阅读说明：本技术 聚酰亚胺复合胶液、黑色哑光聚酰亚胺材料及制备和应用 (Polyimide composite glue solution, black matte polyimide material, preparation and application ) 是由 刘婷 刘亦武 胡峰 刘杰 江乾 彭军 段瑨 刘含茂 王进 许双喜 于 2021-01-20 设计创作，主要内容包括：本发明公开了一种聚酰亚胺复合胶液、黑色哑光聚酰亚胺材料及制备和应用,其包含可溶性聚酰亚胺胶液和均匀分散在其中的炭黑与消光粉颗粒,所述可溶性聚酰亚胺胶液由含侧基的芳香族二酐单体和含强极性官能团的芳香族二胺单体在非质子极性溶剂体系中经缩聚和化学亚胺化得到。本发明的填料均匀分散、储存稳定性良好的可溶性黑色哑光聚酰亚胺复合胶液,经蒸除溶剂可得到具有低透光率、低光泽度、高力学强度和优异电气绝缘性的黑色哑光聚酰亚胺材料,其透光率≤0.10％、光泽度≤32、拉伸强度≥120MPa、电气绝缘强度≥150kV/mm。(The invention discloses a polyimide composite glue solution, a black matte polyimide material, preparation and application thereof, wherein the polyimide composite glue solution comprises a soluble polyimide glue solution, and carbon black and matting powder particles uniformly dispersed in the soluble polyimide glue solution, wherein the soluble polyimide glue solution is obtained by performing polycondensation and chemical imidization on an aromatic dianhydride monomer containing a side group and an aromatic diamine monomer containing a strong polar functional group in an aprotic polar solvent system. The soluble black matte polyimide composite glue solution with uniformly dispersed fillers and good storage stability can be used for obtaining a black matte polyimide material with low light transmittance, low glossiness, high mechanical strength and excellent electrical insulation property by evaporating a solvent, wherein the light transmittance is less than or equal to 0.10%, the glossiness is less than or equal to 32, the tensile strength is greater than or equal to 120MPa, and the electrical insulation strength is greater than or equal to 150 kV/mm.)

1. The polyimide composite glue solution is characterized by comprising a soluble polyimide glue solution, and carbon black and matting powder particles uniformly dispersed in the soluble polyimide glue solution, wherein the soluble polyimide glue solution is obtained by performing polycondensation and chemical imidization on an aromatic dianhydride monomer containing a side group and an aromatic diamine monomer containing a strong polar functional group in an aprotic polar solvent system;

the aromatic dianhydride monomer containing the side group is selected from one or more than two of the following structural formulas:

wherein the side group R₁Or R₂Each independently selected from the group consisting of:

-H-CF₃

the aromatic diamine monomer containing the strong polar functional group is selected from one or more than two of the following structures:

2. the polyimide composite glue solution according to claim 1, wherein the carbon black is insulating carbon black, the blackness value is 180-320, the tinting strength is 50-150%, and the primary particle size is 10-100 nm.

3. The polyimide composite glue solution according to claim 1, wherein the matting powder is SiO₂、TiO₂Or one or more of BN.

4. A preparation method of the polyimide composite glue solution as described in any one of claims 1 to 3, characterized by comprising the following steps: adding carbon black slurry and matting powder dispersion into the soluble polyimide glue solution, and stirring and dispersing to obtain the polyimide composite glue solution; the carbon black slurry is obtained by sanding carbon black and an aprotic polar solvent, and the matting powder dispersion liquid is obtained by dispersing matting powder and the aprotic polar solvent.

5. The preparation method according to claim 4, wherein the addition amount of the carbon black slurry is 2.0-8.0 wt% of the soluble polyimide glue solution, and the mass fraction of the carbon black in the carbon black slurry is 5-15%.

6. The preparation method according to claim 4 or 5, wherein the addition amount of the matting powder dispersion is 2.0 to 8.0 wt% of the soluble polyimide glue solution, and the matting powder accounts for 5 to 15 wt% of the matting powder dispersion.

7. The method according to claim 4 or 5, wherein the aprotic polar solvent is one or more of DMF, DMAc, NMP or DMSO.

8. A preparation method of a black matte polyimide material is characterized in that the black matte polyimide material is obtained by evaporating a solvent from a polyimide composite glue solution obtained by the preparation method of any one of claims 4 to 7.

