阅读说明：本技术 着色树脂组成物、及应用其的光阻结构、彩色滤光片和显示装置 (Colored resin composition, and photoresist structure, color filter and display device using the same ) 是由 陈亚柔 刘忠辉 张鸿伟 于 2021-06-16 设计创作，主要内容包括：一种着色树脂组成物,包括着色剂、碱可溶性树脂、聚合性不饱和化合物、光聚合起始剂以及溶剂,其中前述碱可溶性树脂包含一光固性树脂,且此光固性树脂的重量平均分子量(Mw)低于20000,氢氧化钾(KOH)滴定酸价是小于100mg/g。应用本揭露的着色树脂组成物的显示装置可避免因光阻局部脱落而使显示装置的像素所产生的露光缺陷,也可以大幅改善因缺陷光阻所产生的亮暗线不均而导致检测机误判光阻缺陷数目过高的问题。(A colored resin composition comprises a colorant, an alkali-soluble resin, a polymerizable unsaturated compound, a photopolymerization initiator and a solvent, wherein the alkali-soluble resin comprises a photocurable resin, the weight average molecular weight (Mw) of the photocurable resin is less than 20000, and the acid value of potassium hydroxide (KOH) is less than 100 mg/g. The display device using the coloring resin composition can avoid the exposure defect generated by the pixel of the display device due to the local falling of the photoresist, and can also greatly improve the problem of overhigh number of photoresist defects judged by a detection machine due to uneven bright and dark lines generated by the defective photoresist.)

1. A colored resin composition comprises a coloring agent, an alkali-soluble resin, a polymerizable unsaturated compound, a photopolymerization initiator and a solvent, wherein the alkali-soluble resin comprises a photocurable resin, the weight average molecular weight (Mw) of the photocurable resin is less than 20000, and the acid value of potassium hydroxide (KOH) titration is less than 100 mg/g.

2. The colored resin composition of claim 1, wherein the photocurable resin has a potassium hydroxide (KOH) titer of less than 55 mg/g.

3. The colored resin composition of claim 2, wherein the photocurable resin comprises-COOH groups in an amount of 3.5 to 31.2 mol% based on the photocurable resin.

4. The colored resin composition according to claim 1 or 2, wherein the weight average molecular weight of the photocurable resin is between 6000 and 20000.

5. The colored resin composition of claim 4, wherein the photocurable resin comprises-COOH groups in an amount of less than 7 mol% based on the photocurable resin.

6. The colored resin composition according to claim 1, wherein the ratio of the photocurable resin to the monomer of the polymerizable unsaturated compound is 6.7% to 300%.

7. The colored resin composition according to claim 1, wherein the photocurable resin of the alkali-soluble resin comprises a copolymer having a structure represented by the following formula (I):

wherein m, e, f and g are positive integers.

8. The colored resin composition according to claim 7, wherein the structure is represented by formula (I), wherein m is 1 to 10% of the polymer chain when the whole molecular chain is 100%; e accounts for 20-70% of the polymer chain; f accounts for 20-70% of the polymer chain; and g accounts for 1-35% of the high molecular chain.

9. The colored resin composition according to claim 7, wherein the copolymer having the structure represented by the formula (I) comprises: copolymers of dicyclopentanyl (meth) acrylate (TCDMA)/(methyl (meth) acrylate (MMA)/(glycidyl (meth) acrylate (GMA)/(meth) acrylic acid (MAA).

10. The colored resin composition according to claim 9, wherein the main chain of the copolymer having the structure represented by formula (I) comprises:

dicyclopentyl (meth) acrylate (TCDMA) in an amount of 3 mol% based on the main chain;

methyl (meth) acrylate (MMA), which is 70 to 27 mol% of the aforementioned main chain; and

glycidyl (meth) acrylate (GMA) in an amount of 27 to 70 mol% based on the aforementioned main chain.

11. The colored resin composition according to claim 1, wherein the alkali-soluble resin is in the range of 5 to 50% by weight based on the total weight of the colored resin composition as 100% by weight.

12. The colored resin composition according to claim 1, wherein the alkali-soluble resin further comprises a thermosetting resin.

13. The colored resin composition according to claim 12, wherein the thermosetting resin accounts for 8.9-10 wt% of the colored resin composition, and the photocurable resin accounts for 1.5-17.4 wt% of the colored composition.

14. The colored resin composition of claim 13, wherein the photocurable resin comprises 1.5-14.6 wt% of the colored composition, and the titrated acid value of potassium hydroxide (KOH) is less than 50 mg/g.

15. The colored resin composition according to claim 12, wherein the thermosetting resin has a weight average molecular weight of 5000 to 20000 and a titrated acid value of potassium hydroxide (KOH) of 100 to 120 mg/g.

16. The colored resin composition according to claim 15, wherein the-COOH group contained in the thermosetting resin accounts for 18 mol% or less than 18 mol% of the thermosetting resin.

17. The colored resin composition according to claim 12, wherein the weight average molecular weight of the thermosetting resin is less than 10000.

18. The colored resin composition according to claim 1, wherein the total amount of the colored resin composition is 100% by weight,

the colorant is in the range of 10 to 30 wt% of the colored resin composition;

the polymerizable unsaturated compound accounts for 5 to 50 weight percent of the coloring resin composition; and

the photopolymerization initiator is in the range of 0.1-10 wt% of the colored resin composition.

19. A photoresist structure, comprising the colored resin composition according to any one of claims 1 to 18 coated on a substrate and formed by baking, exposing and developing, wherein the photoresist structure is a convex body, and a vertical projection area of the convex body on the substrate is larger than a contact area between a bottom surface of the convex body and the substrate.

20. The photoresist structure of claim 19 wherein the top of the convex body has a curvature that forms a gap between a most distant point of an edge of the convex body and a location where the bottom surface of the convex body contacts the substrate.

21. The photoresist structure of claim 19, wherein a perpendicular projection of a most distant point on an edge of the convex body on the substrate and a position where a bottom surface of the convex body contacts the substrate have a distance defined as an undercut depth, the undercut depth being less than 1 μm.

22. The photoresist structure of claim 21, wherein a parallel line is drawn parallel to the substrate at a highest vertex of the protrusion, a vertical line is drawn perpendicular to the substrate at the farthest point of the edge of the protrusion, wherein the parallel line and the vertical line form an angle equal to 90 degrees, and a cross section of the protrusion comprises an arc line segment between the parallel line and the vertical line.

23. A color filter formed from the colored resin composition according to any one of claims 1 to 18.

24. The color filter of claim 23, comprising a photoresist layer formed by applying the colored resin composition over a substrate and exposing and developing the same.

25. A display device comprising the color filter according to claim 23.

Technical Field

The present invention relates to a composition, a photoresist structure, a color filter and a display device using the same, and more particularly, to a colored resin composition, a photoresist structure, a color filter and a display device using the same.

Background

Display devices are commonly used in daily life, including various portable or non-portable electronic products, devices in workplaces, intelligent appliances, vehicles, or public uses, etc. to provide related information and/or interaction modes, so as to improve convenience and interest of users in life and work. The photoresist plays an important role in the display device. Taking a color liquid crystal display device as an example, a color filter is used in the color liquid crystal display device to display a color display screen. The color filter includes a photoresist layer of different colors, and a typical color filter includes four color photoresists, e.g., red, green, blue, and black. The optical characteristics of the color filter have a critical influence on the optical display effect of the color liquid crystal display device.

Although current photoresist compositions are generally adequate in the formation process, they do not fully satisfy all of the requirements, and various attempts and adjustments have been made to the photoresist compositions for color filters.

Disclosure of Invention

Some embodiments of the present invention disclose a colored resin composition comprising a colorant, an alkali-soluble resin, a polymerizable unsaturated compound, a photopolymerization initiator, and a solvent, wherein the alkali-soluble resin comprises a photocurable resin, the photocurable resin has a weight average molecular weight (Mw) of less than 20000, and a potassium hydroxide (KOH) titration acid value of less than 100 mg/g.

In some embodiments, the photocurable resin has a potassium hydroxide (KOH) titration acid value of less than 55 mg/g.

In some embodiments, the weight average molecular weight of the photocurable resin is less than 10000.

In some embodiments, the weight average molecular weight of the photocurable resin is between 6000 and 20000. Further, the photocurable resin contains-COOH groups, for example, in an amount of less than 7 mol% based on the photocurable resin.

Some embodiments of the present invention disclose a color filter, comprising a photoresist layer formed by applying the above-mentioned colored resin composition on a substrate and exposing and developing.

Some embodiments of the present invention disclose a display device, including the color filter. The color filter is formed by applying the colored resin composition above a substrate and curing.

Drawings

FIG. 1A is a schematic cross-sectional view of a photoresist structure formed from a currently pigmented resin composition;

FIG. 1B is a top view of a photoresist structure formed with a current colored resin composition;

FIG. 2A is a cross-sectional view of a photoresist structure formed with the colored resin compositions of some embodiments of the present disclosure;

FIG. 2B is a top view of a photoresist structure formed with the colored resin composition according to some embodiments of the present disclosure;

FIGS. 3A-3G are simplified schematic diagrams of the edge and undercut portions of a film layer in SEM images according to experiments 1-7, respectively;

FIGS. 4A to 4G are simplified schematic diagrams of the edge and undercut portions of the film layer in SEM images according to experimental examples 2-1 to 2-7, respectively;

FIGS. 5A to 5C are simplified schematic diagrams of the edge and undercut portions of the film layer in SEM images according to experimental examples 3-1 to 3-3, respectively;

FIGS. 6A to 6C are simplified schematic diagrams of the edge and undercut portions of the film layer in SEM images according to experimental examples 4-1 to 4-3, respectively;

wherein, the notation:

10,20,30,40,50,60: substrate 11,21,31,41,51,61: photoresist structure

21b bottom surface 21c arc line segment

d₀D undercut depth A₁Vertical projection area

A₂Contact area L1 parallel lines

L2 vertical line U_CGap for fixing a thread

a, b and c are points.

Detailed Description

In addition to the conventional liquid crystal display, the mainstream of the recent development of display technologies, such as Organic Light Emitting Diode (OLED) display, is becoming popular, and other new types of display technologies, such as Micro light emitting diode (Mini LED) and sub-millimeter Micro LED, which have promising market prospects, are also attracting attention. As various types of display technologies have been developed, the demand for resist characteristics has increased. Taking a display device including a color filter substrate as an example, a color resin composition may be used as a resist material to form a resist structure of a color filter on a substrate. In general, the composition of the colored resin composition can be adjusted and optimized to match various display applications, so as to form various color filters with predetermined characteristics, including forming photoresist structures with smaller undercut and complete profile, which is also one of the objectives of the industry. However, the photoresist structure formed on the substrate by the current colored resin composition is still easy to be undercut greatly or too deeply, and the defects such as partial peeling or incomplete profile are generated.

In addition, a general photoresist material may include a resin material as a Binder (Binder), a polymerizable unsaturated compound, a photopolymerization initiator, a solvent as a diluent liquid capable of dissolving other materials/compounds, and other additives (additives), so that the photoresist may be in a liquid form for convenient use. Typical photoresist materials can be classified into positive photoresist and negative photoresist due to their characteristics. The positive photoresist itself is difficult to dissolve in the developing solution, but after the reaction generated by light irradiation, the positive photoresist can be dissociated into an acidic high molecular compound which is easy to dissolve in the developing solution (alkaline); on the contrary, the negative photoresist (which is an acidic substance) is easily dissolved in the developing solution, but after the reaction caused by light irradiation, new polymer bonds are generated to strengthen the structure and is difficult to dissolve in the developing solution. The following description relates to negative photoresist as the photoresist material of some embodiments of the present disclosure.

FIG. 1A is a cross-sectional view of a photoresist structure formed with a conventional colored resin composition. FIG. 1B is a top view of a photoresist structure formed with a current colored resin composition. In the photoresist process, the exposure intensity is variedThe decreasing resist thickness results in insufficient cross-linking (Crosslink) at the bottom of the resist structure 11 near the substrate 10. Furthermore, during the development process of the photoresist, the bottom of the photoresist will have a certain undercut depth d due to the undercut effect₀. The photoresist structure 11 made of the present coloring resin composition has a slightly recessed top surface in cross section, and the extreme edge of the photoresist structure 11 and the bottom surface 11b of the contact substrate 10 have a larger undercut depth d₀As shown in fig. 1A. If the undercut is too deep, photoresist Peeling (Peeling) is easily caused during the developing process, for example, at the circled position in fig. 1B, the profile of the long photoresist structure 11 has a missing corner, which causes the pixels of the display device to be exposed, or the defect number of the photoresist is too high due to uneven bright and dark lines.

