阅读说明：本技术 陶瓷片切片的解胶及撕膜机构 (Ceramic wafer slicing glue-releasing and film-tearing mechanism ) 是由 唐亮 辛惠显 于 2021-08-18 设计创作，主要内容包括：本发明提供一种陶瓷片切片的解胶及撕膜机构,包括解胶平台,所述解胶平台上设置有解胶机构、撕膜机构、供料机械手以及用于放置陶瓷片的料仓,所述解胶机构用于使陶瓷片背面的胶膜失去粘性；所述撕膜机构用于将失去粘性的胶膜从陶瓷片上撕除；所述料仓用于放置陶瓷片切片；所述供料机械手用于吸附陶瓷片切片在不同工位之间的流转。本发明能够实现胶膜的快速解胶和撕除,提高了工作效率,满足自动化产线的需求。(The invention provides a debonding and film tearing mechanism for ceramic wafer slicing, which comprises a debonding platform, wherein the debonding platform is provided with a debonding mechanism, a film tearing mechanism, a feeding manipulator and a storage bin for placing a ceramic wafer, and the debonding mechanism is used for enabling a glue film on the back of the ceramic wafer to lose stickiness; the film tearing mechanism is used for tearing the adhesive film which loses viscosity from the ceramic sheet; the bin is used for placing ceramic chip slices; the feeding mechanical arm is used for adsorbing the ceramic chip slices to circulate among different stations. The glue film stripping device can realize quick glue stripping and tearing of a glue film, improves the working efficiency and meets the requirements of an automatic production line.)

1. The utility model provides a sliced debonding of potsherd and dyestripping mechanism which characterized in that: the glue dissolving platform is provided with a glue dissolving mechanism, a film tearing mechanism, a feeding mechanical arm and a storage bin for placing a ceramic wafer, wherein the glue dissolving mechanism is used for enabling a glue film on the back of the ceramic wafer to lose viscosity; the film tearing mechanism is used for tearing the adhesive film which loses viscosity from the ceramic sheet; the bin is positioned on the side surface of the feeding mechanical arm and used for placing ceramic chip slices; the execution end of the feeding manipulator is connected with a feeding sucker mechanism for adsorbing the circulation of the ceramic chip slices among different stations.

2. The debonding and film tearing mechanism for ceramic wafer slices of claim 1, characterized in that: the mechanism of debonding is including debonding lamp, lamp house and lamp controller, the debonding lamp is a plurality of parallel installations in the lamp house, the lamp house is fixed on the debonding platform, and the upper surface of lamp house is light-transmitting structure, the lamp controller sets up on the debonding platform and with the debonding lamp line connection for the operating condition of control debonding lamp.

3. The debonding and film tearing mechanism for ceramic wafer slices of claim 2, characterized in that: the film tearing mechanism is located on one side of the film separating mechanism and comprises a vertical plate, a clamping piece and a film tearing cylinder, the bottom of the vertical plate is fixed on the film separating platform, the clamping piece is fixed on the top of the vertical plate, one end of the clamping piece extends outwards to form a film clamping portion, the film tearing cylinder is fixed below the film clamping portion, and a push rod of the film tearing cylinder is opposite to the film clamping portion.

4. The debonding and film tearing mechanism for ceramic wafer slices of claim 1, characterized in that: the feed sucking disc mechanism includes revolving cylinder, revolving cylinder's cylinder body passes through cylinder spliced pole transverse connection and serves at the execution of feed manipulator, revolving cylinder's swing end can be in vertical plane gyration swing, and swings and serve fixed connection keysets, the upper and lower two sides of keysets are equipped with a set of sucking disc subassembly respectively, every group the sucking disc subassembly all includes sucking disc, Y shaped plate and sucking disc spliced pole, Y shaped plate fixed connection is on the surface of keysets, and connects a sucking disc spliced pole on the three branch of Y shaped plate respectively, just the top at the sucking disc spliced pole is fixed to the sucking disc, the back of sucking disc is equipped with the trachea joint, just the trachea joint communicates with the positive air flue of sucking disc.