9. The black matte polyimide material obtained by the preparation method of claim 8 is characterized by having light transmittance of less than or equal to 0.10%, glossiness of less than or equal to 32, tensile strength of more than or equal to 120MPa and electrical insulation strength of more than or equal to 150 kV/mm.

10. The application of the black matte polyimide material as claimed in claim 9, wherein the black matte polyimide material is prepared into a black matte polyimide film material.

Technical Field

The invention belongs to the field of polyimide materials, and particularly relates to a polyimide composite glue solution, a black matte polyimide material, preparation and application thereof.

Background

Polyimide (sometimes abbreviated as PI) refers to a polymer having an imide ring (-CO-N-CO-) in its main chain, and is one of organic polymer materials having the best overall performance. Polyimide is used as a special engineering material and has been widely applied to the fields of aviation, aerospace, microelectronics, nano-scale, liquid crystal, separation membranes, laser and the like.

The black polyimide film material is widely applied to the electronic field as a functional polyimide film, and shows excellent physical and chemical properties, electrical insulation property and the like. The black matte polyimide film material is a series of products of black polyimide film materials, and is a film which is black, non-transparent, and low in light transmittance and reflection coefficient. The main application is satellite shell coating, opaque cover layer, radiant heat absorber, high temperature marking material and the like.

At present, the polyimide film is colored by adding carbon black pigment in most markets. In order to improve the dispersibility of the filler particles, when the black matte polyimide material is prepared by the prior art, a coupling agent is generally used for modifying the surfaces of the filler particles, the material performance is improved to a certain extent, the improvement effect is limited, and a complex modification procedure is added. For example, patent application CN201010148349.1 "a method for preparing a printable polyimide black film", mixing titanate coupling agent modified carbon black, titanate coupling agent modified nano calcium carbonate and matting agent into a PAA solution obtained by reacting 2, 5-o-dimethyl-p-biphenyldiamine and 3,3 ', 4, 4' -diphenyl sulfide tetracarboxylic dianhydride to prepare black PAA slurry, and performing casting drying, high-temperature thermal imidization treatment and 4 times of definite-ratio stretching to prepare a black PI film. The black polyimide material prepared by the patent has good mechanical property and insulating property, but the solubility of the black polyimide material in a solvent is poor, so that the diversity of processing modes of the black polyimide material is limited to a certain extent.

Disclosure of Invention

The technical problem to be solved by the invention is to overcome the defects and shortcomings mentioned in the background technology, and provide a polyimide composite glue solution, a black matte polyimide material, and preparation and application thereof, so as to improve the solubility of polyimide, improve the dispersibility of filler particles and simplify the preparation process.

In order to solve the technical problems, the technical scheme provided by the invention is as follows:

a polyimide composite glue solution comprises a soluble polyimide glue solution, and carbon black and matting powder particles uniformly dispersed in the soluble polyimide glue solution, wherein the soluble polyimide glue solution is obtained by performing polycondensation and chemical imidization on an aromatic dianhydride monomer containing a side group and an aromatic diamine monomer containing a strong polar functional group in an aprotic polar solvent system;

the aromatic dianhydride monomer containing the side group is selected from one or more than two of the following structural formulas:

wherein the side group R₁Or R₂Each independently selected from the group consisting of:

the aromatic diamine monomer containing the strong polar functional group is selected from one or more than two of the following structures:

in some embodiments, the carbon black is an insulating carbon black, the black value is 180 to 320, the tinting strength is 50 to 150%, and the primary particle size is 10 to 100 nm.

In certain embodiments, the matting powder is SiO₂、TiO₂Or one or more of BN.

The preparation method of the polyimide composite glue solution provided by the invention comprises the following steps: adding carbon black slurry and matting powder dispersion into the soluble polyimide glue solution, and stirring and dispersing to obtain the polyimide composite glue solution; the carbon black slurry is obtained by sanding carbon black and an aprotic polar solvent, and the matting powder dispersion liquid is obtained by dispersing matting powder and the aprotic polar solvent.

In some embodiments, the addition amount of the carbon black slurry is 2.0-8.0 wt% of the soluble polyimide glue solution, and the mass fraction of the carbon black in the carbon black slurry is 5-15%.

In some embodiments, the addition amount of the matting powder dispersion liquid is 2.0-8.0 wt% of the soluble polyimide glue solution, and the matting powder accounts for 5-15 wt% of the matting powder dispersion liquid.

