendicular to the Z-axis direction. A female screw hole 75a into which the bolt 75 is screwed is formed in the attachment surface 73. Further, the mounting surface 73 is formed with an opening 73a into which the sealing member 76 is inserted. In the present embodiment, the sealing member 76 is an elastic resin member, and is press-fitted into the opening 73 a.

Fig. 23 is a perspective view of the second case 57 cut along line XXIII-XXIII in fig. 22. The opening 73a has a predetermined depth in the Z-axis direction, and a projection determining the depth of the opening 73a extends in a direction perpendicular to the Z-axis direction, and the seal member 76 is positioned in the Z-axis direction by contacting the projection. The cross section of the opening 73a is slightly smaller than the cross section of the sealing member 76 when viewed from a plane perpendicular to the Z-axis direction. Therefore, when the sealing member 76 is inserted into the opening 73a, the sealing member 76 is pressed into the opening 73 a.

Fig. 24 is a perspective view of the seal member 76. The sealing member 76 has a rectangular parallelepiped shape. The sealing member 76 has a hole 77 for passing the lead 1. More specifically, the sealing member 76 has a hole 77a for passing the lead wire 1a and a hole 77b for passing the lead wire 1 b. The diameter of hole 77a is smaller than the diameter of hole 77 b. The seal member 76 has a projection 79 on the side face 76 a. The protrusion 79 protrudes in a direction perpendicular to the Z-axis direction. The projection 79 extends annularly in the circumferential direction of the seal member 76. When the sealing member 76 is press-fitted into the opening 73a, the projection 79 is elastically deformed to be in close contact with the wall of the opening 73a, and therefore the sealing member 76 can prevent foreign matter and the like from entering the second case 57 from the lead outlet 70.

As described above, at the lead outlet 70 of the lead drawing portion 66, the lead outlet holding member 74 is fixed by the bolt (fixing member) 75. Since the lead 1a is held by the lead exit holding member 74, the posture of the lead 1a is maintained at a predetermined posture in the drawing direction.

Further, since the sealing member 76 is fitted to the inner wall of the opening 73a of the lead outlet 70, it is not necessary to newly secure a space for disposing the sealing member 76. Therefore, the second case 57 (lead drawing portion 66) can be downsized.

< Effect of the first embodiment >

In the present embodiment, the plurality of leads 1a can be held and fixed with respect to the bonding position (substrate pad 4 d). Since the plurality of leads 1a can be held and fixed at the bonding position, a hand for pressing the leads 1a is not required during the bonding operation. According to the present embodiment, the solder holding hand and the soldering iron holding hand are required as the hand for soldering.

Further, since the plurality of leads 1a can be held and fixed at the bonding position, the plurality of leads 1a can be collectively bonded. Therefore, according to the present embodiment, the efficiency of the welding work is improved.

Further, according to the present embodiment, since the lead 1a is pressed by the lead holding member 3, the lead 1a is not easily peeled off from the bonding portion.

Since the second wire holding member 16 can be detached from the first wire holding member 15, the second wire holding member 16 can be detached from the first wire holding member 15 after the welding operation is completed. When the second wire holding member 16 is detached from the first wire holding member 15, as shown in fig. 10.

Since the first lead holding member 15 can be detached from the substrate 4, the first lead holding member 15 can be detached from the substrate 4 after the soldering operation is completed. From the state of fig. 10, the first lead holding member 15 is detached. Further, after the first lead holding member 15 is detached from the substrate 4, the substrate 4 may be fixed to the second case 57 by the bolts 33. That is, the fixation of the first lead holding member 15 (or the lead holding member 3) to the second case 57 and the fixation of the substrate 4 to the second case 57 are independent, and even if the first lead holding member 15 is detached from the second case 57, the fixation of the substrate 4 to the second case 57 can be maintained.

In the electric oil pump 100, a signal is supplied to the substrate 4 via the lead 1. Thereafter, the substrate 4 supplies a signal to the motor. The motor is driven (rotated) according to the signal, and the rotor rotates when the motor rotates. When the rotor rotates, oil is supplied to the transmission 200. When electric oil pump 100 is mounted on an automobile, oil is supplied from electric oil pump 100 to transmission 200, for example, immediately after an idle stop.

In addition, the electric oil pump 100 may have the following structure.