5. The debonding and film tearing mechanism for ceramic wafer slices of claim 1, characterized in that: the device comprises at least one storage bin, a glue dissolving platform, a plurality of positioning columns and a plurality of glue dissolving devices, wherein the bottom of the storage bin base is fixed on the glue dissolving platform, the upper surface of the storage bin base is enclosed by the adjusting plate and the plurality of positioning columns into a rectangular material cavity with an opening on one side, and the opening of the rectangular material cavity faces to a feeding manipulator; at least one side surface of the rectangular material cavity is formed by a positioning column, and at least one side surface of the rectangular material cavity is formed by an adjusting plate; the adjusting plate can move on the upper surface of the stock bin base to adjust the size of the opening of the rectangular stock cavity.

6. The debonding and film tearing mechanism for ceramic wafer slices of claim 5, characterized in that: the bin base is provided with a guide sliding groove perpendicular to the plane of the adjusting plate, the bottom of the adjusting plate is provided with a guide strip matched with the guide sliding groove, and the guide strip is embedded into the guide sliding groove;

the two sides of the guide sliding groove of the bin base are respectively provided with a row of connecting holes, the bottom surface of the adjusting plate is provided with a waist-shaped through hole, the waist-shaped through hole is aligned with the connecting holes up and down, and the adjusting plate is connected and fixed on the bin base through screws arranged in the waist-shaped through hole and the connecting holes.

7. The debonding and film tearing mechanism for ceramic wafer slices of claim 1, characterized in that: the adsorption type discharging platform comprises an adsorption bottom plate, an adsorption upper plate and a backlight source, wherein the adsorption bottom plate is fixed on the embedding platform, the upper surface of the adsorption bottom plate is provided with a plurality of concentric annular gas grooves, the adsorption upper plate is fixed on the adsorption bottom plate, the adsorption upper plate is provided with adsorption gas holes, the adsorption gas holes are communicated with the annular gas grooves and used for adsorbing a ceramic wafer tray placed on the adsorption upper plate, and the surface of the ceramic wafer tray is also provided with adsorption gas holes and used for adsorbing and removing a ceramic wafer of an adhesive film; the ceramic wafer tray is of a transparent structure, and the backlight source is arranged below the ceramic wafer tray and used for illuminating the bottom of the ceramic wafer tray.

8. The debonding and film tearing mechanism for ceramic wafer slices of claim 1, characterized in that: the debonding platform includes the box and is used for supporting the support of fixed box, debonding mechanism, dyestripping mechanism, absorption formula blowing platform, feeding manipulator and feed bin all set up at the top of box, and the electric cabinet setting is in the side of box, and dyestripping mechanism, absorption formula blowing platform and feeding manipulator controller all set up in the inside of box, and the four corners of the bottom of box is equipped with universal castor, just the four corners of support is provided with the lower margin.

Technical Field

The invention relates to the technical field of PCB (printed circuit board) production equipment, in particular to a glue-stripping and film-tearing mechanism for ceramic chip slices.

Background

The ceramic chip is embedded in the PCB and mainly used for solving the problem that faults are caused by the fact that the PCB is aged and the service life of a high-power heating element on the PCB is shortened due to heat dissipation in the using process, so that the ceramic chip needs to be embedded in the position, corresponding to the high-power heating element, on the PCB, the position precision requirement is higher (plus or minus 0.005 mm), and the process is widely applied to foreign mainstream automobile lamp factories at present and is a necessary process for LED light sources and laser light source PCBs.

The raw material of the ceramic wafer is one piece and one piece, when in use, the whole ceramic wafer is required to be cut according to the required size and then is matched with the through hole formed in the PCB, so that the ceramic wafer on the PCB is placed. As shown in fig. 1, the cut ceramic sheet raw material includes an upper layer of ceramic sheet 1b and a lower layer of adhesive film 1a, in order to facilitate tearing off the adhesive film 1a, at least one corner position is reserved with a film tearing notch 1c, and the commonly used adhesive film 1a is a UV adhesive film.