In order to meet the above requirements, embodiments of the present disclosure provide a colored resin composition, and a photoresist structure, a color filter and a display device formed by applying the colored resin composition. In some embodiments, the colored resin composition is coated on a substrate of a display device, and cured by baking and photolithography processes (e.g., exposure and development steps) to form a patterned photoresist layer, wherein the patterned photoresist layer comprises a plurality of photoresist structures. In some embodiments, the photoresist structure is a convex body. The embodiment provides a coloring resin composition which comprises an alkali-soluble resin, wherein one or more copolymers contained in the alkali-soluble resin can enable a formed photoresist structure to present a relatively perfect mushroom-shaped cross section after the coloring resin composition is exposed and developed, and the problem of over-deep undercut after the traditional coloring resin composition forms the photoresist structure is obviously improved.

Various embodiments are described in detail below, which are provided as examples only and do not limit the scope of the disclosure, but the disclosure can be implemented with other features, elements, methods, and parameters. The embodiments are provided only for illustrating the technical features of the present disclosure, and not for limiting the claims of the present disclosure. Those skilled in the art will recognize that various modifications and changes may be made in the embodiments without departing from the scope of the present disclosure.

FIG. 2A is a cross-sectional view of a photoresist structure formed with the colored resin composition according to some embodiments of the present disclosure. The colored resin composition of some embodiments comprises an alkali-soluble resin, a photocurable resin that the alkali-soluble resin may comprise, or a combination of the photocurable resin and the thermosetting resin, and the molecular weight and the acid value are appropriately matched, so that the colored resin composition of the embodiments has less difference in the degree of crosslinking between the upper portion (farther from the substrate 20) and the lower portion (closer to the substrate 20) of the photoresist layer formed on the substrate 20, thereby reducing the difference in the strength between the upper portion and the lower portion of the crosslinked composition. Therefore, when the colored resin composition of the embodiment is coated on the substrate 20 and the photolithography process is performed, the upper portion and the lower portion of the photoresist layer can have a small difference or even a similar lateral erosion resistance, so that the developed photoresist structure 21 has a good and complete shape, and the defect of over-deep undercut after the photoresist structure is formed by the conventional colored resin composition is also eliminated.

In some embodiments, as shown in FIG. 2A, the photoresist structure 21 on the substrate 20 is a convex body. For example, the photoresist structure 21 has a mushroom-shaped cross section, i.e., the top of the photoresist structure 21 is larger and the lower portion is slightly recessed. In some embodiments, a vertical projection area of the convex photoresist structure 21 on the substrate 20 is larger than a contact area between the bottom surface 21b of the photoresist structure 21 and the substrate 20. As shown in FIG. 2A, the photoresist structure 21 has a vertical projection area A on the substrate 20₁A contact area A is formed between the bottom surface 21b of the photoresist structure 21 and the substrate 20₂Wherein the area A is vertically projected₁Is larger than the contact area A₂The area of (a). According to some embodiments of the present disclosure, the colored resin composition is capable of forming the contact region A of the photoresist structure 21₂At least in the vertical projection area A₁94% to 100% of the area of (A).

In some embodiments, as shown in FIG. 2A, the top of the photoresist structure 21 is a curved surface. Furthermore, in some embodiments, the cross-section of the photoresist structure 21 also includes an arc-shaped line segment from the top toward the side edge. For example, a parallel line L1 is drawn parallel to the substrate 20 at a highest vertex of the convex body (e.g., point a indicated in fig. 2A), a vertical line L2 is drawn perpendicular to the substrate 20 at a farthest point of the edge of the convex body (e.g., point b indicated in fig. 2A), wherein the parallel line L1 and the vertical line L2 form an included angle equal to 90 degrees, and the cross-section of the convex body (e.g., along the XZ plane) includes an arc line segment 21c between the parallel line L1 and the vertical line L2.

Furthermore, in some embodiments, as shown in FIG. 2A, a gap U is formed between an extreme edge (e.g., point b indicated in FIG. 2A) of the cross-section (e.g., along the XZ plane) of the photoresist structure 21 perpendicular to the substrate 20 and a position where the bottom surface 21b of the convex body contacts the substrate 20_C. This gap U_CAlso called undercut (undercut), and this notch U_CThe depth in the direction along, for example, the X direction may also be referred to as an undercut depth (d).

In other words, as shown in fig. 2A, a perpendicular projection of a farthest point (e.g., the point b indicated in fig. 2A) of one of the edges of the photoresist structure 21 on the substrate 20 and a position (e.g., the point c indicated in fig. 2A) where the bottom surface 21b of the photoresist structure 21 contacts the substrate 20 have a distance in, for example, the X direction, where the distance is defined as an undercut depth d of the photoresist structure 21.

According to the colored resin composition of the present disclosure, the undercut depth d of the formed photoresist structure 21 may be less than about 1 μm. Therefore, compared to the photoresist structure 11 shown in fig. 1A, the photoresist structure 21 (shown in fig. 2A) formed on the substrate 20 by the colored resin composition of the embodiment can effectively improve the problem of the conventional photoresist material that the undercut depth is too deep after forming the photoresist structure.

FIG. 2B is a top view of a photoresist structure formed with the colored resin composition according to some embodiments of the present disclosure. Please refer to fig. 1B and fig. 2B simultaneously. Compared with the long photoresist structures 11 shown in fig. 1B, the long photoresist structures 21 (shown in fig. 2B) formed on the substrate 20 by the colored resin composition of the embodiment can have a complete profile without causing over-deep undercut, or defects such as partial Peeling (Peeling), or uneven bright and dark lines, which makes the defect number of the photoresist erroneously determined by the inspection machine to be too high, thereby affecting the manufacturing process.

Some embodiments of the present disclosure relate to a colored resin composition and applications thereof, including a photoresist structure formed using the colored resin composition, a color filter including the photoresist structure, and a display device including the color filter. In some embodiments, the colored resin composition comprises a colorant, an alkali-soluble resin, a polymerizable unsaturated compound, a photopolymerization initiator, and a solvent, wherein the alkali-soluble resin comprises a photocurable resin, the photocurable resin has a weight average molecular weight (Mw) of less than 20000, and a potassium hydroxide (KOH) titration acid value of less than 100mg KOH/g. The colored resin composition of the embodiment has good lateral erosion resistance, and can improve the problems of stripping or uneven bright and dark lines of the formed photoresist structure caused by a developing process. In some embodiments, the alkali soluble resin may comprise one or more photocurable resins, one or more thermosetting resins, or a combination of the foregoing resins.

In some embodiments, the colorant comprises from about 10 wt% to about 30 wt% of the colored resin composition, based on 100 wt% of the total colored resin composition; the alkali soluble resin is present in an amount of about 5 wt.% to about 50 wt.% of the colored resin composition; the polymerizable unsaturated compound is present in an amount of about 5 wt.% to about 50 wt.% of the colored resin composition; the photopolymerization initiator is about 0.1 wt% to about 10 wt% of the colored resin composition. In some embodiments, the alkali-soluble resin is an adhesive (Binder) that allows the colored resin composition to adhere to the surface of the substrate smoothly and effectively provides resistance against attack by acids, alkalis, or plasma.

In some embodiments, the colorant of the colored resin composition may comprise a pigment and a dye. The pigment of The colorant is not particularly limited, and known pigments can be used, and for example, compounds classified as pigments (pigments) in The color index (The Society of Dyers and Colourists publication) can be exemplified. According to some embodiments, the dye of the colorant is not particularly limited as long as it can be appropriately selected in accordance with the desired spectral spectrum of the color filter.

In some embodiments, the colorant comprises a green pigment and/or a yellow pigment and/or a blue pigment

In some embodiments, the pigment of the colorant refers to a dispersion including a green pigment and/or a yellow pigment and/or a blue pigment. In an embodiment, the green pigment and/or yellow pigment and/or blue pigment dispersion comprises a mixture of an acrylic pigment dispersant, a pigment dispersing resin and propylene glycol monomethyl ether acetate (propylene glycol monomethyl ether acetate) uniformly dispersed by a bead mill.

In some examples, as the green pigment in the colorant of the present invention, phthalocyanine pigments, azomethine metal complex pigments, and the like can be mentioned, and specifically, for example: c.i. pigment green 1, c.i. pigment green 4, c.i. pigment green 7, c.i. pigment green 8, c.i. pigment green 36, c.i. pigment green 58, and the like. In one embodiment, the colorant of the present invention may comprise a halogenated metal phthalocyanine pigment as a pigment. Examples of the halogenated metal phthalocyanine pigment include halogenated copper phthalocyanine pigments and halogenated zinc phthalocyanine pigments, and particularly preferred is a halogenated zinc phthalocyanine pigment containing c.i. pigment green 58, c.i. pigment green 59, and the like. In the present invention, c.i. pigment green 58 is particularly preferable.

In some embodiments, the colorant of the present invention may include a yellow pigment, and may be exemplified by monoazo pigments (monoazo pigments), monoazo lake pigments (monoazo lake pigments), disazo pigments (disazo pigments), anthraquinone pigments (anthraquinone pigments), monoazo pyrazolone pigments (monoazo pyrazolone pigments), condensed azo pigments (condensed azo pigments), isoindoline pigments (isoindoline pigments), benzimidazolone pigments (benzimidazolone pigments), azomethine metal complex pigments (azomethine metal complex pigments), quinophthalone pigments (quinophthalone pigments), quinoxaline pigments (quinoxaline pigments), and the like, and specifically, for example: c.i. pigment yellow 1, c.i. pigment yellow 2, c.i. pigment yellow 3, c.i. pigment yellow 4, c.i. pigment yellow 5, c.i. pigment yellow 6, c.i. pigment yellow 10, c.i. pigment yellow 12, c.i. pigment yellow 13, c.i. pigment yellow 14, c.i. pigment yellow 15, c.i. pigment yellow 16, c.i. pigment yellow 17, c.i. pigment yellow 18, c.i. pigment yellow 20, c.i. pigment yellow 24, c.i. pigment yellow 31, c.i. pigment yellow 32, c.i. pigment yellow 34, c.i. pigment yellow 35: 1. c.i. pigment yellow 36, c.i. pigment yellow 36: 1. c.i. pigment yellow 37, c.i. pigment yellow 37: 1. c.i. pigment yellow 40, c.i. pigment yellow 42, c.i. pigment yellow 43, c.i. pigment yellow 53, c.i. pigment yellow 55, c.i. pigment yellow 60, c.i. pigment yellow 61, c.i. pigment yellow 62, c.i. pigment yellow 63, c.i. pigment yellow 65, c.i. pigment yellow 73, c.i. pigment yellow 74, c.i. pigment yellow 77, c.i. pigment yellow 81, c.i. pigment yellow 83, c.i. pigment yellow 86, c.i. pigment yellow 93, c.i. pigment yellow 94, c.i. pigment yellow 95, c.i. pigment yellow 97, c.i. pigment yellow 98, c.i. pigment yellow 100, c.i. pigment yellow 101, c.i. pigment yellow 104, c.i. pigment yellow 106, c.i. pigment yellow 108, c.i. pigment yellow 109, c.i. pigment yellow 120, c.i. pigment yellow 119, c.i. pigment yellow 125, c.i. pigment yellow 115, c.i. pigment yellow 129, c.i. pigment yellow 115, c.i. pigment yellow 129, c.i. pigment yellow 114, c.i. pigment yellow 115, c.i. pigment yellow 126, c.i. pigment yellow 115, c.i. pigment yellow, C.i. pigment yellow 138, c.i. pigment yellow 139, c.i. pigment yellow 147, c.i. pigment yellow 148, c.i. pigment yellow 150, c.i. pigment yellow 151, c.i. pigment yellow 152, c.i. pigment yellow 153, c.i. pigment yellow 154, c.i. pigment yellow 155, c.i. pigment yellow 156, c.i. pigment yellow 161, c.i. pigment yellow 162, c.i. pigment yellow 164, c.i. pigment yellow 166, c.i. pigment yellow 167, c.i. pigment yellow 168, c.i. pigment yellow 169, c.i. pigment yellow 170, c.i. pigment yellow 171, c.i. pigment yellow 172, c.i. pigment yellow 173, c.i. pigment yellow 174, c.i. pigment yellow 175, c.i. pigment yellow 176, c.i. pigment yellow 177, c.i. pigment yellow 182, c.i. pigment yellow 179, c.i. pigment yellow 185, c.i. pigment yellow 194, c.i. pigment yellow 185, c.i. pigment yellow 193, c.i. pigment yellow 185, c.i. pigment yellow 194, c.i. pigment yellow 185, c.i. pigment yellow 194, c.i. pigment yellow 185, c.i. pigment yellow 194, c.i. pigment yellow 193, c.i. pigment yellow 185, c.i. pigment yellow 194, c.i. pigment yellow 185, etc. In the present invention, c.i. pigment yellow 138 is particularly preferable.

