阅读说明：本技术 一种ct滑环导电盘成型方法 (Forming method of CT slip ring conducting disc ) 是由 李冰 刘益清 李琪 于 2021-07-01 设计创作，主要内容包括：本发明公开了一种CT滑环导电盘成型方法,包括以下步骤：(1)准备导电盘模具；(2)在环形铜板上一次性车削出铜板环槽；并将该环形铜板放入导电盘模具内；(3)准备浇注材料；(4)将材料分为A组分和B组分；(5)将A组分和B组分分别加入静态混料真空浇注设备中加热搅拌并真空脱泡；(6)在导电盘模具内表面喷涂聚四氟乙烯涂层并涂抹有机硅类脱模剂,并在恒温热风烘箱中加热并保温；(7)通过真空泵对模腔内气压抽真空,(8)通过静态混料真空浇注设备对模腔内进行浇注；(9)浇注完成后将导电盘模具进行加热固化及炉冷后进行脱模；(10)脱模后整体铣削成型。本发明能够实现批量化生产,且生产出来的导电盘同轴度高。(The invention discloses a method for forming a CT slip ring conducting disc, which comprises the following steps: (1) preparing a conductive disc mold; (2) turning a copper plate ring groove on the annular copper plate at one time; putting the annular copper plate into a conductive disc mold; (3) preparing a casting material; (4) dividing the material into a component A and a component B; (5) respectively adding the component A and the component B into static mixing vacuum pouring equipment, heating, stirring and defoaming in vacuum; (6) spraying a polytetrafluoroethylene coating on the inner surface of the conductive disc mould, smearing an organic silicon release agent, heating in a constant-temperature hot air oven and preserving heat; (7) vacuumizing the air pressure in the die cavity by a vacuum pump, (8) pouring the die cavity by static mixing vacuum pouring equipment; (9) after the pouring is finished, heating and curing the conductive disc mould, cooling the conductive disc mould in a furnace, and then demoulding; (10) and (5) integrally milling and forming after demolding. The invention can realize batch production, and the produced conductive disc has high coaxiality.)

1. A method for forming a CT slip ring conductive disc is characterized by comprising the following steps:

(1) preparing a conductive disc mold;

(2) turning a copper plate ring groove on the annular copper plate at one time; putting the annular copper plate into a conductive disc mold;

(3) preparing a casting material, wherein the casting material comprises E44 epoxy resin, methyl tetrahydrophthalic anhydride, polysebacic dianhydride, an accelerator, fumed silica and hollow glass beads;

(4) mixing E44 epoxy resin, fumed silica and hollow glass beads to obtain a component A; mixing methyl tetrahydrophthalic anhydride, polysebacic anhydride, an accelerator, fumed silica and hollow glass beads to obtain a component B;

(5) respectively adding the component A and the component B into static mixing vacuum pouring equipment, heating, stirring and defoaming in vacuum;

(6) spraying a polytetrafluoroethylene coating on the inner surface of the conductive disc mould, smearing an organic silicon release agent, heating to 85 ℃ in a constant-temperature hot air oven, and keeping the temperature for more than 30 min;

(7) communicating a discharge port of static mixing vacuum pouring equipment with a pouring hole of a conductive disc mold by using a polytetrafluoroethylene hose, and vacuumizing the pressure in a mold cavity of the conductive disc mold to be below 300pa by using a vacuum pump;

(8) mixing the component A and the component B through static mixing vacuum pouring equipment and pouring a conductive disc mold;

(9) after the pouring is finished, placing the conductive disc mold in a constant-temperature hot air oven for heating and curing, and demolding after heating and curing and furnace cooling to 60 ℃;

(10) and (5) integrally milling and forming after demolding.

2. The method for forming the CT slip ring conducting disc as claimed in claim 1, wherein the method comprises the following steps: in the step (5), the heating and stirring temperature is controlled to be 80 +/-3 ℃, and the vacuum defoaming time is more than 2 hours.

3. The method for forming the CT slip ring conducting disc as claimed in claim 1, wherein the method comprises the following steps: and (3) controlling the pouring flow rate to be 2L/min during pouring in the step (8), wherein the total pouring amount needs to exceed the volume of the die cavity of the conductive disc die by more than 0.5L.

4. The method for forming the CT slip ring conducting disc as claimed in claim 1, wherein the method comprises the following steps: the heating curing temperature and time in the step (9) are as follows: 100 ℃ (4h) +140 ℃ (2h) +180 ℃ (2 h).