In the process of embedding the ceramic wafer, the whole ceramic wafer is cut into small sizes, generally square or rectangular with the side length of several millimeters to tens of millimeters; because the size is smaller after cutting, the circulation is not convenient, therefore, a layer of glue film is pasted on the back of the whole ceramic wafer, and the small ceramic wafer after cutting is adhered on the glue film, so that the ceramic wafer is not easy to scatter and convenient to circulate. However, when the ceramic chip is placed in the through hole of the PCB, the adhesive film on the back of the ceramic chip needs to be removed first, and then the small ceramic chip can be placed in the through hole of the PCB. If manual operation is adopted, the ceramic wafer after cutting is small, the ceramic wafer is not easy to tear, long-time operation is easy to fatigue, the workload is large, and the efficiency is low. Therefore, the equipment capable of automatically removing the ceramic wafer adhesive film is designed to meet the requirements of the PCB production process.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: in order to overcome the defects in the prior art, the invention provides a glue-releasing and film-tearing mechanism for ceramic wafer slices.

The technical scheme adopted for solving the technical problems is as follows: the glue dissolving and film tearing mechanism for the ceramic wafer slices comprises a glue dissolving platform, wherein the glue dissolving platform is provided with a glue dissolving mechanism, a film tearing mechanism, a feeding mechanical arm and a storage bin for placing the ceramic wafer, and the glue dissolving mechanism is used for enabling a glue film on the back of the ceramic wafer to lose viscosity; the film tearing mechanism is used for tearing the adhesive film which loses viscosity from the ceramic sheet; the bin is positioned on the side surface of the feeding mechanical arm and used for placing ceramic chip slices; the execution end of the feeding manipulator is connected with a feeding sucker mechanism for adsorbing the circulation of the ceramic chip slices among different stations.

Further, the mechanism of debonding is including debonding lamp, lamp house and lamp controller, the debonding lamp is a plurality of parallel installations in the lamp house, the lamp house is fixed on the debonding platform, and the upper surface of lamp house is the printing opacity structure, the lamp controller sets up on the debonding platform and with the debonding lamp line connection for the operating condition of control debonding lamp. The light of the corresponding glue-releasing lamps of the glue films made of different materials is not necessarily the same, such as: the glued membrane on the ceramic wafer back is the UV glued membrane, therefore, generally adopts the ultraviolet lamp to the UV glued membrane debonding lamp, can make the UV glued membrane lose viscidity through the irradiation of ultraviolet ray, and although there is certain viscidity between the section with the ceramic wafer, nevertheless very easily tears the glued membrane through external force.

Further, in order to achieve removal of the adhesive film, the film tearing mechanism is designed by simulating manual film tearing, is located on one side of the film removing mechanism and comprises a vertical plate, a clamping piece and a film tearing cylinder, the bottom of the vertical plate is fixed on the film removing platform, the clamping piece is fixed on the top of the vertical plate, one end of the clamping piece extends outwards to form an adhesive film clamping portion, the film tearing cylinder is fixed below the adhesive film clamping portion, and a push rod of the film tearing cylinder is opposite to the adhesive film clamping portion. When the film is torn, the push rod of the film tearing cylinder moves upwards to clamp the adhesive film at the position of the film tearing notch of the ceramic wafer slice between the push rod and the adhesive film clamping part, and the ceramic wafer slice is driven by the feeding manipulator to move to tear the adhesive film.

Further, the feeding sucker mechanism comprises a rotary cylinder, the cylinder body of the rotary cylinder is transversely connected to the execution end of the feeding manipulator through a cylinder connecting column, the swinging end of the rotary cylinder can swing in a rotary manner in a vertical plane, and the swing end is fixedly connected with an adapter plate, the upper surface and the lower surface of the adapter plate are respectively provided with a group of sucker components, each group of sucker components comprises a sucker, a Y-shaped plate and a sucker connecting column, the Y-shaped plate is fixedly connected on the surface of the adapter plate, and the three branches of the Y-shaped plate are respectively connected with a sucker connecting column, the sucker is fixed at the top of the sucker connecting column, the sucker is fixed on the adapter plate through the sucker connecting column and the Y-shaped plate, the sucker connecting column is a stud, a nut is arranged on the sucker connecting column, locking of both ends about going on through the nut, the back of sucking disc is equipped with the air pipe and connects, just the air pipe connects and the positive air flue intercommunication of sucking disc.