In certain embodiments, the aprotic polar solvent is one or more of DMF, DMAc, NMP, or DMSO.

According to the preparation method of the black matte polyimide material, the polyimide composite glue solution obtained by the preparation method is evaporated to remove the solvent to obtain the black matte polyimide material.

In some embodiments, the black matte polyimide material of the invention is applied to preparing a black matte polyimide film material.

Compared with the prior art, the invention has the beneficial effects that:

(1) according to the invention, aromatic dianhydride containing side groups and aromatic diamine monomer containing strong polar functional groups are selected for copolymerization, and the side groups are introduced to destroy the compactness of polyimide molecule stacking and reduce intermolecular acting force; a strong polar functional group with affinity to the solvent is introduced to enhance the interaction force between molecules and the solvent, and the functional group has a space effect and can reduce the interaction force between molecules; the order and symmetry of macromolecular chains are disturbed by copolymerization of a plurality of monomers, the solubility of polyimide is improved under the combined action of the three monomers, and the processability is improved.

(2) According to the invention, diamine containing polar functional groups is used, and the polar functional groups can form interaction force with the surfaces of carbon black and matting powder filler particles, so that the filler particles can be uniformly dispersed in a resin matrix, the filler particles are prevented from settling and agglomerating, and a similar dispersing agent effect is achieved. The step of adding a dispersant during the preparation can be eliminated by introducing a diamine containing a polar functional group.

(3) The chemical imidization mode is selected, so that the orientation, crystallization and crosslinking of polyimide molecular chains caused by the thermal imidization mode are avoided, and the comprehensive performance is better.

(4) And adding the uniformly dispersed carbon black slurry/extinction powder dispersion liquid into the soluble polyimide glue solution to obtain the soluble black matte polyimide composite glue solution with uniformly dispersed fillers and good storage stability. The black matte polyimide material with low light transmittance, low glossiness, high mechanical strength and excellent electrical insulation can be obtained by evaporating the solvent, wherein the light transmittance is less than or equal to 0.10 percent, the glossiness is less than or equal to 32 percent, the tensile strength is greater than or equal to 120MPa, and the electrical insulation strength is greater than or equal to 150 kV/mm.

Detailed Description

In order to facilitate an understanding of the present invention, the present invention will be described more fully and in detail with reference to the preferred embodiments, but the scope of the present invention is not limited to the specific embodiments below.

Unless otherwise defined, all terms of art used hereinafter have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the present invention.

Unless otherwise specifically stated, various raw materials, reagents, instruments, equipment and the like used in the present invention are commercially available or can be prepared by existing methods.

The soluble black matte polyimide composite glue solution comprises a soluble polyimide glue solution and carbon black/matting powder particles uniformly dispersed in the soluble polyimide glue solution. The soluble polyimide glue solution is obtained by polycondensation and chemical imidization of aromatic dianhydride containing a side group and aromatic diamine monomer containing a strong polar functional group in an aprotic polar solvent system. The preparation method of the composite glue solution comprises the steps of adding the carbon black slurry and the matting powder dispersion into the soluble polyimide glue solution, and stirring and dispersing to obtain the composite glue solution. In one embodiment, the solid content of the soluble polyimide glue solution may be 10 to 30 wt%, and in each of the following embodiments 1 to 8, 15 wt%.

In one embodiment, the carbon black has a blackness value of 180 to 320, preferably 220 to 280, a tinting strength of 50 to 150, preferably 80 to 120, a primary particle size of 10 to 100nm, preferably 20 to 50nm, and the blackness value, tinting strength and particle size are within the above ranges, so that the carbon black has a good dispersion effect and a low light transmittance. It is insulating carbon black produced by a furnace method. And (3) sanding the carbon black and the aprotic polar solvent to obtain carbon black slurry (the mass fraction of the carbon black in the carbon black slurry can be 5-15%). The adding amount of the carbon black slurry is 2.0-8.0 wt% of the soluble polyimide glue solution, and preferably 3.0-6.0 wt%.

In one embodiment, the matting powder is SiO₂、TiO₂Or BN. And (3) processing the matting powder and the aprotic polar solvent by using a high-speed dispersion machine to obtain a matting powder dispersion liquid (the mass fraction of the matting powder in the matting powder dispersion liquid can be 5-15%). The addition amount of the matting powder dispersion liquid is 2.0-8.0 wt% of the soluble polyimide glue solution, and preferably 3.0-6.0 wt%.