5. The method for forming the CT slip ring conducting disc as claimed in claim 1, wherein the method comprises the following steps: 36-44% of E44 epoxy resin, 9-17% of methyl tetrahydrophthalic anhydride, 9-17% of polysebacic anhydride, 0.3-1.4% of accelerant, 6-14% of fumed silica and the balance of hollow glass beads.

6. The method for forming the CT slip ring conducting disc as claimed in claim 5, wherein the method comprises the following steps: the component A comprises 60% of the total amount of the gas phase white carbon black and the hollow glass beads, and the component B comprises 40% of the total amount of the gas phase white carbon black and the hollow glass beads.

7. The method for forming the CT slip ring conducting disc as claimed in claim 1, wherein the method comprises the following steps: the conductive disc mould comprises a mould bottom plate, a mould inner ring and a mould outer ring which are arranged on the mould bottom plate, and a mould cover plate which covers the mould inner ring and the mould outer ring;

the die bottom plate, the die inner ring, the die outer ring and the die cover plate enclose a die cavity;

the bottom plate department is equipped with the position of placing that supplies the annular copper to place, the annular copper is through placing the position and realizing that the annular copper puts into the conducting disc mould.

8. The method for forming the CT slip ring conducting disc as claimed in claim 7, wherein the method comprises the following steps: the mould cover plate is provided with a pouring hole and an air exhaust hole;

the pouring hole is connected with a discharge hole of static mixing vacuum pouring equipment through a hose so as to realize that the static mixing vacuum pouring equipment pours the conductive disc mold;

the air exhaust hole is connected with a vacuum pump so as to realize that the vacuum pump reduces the air pressure in the die cavity of the conductive disc die.

9. The method for forming the CT slip ring conducting disc as claimed in claim 8, wherein the method comprises the following steps: the pouring hole and the exhaust hole are arranged on opposite sides, and the pouring hole and the exhaust hole are both close to the edge of the mold cover plate.

10. The method for forming the CT slip ring conducting disc as claimed in claim 1, wherein the method comprises the following steps: the accelerant is 2-ethyl-4-methylimidazole.

Technical Field

The invention relates to the technical field of CT slip rings, in particular to a method for forming a conductive disc of a CT slip ring.

Background

The disc type slip ring is one of electric rotary connectors, can realize unlimited free rotation transmission of signals and power, and has the advantages that a single disc can be provided with loops on two sides, the axial width is short, the conductive disc is of an annular structure and the like; the disadvantage that the existing conductive slip ring needs to be installed in the center of a rotating shaft is overcome, and the conductive slip ring can be widely applied to large-scale security check machines, medical CT (computed tomography) and other equipment.

The size of the conductive disc of the CT slip ring is large, the diameter of the conductive disc can reach 1.5m, and the manufacturing process of the conductive disc in the current market cannot well meet the requirement of manufacturing the conductive disc with the outer diameter larger than 1m, so that the application of the conductive disc of the CT slip ring is influenced to a certain extent.

The manufacturing process of the CT slip ring conducting disc capable of realizing batch production is especially necessary.

Disclosure of Invention

The invention aims to solve the problems in the prior art, and provides a method for forming a CT slip ring conductive disc, which can realize batch production and can produce conductive discs with high coaxiality.

The technical scheme adopted by the invention for solving the technical problems is as follows: a method for forming a CT slip ring conductive disc comprises the following steps:

(1) preparing a conductive disc mold; (2) turning a copper plate ring groove on the annular copper plate at one time; putting the annular copper plate into a conductive disc mold; (3) preparing a casting material, wherein the casting material comprises E44 epoxy resin, methyl tetrahydrophthalic anhydride, polysebacic dianhydride, an accelerator, fumed silica and hollow glass beads; (4) mixing E44 epoxy resin, fumed silica and hollow glass beads to obtain a component A; mixing methyl tetrahydrophthalic anhydride, polysebacic anhydride, an accelerator, fumed silica and hollow glass beads to obtain a component B; (5) respectively adding the component A and the component B into static mixing vacuum pouring equipment, heating, stirring and defoaming in vacuum; (6) spraying a polytetrafluoroethylene coating on the inner surface of the conductive disc mould, smearing an organic silicon release agent, heating to 85 ℃ in a constant-temperature hot air oven, and keeping the temperature for more than 30 min; (7) communicating a discharge port of static mixing vacuum pouring equipment with a pouring hole of a conductive disc mold by using a polytetrafluoroethylene hose, and vacuumizing the pressure in a mold cavity of the conductive disc mold to be below 300pa by using a vacuum pump; (8) mixing the component A and the component B through static mixing vacuum pouring equipment and pouring a conductive disc mold; (9) after the pouring is finished, placing the conductive disc mold in a constant-temperature hot air oven for heating and curing, and demolding after heating and curing and furnace cooling to 60 ℃; (10) and (5) integrally milling and forming after demolding.