In some examples, as the blue pigment in the colorant of the present invention, blue pigments such as c.i. pigment blue 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 60, 64, 80, and the like can be cited. Alternatively, in some embodiments, the colorant may include a violet pigment such as c.i. pigment violet 1, 19, 23, 27, 29, 30, 32, 37, 40, 42, 50, and the like.

In some embodiments, pigments may be used alone or in combinations of two or more thereof to increase color purity.

In some embodiments, the colorant resin composition may have other pigments or dyes of green, yellow, blue, or other colors, in addition to the green pigment, yellow pigment, and/or blue pigment, according to the actual requirement.

In the present invention, the pigment and the dye may be used alone or in combination of two or more. Examples of the other pigments include yellow pigments, brown pigments, and violet pigments.

The dye usable in the examples is not particularly limited, and known dyes can be used, and examples thereof include solvent dyes, acid dyes, direct dyes, and mordant dyes. Examples of The dye include compounds classified as substances having a color tone other than pigments in The color index (published by The Society of Dyers and Colourists), and known dyes described in dyeing notes (color dyeing company). Further, depending on the chemical structure, azo dyes, cyanine dyes, triphenylmethane dyes, xanthene dyes, phthalocyanine dyes, naphthoquinone dyes, quinonimine dyes, methine dyes, azomethine dyes, squaraine dyes, acridine dyes, styryl dyes, coumarin dyes, cyanine dyes, anthraquinone dyes, azo dyes, squaraine dyes, dipyrromethene dyes, quinoline dyes, porphyrin dyes, quinoline dyes, nitro dyes, and the like can be cited.

In some embodiments, the colorant in the colored resin composition is preferably 5 to 50 parts by weight, more preferably 10 to 25 parts by weight, if the total weight of the colored resin composition is 100 parts by weight.

The colored resin composition may further contain a dispersant according to actual requirements, so that the colorant can be uniformly dispersed in the solution. Examples of the dispersant include cationic, anionic, nonionic, amphoteric, polyester, polyamine, and acrylic surfactants. These dispersants may be used alone, or 2 or more kinds may be used in combination. Examples of the pigment dispersant include KP (manufactured by shin-Etsu chemical Co., Ltd.), FLOREN (manufactured by Kyoho chemical Co., Ltd.), Solsperse (manufactured by zeneca Co., Ltd.), EFKA (manufactured by CIBA Co., Ltd.), Adisper (manufactured by Ajinomoto fine-technique Co., Ltd.), Disperbyk (manufactured by Bikk chemical Co., Ltd.), and the like, which are shown by trade names.

In some embodiments, the alkali-soluble resin of the colorant resin composition may comprise a resin monomer unit and a silane-based monomer unit, wherein the resin monomer unit contains an unsaturated double bond and/or an epoxy group.

In some embodiments, the alkali-soluble resin of the colorant resin composition may be selected from structures having alkane or cycloalkane side chains, and the side chain structure may include acid-branched functional groups or unsaturated bonds.

In some embodiments, the alkali-soluble resin of the colorant resin composition can be, for example, but not limited to, having (meth) acrylic acid-derived structural units.

In some embodiments, the alkali-soluble resin may be a copolymer having a constituent unit derived from the monomer (m2-1) and a constituent unit derived from a monomer having a cyclic ether structure with 2 to 4 carbon atoms and an ethylenically unsaturated bond (hereinafter referred to as "monomer (m 2-2)"). The above copolymer may contain other constituent units. Examples of the other constituent unit include a constituent unit derived from a monomer different from the monomer (m2-1) and the monomer (m2-2) (hereinafter referred to as "monomer (m 2-3)"), and a constituent unit having an ethylenically unsaturated bond. In the copolymer, the constituent units each contain only 1 type, and may contain 2 or more types.

Examples of the monomer (m2-1) include (1) unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid (MAA), Succinic Acid (SA), crotonic acid, and o-, m-, and p-vinyl benzoic acid; (2) unsaturated dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, 3-vinylphthalic acid, 4-vinylphthalic acid, 3,4,5, 6-tetrahydrophthalic acid, 1,2,3, 6-tetrahydrophthalic acid, dimethyltetrahydrophthalic acid, and 1, 4-cyclohexene dicarboxylic acid; (3) carboxyl group-containing bicyclic unsaturated compounds such as methyl-5-norbornene-2, 3-dicarboxylic acid, 5-carboxybicyclo [2.2.1] hept-2-ene, 5, 6-dicarboxybicyclo [2.2.1] hept-2-ene, 5-carboxy-5-methylbicyclo [2.2.1] hept-2-ene, 5-carboxy-5-ethylbicyclo [2.2.1] hept-2-ene, 5-carboxy-6-methylbicyclo [2.2.1] hept-2-ene and 5-carboxy-6-ethylbicyclo [2.2.1] hept-2-ene; (4) unsaturated dicarboxylic acid anhydrides such as maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, 3,4,5, 6-tetrahydrophthalic anhydride, 1,2,3, 6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, and 5, 6-dicarboxybicyclo [2.2.1] hept-2-ene anhydride; (5) unsaturated mono [ (meth) acryloyloxyalkyl ] esters of 2-or more-membered polycarboxylic acids such as succinic acid mono [2- (meth) acryloyloxyethyl ] ester and phthalic acid mono [2- (meth) acryloyloxyethyl ] ester; and (6) unsaturated acrylates containing a hydroxyl group and a carboxyl group in the same molecule, such as α - (hydroxymethyl) acrylic acid.

Among these, Acrylic Acid (AA), methacrylic acid (MAA), maleic anhydride and the like are preferable in view of copolymerization reactivity and solubility of the obtained resin in an aqueous alkali solution.

The monomer (m2-2) means, for example, a polymerizable compound having a cyclic ether structure having 2 to 4 carbon atoms (e.g., an oxirane ring, an oxetane ring, or a tetrahydrofuran ring) and an ethylenically unsaturated bond.

Examples of the monomer (m2-2) include a monomer (m2-2-1) (hereinafter, also referred to as "monomer (m 2-2-1)") having an oxiranyl group and an ethylenically unsaturated bond, a monomer (m2-2-2) (hereinafter, also referred to as "monomer (m 2-2-2)") having an oxetanyl group and an ethylenically unsaturated bond, a monomer (m2-2-3) (hereinafter, also referred to as "monomer (m 2-2-3)") having a tetrahydrofuranyl group and an ethylenically unsaturated bond, and the like.

Examples of the monomer (m2-2-1) include a monomer (m2-2-1a) (hereinafter, sometimes referred to as "monomer (m2-2-1 a)") having a structure in which a linear or branched aliphatic unsaturated hydrocarbon is epoxidized, and a monomer (m2-2-1b) (hereinafter, sometimes referred to as "monomer (m2-2-1 b)") having a structure in which an alicyclic unsaturated hydrocarbon is epoxidized.

As the monomer (m2-2-1a), a monomer having a glycidyl group and an ethylenically unsaturated bond is preferable. Examples of the monomer (m2-2-1a) include glycidyl (meth) acrylate (GMA), beta-methylglycidyl (meth) acrylate, beta-ethylglycidyl (meth) acrylate, glycidyl vinyl ether, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, alpha-methyl-o-vinylbenzyl glycidyl ether, alpha-methyl-m-vinylbenzyl glycidyl ether, alpha-methyl-p-vinylbenzyl glycidyl ether, 2, 3-bis (glycidoxymethyl) styrene, 2, 4-bis (glycidoxymethyl) styrene, 2, 5-bis (glycidoxymethyl) styrene, 2-bis (glycidoxymethyl) styrene, and, 2, 6-bis (glycidoxymethyl) styrene, 2,3, 4-tris (glycidoxymethyl) styrene, 2,3, 5-tris (glycidoxymethyl) styrene, 2,3, 6-tris (glycidoxymethyl) styrene, 3,4, 5-tris (glycidoxymethyl) styrene, 2,4, 6-tris (glycidoxymethyl) styrene and the like.

Examples of the monomer (m2-2-1b) include vinylcyclohexene monoxide, 1, 2-epoxy-4-vinylcyclohexane (for example, CELLOXIDE 2000; manufactured by Dailuo Co., Ltd.), (3, 4-epoxycyclohexylmethyl (meth) acrylate (for example, CYCLOMERA 400; manufactured by Dailuo Co., Ltd.), (3, 4-epoxycyclohexylmethyl (meth) acrylate (for example, CYCLOMERM 100; manufactured by Dailuo Co., Ltd.), and the like.

Examples of the monomer (m2-3) include methyl (meth) acrylate (MMA), ethyl (meth) acrylate, n-butyl (meth) acrylate, second butyl (meth) acrylate, t-butyl (meth) acrylate, 2-Ethylhexyl acrylate (2-Ethylhexyl acrylate; 2EHA), 2-Ethylhexyl (meth) acrylate, dodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, and 2-methylcyclo (meth) acrylateHexyl ester, tricyclo [5.2.1.0 ] meth (acrylic acid)^2,6]Decan-8-yl ester (in this technical field, as a common name, "(dicyclopentyl (meth) acrylate". Alter, tricyclodecanyl (meth) acrylate "may be mentioned) and tricyclo (meth) acrylate [5.2.1.0 ]^2,6](meth) acrylates such as dicyclopentenyl 8-decene (commonly known in the art as "dicyclopentenyl (meth) acrylate"), (meth) acrylates such as dicyclopentenyl ethyl (meth) acrylate, isobornyl (meth) acrylate, adamantyl (meth) acrylate, allyl (meth) acrylate, propargyl (meth) acrylate, phenyl (meth) acrylate, naphthyl (meth) acrylate, and benzyl (meth) acrylate (BZMA);

hydroxyl group-containing (meth) acrylates such as 2-hydroxyethyl (meth) acrylate (HEMA) and 2-hydroxypropyl (meth) acrylate;

dicarboxylic acid diesters such as diethyl maleate, diethyl fumarate and diethyl itaconate; bicyclo [2.2.1] hept-2-ene, 5-methylbicyclo [2.2.1] hept-2-ene, 5-ethylbicyclo [2.2.1] hept-2-ene, 5-hydroxybicyclo [2.2.1] hept-2-ene, 5-hydroxymethylbicyclo [2.2.1] hept-2-ene, 5- (2 '-hydroxyethyl) bicyclo [2.2.1] hept-2-ene, 5-methoxybicyclo [2.2.1] hept-2-ene, 5-ethoxybicyclo [2.2.1] hept-2-ene, 5, 6-dihydroxybicyclo [2.2.1] hept-2-ene, 5, 6-bis (hydroxymethyl) bicyclo [2.2.1] hept-2-ene, 5, 6-bis (2' -hydroxyethyl) bicyclo [2.2.1] hept-2-ene, 5, 6-dimethoxybicyclo [2.2.1] hept-2-ene, 5, 6-diethoxybicyclo [2.2.1] hept-2-ene, 5-hydroxy-5-methylbicyclo [2.2.1] hept-2-ene, 5-hydroxy-5-ethylbicyclo [2.2.1] hept-2-ene, 5-hydroxymethyl-5-methylbicyclo [2.2.1] hept-2-ene, bicyclic unsaturated compounds such as 5-tert-butoxycarbonylbicyclo [2.2.1] hept-2-ene, 5-cyclohexyloxycarbonybicyclo [2.2.1] hept-2-ene, 5-phenoxycarbonylbicyclo [2.2.1] hept-2-ene, 5, 6-bis (tert-butoxycarbonyl) bicyclo [2.2.1] hept-2-ene and 5, 6-bis (cyclohexyloxycarbonyl) bicyclo [2.2.1] hept-2-ene;

dicarbonylimide derivatives such as N-phenylmaleimide, N-Cyclohexylmaleimide (CHMI), N-benzylmaleimide, N-succinimidyl-3-maleimidobenzoate, N-succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidocaproate, N-succinimidyl-3-maleimidopropionate and N- (9-acridinyl) maleimide;

styrene, α -methylstyrene, m-methylstyrene, p-methylstyrene, vinyltoluenes, p-methoxystyrenes, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, 1, 3-butadiene, isoprene, 2, 3-dimethyl-1, 3-butadiene and the like.