All set up a set of sucking disc subassembly on the upper and lower two sides of keysets, can realize the sliced absorption of two potsherds simultaneously, can improve work efficiency, adopt revolving cylinder can satisfy the alternative of upper and lower two sets of sucking disc subassemblies.

Furthermore, the number of the bins is at least one, the bins comprise bin bases, at least one adjusting plate and a plurality of positioning columns, the bottoms of the bin bases are fixed on the dispergation platform, the adjusting plate and the plurality of positioning columns jointly enclose a rectangular material cavity with an opening on one side surface on the upper surface of the bin base, and the opening of the rectangular material cavity faces the feeding manipulator; at least one side surface of the rectangular material cavity is formed by a positioning column, and at least one side surface of the rectangular material cavity is formed by an adjusting plate; the adjusting plate can move on the upper surface of the stock bin base to adjust the size of the opening of the rectangular stock cavity. When the feed bin is a plurality of, the potsherd section of different specifications can be placed to every feed bin, satisfies the demand of the potsherd of equidimension not on the PCB board simultaneously.

Further, a guide sliding groove perpendicular to the plane of the adjusting plate is formed in the bin base, a guide strip matched with the guide sliding groove is arranged at the bottom of the adjusting plate, and the guide strip is embedded into the guide sliding groove; when the adjusting plate moves, the guide is carried out, the shape of the rectangular bin is convenient to maintain, and therefore the positioning and material storage of ceramic wafer slices can be better achieved.

The two sides of the guide sliding groove of the bin base are respectively provided with a row of connecting holes, the bottom surface of the adjusting plate is provided with a waist-shaped through hole, the waist-shaped through hole is aligned with the connecting holes up and down, and the adjusting plate is connected and fixed on the bin base through screws arranged in the waist-shaped through hole and the connecting holes. The position of the adjusting plate can be adjusted conveniently according to the size of the ceramic chip slices through the connecting holes, the waist-shaped through holes can achieve fine adjustment of the position of the adjusting plate, and therefore the same bin can meet the requirement for placing the ceramic chip slices of different sizes.

Furthermore, in order to realize the loading of the ceramic wafer, the ceramic wafer unloading device also comprises at least one adsorption type discharging platform fixed on the gel-releasing platform, wherein the adsorption type discharging platform comprises an adsorption bottom plate, an adsorption upper plate and a backlight source, the adsorption bottom plate is fixed on the embedding platform, the upper surface of the adsorption bottom plate is provided with a plurality of concentric annular air grooves, the adsorption upper plate is fixed on the adsorption bottom plate, adsorption air holes are formed in the adsorption upper plate, the adsorption air holes are communicated with the annular air grooves and used for adsorbing a ceramic wafer tray placed on the adsorption upper plate, and adsorption air holes are also formed in the surface of the ceramic wafer tray and used for adsorbing and removing the ceramic wafer of the adhesive film; the small ceramic wafer after slicing is directly placed on the ceramic wafer tray due to the small size, and the gap between the adjacent small ceramic wafers is not easy to identify, so that the ceramic wafer tray is of a transparent structure, and the backlight source is arranged below the ceramic wafer tray and used for illuminating the bottom of the ceramic wafer tray. The ceramic plates are illuminated from the lower side of the ceramic plate tray through the backlight source, and light rays can penetrate through the cut gaps between the adjacent small ceramic plates, so that the camera can distinguish and determine the positions of the small ceramic plates conveniently.

Specifically, the debonding platform includes the box and is used for supporting the support of fixed box, debonding mechanism, dyestripping mechanism, absorption formula blowing platform, feeding manipulator and feed bin all set up at the top of box, and the electric cabinet setting is in the side of box, and dyestripping mechanism, absorption formula blowing platform and feeding manipulator controller all set up in the inside of box, and the four corners of the bottom of box is equipped with universal castor, just the four corners of support is provided with the lower margin.

The invention has the beneficial effects that: the glue-releasing and film-tearing mechanism for ceramic wafer slices provided by the invention can realize quick glue-releasing and tearing of a glue film, improves the working efficiency and meets the requirements of an automatic production line.

Drawings

The invention is further illustrated by the following figures and examples.