The fitting of the first lead holding member 15 and the second lead holding member 16 is a snap fit, but the coupling of the first lead holding member 15 and the second lead holding member 16 may be other fitting (or engagement). The second wire holding member 16 may be configured to be detachable from the first wire holding member 15.

The hole 22 of the first lead holding member 15 may have a shape other than a rectangular shape. Alternatively, even if the hole 22 is not provided, the hole 22 may not be provided as long as the first lead holding member 15 has sufficient elasticity.

The second wire holding member 16 can be detached from the first wire holding member 15, but there may be a case where it is more preferable to maintain the state where the second wire holding member 16 is fixed to the first wire holding member 15. In this case, the combination of the second lead holding member 16 and the first lead holding member 15 may also be an inseparable combination.

The above-described structures can be combined appropriately within a range not inconsistent with each other.

< second embodiment >

Next, a second embodiment of the present invention will be described with reference to fig. 25 to 33. The lead holding member of the second embodiment has a different structure from the lead holding member of the first embodiment. In the following description, the same components as those of the first embodiment are denoted by the same reference numerals. Note that the same configurations as those of the first embodiment will not be described. The direction perpendicular to the side 4c of the substrate 4 is referred to as the Za-axis direction.

Fig. 25 is a view of the lead holding member 103 according to the second embodiment as viewed in the-X axis direction. Fig. 26 is a view corresponding to fig. 8, and is a perspective view of the lead holding member 103 according to the second embodiment, as viewed in the-X axis direction. Fig. 27 is a view corresponding to fig. 9, and is a perspective view of the substrate 4 and the lead holding member 103 as viewed in the + X axis direction. In fig. 27, the second case 57 is omitted. Fig. 28 is a perspective view of the first lead holding member 115 of the lead holding member 103 according to the second embodiment as viewed in the + X axis direction. Fig. 29 is a perspective view of the first lead holding member 115 of the lead holding member 103 of the second embodiment viewed in the-X axis direction. Fig. 30 is a perspective view of the second lead holding member 116 of the lead holding member 103 of the second embodiment viewed in the-X axis direction. Fig. 31 is a perspective view of the second lead holding member 116 of the lead holding member 103 according to the second embodiment, as viewed in the + X axis direction. Fig. 32 is a cross-sectional view taken along line XXXII-XXXII in fig. 25, showing a cross-section of the lead passage 101 of the lead holding member 103 according to the second embodiment. Fig. 33 is a sectional perspective view of fig. 32, which is turned upside down.

As shown in fig. 25, the lead holding member 103 of the second embodiment includes a lead path portion 101 covering at least a part of the lead 1a, and a fixing portion 105 fixing the lead path portion 101 to the substrate 4 so that the core wire (conductor) 2 of the lead 1a is exposed on the surface 4b of the substrate 4. Since the fixing portion 105 is fixed to the second housing (substrate housing) 57 by the bolt 33, the lead holding member 103 can also be said to be fixed to the second housing 57 by the bolt 33. The lead wires 1(1a, 1b) are bundled by the lead wire band 50 before entering the lead wire holding member 103.

As shown in fig. 26, the lead wire holding member 103 includes: a first lead holding member 115 having a fixing portion 105 fixed to the substrate 4; and a second lead holding member 116 engaged (coupled) with the first lead holding member 115. The relationship between the first and second lead holding members 115 and 116 and the lead passage portion 101 will be described later. Fig. 30 shows the second lead holding member 116 detached from the first lead holding member 115, and fig. 29 shows the first lead holding member 115 detached from the substrate 4. Unlike the first embodiment, in the present embodiment, the second lead holding member 116 is detached from the first lead holding member 115 by being pulled in a direction (the + Za axis direction) parallel to the upper surface 4b of the substrate 4, and is pressed in the-Za axis direction, thereby being fitted (coupled) to the first lead holding member 115. When the claw 184a of the second lead holding member 116 is engaged with the recess 182a of the first lead holding member 115, the second lead holding member 116 is fitted (coupled) to the first lead holding member 115. At this time, side portion protrusion 182b of first lead holding member 115 is fitted into side portion groove 184b of second lead holding member 116.

The recess 182a of the first lead holding member 115 and the claw 184a of the second lead holding member 116 may be referred to as a first fitting portion. Side projection 182b of first lead holding member 115 and side groove 184b of second lead holding member 116 may be referred to as a second fitting portion. The claw 184a is an example of a convex portion, and if it can be engaged with the concave portion 182a, it may be replaced with a convex portion having a shape other than the claw. The side projection 182b is an example of a convex portion, and may be replaced with a convex portion having another shape. The side groove 184b is an example of a recess, and may be replaced with a recess having a shape other than a groove.