Of these, styrene, vinyltoluene, 2-hydroxyethyl (meth) acrylate, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, bicyclo [2.2.1] hept-2-ene, and benzyl (meth) acrylate are preferable from the viewpoint of copolymerization reactivity and heat resistance.

The constituent unit having an ethylenically unsaturated bond may preferably be a constituent unit having a (meth) acryloyl group. The first adhesive polymer (B1) having such a structural unit can be obtained by reacting a polymer containing a structural unit derived from the monomer (m2-1) and a structural unit derived from the monomer (m2-2), and a monomer having a group reactive with the aforementioned structural unit and an ethylenically unsaturated bond.

Examples of the constituent unit having an ethylenically unsaturated bond include a constituent unit obtained by adding glycidyl (meth) acrylate to a (meth) acrylic acid unit, a constituent unit obtained by adding 2-hydroxyethyl (meth) acrylate to a maleic anhydride unit, a constituent unit obtained by adding (meth) acrylic acid to a glycidyl (meth) acrylate unit, and a constituent unit obtained by adding carboxylic anhydride to a constituent unit having a hydroxyl group.

In some embodiments, the alkali-soluble resin comprises a photocurable resin having a weight average molecular weight (Mw) of less than 20000 and a potassium hydroxide (KOH) titration acid value of less than 100mg KOH/g. The unit of the acid value of potassium hydroxide (KOH) titration is also referred to herein simply as mg/g. In some embodiments, the photocurable resin has a potassium hydroxide (KOH) titration acid value of less than 55 mg/g. In one embodiment, the alkali-soluble resin may include a copolymer having a structure represented by the following formula (I) (described below).

In some embodiments, the alkali-soluble resin of the colorant resin composition may, for example, comprise a copolymer having a structure represented by the following formula (I):

wherein m, e, f and g are positive integers.

In one example, when the total molecular chain is set to 100%, m accounts for 1-10% of the polymer chain, e accounts for 20-70% of the polymer chain, f accounts for 20-70% of the polymer chain, and g accounts for 1-35% of the polymer chain.

In some embodiments, the copolymer having the structure represented by formula (I) above contained in the alkali-soluble resin is a photocurable resin of a copolymer of dicyclopentanyl (meth) acrylate (TCDMA)/(methyl (meth) acrylate (MMA)/(glycidyl (meth) acrylate (GMA)/(meth) acrylic acid (MAA). Herein, the use of parentheses for describing the compound is meant to include the presence and absence of the parenthesized letters, such as the aforementioned dicyclopentyl (meth) acrylate, dicyclopentyl acrylate, and dicyclopentyl methacrylate.

In some embodiments, the backbone of the copolymer having the structure shown in formula (I) comprises: dicyclopentyl (meth) acrylate (TCDMA) in an amount of 3 mol% based on the main chain; methyl (meth) acrylate (MMA), which is 70 to 27 mol% of the aforementioned main chain; and glycidyl (meth) acrylate (GMA) in an amount of 27 to 70 mol% based on the main chain.

In some embodiments according to the present disclosure, the alkali-soluble resin comprises a photocurable resin such as the copolymer prepared in preparation examples 3-8.

Furthermore, in some embodiments, the alkali-soluble resin comprises a photocurable resin, such as but not limited to the structure shown in formula (I), which has a weight average molecular weight of less than 20000, and preferably has a titer of less than 55mg/g with potassium hydroxide (KOH); the weight average molecular weight is less than 10000, and the acid value of potassium hydroxide (KOH) is less than 100 mg/g.

In addition, according to some comparative examples, if the alkali-soluble resin comprises a photo-curable resin, such as but not limited to the structure shown in formula (I), and the weight average molecular weight is greater than 10000 and the titer of potassium hydroxide (KOH) is greater than 55mg/g, the formed photoresist structure may have a deeper undercut depth, and may have defects such as local Peeling (Peeling) or uneven bright and dark lines.

In some embodiments, the alkali-soluble resin comprises a photocurable resin, such as but not limited to the structure shown in formula (I), with a weight average molecular weight of less than 10000, and the photocurable resin comprises-COOH groups in an amount of about 3.5 mol% to about 31.2 mol% based on the photocurable resin. In some other embodiments, the photocurable resin has a weight average molecular weight of less than 10000, and the photocurable resin comprises-COOH groups in an amount of about 3.5 mol% to about 10 mol% based on the photocurable resin.

In some embodiments, the alkali-soluble resin comprises a photocurable resin, such as but not limited to the structure shown in formula (I), wherein the weight average molecular weight of the photocurable resin is between 6000 and 20000, and the content of-COOH groups in the photocurable resin is less than about 7 mol%.

In some embodiments, the alkali-soluble resin comprises a photocurable resin in a proportion (Binder/Monomer Ratio) of about 6.7% to about 300% relative to the monomers of the polymerizable unsaturated compound of the colored resin composition. In some other embodiments, the ratio of the photocurable resin to the monomer of the polymerizable unsaturated compound is about 6.7% to about 166.7%.

Furthermore, in some embodiments according to the present disclosure, the alkali-soluble resin of the colored resin composition may further include a thermosetting resin in addition to the photocurable resin. In some embodiments, the thermosetting resin may comprise a copolymer of EDCPA/methacrylic acid (MAA) with the trade name "E-DCPA" (manufactured by Dailuo Co., Ltd.) containing acrylic acid 3, 4-epoxy tricyclo [5.2.1.0 ]^2,6]Decane-8-yl ester with acrylic acid 3, 4-epoxytricyclo [5.2.1.0^2,6]Decan-9-yl ester at a molar ratio of 50: 50 of a mixture of the above. In some embodiments, the thermosetting resin includes one of the resin I-1 (shown in chemical formula 1-4), the resin I-2 (shown in chemical formula 1-5), the resin J-1 (shown in chemical formula 1-4), the resin J-2 (shown in chemical formula 1-5), the resin K-1 (shown in chemical formula 1-4), the resin K-2 (shown in chemical formula 1-5), or a combination thereof, which are prepared in preparation examples 9-11. Table III also shows the compositional ratio, molecular weight, and proportion of-COOH groups in resin I, J, K.

In some embodiments, the alkali soluble resin comprises a thermosetting resin having a weight average molecular weight of about 5000 to about 20000 and a potassium hydroxide (KOH) titration acid value of about 100mg/g to about 120 mg/g. In some other embodiments, the alkali-soluble resin comprises a thermosetting resin having a weight average molecular weight of less than about 10000.

In some embodiments, the alkali-soluble resin comprises about 8.9 wt% to about 10 wt% of the colored resin composition, and the alkali-soluble resin comprises about 1.5 wt% to about 17.4 wt% of the colored composition. In some other embodiments, the alkali soluble resin comprises about 1.5% to about 14.6% by weight of the coloring composition of the photocurable resin and has a potassium hydroxide (KOH) titration acid value of less than about 50 mg/g.

Further, in some embodiments, the alkali-soluble resin comprises a thermosetting resin comprising-COOH groups in an amount of about 18 mol% or less than about 18 mol% of the thermosetting resin. In one embodiment, the alkali-soluble resin comprises a thermosetting resin and a photocurable resin, wherein the thermosetting resin comprises-COOH groups in an amount of about 18 mol% based on the thermosetting resin, and the photocurable resin has a weight average molecular weight of less than 10000.

According to some embodiments, the polymerizable unsaturated compound of the colored resin composition may be a monomer that is polymerized by a reactive radical and/or an acid generated by a photopolymerization initiator, such as, but not limited to, an ethylenically unsaturated bond having polymerizability, such as a (meth) acrylate compound. Herein, the use of a compound described in parentheses is meant to include the presence and absence of the parenthetical letters, such as the aforementioned (meth) acrylate compound, the case of including an acrylate compound, and a methacrylate compound. The polymerizable unsaturated compound may also be referred to as a polymerizable compound.

In some embodiments, the polymerizable unsaturated compound is, for example, a photopolymerizable monomer, which may include, but is not limited to, at least one selected from the group consisting of: polymerizable compounds having one ethylenically unsaturated bond such as nonylphenyl carbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexyl carbitol acrylate, 2-hydroxyethyl acrylate, and N-vinylpyrrolone; polymerizable compounds having two ethylenically unsaturated bonds such as 1, 6-hexanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, bis (acryloyloxyethyl) ether of bisphenol A, and 3-methylpentanediol di (meth) acrylate; and trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tripentaerythritol octa (meth) acrylate, tripentaerythritol hepta (meth) acrylate, tripentaerythritol octa (meth) acrylate, tetrapentaerythritol deca (meth) acrylate, tetrapentaerythritol nona (meth) acrylate, tris (2- (meth) acryloyloxyethyl) isocyanate, ethylene glycol-modified pentaerythritol tetra (meth) acrylate, ethylene glycol-modified dipentaerythritol hexa (meth) acrylate, propylene glycol-modified pentaerythritol tetra (meth) acrylate, propylene glycol-modified dipentaerythritol hexa (meth) acrylate, caprolactone-modified pentaerythritol tetra (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol penta (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol, and the like, pentaerythritol, and the like, pentaerythritol, and the like, And a polymerizable compound having three ethylenically unsaturated bonds such as caprolactone hexa (meth) acrylate-modified dipentaerythritol ester. In some embodiments, the polymerizable unsaturated compound is, for example, a compound having an ethylenically unsaturated double bond. In some embodiments, the polymerizable unsaturated compound is, for example, a polymerizable compound having three ethylenically unsaturated double bonds.

Examples of commercially available products of the polymerizable unsaturated compound include KAYARAD (Japanese trademark) DPHA (Japanese Kayaku Co., Ltd.) and "A-TMM-3 LM-N" (pentaerythritol triacrylate; New Zhongcun chemical industry Co., Ltd.).

In some embodiments, the weight average molecular weight of the polymerizable unsaturated compound is, for example, 150 or more and 2,900 or less. In some embodiments, the weight average molecular weight of the polymerizable unsaturated compound is, for example, 250 or more and 1,500 or less.

In some embodiments, the polymerizable unsaturated compound may comprise about 1 to 10 wt% of the colored resin composition.

According to some embodiments, the photopolymerization initiator may be any compound capable of generating active radicals, acids, etc. by the action of light to initiate photopolymerization, and is not particularly limited.

In some embodiments, the photopolymerization initiator of the colored resin composition may include, but is not limited to, at least one selected from the group consisting of: o-acyloxime (O-acyloxime) compounds, alkylphenone compounds, bisimidazole compounds, triazine compounds, acylphosphine oxide (acylphosphine oxide), benzoin compounds, diphenylketone compounds, quinone compounds, 10-butyl-2-chloroacridone, benzyl, methyl phenylglyoxylate, acetophenone (acetophenone), and cyclopentadienyl titanium (titanocene) compounds.

In some embodiments, the photopolymerization initiator preferably comprises at least one selected from the group consisting of: o-acyloxime compounds, alkylphenone compounds, bisimidazole compounds, acetophenone compounds, triazine compounds, acylphosphine oxide compounds, and bisimidazole compounds. For example, in the case of using an O-acyloxime compound as the photopolymerization initiator (D), it is possible to useOXE-01(BASF corporation),Commercially available products such as OXE-02(BASF corporation) and N-1919(ADEKA corporation).

The O-acyloxime compound is a compound having a partial structure represented by the formula (d 1). Hereinafter, the bond end is denoted.