Fig. 1 is a schematic structural view of a ceramic chip sliced raw material.

Fig. 2 is a schematic perspective view of the glue-releasing and film-tearing mechanism.

Fig. 3 is a schematic top view of the glue-releasing and film-tearing mechanism.

Fig. 4 is a schematic structural diagram of the film tearing mechanism.

Fig. 5 is a schematic diagram of a film tearing process of the film tearing mechanism.

FIG. 6 is a schematic view of the feed suction cup mechanism.

Fig. 7 is a schematic structural diagram of the adsorption type discharge table.

Fig. 8 is a schematic structural view of a single silo.

Fig. 9 is a schematic structural diagram of a double-bin arrangement of large-size ceramic wafer slices.

Fig. 10 is a schematic structural diagram of small-sized ceramic wafer slices placed in a double bunker.

In the figure: 1. ceramic chip section, 1a, adhesive film, 1b, ceramic chip, 1c, film tearing gap, 2, film removing platform, 21, ground foot, 22, universal caster, 24, box, 3, film removing mechanism, 4, film tearing mechanism, 41, vertical plate, 42, film tearing cylinder, 43, clamping piece, 44, adhesive film clamping part, 5, adsorption type discharging platform, 51, ceramic chip tray, 52, adsorption upper plate, 53, adsorption bottom plate, 54, adsorption air hole, 55, annular air groove, 6, feeding sucker mechanism, 61, adapter plate, 62, Y-shaped plate, 63, air pipe joint, 64, sucker connecting column, 65, sucker, 66, air passage, 67, rotary cylinder, 68, cylinder connecting column, 7, bin, 71, bin base, 72, positioning column, 73, adjusting plate, 74, guide chute, 75, guide strip, 76, connecting hole, 77, kidney-shaped through hole, 8, waste box, 9, A feeding manipulator 10 and an electric cabinet.

Detailed Description

The present invention will now be described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, and merely illustrates the basic structure of the present invention in a schematic manner, and therefore it shows only the constitution related to the present invention.

As shown in fig. 2 and 3, the glue-releasing and film-tearing mechanism 4 for the ceramic wafer slice 1 comprises a glue-releasing platform 2, wherein the glue-releasing platform 2 is provided with a glue-releasing mechanism 3, a film-tearing mechanism 4, an adsorption type discharging platform 5, a feeding manipulator 9 and a bin 7 for placing a ceramic wafer 1b, and the glue-releasing mechanism 3 is used for enabling a glue film 1a on the back of the ceramic wafer 1b to lose viscosity; the film tearing mechanism 4 is used for tearing the adhesive film 1a losing viscosity from the ceramic sheet 1 b; the adsorption type discharging table 5 is used for placing the ceramic plate 1b after the adhesive film 1a is removed; the bin 7 is positioned on the side surface of the feeding manipulator 9 and used for placing the ceramic chip slices 1; the execution end of the feeding manipulator 9 is connected with a feeding sucker mechanism 6 for adsorbing the circulation of the ceramic chip slices 1 between different stations.

Wherein, the mechanism 3 of debonding is including debonding lamp, lamp house and lamp controller, the debonding lamp is a plurality of parallel installations in the lamp house, the lamp house is fixed on the debonding platform 2, and the upper surface of lamp house is the printing opacity structure, the lamp controller sets up on the debonding platform 2 and with the debonding lamp line connection for the operating condition of control debonding lamp. The light of the corresponding glue-releasing lamps of the glue films 1a made of different materials is not necessarily the same, such as: the adhesive film 1a on the back of the ceramic sheet 1b is a UV adhesive film, so that the UV adhesive film debonding lamp generally adopts an ultraviolet lamp, the UV adhesive film can lose viscosity by irradiation of ultraviolet rays, and although a certain viscosity exists between the UV adhesive film debonding lamp and the ceramic sheet slice 1, the adhesive film 1a can be easily torn off by external force.