Further setting the following steps: in the step (5), the heating and stirring temperature is controlled to be 80 +/-3 ℃, and the vacuum defoaming time is more than 2 hours.

Further setting the following steps: and (3) controlling the pouring flow rate to be 2L/min during pouring in the step (8), wherein the total pouring amount needs to exceed the volume of the die cavity of the conductive disc die by more than 0.5L.

Further setting the following steps: the heating curing temperature and time in the step (9) are as follows: 100 ℃ (4h) +140 ℃ (2h) +180 ℃ (2 h).

Further setting the following steps: the casting material comprises the following components in percentage by mass: 36-44% of E44 epoxy resin, 9-17% of methyl tetrahydrophthalic anhydride, 9-17% of polysebacic anhydride, 0.3-1.4% of accelerant, 6-14% of fumed silica and the balance of hollow glass beads.

Further setting the following steps: the component A comprises 60% of the total amount of the gas phase white carbon black and the hollow glass beads, and the component B comprises 40% of the total amount of the gas phase white carbon black and the hollow glass beads.

Further setting the following steps: the conductive disc mould comprises a mould bottom plate, a mould inner ring and a mould outer ring which are arranged on the mould bottom plate, and a mould cover plate which covers the mould inner ring and the mould outer ring; the die bottom plate, the die inner ring, the die outer ring and the die cover plate enclose a die cavity; the mould bottom plate department is equipped with the position of placing that supplies the annular copper to place, the annular copper is through placing the position and realizing that the annular copper puts into the conducting disc mould.

Further setting the following steps: the mould cover plate is provided with a pouring hole and an air exhaust hole; the pouring hole is connected with a discharge hole of static mixing vacuum pouring equipment through a hose so as to realize that the static mixing vacuum pouring equipment pours the conductive disc mold; the air exhaust hole is connected with a vacuum pump so as to realize that the vacuum pump reduces the air pressure in the die cavity of the conductive disc die.

Further setting the following steps: the pouring hole and the exhaust hole are arranged on opposite sides, and the pouring hole and the exhaust hole are both close to the edge of the mold cover plate.

Further setting the following steps: the accelerant is 2-ethyl-4-methylimidazole.

The invention has the beneficial effects that:

1. the copper plate sliding grooves are formed by turning the annular copper plate once, so that the coaxiality of the copper plate sliding grooves in the annular copper plate is guaranteed, the annular copper plate is placed into the conductive disc mold, the inner and outer diameters of the conductive disc formed by pouring and the coaxiality of each conductive ring can be guaranteed, and compared with the traditional process, the coaxiality of the inner and outer diameters of the conductive disc and each conductive ring is improved, and the subsequent installation and use are facilitated.

2. Through the manufacturing of the conductive disc mould and the steps, the mass production of the conductive discs can be realized, and the quality of the produced conductive discs is high.

3. Simple convenient to use of electrically conductive dish mould, wherein the setting up of the position of plug hole and aspirating hole can make things convenient for static compounding vacuum pouring equipment and vacuum pump to its job connection more, and the while during operation can be better bleed the die cavity through the aspirating hole, through the static compounding vacuum pouring equipment of plug hole can be better carry out even pouring for the die cavity.

Drawings

Fig. 1 is a schematic view of a conductive disc mold of the present invention.

In the figure, 1 a mould bottom plate, 2 a mould outer ring, 3 a mould cover plate, 4 air extraction holes, 5 a mould inner ring, 6 an annular copper plate and 7 a pouring hole.

Detailed Description

The invention is further described below with reference to the accompanying drawings: :

as shown in fig. 1, the present invention comprises the steps of:

(1) preparing and manufacturing a conductive disc mold, wherein the conductive disc mold comprises a mold bottom plate, a mold inner ring and a mold outer ring which are arranged on the mold bottom plate, and a mold cover plate which covers the mold inner ring and the mold outer ring, wherein a mold cavity is defined by the mold bottom plate, the mold inner ring, the mold outer ring and the mold cover plate; wherein the bottom plate of the mold is provided with a placing position for placing the annular copper plate. Wherein, the mould cover plate is provided with a pouring hole and an air exhaust hole; the pouring hole and the exhaust hole are arranged on opposite sides, and the pouring hole and the exhaust hole are both close to the edge of the mold cover plate.

(2) Preparing an annular copper plate, and turning a copper plate ring groove on the annular copper plate at one time; and the annular copper plate is placed in a conductive disc mold and placed on a placement position.