Examples of the O-acyloxime compounds include N-benzoyloxy-1- (4-phenylsulfanylphenyl) butane-1-one-2-imine, N-benzoyloxy-1- (4-phenylsulfanylphenyl) octane-1-one-2-imine, N-benzoyloxy-1- (4-phenylsulfanylphenyl) -3-cyclopentylpropane-1-one-2-imine, N-acetoxy-1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl ] ethane-1-imine, and N-acetoxy-1- [ 9-ethyl-6- { 2-methyl-4-yl ] ethane-1-imine - (3, 3-dimethyl-2, 4-dioxocyclopentylmethoxy) benzoyl } -9H-carbazol-3-yl ] ethane-1-imine, N-acetoxy-1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl ] -3-cyclopentylpropane-1-imine, N-benzoyloxy-1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl ] -3-cyclopentylpropane-1-one-2-imine and the like. Commercially available products such as IRGACURE OXE01, OXE02 (manufactured by BASF Co., Ltd.), N-1919 (manufactured by ADEKA Co., Ltd.) can be used. Among them, the O-acyloxime compound is preferably at least 1 selected from the group consisting of N-benzoyloxy-1- (4-phenylsulfanylphenyl) butan-1-one-2-imine, N-benzoyloxy-1- (4-phenylsulfanylphenyl) octan-1-one-2-imine and N-benzoyloxy-1- (4-phenylsulfanylphenyl) -3-cyclopentylpropane-1-one-2-imine, and more preferably N-benzoyloxy-1- (4-phenylsulfanylphenyl) octan-1-one-2-imine. In the case of these O-acyloxime compounds, color filters having high brightness tend to be obtained.

The alkylphenyl ketone compound is a compound having a partial structure represented by the formula (d2) or a partial structure represented by the formula (d 3). In these partial structures, the benzene ring may have a substituent.

Examples of the compound having a partial structure represented by the formula (d2) include 2-methyl-2-morpholino-1- (4-methylsulfanylphenyl) propan-1-one, 2-dimethylamino-1- (4-morpholinophenyl) -2-benzylbutan-1-one, and 2- (dimethylamino) -2- [ (4-methylphenyl) methyl ] -1- [4- (4-morpholinyl) phenyl ] butan-1-one. Commercially available products such as IRGACURE 369, 907, and 379 (manufactured by BASF) can be used.

Examples of the compound having a partial structure represented by the formula (d3) include 2-hydroxy-2-methyl-1-phenylpropan-1-one, 2-hydroxy-2-methyl-1- [4- (2-hydroxyethoxy) phenyl ] propan-1-one, 1-hydroxycyclohexylphenyl ketone, oligomers of 2-hydroxy-2-methyl-1- (4-isopropenylphenyl) propan-1-one, α -diethoxyacetophenone, benzildimethylketal, and the like.

In the moiety that senses brightness, as the alkylphenyl ketone compound, a compound having a partial structure represented by the formula (d2) is preferable.

Examples of the triazine compounds include 2, 4-bis-trichloromethyl-6-4-methoxyphenyl-1, 3, 5-triazine, 2, 4-bis-trichloromethyl-6-4-methoxynaphthyl-1, 3, 5-triazine, 2, 4-bis-trichloromethyl-6-piperonyl-1, 3, 5-triazine, 2, 4-bis-trichloromethyl-6-4-methoxystyryl-1, 3, 5-triazine, 2, 4-bis-trichloromethyl-6- [2- (5-methylfuran-2-yl) vinyl ] -1,3, 5-triazine, 2, 4-bis-trichloromethyl-6- [2- (furan-2-yl) vinyl ] -1,3, 5-triazine, 2, 4-bis trichloromethyl-6- [2- (4-diethylamino-2-methylphenyl) vinyl ] -1,3, 5-triazine, 2, 4-bis trichloromethyl-6- [2- (3, 4-dimethoxyphenyl) vinyl ] -1,3, 5-triazine, and the like.

Examples of the acylphosphine oxide compound include 2,4, 6-trimethylbenzoyldiphenylphosphine oxide and the like. Commercially available products such as IRGACURE (registered trademark) 819 (manufactured by BASF) can be used.

Examples of the biimidazole compound include 2,2' -bis (2-chlorophenyl) -4,4 ', 5,5 ' -tetraphenylbiimidazole, 2' -bis (2, 3-dichlorophenyl) -4,4 ', 5,5 ' -tetraphenylbiimidazole (see, for example, Japanese patent application laid-open Nos. 6-75372 and 6-75373), 2' -bis (2-chlorophenyl) -4,4 ', 5,5 ' -tetraphenylbiimidazole, 2' -bis (2-chlorophenyl) -4,4 ', 5,5 ' -tetrakis (alkoxyphenyl) biimidazole, 2' -bis (2-chlorophenyl) -4,4 ', 5,5 ' -tetrakis (dialkoxyphenyl) biimidazole, 2,2' -bis (2-chlorophenyl) -4,4 ', 5,5 ' -tetrakis (trialkoxyphenyl) biimidazole (see, for example, Japanese patent publication No. 48-38403 and Japanese patent publication No. 62-174204), and imidazole compounds in which the phenyl group at the 4,4 ', 5,5 ' -position is substituted with an alkoxycarbonyl group (see, for example, Japanese patent publication No. 7-10913).

Examples of other polymerization initiators include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzophenone compounds such as benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4 ' -methyldiphenyl sulfide, 3 ', 4,4 ' -tetrakis (t-butylperoxycarbonyl) benzophenone, and 2,4, 6-trimethylbenzophenone; quinone compounds such as 9, 10-phenanthrenequinone, 2-ethylanthraquinone, camphorquinone, etc.; 10-butyl-2-chloroacridone, benzil, methyl phenylglyoxylate, titanocene compounds, and the like. These polymerization initiators may be preferably used in combination with a polymerization initiator (particularly, an amine) described later.

Examples of the acid generator include onium salts such as 4-hydroxyphenyl dimethyl sulfonium-p-toluenesulfonate, 4-hydroxyphenyl dimethyl sulfonium hexafluoroantimonate, 4-acetoxyphenyl dimethyl sulfonium-p-toluenesulfonate, 4-acetoxyphenyl methylbenzyl sulfonium hexafluoroantimonate, triphenyl sulfonium-p-toluenesulfonate, triphenyl sulfonium hexafluoroantimonate, diphenyliodonium-p-toluenesulfonate and diphenyliodonium hexafluoroantimonate, nitrobenzyl tosylates and benzoin tosylates.

In some embodiments, the photopolymerization initiator may be about 0.1 wt% to about 10 wt% of the colored resin composition.

In some embodiments, the solvent of the colored resin composition may include, but is not limited to, at least one selected from the group consisting of: an ester solvent (herein, it means a solvent containing-COO-but not-O-in the molecule), an ether solvent (herein, it means a solvent containing-O-but not-COO-in the molecule), an ether ester solvent (herein, it means a solvent containing-COO-and-O-in the molecule), a ketone solvent (herein, it means a solvent containing-CO-but not-COO-in the molecule), an alcohol solvent (herein, it means a solvent containing OH but not-O-, -CO-and-COO-in the molecule), an aromatic hydrocarbon solvent, an amide solvent, dimethyl sulfoxide, etc.

Examples of the ester solvent include methyl lactate, ethyl lactate, butyl lactate, methyl 2-hydroxyisobutyrate, ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, cyclohexanol acetate, and γ -butyrolactone.

Examples of the ether solvent include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, 3-methoxy-1-butanol, 3-methoxy-3-methylbutanol, tetrahydrofuran, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, anisole, phenetole, and methyl anisole.

Examples of the ketone solvent include 4-hydroxy-4-methyl-2-pentanone, acetone, 2-butanone, 2-heptanone, 3-heptanone, 4-methyl-2-pentanone, cyclopentanone, Cyclohexanone (CHN), and isophorone.

Examples of the alcohol solvent include methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, glycerin, and the like.

As the aromatic hydrocarbon solvent, benzene, toluene, xylene, 1,3, 5-trimethylbenzene, and the like are exemplified.

Examples of the amide solvent include N, N-dimethylformamide, N-dimethylacetamide, and N-methylpyrrolidone.

Among the above solvents, organic solvents having a boiling point of 120 ℃ to 180 ℃ at 1atm are preferable from the viewpoint of coatability and drying property. As the solvent, Propylene Glycol Monomethyl Ether Acetate (PGMEA), ethyl lactate, propylene glycol monomethyl ether, ethyl 3-ethoxypropionate, ethylene glycol monomethyl ether, diethylene glycol monoethyl ether, 4-hydroxy-4-methyl-2-pentanone, N-methylpyrrolidone, and N, N-dimethylformamide are preferable, and propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, N-methylpyrrolidone, ethyl lactate, and ethyl 3-ethoxypropionate are more preferable.

In some embodiments, the content of the solvent may be about 30 wt% to about 95 wt%, or 40 wt% to 60 wt%, for example, about 45 wt%, relative to the total amount of the colored resin composition. The content of the solvent is appropriate, whereby flatness at the time of coating can be improved, and the display characteristics can be improved because the color density is not insufficient when the color filter is formed.

In order to make the above and other objects, features, and advantages of the present disclosure more comprehensible, several experimental examples and comparative examples are prepared, and the colored resin compositions in these examples are coated on a substrate, followed by performing an inspection analysis and evaluation to observe the characteristics of a film layer including the composition. These experimental contents specifically illustrate the effects achieved by the colored resin compositions according to the embodiments of the present disclosure, and the characteristics of the colored photoresist compositions prepared by applying the present disclosure. However, the following examples and comparative examples are illustrative only and should not be construed as limiting the practice of the present disclosure.

The method of forming a coating film and evaluating the film properties of the colored resin compositions proposed in the experimental examples are briefly described below. The detection and evaluation modes are not repeated when the detection results of all experimental examples are analyzed subsequently.

[ formation of coating film ]

(a) Firstly, coating of the colored resin composition of each experimental example was performed on a substrate having a thickness of about 0.4mm to about 0.7mm by spin coating;

(b) placing the substrate coated with the colored resin composition on a Hot plate (Hot plate) at about 80 to about 90 ℃ for a prebaking time of about 38 to about 88 seconds to remove most of the solvent in the composition; and

(c) after the substrate is cooled, the exposure step is executed by using an exposure machine, and then the substrate is moved to a developing machine to execute the developing step so as to form a coloring film layer on the substrate.

[ developing Process conditions ]

And (3) developing process: the development was performed using an alkaline developer at a development pressure of 0.07 megapascal (MPa) and a development time of 50 seconds. Then, the substrate was rinsed with clean water (deionized water) at a rinsing pressure of 0.1 megapascal (MPa) for a rinsing time of 40 seconds.

After the development is completed, a colored film layer is formed on the substrate.

[ method for evaluating colored film layer ]

The present disclosure provides Scanning Electron Microscope (SEM) images of the edge and undercut portion of the colored film formed on the substrate after pre-baking, exposing and developing steps of the colored resin composition of each experimental example to observe the cross-sectional shape of the film and measure the undercut depth (undercut depth). For the definition of the undercut depth, refer to the depth d of the photoresist structure 21 along the X direction as shown in fig. 2A and the related description.

Further, OM photographs were taken of the upper side of the colored film layer formed on the substrate at 20 times and 50 times magnification, respectively, using an optical microscope (model: NiKon eclipse LV150N) to inspect and observe whether the edge of the colored film layer formed on the substrate was complete; for example, if the formed colored film includes a plurality of stripe-shaped photoresist structures (as shown in fig. 2B), the edges of the stripe-shaped photoresist structures are inspected for peeling, sagging or other defects, and the percentage of the defects in all the photoresist structures is evaluated as high.

(a) The evaluation criteria for undercut depth of the colored film layer formed on the substrate were as follows:

the undercut depth of 1 μm or less (≦ 1 μm) is evaluated as O, indicating that the colored film layer has good undercut characteristics;

the undercut depth in the range of greater than 1 μm to less than 3 μm (i.e., 1 μm < undercut depth μm <3 μm) is evaluated as Δ, indicating that the colored film layer has acceptable undercut characteristics; and

the undercut depth of 3 μm or more (≧ 3 μm) is evaluated as X, which indicates that the colored film layer has poor undercut characteristics.