As shown in fig. 4, in order to remove the adhesive film 1a, the invention designs a film tearing mechanism 4 by simulating manual film tearing, wherein the film tearing mechanism 4 is located at one side of the film removing mechanism 3 and comprises a vertical plate 41, a clamping piece 43 and a film tearing cylinder 42, the bottom of the vertical plate 41 is fixed on the film removing platform 2, the clamping piece 43 is fixed at the top of the vertical plate 41, one end of the clamping piece 43 extends outwards to form a section of adhesive film clamping portion 44, the film tearing cylinder 42 is fixed below the adhesive film clamping portion 44, and a push rod of the film tearing cylinder 42 is opposite to the adhesive film clamping portion 44.

As shown in fig. 5, the hollow arrows in the figure indicate the change of the film tearing state, and the small arrows indicate the moving direction of the ceramic chip slice 1. When the film is torn, the ceramic chip slice 1 moves along the arrow a direction to be close to the film tearing mechanism 4, so that the adhesive film 1a at the film tearing notch 1c of the ceramic chip slice 1 moves to the position below the adhesive film clamping part 44 and is positioned between the adhesive film clamping part 44 and the push rod of the film tearing cylinder 42, and the adhesive film 1a at the film tearing notch 1c of the ceramic chip slice 1 is clamped between the push rod and the adhesive film clamping part 44 by the upward movement of the push rod of the film tearing cylinder 42, thereby simulating the process of pinching the adhesive film 1a by fingers; in order to avoid collision between the ceramic sheet 1b and the adhesive film clamping portion 44 of the clamping piece 43, the ceramic sheet slice 1 is lifted upwards along the arrow b direction, then the ceramic sheet slice 1 is moved transversely along the arrow c direction, the adhesive film 1a at the bottom of the ceramic sheet slice 1 is torn off, and then the ceramic sheet 1b with the torn adhesive film 1a is placed on the adsorption type discharging table 5.

As shown in fig. 6, the feeding suction cup mechanism 6 comprises a rotary cylinder 67, the cylinder body of the rotary cylinder 67 is transversely connected to the execution end of the feeding manipulator 9 through a cylinder connecting column 68, the swing end of the rotary cylinder 67 can swing in a vertical plane and swing to end a fixedly connected adapter plate 61, the upper and lower surfaces of the adapter plate 61 are respectively provided with a set of suction cup components, each set of suction cup components comprises a suction cup 65, a Y-shaped plate 62 and a suction cup connecting column 64, the Y-shaped plate 62 is fixedly connected to the surface of the adapter plate 61, three branches of the Y-shaped plate 62 are respectively connected with a suction cup connecting column 64, the suction cup 65 is fixed to the top of the suction cup connecting column 64, the suction cup 65 is fixed to the adapter plate 61 through the suction cup connecting column 64 and the Y-shaped plate 62, the suction cup connecting column 64 is a stud, a nut is arranged on the upper surface, and the upper and lower ends are locked through the nut, the back of the sucking disc 65 is provided with an air pipe joint 63, and the air pipe joint 63 is communicated with an air passage 66 on the front of the sucking disc 65.

All set up a set of sucking disc subassembly on the upper and lower two sides of keysets 61, can realize the absorption of two potsherd section 1 simultaneously, can improve work efficiency, adopt revolving cylinder 67 can satisfy the alternation of two sets of sucking disc subassemblies from top to bottom.

In order to realize giving vision feed mechanism's potsherd 1b material loading, still including fixing on the platform 2 of debonding and be close to at least one absorption formula blowing platform 5 of caulking platform one side, absorption formula blowing platform 5 sets up in the periphery of debonding mechanism 3, it places nearby to be convenient for after the debonding dyestripping, and absorption formula blowing platform 5 need be close to potsherd 1b vision feed mechanism, the snatching of the caulking manipulator of the caulking process of being convenient for, can set up several at the platform 2 of debonding, then also set up several at the caulking platform, be convenient for place potsherd 1b of different sizes.