In the present embodiment, the fitting of the side projection 182b and the side groove 184b is configured to withstand a load larger than the fitting of the recess 182a and the claw 184 a.

In the present embodiment, the direction along the side 4c of the substrate 4 is also referred to as the longitudinal direction of the lead holding member 103. As shown in fig. 29, the first lead holding member 115 has a main body portion 118 of a substantially rectangular parallelepiped shape extending in the longitudinal direction of the lead holding member 103, fixing portions 105 extending in the-Za axis direction from both ends of the main body portion 118, and a passage portion forming portion (extending portion) 119 provided on the opposite side of the main body portion 118 as viewed from the fixing portions 105. The fixing portion 105 is provided with a bolt hole 105 a. The bolt 33 passes through the bolt hole 105 a. The passage forming portion (extending portion) 119 extends from the surface 118a of the main body portion 118 facing the + Za direction. The body portion 118 has an upper surface 118b in the longitudinal direction.

Side projections 182b are provided on both sides of the passage forming portion (extending portion) 119. The side projection 182b extends from the surface 118a of the body portion 118 in the + Za direction. Five holes 120 having a truncated circular cross section are formed in the passage forming portion (extending portion) 119. The hole 120 extends in the Za direction. The lead 1a is exposed through the hole 120 on the substrate 4 side. The hole 120 is a hole parallel to the upper surface 4b of the substrate 4.

When the second lead holding member 116 is fitted with the first lead holding member 115, the passage forming portion (extended portion) 119 is covered by the second lead holding member 116 and is not visible.

As shown in fig. 28, the body portion 118 of the first lead holding member 115 has the protruding portion 106 protruding in the-Za direction. The protruding portion 106 has a surface 107 parallel to the upper surface 118b of the body portion 118 on both sides of the recess 182 a. The surface 107 is an opposing surface that faces the upper surface 4b of the substrate 4. When the first lead holding member 115 is mounted on the substrate 4, a part of the substrate 4 is covered with the protruding portion 106, and the lead 1a is sandwiched between the substrate 4 and the surface 107 of the protruding portion 106. According to the above configuration, since at least a part of the substrate 4 is covered with the extension portion 106, there is a portion where the lead path portion 101 overlaps the substrate 4. Since the lead 1a is sandwiched between the lead passage portion 101 and the substrate 4, the lead 1a can be firmly held. The state of the lead 1a can be maintained, and the work of soldering the lead 1a to the substrate 4 is facilitated.

As shown in fig. 30, the second lead holding member 116 includes a main body portion 122 extending in the longitudinal direction of the lead holding member 103, and an upper fitting portion 123 provided on an upper surface 122a of the main body portion 122. The upper fitting portion 123 includes a rectangular portion 123a, and a claw portion 184a provided on the rectangular portion 123 a. The claw portion 184a extends in the-X-axis direction. The rectangular portion 123a has an opening 124.

As shown in fig. 31, the body portion 122 of the second wire holding member 116 has a protruding portion 121 protruding in the-Za direction, side portions 126 formed on both sides of the protruding portion 121, and a body lower portion 128 located between the two side portions 126. A groove 127 is formed in the X-axis direction from the lower surface 122b of the body portion 122 (i.e., the lower surface of the body lower portion 128) of the second lead holding member 116. The groove 127 becomes a part of the lead path when the second lead holding member 116 is coupled with the first lead holding member 115. The groove 127 is a groove perpendicular to the upper surface 4b of the substrate 4. The groove 127 may be referred to as a vertical groove or a vertical groove in the following description. A side groove 184b is formed in the inner surface 126a of the side portion 126 of the body portion 122. The side groove 184b extends in the Za direction. As is apparent from fig. 26 and 27, in the present embodiment, the lead 1a enters from the lower side (X-axis direction) of the lead holding member 103, and is exposed on the upper surface 4b of the substrate 4 after changing the direction to the-Za direction in the lead holding member 103.