(b) Inspecting the colored film formed on the substrate by an optical microscope, wherein the evaluation standard of the integrity of the film edge is as follows:

if the edge of the coloring film layer formed on the substrate is inspected by an optical microscope, the line color is uniform, and the coloring film layer has no sunken flaws, the evaluation is O, and the coloring film layer has excellent edge integrity;

if the color of the edge of the colored film layer is inspected to be small and uneven, then the color is evaluated as delta, which indicates that the colored film layer has acceptable edge integrity, and all defects on the edge account for less than 30% of the area of all film layer structures in the experiment, and the color is evaluated as small;

if the edge of the colored film is inspected, the color of the line is mostly uneven or has a collapse, and then the line is evaluated as X, which indicates that the colored film has unacceptable edge integrity.

The undercut results and OM photographs were combined for general evaluation, with the following criteria:

undercut results	OM	Total evaluation
			O	O	◎
O	Δ	O
			Δ	O	O
Δ	Δ	Δ
			X	X	X

< related experiments one: the colored resin composition comprising different photocurable resins in the alkali-soluble resin >

Please refer to tables 1 and 2. In the first related experiment, the compositions (including the components and the weight percentages thereof) of the colored resin compositions of the respective experimental examples and comparative examples are shown in table 1. Table 2 shows the types and properties (e.g., weight average molecular weight and-COOH groups contained) of the photocurable resins used in the respective experimental examples and comparative examples, and the undercut depths of the colored film layers formed from the compositions containing the photocurable resins.

The alkali-soluble resins in the respective experimental examples as listed in Table 1 were those comprising a thermosetting resin-I (as in subsequent preparation example 9) and a photocurable resin (comprising 7 kinds of self-prepared resins of different kinds and/or in different proportions, as in subsequent preparation examples 1 to 7). To facilitate a brief presentation of the tables, the ingredients/copolymers in Table 1 are indicated by commercial trade names and/or ingredient abbreviations and the monomer names and proportions of each ingredient/copolymer are tabulated below Table 1 and in Table 2.

TABLE 1

(continuation table 1)

Colorant pigment blue B15: 6: organic blue Pigment (product-available from Nippon Pigment Co.)

Thermosetting resin material-I: please refer to preparation example 9

Monomer DPHA of polymerizable unsaturated compound: dipentaerythritol hexaacrylate (KAYARAD (registered trademark))

Photopolymerization initiator OXE-01: o-acyloxime (O-acyloxime) compounds (from BASF-)

Solvent PGMEA: propylene glycol monomethyl ether acetate (ex friend and trade-)

TABLE 2

TCDMA: dicyclopentyl (meth) acrylate

BZMA: (meth) acrylic acid benzyl ester

MAA: methacrylic acid

MMA: (meth) acrylic acid methyl ester

GMA: glycidyl (meth) acrylate

Furthermore, the chemical formula and the monomer ratio (mol%) of the photocurable resin corresponding to experiments 1-1 to 1-7 listed in Table 2 are summarized as follows:

in the first related experiment, the evaluation results of the characteristics of the colored resin compositions of the respective experimental examples, the edges and undercut portions of the film layer after the colored film layer was formed on the substrate was inspected by a Scanning Electron Microscope (SEM), and the measured undercut depth (undercut depth) are shown in table 3. Reference is now made to table 3 and fig. 3A-3G, wherein fig. 3A-3G are simplified schematic diagrams of the edge and undercut portions of the SEM images according to experiments 1-7, respectively, illustrating the local photoresist structures 31 and the undercut depth d on the substrate 30 for each example. The results of evaluation of whether the edges of the colored film layers of the respective experimental examples were intact or not were observed by optical microscopes at 20 times and 50 times, respectively, are also shown in table 3.

TABLE 3

According to the results of the above-mentioned first related experiment, it was revealed that the alkali-soluble resin of the colored resin composition as proposed in the first experimental examples 1-3, 1-4, 1-5 and 1-6, the photocurable resin used, which comprises a copolymer of, for example, dicyclopentanyl (meth) acrylate (TCDMA)/(methyl (meth) acrylate (MMA)/(glycidyl (meth) acrylate) (GMA)/(meth) acrylic acid (MAA), can improve the undercut depth of the film layer and the formation of the complete edge after forming the colored film layer on the substrate, with appropriate molecular weight and acid value matching, for example, the molecular weight thereof is lower than 20000, and the potassium hydroxide (KOH) titer is less than 100 mg/g. For example, the light-curable resins used in experimental examples 1-3 to 1-6 have molecular weights 17200, 6100, 6400, 6500 (all less than 20000), acid values 28, 97, 35.4, 33.7mg/g (all less than 100mg/g), and the formed colored film has a good mushroom-shaped cross section (as shown in fig. 3C to 3F), and the undercut depths are all less than 1.5 μm, and the edge of the colored film formed on the substrate has good or acceptable edge integrity as observed by an optical microscope.

Further, in some embodiments, the photocurable resin used, which comprises a copolymer such as dicyclopentanyl (meth) acrylate (TCDMA)/Methyl Methacrylate (MMA)/(glycidyl (meth) acrylate (GMA)/(meth) acrylic acid (MAA), has a uniform line color and good edge integrity at the edge of the colored film layer formed on the substrate, when the molecular weight is less than 20000 and the acid value of potassium hydroxide (KOH) is less than 55mg/g, such as less than 40mg/g in experimental examples 1-3, 1-5 and 1-6, and the edge of the colored film layer formed on the substrate is inspected with an optical microscope. The photo-curing resins of experimental examples 1-4 have an acid value of 97mg/g, and after the substrate is exposed and developed to form a colored film layer, the color of the edge of the colored film layer is slightly uneven, but still within the standard of acceptable edge integrity (i.e., the detector does not generate an excessively high number of false judgments of defects).

Furthermore, in some embodiments, the photocurable resin used, which comprises a copolymer such as dicyclopentanyl (meth) acrylate (TCDMA)/Methyl Methacrylate (MMA)/(glycidyl (meth) acrylate (GMA)/(meth) acrylic acid (MAA), has a very excellent edge integrity when the undercut depth of the formed colored film layer can be reduced by less than 0.4 μm in the case of experimental examples 1-5 and 1-6, in which the molecular weight is less than 10000 and the acid value of potassium hydroxide (KOH) is less than 55 mg/g.

< related experiment two: a photocurable resin containing the same components but in different component ratios in the alkali-soluble resin of the colored resin composition >

Please refer to tables 4 and 5. In the second related experiment, the respective components of the thermosetting resin, the photocurable resin and the Monomer of the polymerizable unsaturated compound of the colored resin compositions of experimental examples 2-1 to 2-7, and the Ratio (%) therebetween (Binder/Monomer Ratio) are shown in Table 4. In the experimental examples 2-1 to 2-7, the name I was selected as a thermosetting resin, the name F was selected as a photocurable resin, and DPHA was selected as a monomer of a polymerizable unsaturated compound.

TABLE 4

See table 6 for the composition of thermosetting resin I.

The composition of the photocurable resin F is as described above.

In the second related experiment, the evaluation results of the properties of the colored resin compositions of the respective experimental examples, the edges and undercut portions of the film layer after the colored film layer was formed on the substrate was inspected by a Scanning Electron Microscope (SEM), and the measured undercut depth (undercut depth) are shown in table 5. Reference is now made to table 5 in conjunction with fig. 4A-4F, wherein fig. 4A-4G are simplified schematic diagrams of the edge and undercut portions of the SEM images of examples 2-1-2-7, respectively, illustrating the local photoresist structures 41 and the undercut depth d on the substrate 40 of each example. Further, the results of evaluating whether the edges of the colored film layers of the respective experiments were intact or not were observed by optical microscopes at 20 times and 50 times of magnification, respectively, are also shown in Table 5.

TABLE 5

According to the results of the second related experiment, the alkali-soluble resin of the colored resin composition as proposed in the experimental examples 2-1 to 2-7 uses the same thermosetting resin I and the same photocurable resin F, wherein the thermosetting resin I is (A)Composition ofPlease refer to table 6 and the preparation method of preparation example 9), the photocurable resin F is a copolymer of TCDMA/MMA/(GMA + MAA)/MAA of 3/70/23.5/3.5 (weight ratio is 3:70:23.5: 3.5). In the second related experiment, the Ratio of the photocurable resin to the Monomer of the polymerizable unsaturated compound (Binder/Monomer Ratio) of the colored resin composition was further changed. According to the experimental results, when the Ratio of the photocurable resin to the Monomer of the polymerizable unsaturated compound (Binder/Monomer Ratio) is about 6.7% to about 300%, the colored film layer formed has a good or acceptable mushroom-shaped cross section (as shown in FIGS. 4A to 4G), and the undercut depths are all less than 1.0 μm, and thus, the thickness of the colored film layer is reducedThe edges of the colored film layer formed on the substrate were also inspected by optical microscopy to have good or acceptable edge integrity.

In some embodiments, for example, in experimental examples 2-1 to 2-6, when the Ratio of the photo-curable resin to the Monomer of the polymerizable unsaturated compound (Binder/Monomer Ratio) is about 6.7% to about 166.7%, the formed colored film layer has a good mushroom-shaped cross section, the undercut depth is less than 1.0 μm, and the edge of the colored film layer formed on the substrate has good or even excellent edge integrity as observed by an optical microscope.

< related experiment three: the alkali-soluble resin of the colored resin composition comprises different thermosetting resins >

Please refer to tables 6 and 7. In the third related experiment, the components (for example, monomer ratio) and characteristics (for example, weight average molecular weight and-OH group and-COOH group contained) of the thermosetting resins used in the respective colored resin compositions of experiment examples 3-1 to 3-3 are shown in Table 6.

TABLE 6

Name of thermosetting resin	Proportion of monomers (% mol)	Molecular weight	COOH group
				I	EDCPA/MAA＝84.9/15.1	7960	15.1mol％
J	EDCPA/MAA＝82.9/17.1	18650	17mol％
				K	EDCPA/MAA＝81.7/18.3	24800	18.3mol％

Further, regarding the thermosetting resin listed in Table 6, taking the thermosetting resin K as an example, the chemical formulas 1 to 4 are as follows:

in the third related experiment, the evaluation results of the properties of the colored resin compositions of the respective experimental examples, the edges and undercut portions of the film layer after the colored film layer was formed on the substrate was inspected by a Scanning Electron Microscope (SEM), and the measured undercut depth (undercut depth) are shown in table 7. Reference is now made to table 6 in conjunction with fig. 5A-5C, wherein fig. 5A-5C are simplified schematic diagrams of the edge and undercut portions of the film in SEM images according to examples 3-1-3, respectively, illustrating the local photoresist structures 51 and the undercut depth d on the substrate 50 for each example. Further, the results of evaluating whether the edges of the colored film layers of the respective experiments were intact or not were observed by optical microscopes at 20 times and 50 times, respectively, are also shown in Table 7.

TABLE 7

According to the results of the above-mentioned related experiments three (using the same thermosetting resin but using different thermosetting resins), it was revealed that, for example, the alkali-soluble resins of the colored resin compositions proposed in experimental examples 3-1 and 3-2, which contained thermosetting resins having weight average molecular weights of about 5000 to about 20000, potassium hydroxide (KOH) titer values of about 100mg/g to about 120mg/g, formed colored film layers having good or acceptable mushroom-shaped profiles (as shown in fig. 5A, 5B), undercut depths of less than 1.0 μm (0.715 μm and 0.515 μm, respectively), and edge integrity of the colored film layers formed on the substrate as viewed with an optical microscope.

Furthermore, in some embodiments, the alkali-soluble resin comprises a thermosetting resin comprising about 18 mol% or less than about 18 mol% of-COOH groups, for example, the thermosetting resins of experimental examples 3-1 and 3-2 comprise 15.1 mol% and 17 mol% of-COOH groups, respectively, to form a colored film layer having an undercut depth of less than 1.0 μm and good edge integrity.

In some other embodiments, such as Experimental example 3-1, the alkali-soluble resin comprises a thermosetting resin having a weight average molecular weight of less than about 10000 and an acid value of between about 100mg/g and about 120mg/g titrated with potassium hydroxide (KOH). The formed colored film layer has a good profile, and the edge of the colored film layer formed on the substrate has very good edge integrity when viewed by an optical microscope, except that the undercut depth is less than 1.0 μm.