(3) Preparing a casting material, wherein the casting material comprises E44 epoxy resin, methyl tetrahydrophthalic anhydride, polysebacic dianhydride, an accelerator, fumed silica and hollow glass beads.

Wherein the mass percent of the casting material is as follows: 36-44% of E44 epoxy resin, 9-17% of methyl tetrahydrophthalic anhydride, 9-17% of polysebacic anhydride, 0.3-1.4% of accelerant, 6-14% of fumed silica and the balance of hollow glass beads.

(4) Mixing E44 epoxy resin, fumed silica and hollow glass beads to obtain a component A; mixing methyl tetrahydrophthalic anhydride, polysebacic dianhydride, an accelerant, fumed silica and hollow glass beads to obtain a component B.

Wherein, 60 percent of the total amount of the gas-phase white carbon black and the hollow glass beads are distributed in the component A, and 40 percent of the total amount of the gas-phase white carbon black and the hollow glass beads are distributed in the component B.

(5) Respectively adding the component A and the component B into static mixing vacuum casting equipment, heating, stirring and vacuum defoaming for more than 2 hours, and controlling the temperature to be 80 +/-3 ℃.

(6) And spraying a polytetrafluoroethylene coating on the inner surface of the conductive disc mould, smearing an organic silicon type release agent, heating to 85 ℃ in a constant-temperature hot air oven, and keeping the temperature for more than 30 min.

(7) And communicating a discharge port of the static mixing vacuum pouring equipment with a pouring hole of the conductive disc mold by using a polytetrafluoroethylene hose, and vacuumizing the pressure in the mold cavity of the conductive disc mold to be below 300pa by using a vacuum pump.

(8) Mixing the component A and the component B through static mixing vacuum pouring equipment and pouring a conductive disc mold; and the pouring flow is controlled to be 2L/min during pouring, and the total pouring amount needs to exceed the volume of the die cavity of the conductive disc die by more than 0.5L.

(9) After the pouring is finished, placing the conductive disc mold in a constant-temperature hot air oven for heating and curing, wherein the curing temperature is as follows: heating to 100 deg.C (4h) +140 deg.C (2h) +180 deg.C (2h), and demoulding by furnace cooling to 60 deg.C, wherein the heating is performed at 100 deg.C for 4 hr, the heating is performed at 140 deg.C for 2 hr, and the heating is performed at 180 deg.C for 2 hr, and then the furnace cooling is performed to 60 deg.C.

(10) And (5) integrally milling and forming after demolding.

Wherein the accelerator is 2-ethyl-4-methylimidazole.

In the first embodiment: according to the steps, the mass percentage of the casting material is as follows: 40% of E44 epoxy resin, 13% of methyl tetrahydrophthalic anhydride, 13% of polysebacic anhydride, 0.7% of accelerator, 10% of fumed silica and the balance of hollow glass beads;

wherein, the component A is obtained by premixing 60 percent of the total mass of the fumed silica and the hollow glass beads and 40 percent of the E44 epoxy resin.

Wherein 40 percent of the total mass of the fumed silica and the hollow glass beads, methyl tetrahydrophthalic anhydride, polysebacic anhydride and an accelerator are premixed to obtain a component B.

The second embodiment: according to the steps, the casting materials comprise 36% of E44 epoxy resin, 9% of methyl tetrahydrophthalic anhydride, 9% of polysebacic anhydride, 0.3% of accelerator, 6% of fumed silica and the balance of hollow glass beads in percentage by mass;

wherein, the component A is obtained by premixing 60 percent of the total mass of the fumed silica and the hollow glass beads and 40 percent of the E44 epoxy resin.

Wherein 40 percent of the total mass of the fumed silica and the hollow glass beads, methyl tetrahydrophthalic anhydride, polysebacic anhydride and an accelerator are premixed to obtain a component B.

In the third embodiment: according to the steps, the casting materials comprise 44 mass percent of E44 epoxy resin, 17 mass percent of methyl tetrahydrophthalic anhydride, 17 mass percent of polysebacic anhydride, 1.4 mass percent of accelerant, 14 mass percent of fumed silica and the balance of hollow glass beads;

wherein, the component A is obtained by premixing 60 percent of the total mass of the fumed silica and the hollow glass beads and 40 percent of the E44 epoxy resin.

Wherein 40 percent of the total mass of the fumed silica and the hollow glass beads, methyl tetrahydrophthalic anhydride, polysebacic anhydride and an accelerator are premixed to obtain a component B.

The above embodiments are illustrative of the present invention, and are not intended to limit the present invention, and any simple modifications of the present invention are within the scope of the present invention.