As shown in fig. 32, in a state where the first lead holding member 115 is mounted on the substrate 4 and the second lead holding member 116 is coupled to the first lead holding member 115, the lead passage portion 101 has, from the substrate 4 side toward the + Za direction: a first passage portion 111, a second passage portion 125, and a third passage portion (groove 127). The first passage portion 111 is formed on the first lead holding member 115. The second passage portion 125 is formed by overlapping the second lead holding member 116 and the first lead holding member 115. The third passage portion 127 is formed on the second lead holding member 116. A bent portion 180 is formed at a portion where the second passage portion 125 and the third passage portion 127 are connected. The bent portion 180 is bent at a predetermined angle. In the present embodiment, the bent portion 180 is bent at 90 degrees. Therefore, the lead path portion 101 includes a bent portion 180 bent at a predetermined angle. In the present embodiment, the bent portion 180 is formed on the second lead holding member 116. The bending angle of the bending portion 180 may be an angle other than 90 degrees. The predetermined angle also includes a case where the angle changes slowly (continuously). That is, the bending of the bent portion of the lead path portion also includes a state in which the direction of the lead gradually changes in the lead path portion. The third passage portion 127 may also be referred to as a vertical passage portion.

As described above, when the second lead holding member 116 is overlapped and fixed with the first lead holding member 115, the bent portion 180 of the lead passage portion 101 is formed at a portion where the second passage portion 125 and the third passage portion 127 are connected. Therefore, when the angle of the bent portion 180 is changed, only the second lead holding member 116 may be replaced. Therefore, the bending angle (orientation) of the lead 1a can be easily changed. Since the lead path portion 101 is formed only by connecting the first lead holding member 115 and the second lead holding member 116, assembly is also easy.

In the second passage portion 125, since the second lead holding member 116 is overlapped and fixed with the first lead holding member 115, the lead 1a can be held (vertically) between the first lead holding member 115 and the second lead holding member 116. Therefore, the lead 1a has good holding property.

The first path portion 111 formed on the first lead holding member 115 includes two portions. Specifically, the first passage portion 111 includes a first section 133 connected to the second passage portion 125, and a second section 134 extending from the first section 133 toward the substrate 4. The dimension D4 of the second section 134 in the diameter direction of the lead 1a is smaller than the diameter D2 of the covering portion 10 of the lead 1a and larger than the diameter of the core wire 2 of the lead 1 a. That is, the second section 134 is a small-diameter passage (section) having a smaller diameter than the first section 133. Therefore, when the lead 1a passes through the first passage portion 111, the coating portion (film portion) 10 of the lead 1a cannot pass through the second section (small-diameter passage) 134. Only the core wire 2 of the lead 1a passes through the second section 134 to reach the pad 4d of the substrate 4. Since the position of the covering portion 10 of the lead 1a is determined at the position where the first section 133 and the second section 134 are connected, the lead 1a can be positioned in the lead passage portion 101. Since the coating portion 10 of the lead 1a is not exposed on the upper surface of the substrate 4, the coating portion 10 of the lead 1a is not erroneously melted at the time of soldering.

In the present embodiment, the area (D6) of the second passage portion 125 in the diameter direction of the lead 1a is smaller than the area (D2) of the lead 1a in a state where the core wire 2 of the lead 1a is covered by the cover portion 10. Therefore, when the lead 1a passes through the second passage portion 125, the second passage portion 125 presses the outer diameter of the lead 1 a. As a result, the second passage portion 125 can firmly press the covering portion 10 of the lead 1a, and the lead holding property of the lead holding member 103 can be enhanced.

As is apparent from fig. 32, the lead path portion 101 extends parallel to the upper surface (front surface) 4b of the substrate 4 on the facing surface 107, and therefore the lead 1a extends substantially parallel to the upper surface 4b of the substrate 4 in the vicinity of the facing surface 107. In other words, the parallel passage 109 extending parallel to the upper surface 4b of the substrate 4 is defined by the first passage portion 111 and the second passage portion 125. The parallel passage 109 is a passage toward the facing surface 107. The lead 1a is exposed on the upper surface 4b of the substrate 4 by the lead holding member 103, and is soldered along the upper surface 4b of the substrate 4. As a result, the lead holding member 103 (lead passage portion 101) can be downsized. In particular, the height of the bonding site can be reduced, and the dimension of the lead holding member 103 (lead passage portion 101) in the height direction can be reduced. Accordingly, the entire product (for example, the electric oil pump 100) including the lead wire holding member 103 can also be downsized. When the third passage 127 is referred to as a vertical passage, the parallel passage 109 may be referred to as a horizontal passage.