< related experiments four: the colored resin composition comprises two types of photocurable resins in the alkali-soluble resin >

Please refer to tables 8 and 9. In the fourth related experiment, the components and weight percentages of the colored resin compositions of experiment examples 4-1 to 4-3 are listed in Table 8. As shown in Table 8 of the experimental examples 4-1 to 4-3, the alkali-soluble resin of the colored resin composition of each experimental example comprises a thermosetting resin (e.g., I) and two types of photocurable resins (e.g., 5% F and another 5% photocurable resin A, C, or H).

In the fourth related experiment, the components and properties of the thermosetting resin I and the photocurable resins a and C were as described above, and the copolymer monomer ratio (mol%) of the photocurable resin H was: TCDMA/MMA/MAA/(MAA + GMA) ═ 3/27/18.9/51.1. The molecular weight of the photocurable resin H was 17800, the undercut depth was 6.11 μm, and the COOH group was 18.9 mol%. The method for producing the photocurable resin H is, for example, described in preparation example 8 below.

TABLE 8

In the related experiment four, the evaluation results of the characteristics of the colored resin compositions of the respective experimental examples, the edges and undercut portions of the film layer after the colored film layer formed on the substrate was inspected by a Scanning Electron Microscope (SEM), and the measured undercut depth (undercut depth) are shown in table 9. Reference is now made to table 9 together with fig. 6A-6C, wherein fig. 6A-6C are simplified schematic diagrams of the edge and undercut portions of the film in SEM images according to examples 4-1-4-3, respectively, illustrating the local photoresist structures 61 and the undercut depth d on the substrate 60 of each example. Further, whether the edges of the colored film layers of examples 4-1 to 4-3 were intact was observed by an optical microscope at 20-fold and 50-fold magnifications, respectively, and the evaluation results are also shown in Table 9.

TABLE 9

According to the results of the above-mentioned fourth related experiment, it was revealed that two kinds of photocurable resins can be mixed and a colored film layer having a good cross-sectional shape, an undercut depth of about 1.0 μm or less and a complete film edge can be obtained.

Taking experiments 4-3 as an example, which used the photocurable resin H in addition to the photocurable resin F as described in experiments 1-6 above, and the weight average molecular weight was less than 20000, the formed colored film layer had a good mushroom-shaped profile (as shown in fig. 6C), an undercut depth of 1.12 μm (close to 1.0 μm), and the edge of the colored film layer formed on the substrate was examined with an optical microscope to have acceptable edge integrity.

Further, taking experiment 4-2 as an example, using the photo-curable resin F of the above-mentioned experimental examples 1-6 and the photo-curable resin C of, for example, experimental examples 1-3, and having a weight average molecular weight of less than 20000, the formed colored film layer has a good mushroom-shaped cross section (as shown in FIG. 6B), an undercut depth of 0.99 μm (less than 1.0 μm), and the edge of the colored film layer formed on the substrate has good edge integrity as viewed by an optical microscope.

< Synthesis of Photocurable resin and thermosetting resin >

The synthetic methods of the above-mentioned photocurable resins A to H are as described in the following preparation examples 1 to 8, respectively. The synthetic methods of the thermosetting resin I, J, K are as described in the following preparation examples 9 to 11. For the sake of convenience of comparison, the compositions of the photocurable resins a to H used in the above experiments and the preparation methods thereof were arranged as follows.

[ production example 1 ]:

213.6g of propylene glycol monomethyl ether acetate was placed in a flask equipped with a stirrer, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, and then the mixture was stirred while being replaced with nitrogen gas, and the temperature was raised to 90 ℃. Next, 4.0g of t-butylperoxy-2-ethylhexanoate was added to a monomer mixture comprising 88.2g (0.50 mole) of benzyl methacrylate, 22.0g (0.1 mole) of methacrylic acid, tricyclodecanyl ester and 28.9g (0.40 mole) of methacrylic acid, and the mixture was dropped from a dropping funnel into the flask. After completion of the dropping, the mixture was stirred at 95 ℃ for about 3 hours to conduct copolymerization reaction, thereby producing a copolymer. Subsequently, after the flask was purged with air, 21.4g (0.15 mol) of epoxypropyl methacrylate, 0.6g of triphenylphosphine (catalyst) and 0.6g of hydroquinone (polymerization inhibitor) were added thereto, and a ring-opening addition reaction was carried out at 120 ℃ for about 6 hours to produce a copolymer. Next, 221.3g of propylene glycol monomethyl ether was added to the reaction solution to obtain a copolymer solution (weight-average molecular weight: 27,000) having a solid content of 30% by mass. The copolymer (photocurable resin A) prepared in preparation example 1 had a constitutional unit represented by the following chemical formula 1-1.

[ chemical formula 1-1]

[ production example 2 ]:

213.6g of propylene glycol monomethyl ether acetate was placed in a flask equipped with a stirrer, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, and then the mixture was stirred while being replaced with nitrogen gas, and the temperature was raised to 90 ℃. Next, 4.0g of t-butylperoxy-2-ethylhexanoate was added to a monomer mixture comprising 88.2g (0.60 mol) of benzyl methacrylate and 22.0g (0.4 mol) of methacrylic acid, and the mixture was dropped into the flask from a dropping funnel. After completion of the dropping, the mixture was stirred at 95 ℃ for 1.5 hours to conduct copolymerization reaction, thereby producing a copolymer. Next, after the flask was purged with air, 221.3g of propylene glycol monomethyl ether was added to obtain a copolymer solution (weight-average molecular weight: 10,500) having a solid content of 30% by mass. The copolymer (photocurable resin B) prepared in preparation example 2 had a constitutional unit represented by chemical formula 1-2.

[ chemical formulas 1-2]

[ production example 3 ]:

213.6g of propylene glycol monomethyl ether acetate was placed in a flask equipped with a stirrer, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, and then the mixture was stirred while being replaced with nitrogen gas, and the temperature was raised to 90 ℃. Next, 4.0g of t-butylperoxy-2-ethylhexanoate was added to a monomer mixture comprising 30.0g (0.30 mole) of methyl methacrylate, 11.0g (0.05 mole) of tricyclodecanyl methacrylate and 46.9g (0.65 mole) of methacrylic acid, and the mixture was dropped into the flask from a dropping funnel. After completion of the dropping, the mixture was stirred at 95 ℃ for about 2 hours to conduct copolymerization reaction, thereby producing a copolymer. Next, the flask was purged with air, and then 82.5g (0.58 mol) of epoxypropyl methacrylate, 0.6g of triphenylphosphine (catalyst) and 0.6g of hydroquinone (polymerization inhibitor) were added thereto to conduct a ring-opening addition reaction at 120 ℃ for about 7 hours, thereby producing a copolymer. Next, 221.3g of propylene glycol monomethyl ether was added to the reaction solution to obtain a copolymer solution having a solid content of 30% by mass (weight-average molecular weight 17,200). The copolymer (photocurable resin C) prepared in preparation example 3 had the constitutional unit shown in chemical formula 1-3.

[ chemical formulas 1-3]

[ production example 4 ]:

213.6g of propylene glycol monomethyl ether acetate was placed in a flask equipped with a stirrer, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, and then the mixture was stirred while being replaced with nitrogen gas, and the temperature was raised to 90 ℃. Next, 4.0g of t-butylperoxy-2-ethylhexanoate was added to a monomer mixture comprising 30.0g (0.30 mole) of methyl methacrylate, 11.0g (0.05 mole) of tricyclodecanyl methacrylate and 46.9g (0.65 mole) of methacrylic acid, and the mixture was dropped into the flask from a dropping funnel. After completion of the dropping, the mixture was stirred at 95 ℃ for about 1 hour to conduct copolymerization reaction, thereby producing a copolymer. Subsequently, after the flask was purged with air, 49.8g (0.35 mol) of epoxypropyl methacrylate, 0.6g of triphenylphosphine (catalyst) and 0.6g of hydroquinone (polymerization inhibitor) were added thereto, and a ring-opening addition reaction was carried out at 120 ℃ for about 3 hours to produce a copolymer. Next, 221.3g of propylene glycol monomethyl ether was added to the reaction solution to obtain a copolymer solution having a solid content of 30% by mass (weight-average molecular weight: 6,100). The copolymer (photocurable resin D) prepared in preparation example 4 had the constitutional units represented by the above chemical formulas 1 to 3.

[ production example 5 ]:

213.6g of propylene glycol monomethyl ether acetate was placed in a flask equipped with a stirrer, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, and then the mixture was stirred while being replaced with nitrogen gas, and the temperature was raised to 90 ℃. Next, 4.0g of t-butylperoxy-2-ethylhexanoate was added to a monomer mixture comprising 30.0g (0.30 mole) of methyl methacrylate, 11.0g (0.05 mole) of tricyclodecanyl methacrylate and 46.9g (0.65 mole) of methacrylic acid, and the mixture was dropped into the flask from a dropping funnel. After completion of the dropping, the mixture was stirred at 95 ℃ for about 1 hour to conduct copolymerization reaction, thereby producing a copolymer. Then, the flask was purged with air, 78.2g (0.55 mol) of epoxypropyl methacrylate, 0.6g of triphenylphosphine (catalyst) and 0.6g of hydroquinone (polymerization inhibitor) were added thereto, and a ring-opening addition reaction was carried out at 120 ℃ for about 6 hours to produce a copolymer. Next, 221.3g of propylene glycol monomethyl ether was added to the reaction solution to obtain a copolymer solution having a solid content of 30% by mass (weight-average molecular weight: 6,400). The copolymer (photocurable resin E) prepared in preparation example 5 had the constitutional units shown in the above chemical formulas 1 to 3.

[ production example 6 ]:

213.6g of propylene glycol monomethyl ether acetate was placed in a flask equipped with a stirrer, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, and then the mixture was stirred while being replaced with nitrogen gas, and the temperature was raised to 90 ℃. Next, 4.0g of t-butylperoxy-2-ethylhexanoate was added to a monomer mixture comprising 70.0g (0.70 mol) of methyl methacrylate, 11.0g (0.05 mol) of tricyclodecanyl methacrylate and 18.1g (0.25 mol) of methacrylic acid, and the mixture was dropped into the flask from a dropping funnel. After completion of the dropping, the mixture was stirred at 95 ℃ for about 1 hour to conduct copolymerization reaction, thereby producing a copolymer. Subsequently, the flask was purged with air, and then 28.5g (0.20 mol) of epoxypropyl methacrylate, 0.6g of triphenylphosphine (catalyst) and 0.6g of hydroquinone (polymerization inhibitor) were added thereto to conduct a ring-opening addition reaction at 120 ℃ for 8 hours, thereby producing a copolymer. Next, 221.3g of propylene glycol monomethyl ether was added to the reaction solution to obtain a copolymer solution having a solid content of 30% by mass (weight-average molecular weight: 6,500). Preparation example 6 produced a copolymer (photocurable resin-F) having the constitutional units represented by the above chemical formulas 1 to 3.

[ production example 7 ]:

213.6g of propylene glycol monomethyl ether acetate was placed in a flask equipped with a stirrer, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, and then the mixture was stirred while being replaced with nitrogen gas, and the temperature was raised to 90 ℃. Next, 4.0g of t-butylperoxy-2-ethylhexanoate was added to a monomer mixture comprising 30.0g (0.30 mole) of methyl methacrylate, 11.0g (0.05 mole) of tricyclodecanyl methacrylate and 46.9g (0.65 mole) of methacrylic acid, and the mixture was dropped into the flask from a dropping funnel. After completion of the dropping, the mixture was stirred at 95 ℃ for about 3 hours to conduct copolymerization reaction, thereby producing a copolymer. Subsequently, after the flask was purged with air, 49.8g (0.35 mol) of epoxypropyl methacrylate, 0.6g of triphenylphosphine (catalyst) and 0.6g of hydroquinone (polymerization inhibitor) were added thereto, and a ring-opening addition reaction was carried out at 120 ℃ for about 3 hours to produce a copolymer. Next, 221.3g of propylene glycol monomethyl ether was added to the reaction solution to obtain a copolymer solution having a solid content of 30% by mass (weight-average molecular weight: 23,900). The copolymer (photocurable resin G) prepared in preparation example 7 had the constitutional unit shown in the above chemical formula 1-3.