Wherein, the aromatic dianhydride monomer containing the side group is composed of one or more of the following monomers.

The dianhydride has the following structural general formula:

wherein R is₁Or R₂Are all selected from the following side groups (R)₁Or R₂Not simultaneously H):

R₁or R₂The larger the group volume, the more favorable the reduction of intermolecular force and the more favorable the dissolution.

The aromatic diamine monomer containing the strong polar functional group is composed of one or more of the following monomers.

The higher the content of the strong polar group in the aromatic diamine monomer is, the more favorable the dissolution is; in addition, when the diamine monomer structure contains, for example, an-O-ether bond, the easier the molecular movement, the more favorable the dissolution.

Preferably, two or more diamines having the above structure are copolymerized with two or more dianhydrides to disorder the order and symmetry of the macromolecular chain, which contributes to the improvement of the solubility of polyimide.

In a specific embodiment, the aprotic polar solvent is one or more of DMF, DMAc, NMP, DMSO.

In a specific embodiment, the dehydrating agent in the chemical imidization reagent is one or more of acetic anhydride, trifluoroacetic anhydride, propionic anhydride and aromatic monocarboxylic acid anhydride, the catalyst is one or more of pyridine, lutidine, collidine, quinoline, isoquinoline, triethylamine and dimethylethanolamine, and the proportion of the dehydrating agent to the catalyst is 2-6: 1, preferably 2.5-3.5: 1.

The invention will be further illustrated with reference to the following specific examples.

Example 1

Adding 10.81g of dihydroxy benzidine, 13.60g of 3, 3' -dicarboxy benzidine and 335.64g of dry DMF (dimethyl formamide) into a 1000ml three-neck flask, stirring for 0.5h in an ice-water bath, after diamine is completely dissolved, slowly adding 20.12g of 3, 6-diphenoxy pyromellitic dianhydride and 14.71g of 3-phenyl pyromellitic dianhydride in batches, after the reaction is completely finished, adding 20g of chemical imidization reagent with the mass ratio of acetic anhydride to pyridine of 3:1, heating to 165 ℃, carrying out reflux reaction for 3-4 h, and purifying to obtain a soluble polyimide glue solution.

Sanding carbon black with the blackness value of 276, the tinting strength of 110 percent and the particle diameter of 17nm and dry DMF to obtain carbon black slurry with the mass fraction of 10 percent, namely SiO₂And treating the mixture and dry DMF by a high-speed dispersion machine to obtain the matting powder dispersion liquid with the mass fraction of 10%. Adding 5.0g of carbon black slurry and 5.0g of matting powder dispersion into 100.0g of soluble polyimide glue solution, and mechanically stirring and dispersing to obtain the soluble black matte polyimide composite glue solution.

Example 2

Adding 10.81g of dihydroxybenzidine, 7.00g of 4, 6-dihydroxy m-phenylenediamine and 298.24g of dry DMF (dimethyl formamide) into a 1000ml three-neck flask, stirring for 0.5h in an ice water bath, after the diamine is completely dissolved, slowly adding 20.12g of 3, 6-diphenoxy pyromellitic dianhydride and 14.71g of 3-phenyl pyromellitic dianhydride in batches, after the reaction is completely finished, adding 20g of chemical imidization reagent with the mass ratio of acetic anhydride to pyridine of 3:1, heating to 165 ℃, carrying out reflux reaction for 3-4 h, and purifying to obtain the soluble polyimide glue solution.

Sanding carbon black with the blackness value of 276, the tinting strength of 110 percent and the particle diameter of 17nm and dry DMF to obtain carbon black slurry with the mass fraction of 10 percent, namely SiO₂And treating the mixture and dry DMF by a high-speed dispersion machine to obtain the matting powder dispersion liquid with the mass fraction of 10%. Adding 5.0g of carbon black slurry and 5.0g of matting powder dispersion into 100.0g of soluble polyimide glue solution, and mechanically stirring and dispersing to obtain the soluble black matte polyimide composite glue solution.