As shown in fig. 7, the adsorption type discharging table 5 includes an adsorption bottom plate 53, an adsorption upper plate 52 and a backlight source (not shown in the figure), the adsorption bottom plate 53 is fixed on the embedding platform 1, the upper surface of the adsorption bottom plate 53 is provided with a plurality of concentric annular air grooves 55, the adsorption upper plate 52 is fixed on the adsorption bottom plate 53, the adsorption upper plate 52 is provided with adsorption air holes 54, the adsorption air holes 54 are communicated with the annular air grooves 55 and used for adsorbing the ceramic wafer tray 51 placed on the adsorption upper plate 52, and the surface of the ceramic wafer tray 51 is also provided with adsorption air holes 54 for adsorbing and removing the ceramic wafer 1b of the adhesive film 1 a; the ceramic wafer tray 51 is of a transparent structure, and the backlight source is arranged below the ceramic wafer tray 51 and used for illuminating the bottom of the ceramic wafer tray 51, so that the ceramic wafer tray is convenient to identify. The ceramic chip 1b may be cracked after being cut, so that in order to remove waste materials on the adsorption type material placing table 5, a waste material box 8 is further arranged on the embedding platform 1, and the waste material box 8 is used for placing unqualified ceramic chips 1 b. In this embodiment, the two adsorption type material placing tables 5 are respectively arranged on the glue dissolving platforms 2 on the two sides of the glue dissolving mechanism 3.

As shown in fig. 8-10, the storage bin 7 may be a single storage bin or a double storage bin, and specifically includes a storage bin base 71, at least one adjusting plate 73, and a plurality of positioning columns 72, the bottom of the storage bin base 71 is fixed on the dispergation platform 2, the upper surface of the storage bin base 71 is enclosed by the adjusting plate 73 and the plurality of positioning columns 72 to form a rectangular material cavity with an open side, and an opening of the rectangular material cavity faces the feeding manipulator 9; at least one side surface of the rectangular material cavity is formed by a positioning column 72, and at least one side surface of the rectangular material cavity is formed by an adjusting plate 73; the adjusting plate 73 can move on the upper surface of the stock bin base 71 to adjust the opening size of the rectangular stock cavity. In this embodiment, each rectangular material chamber has an adjusting plate 73 and two sets of positioning posts 72, which are enclosed along three sides of the rectangular material chamber. A guide sliding groove 74 perpendicular to the plane of the adjusting plate 73 is arranged on the bin base 71, a guide strip 75 matched with the guide sliding groove 74 is arranged at the bottom of the adjusting plate 73, and the guide strip 75 is embedded into the guide sliding groove 74; when the adjusting plate 73 moves, the guiding is performed, so that the shape of the rectangular bin 7 is maintained conveniently, and the positioning and material storage of the ceramic chip slices 1 can be realized better. A row of connecting holes 76 are respectively arranged on two sides of the guide sliding groove 74 of the bin base 71, a waist-shaped through hole 77 is arranged on the bottom surface of the adjusting plate 73, the waist-shaped through hole 77 is vertically aligned with the connecting holes 76, and the adjusting plate 73 is connected and fixed on the bin base 71 through screws arranged in the waist-shaped through hole 77 and the connecting holes 76. The position of the adjusting plate 73 can be conveniently adjusted according to the size of the ceramic chip slice 1 through the plurality of connecting holes 76, and the adjusting plate 73 can be finely adjusted through the waist-shaped through hole 77, so that the ceramic chip slices 1 of different sizes can be placed in the same storage bin 7.

In this embodiment, there are four bins 7, two of the feeding manipulators 9 are disposed on each side, one of the two bins is a single bin, a rectangular material cavity is formed on the bin base 71, and the single bin is arranged in an inclined manner; the other is a double-bin, and two rectangular material cavities are arranged on the same bin base 71.

As shown in fig. 1, the debonding platform includes box 24 and the support that is used for supporting fixed box 24, debonding mechanism 3, dyestripping mechanism 4, absorption formula blowing platform 5, feeding manipulator 9 and feed bin all set up at the top of box 24, and electric cabinet 10 sets up in the side of box 24, and dyestripping mechanism 4, absorption formula blowing platform 5 and feeding manipulator 9 controller all set up in the inside of box 24, and the four corners of the bottom of box 24 is equipped with universal caster 22, just the four corners of support is provided with lower margin 21.

In light of the foregoing description of preferred embodiments in accordance with the invention, it is to be understood that numerous changes and modifications may be made by those skilled in the art without departing from the scope of the invention. The technical scope of the present invention is not limited to the contents of the specification, and must be determined according to the scope of the claims.