When fixing the lead 1 to the substrate 4, first, the first lead holding member 115 is fixed to the substrate 4. Then, the lead 1a is passed through the second lead holding member 116. In this state, the leading end side of the lead 1a (the side that the operator wants to expose on the front surface of the substrate 4) protrudes largely from the main body portion 122 of the second lead holding member 116. Thereafter, the second lead holding member 116 is engaged with the first lead holding member 115 while the lead 1a protruding from the second lead holding member 116 is passed through the hole 120 of the first lead holding member 115. As a result, only the core wires 2 of the leads 1a are exposed on the upper surface 4b of the substrate 4. By configuring the lead path portion 101 with the two lead holding members 115 and 116 in this manner, the lead 1a can easily pass through the lead holding member 103 even if the bent portion 180 is provided in the lead path portion 101. In the case where the lead passage portion is formed of one member and has a bent portion inside, it is difficult to pass the lead through the lead passage portion.

When the lead 1a is exposed on the surface of the pad 4d of the substrate 4, the lead 1a is soldered to the substrate 4.

< Effect of the second embodiment >

According to the present embodiment, the following effects can be exhibited in addition to the effects of the first embodiment.

Since the lead path portion 101 is fixed to the substrate 4, the lead 1a can be held and fixed to the substrate 4 in a state where the bonding portion of the lead 1a (the core wire 2 of the lead) is exposed on the substrate 4. That is, since the lead 1a can be fixed at the bonding position, a hand for pressing the lead 1a is not required at the time of bonding work. Therefore, the hand required for the soldering work is a hand for holding solder and a hand for holding a soldering iron. As a result, the work of soldering the lead 1a to the substrate 4 can be easily performed. Further, since the lead passage portion 101 has the bent portion 180, the lead 1a is less likely to fall off from the lead holding member 103 than a case where the bent portion 180 is not provided (a case where the lead extends in a straight lead passage). Even if tension is applied to the lead 1a, the tension is received by the bent portion 180 of the lead path portion 101, and thus the load applied to the solder portion can be reduced. Therefore, the lead 1a can be prevented from coming off or the solder portion can be prevented from being broken.

The second lead holding member 116 is overlapped and fixed on the first lead holding member 115, the first lead holding member 115 is fixed on the substrate 4 via the fixing portion 105, and the lead 1a passes through the lead passage portion 101, so that the entire fixation of the substrate 4, the lead 1a, and the lead passage portion 101 becomes firm.

The first lead holding member 115 and the second lead holding member 116 are fixed to each other by fitting the concave portion and the convex portion. When tension is applied to the lead 1a, the load due to the tension is transmitted from the lead 1a to the second lead holding member 116, and then transmitted from the second lead holding member 116 to the fitting portion of the uneven portion, so that the load on the solder portion of the lead 1a is reduced, and the lead is prevented from falling off or breaking at the soldered portion.

First lead holding member 115 has a concave portion 182a and a side portion projection (convex portion) 182b, and second lead holding member 116 has a claw portion (convex portion) 184a and a side portion groove (concave portion) 184 b. When tension is applied to the lead 1a, the side portion protrusion 182b and the side portion groove 184b located in the longitudinal direction of the lead holding member 3 receive a larger load than the recessed portion 182a and the claw portion 184a located at the top portion. In the present embodiment, the engagement between the side projection 182b and the side groove 184b is configured to withstand a load larger than the engagement between the recess 182a and the claw 184a, and therefore the lead wire holding member 103 has a strong structure against the tension acting on the lead wire 1 a.

The second wire holding member 116 is detachable from the first wire holding member 15. Therefore, the second lead holding member 116 may be detached from the first lead holding member 115 after the welding operation is completed.

In addition, the first lead holding member 115 can be detached from the substrate 4. Therefore, after the soldering operation is completed, the first lead holding member 115 can be detached from the substrate 4.

Further, after the first lead holding member 115 is detached from the substrate 4, the substrate 4 may be fixed to the second case 57 by the bolts 33. That is, the fixation of the first lead holding member 115 (or the lead holding member 103) to the second case 57 and the fixation of the substrate 4 to the second case 57 are independent, and even if the first lead holding member 115 is detached from the second case 57, the fixation of the substrate 4 to the second case 57 can be maintained.