Example 3

Adding 10.81g of dihydroxy benzidine, 7.00g of 2, 5-dihydroxy p-phenylenediamine and 298.24g of dry DMF (dimethyl formamide) into a 1000ml three-neck flask, stirring for 0.5h in an ice-water bath, after the diamine is completely dissolved, slowly adding 20.12g of 3, 6-diphenoxy pyromellitic dianhydride and 14.71g of 3-phenyl pyromellitic dianhydride in batches, after the reaction is completely finished, adding 20g of chemical imidization reagent with the mass ratio of acetic anhydride to pyridine of 3:1, heating to 165 ℃, carrying out reflux reaction for 3-4 h, and purifying to obtain the soluble polyimide glue solution.

Sanding carbon black with the blackness value of 276, the tinting strength of 110 percent and the particle diameter of 17nm and dry DMF to obtain carbon black slurry with the mass fraction of 10 percent, namely SiO₂And treating the mixture and dry DMF by a high-speed dispersion machine to obtain the matting powder dispersion liquid with the mass fraction of 10%. Adding 5.0g of carbon black slurry and 5.0g of matting powder dispersion into 100.0g of soluble polyimide glue solution, and mechanically stirring and dispersing to obtain the soluble black matte polyimide composite glue solution.

Example 4

10.81g of dihydroxybenzidine, 15.4g of 3, 5-bis (4-aminophenoxy) -1-hydroxymethylbenzene and 345.84g of dry DMF are added into a 1000ml three-neck flask, the mixture is stirred for 0.5h in an ice-water bath, after diamine is completely dissolved, 20.12g of 3, 6-diphenoxy-pyromellitic dianhydride and 14.71g of 3-phenyl-pyromellitic dianhydride are slowly added in batches, after the reaction is completely finished, 20g of chemical imidization reagent with the mass ratio of acetic anhydride to pyridine being 3:1 is added, the temperature is increased to 165 ℃, reflux reaction is carried out for 3-4 h, and the soluble polyimide glue solution is obtained after purification.

Sanding carbon black with the blackness value of 276, the tinting strength of 110 percent and the particle diameter of 17nm and dry DMF to obtain carbon black slurry with the mass fraction of 10 percent, namely SiO₂And treating the mixture and dry DMF by a high-speed dispersion machine to obtain the matting powder dispersion liquid with the mass fraction of 10%. Adding 5.0g of carbon black slurry and 5.0g of matting powder dispersion into 100.0g of soluble polyimide glue solution, and mechanically stirring and dispersing to obtain the soluble black matte polyimide composite glue solution.

Example 5

Adding 10.81g of dihydroxybenzidine, 10.80g of 5- (p-hydroxyphenoxy) m-phenylenediamine and 319.77g of dry DMF (dimethyl formamide) into a 1000ml three-neck flask, stirring for 0.5h in an ice water bath, after the diamine is completely dissolved, slowly adding 20.12g of 3, 6-diphenoxy pyromellitic dianhydride and 14.71g of 3-phenyl pyromellitic dianhydride in batches, after the reaction is completely finished, adding 20g of chemical imidization reagent with the mass ratio of acetic anhydride to pyridine of 3:1, heating to 165 ℃, carrying out reflux reaction for 3-4 h, and purifying to obtain a soluble polyimide glue solution.

Sanding carbon black with the blackness value of 276, the tinting strength of 110 percent and the particle diameter of 17nm and dry DMF to obtain carbon black slurry with the mass fraction of 10 percent, namely SiO₂Treating with dry DMF by high speed disperser to obtain mass fraction10% matting powder dispersion. Adding 5.0g of carbon black slurry and 5.0g of matting powder dispersion into 100.0g of soluble polyimide glue solution, and mechanically stirring and dispersing to obtain the soluble black matte polyimide composite glue solution.

Example 6

10.81g of dihydroxybenzidine, 12.20g of 3, 5-diaminobenzoic acid-1, 4-dimethanol monoester and 344.70g of dry DMF are added into a 1000ml three-neck flask, the mixture is stirred for 0.5h in an ice-water bath, after diamine is completely dissolved, 23.12g of 3, 6-bis (methoxyphenoxy) pyromellitic dianhydride and 14.71g of 3-phenyl pyromellitic dianhydride are slowly added in batches, after the reaction is completed, 20g of chemical imidization reagent with the mass ratio of acetic anhydride to pyridine being 3:1 is added, the mixture is heated to 165 ℃ for reflux reaction for 3-4 h, and the soluble polyimide glue solution is obtained after purification.