[ production example 8 ]:

213.6g of propylene glycol monomethyl ether acetate was placed in a flask equipped with a stirrer, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, and then the mixture was stirred while being replaced with nitrogen gas, and the temperature was raised to 90 ℃. Next, 4.0g of t-butylperoxy-2-ethylhexanoate was added to a monomer mixture comprising 30.0g (0.30 mole) of methyl methacrylate, 11.0g (0.05 mole) of tricyclodecanyl methacrylate and 46.9g (0.65 mole) of methacrylic acid, and the mixture was dropped into the flask from a dropping funnel. After completion of the dropping, the mixture was stirred at 95 ℃ for about 2 hours to conduct copolymerization reaction, thereby producing a copolymer. Next, the flask was purged with air, and then 64.0g (0.45 mol) of epoxypropyl methacrylate, 0.6g of triphenylphosphine (catalyst) and 0.6g of hydroquinone (polymerization inhibitor) were added thereto to conduct a ring-opening addition reaction at 120 ℃ for about 4 hours, thereby producing a copolymer. Next, 221.3g of propylene glycol monomethyl ether was added to the reaction solution to obtain a copolymer solution having a solid content of 30% by mass (weight-average molecular weight: 17,800). The copolymer (photocurable resin H) prepared in preparation example 8 had the constitutional units shown in the above chemical formulas 1-3.

Furthermore, the thermosetting resin I is a self-synthesized resin material, see the following preparation examples 9-1 to 9-2. The thermosetting resin I-1 of preparation example 9-1 and the thermosetting resin I-2 of preparation example 9-2 can be used alternatively or in combination as a material for the thermosetting resin I.

[ production example 9-1: preparation of thermosetting resin I-1

An appropriate amount of nitrogen was flowed into a flask equipped with a reflux condenser, a dropping funnel and a stirrer to provide a nitrogen atmosphere, and 100 parts of propylene glycol monomethyl ether acetate was added and heated to 85 ℃ while stirring. Then, into the flask, a solution obtained by dissolving 19 parts of methacrylic acid (constituting a lower left constituent unit), a mixture (containing a molar ratio of 50: 50) (trade name "E-DCPA", manufactured by Dacellosolve Co., Ltd.) of 3, 4-epoxytricyclo [5.2.1.02,6] decan-8-yl acrylate, and 3, 4-epoxytricyclo [5.2.1.02,6] decan-9-yl acrylate in 40 parts of propylene glycol monomethyl ether acetate was dropped for about 5 hours by using a dropping pump. On the other hand, into the flask was added dropwise a solution prepared by dissolving 26 parts of 2,2' -azobis (2, 4-dimethylvaleronitrile) as a polymerization initiator in 120 parts of propylene glycol monomethyl ether acetate over about 5 hours using another dropping pump. After completion of dropping of the polymerization initiator, the temperature was maintained at the same temperature for about 3 hours, and thereafter, the temperature was cooled to room temperature to obtain a solution of the copolymer (thermosetting resin I-1) having a solid content of 43.5%. The weight-average molecular weight of the obtained resin I-1 was 8000. The copolymer prepared in preparation example 9-1 has the constitutional unit represented by the following chemical formula 1-4.

[ chemical formulas 1 to 4]

[ production examples 9-2: preparation of thermosetting resin I-2

A flask equipped with a reflux condenser, a dropping funnel and a stirrer was charged with a nitrogen atmosphere, 280 parts of propylene glycol monomethyl ether acetate was added thereto, and the mixture was heated to 80 ℃ with stirring. Subsequently, a mixture of 38 parts of acrylic acid, 3, 4-epoxytricyclo [5.2.1.02,6] decan-8-yl acrylate and 3, 4-epoxytricyclo [5.2.1.02]6) decan-9-yl acrylate (containing a molar ratio of 1:1) was added dropwise thereto over 5 hours, 289 parts of a mixed solution of 125 parts of propylene glycol monomethyl ether acetate. On the other hand, a solution in which 33 parts of 2, 2-azobis (2, 4-dimethylvaleronitrile) was dissolved in 235 parts of propylene glycol monomethyl ether acetate was added dropwise over 6 hours. After completion of the dropwise addition, the mixture was held at 80 ℃ for 4 hours and then cooled to room temperature to obtain a copolymer (thermosetting resin I-2) solution containing 35.1% of a solid content and having a viscosity of 125mPas as measured by a type B viscometer (23 ℃). The weight average molecular weight (Mw) of the obtained copolymer was 9200. The copolymer prepared in preparation example 9-2 has the constitutional unit represented by the following chemical formula 1-5.

[ chemical formulas 1 to 5]

The thermosetting resin J is a self-synthesized resin material, see preparation examples 10-1 to 10-2 below. As the material of the thermosetting resin J, the thermosetting resin J-1 of production example 10-1 and the thermosetting resin J-2 of production example 10-2 may be used alternatively or in combination.

[ production example 10-1: preparation of thermosetting resin J-1

An appropriate amount of nitrogen was flowed into a flask equipped with a reflux condenser, a dropping funnel and a stirrer to provide a nitrogen atmosphere, and 100 parts of propylene glycol monomethyl ether acetate was added and heated to 85 ℃ while stirring. Then, into the flask, a solution obtained by dissolving 19 parts of methacrylic acid (constituting a lower left constituent unit), a mixture (containing a molar ratio of 50: 50) (trade name "E-DCPA", manufactured by Dacellosolve Co., Ltd.) of 3, 4-epoxytricyclo [5.2.1.02,6] decan-8-yl acrylate, and 3, 4-epoxytricyclo [5.2.1.02,6] decan-9-yl acrylate in 40 parts of propylene glycol monomethyl ether acetate was dropped for about 5 hours by using a dropping pump. On the other hand, into the flask was added dropwise a solution prepared by dissolving 26 parts of 2,2' -azobis (2, 4-dimethylvaleronitrile) as a polymerization initiator in 120 parts of propylene glycol monomethyl ether acetate over about 5 hours using another dropping pump. After completion of dropping of the polymerization initiator, the temperature was maintained at the same temperature for about 4.5 hours, and thereafter, cooled to room temperature, to obtain a solution of a copolymer (thermosetting resin J-1) having a solid content of 43.5%. The weight-average molecular weight of the obtained resin J-1 was 18000. The copolymer prepared in preparation example 10-1 has the constitutional unit represented by the above chemical formula 1-4.

[ production examples 10-2: preparation of thermosetting resin J-2

A flask equipped with a reflux condenser, a dropping funnel and a stirrer was charged with a nitrogen atmosphere, 280 parts of propylene glycol monomethyl ether acetate was added thereto, and the mixture was heated to 80 ℃ with stirring. Subsequently, a mixture of 38 parts of acrylic acid, 3, 4-epoxytricyclo [5.2.1.02,6] decan-8-yl acrylate and 3, 4-epoxytricyclo [5.2.1.02]6) decan-9-yl acrylate (containing a molar ratio of 1:1) was added dropwise thereto over 5 hours, 289 parts of a mixed solution of 125 parts of propylene glycol monomethyl ether acetate. On the other hand, a solution in which 33 parts of 2, 2-azobis (2, 4-dimethylvaleronitrile) was dissolved in 235 parts of propylene glycol monomethyl ether acetate was added dropwise over 6 hours. After completion of the dropwise addition, the mixture was held at 80 ℃ for 6.5 hours and then cooled to room temperature to obtain a copolymer (thermosetting resin J-2) solution containing 35.1% of a solid content and having a viscosity of 125mPas as measured by a type B viscometer (23 ℃). The weight average molecular weight (Mw) of the obtained copolymer was 19100. The copolymer prepared in preparation example 10-2 has the constitutional unit shown in the above chemical formula 1-5.

The thermosetting resin K is a self-synthesized resin material, see preparation examples 11-1 to 11-2 below. The thermosetting resin K-1 of production example 11-1 and the thermosetting resin K-2 of production example 11-2 may be used alternatively or in combination as the material for the thermosetting resin K.

[ production example 11-1: preparation of thermosetting resin K-1

An appropriate amount of nitrogen was flowed into a flask equipped with a reflux condenser, a dropping funnel and a stirrer to provide a nitrogen atmosphere, and 100 parts of propylene glycol monomethyl ether acetate was added and heated to 85 ℃ while stirring. Then, into the flask, a solution obtained by dissolving 19 parts of methacrylic acid (constituting a lower left constituent unit), a mixture (containing a molar ratio of 50: 50) (trade name "E-DCPA", manufactured by Dacellosolve Co., Ltd.) of 3, 4-epoxytricyclo [5.2.1.02,6] decan-8-yl acrylate, and 3, 4-epoxytricyclo [5.2.1.02,6] decan-9-yl acrylate in 40 parts of propylene glycol monomethyl ether acetate was dropped for about 5 hours by using a dropping pump. On the other hand, into the flask was added dropwise a solution prepared by dissolving 26 parts of 2,2' -azobis (2, 4-dimethylvaleronitrile) as a polymerization initiator in 120 parts of propylene glycol monomethyl ether acetate over about 5 hours using another dropping pump. After completion of dropping of the polymerization initiator, the temperature was maintained at the same temperature for about 6 hours, and thereafter, the temperature was cooled to room temperature to obtain a solution of a copolymer (thermosetting resin K-1) having a solid content of 43.5%. The weight-average molecular weight of the obtained resin K-1 was 24000. The copolymer prepared in preparation example 11-1 has the constitutional unit shown in the above chemical formula 1-4.

[ production examples 11-2: preparation of thermosetting resin K-2

A flask equipped with a reflux condenser, a dropping funnel and a stirrer was charged with a nitrogen atmosphere, 280 parts of propylene glycol monomethyl ether acetate was added thereto, and the mixture was heated to 80 ℃ with stirring. Subsequently, a mixture of 38 parts of acrylic acid, 3, 4-epoxytricyclo [5.2.1.02,6] decan-8-yl acrylate and 3, 4-epoxytricyclo [5.2.1.02]6) decan-9-yl acrylate (containing a molar ratio of 1:1) was added dropwise thereto over 5 hours, 289 parts of a mixed solution of 125 parts of propylene glycol monomethyl ether acetate. On the other hand, a solution in which 33 parts of 2, 2-azobis (2, 4-dimethylvaleronitrile) was dissolved in 235 parts of propylene glycol monomethyl ether acetate was added dropwise over 6 hours. After completion of the dropwise addition, the mixture was held at 80 ℃ for about 6 hours and then cooled to room temperature to obtain a copolymer (thermosetting resin K-2) solution containing 35.1% of a solid content and having a viscosity of 125mPas as measured by a type B viscometer (23 ℃). The weight average molecular weight (Mw) of the resulting copolymer was 25400. The copolymer prepared in preparation example 11-2 has the constitutional unit shown in the above chemical formula 1-5.

In summary, embodiments of the present disclosure provide a colored resin composition, a photoresist structure formed by applying the colored resin composition, and a color filter and a display device including the photoresist structure. In some embodiments, the colored resin composition comprises a colorant, an alkali-soluble resin, a polymerizable unsaturated compound, a photopolymerization initiator, and a solvent, wherein the alkali-soluble resin comprises a photocurable resin, the photocurable resin has a weight average molecular weight (Mw) of less than 20000, and the acid value of potassium hydroxide (KOH) is less than 100 mg/g. The colored resin composition of the embodiment, after being coated on a substrate and exposed, has the alkali-soluble resin component, which can significantly reduce the difference of the degree of crosslinking between the upper part of the composition far away from the substrate and the lower part of the composition near the substrate, thereby reducing the strength difference between the upper part and the lower part of the composition after crosslinking. In particular, the appropriate combination of the molecular weight and acid value of the photo-setting resin and/or the thermosetting resin contained in the alkali-soluble resin provided in some embodiments can significantly make the lateral erosion resistance of the photoresist after the colored resin composition is coated on the substrate equivalent, and the photoresist structure formed after exposure and development can exhibit a mushroom-shaped profile and significantly reduce the undercut depth (e.g., to about 1.0 μm or less than 1.0 μm). Therefore, the colored resin composition provided by the embodiment of the invention can avoid the problem of photoresist Peeling (Peeling) after the developing process, and the formed photoresist structure has acceptable or good integrity of the whole body and the outline of the edge. Therefore, the display device applying the embodiment of the disclosure can avoid the exposure defect generated by the pixel of the display device due to the local falling of the photoresist, and can also greatly improve the problem that the number of the photoresist defects is too high due to the uneven bright and dark lines generated by the defective photoresist, which is misjudged by a detection machine.

Although the present invention has been described with reference to a number of preferred embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.