Sanding carbon black with the blackness value of 276, the tinting strength of 110 percent and the particle diameter of 17nm and dry DMF to obtain carbon black slurry with the mass fraction of 10 percent, namely SiO₂And treating the mixture and dry DMF by a high-speed dispersion machine to obtain the matting powder dispersion liquid with the mass fraction of 10%. Adding 5.0g of carbon black slurry and 5.0g of matting powder dispersion into 100.0g of soluble polyimide glue solution, and mechanically stirring and dispersing to obtain the soluble black matte polyimide composite glue solution.

Example 7

Adding 10.81g of dihydroxybenzidine, 14.55g of 4,4 '-diamino-4' -hydroxy triphenylamine and 341.02g of dry DMF (dimethyl formamide) into a 1000ml three-neck flask, stirring for 0.5h in an ice water bath, after diamine is completely dissolved, slowly adding 20.12g of 3, 6-diphenoxy pyromellitic dianhydride and 14.71g of 3-phenyl pyromellitic dianhydride in batches, after the reaction is completely finished, adding 20g of chemical imidization reagent with the mass ratio of acetic anhydride to pyridine of 3:1, heating to 165 ℃, carrying out reflux reaction for 3-4 h, and purifying to obtain a soluble polyimide glue solution.

Sanding carbon black with the blackness value of 276, the tinting strength of 110 percent and the particle diameter of 17nm and dry DMF to obtain carbon black slurry with the mass fraction of 10 percent, namely SiO₂And treating the mixture and dry DMF by a high-speed dispersion machine to obtain the matting powder dispersion liquid with the mass fraction of 10%. Adding 5.0g of carbon black slurry and 5.0g of matting powder dispersion into 100.0g of soluble polyimide glue solution, and mechanically stirring and dispersing to obtain the soluble black matte polyimide compositeAnd (5) glue solution.

Example 8

Adding 10.81g of dihydroxybenzidine, 10.00g of 2, 6-diamino-4-phenylphenol and 315.24g of dry DMF (dimethyl formamide) into a 1000ml three-neck flask, stirring for 0.5h in an ice water bath, after diamine is completely dissolved, slowly adding 20.12g of 3, 6-diphenoxy pyromellitic dianhydride and 14.71g of 3-phenyl pyromellitic dianhydride in batches, after the reaction is completely finished, adding 20g of chemical imidization reagent with the mass ratio of acetic anhydride to pyridine of 3:1, heating to 165 ℃, carrying out reflux reaction for 3-4 h, and purifying to obtain a soluble polyimide glue solution.

Sanding carbon black with the blackness value of 276, the tinting strength of 110 percent and the particle diameter of 17nm and dry DMF to obtain carbon black slurry with the mass fraction of 10 percent, namely SiO₂And treating the mixture and dry DMF by a high-speed dispersion machine to obtain the matting powder dispersion liquid with the mass fraction of 10%. Adding 5.0g of carbon black slurry and 5.0g of matting powder dispersion into 100.0g of soluble polyimide glue solution, and mechanically stirring and dispersing to obtain the soluble black matte polyimide composite glue solution.

The viscosity of the prepared soluble black matte polyimide composite glue solution was tested, and the results are shown in table 1. The viscosity was measured using a rotational viscometer. The viscosity data can better reflect the processing performance of the composite glue solution, and the following viscosity range is favorable for the coating processing technique of the composite glue solution to obtain a material with good surface and uniform thickness.

TABLE 1 viscosity of soluble black matte polyimide composite glue solution

The soluble black matte polyimide composite glue solution obtained in the embodiment is treated at 160-250 ℃ to remove the solvent by evaporation, the treatment time is 2 hours, the black matte polyimide material is obtained, the glass transition temperature, the light transmittance, the glossiness, the insulating strength, the tensile strength and the elongation of the black matte polyimide material are tested, and the related performance test results are summarized as shown in table 2.

TABLE 2 Performance data for black matte polyimide materials

The black matte polyimide material with low light transmittance, low glossiness, high mechanical strength and excellent electrical insulation can be obtained by the embodiment, and the light transmittance is less than or equal to 0.10%, the glossiness is less than or equal to 32, the tensile strength is greater than or equal to 120MPa, and the electrical insulation strength is greater than or equal to 150 kV/mm.

The foregoing is considered as illustrative of the preferred embodiments of the invention and is not to be construed as limiting the invention in any way. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention should fall within the protection scope of the technical scheme of the present invention, unless the technical spirit of the present invention departs from the content of the technical scheme of the present invention.