Industrial camera mainboard heat dissipation support forming die
阅读说明:本技术 工业相机主板散热支架成型模具 (Industrial camera mainboard heat dissipation support forming die ) 是由 柏宝兰 杨年成 李东岐 唐佩遂 于 2020-08-28 设计创作,主要内容包括:一种工业相机主板散热支架成型模具,包括上模座、下模座、上模、上模脱模组件、下模及下模脱模组件;上模脱模组件包括上脱模固定板、上脱模活动板、若干连接柱、若干上脱模顶针及若干弹簧;上脱模固定板设置于上模远离下模的一侧且与上模座连接;上脱模活动板活动地位于上脱模固定板与上模之间,弹簧位于上脱模活动板与上脱模固定板之间;连接柱的第一端与上脱模活动板靠近边缘的部分连接,第二端与上模靠近边缘的部分抵接;上脱模顶针的第一端与上脱模活动板固定连接,上模开设有若干上顶针孔,上脱模顶针的第二端穿过上模的上顶针孔。如此能够自动实现产品与上模支架内的脱模、避免产品的凸筋变形损坏。(A forming die for a heat dissipation bracket of an industrial camera mainboard comprises an upper die base, a lower die base, an upper die demoulding assembly, a lower die and a lower die demoulding assembly; the upper die demoulding component comprises an upper demoulding fixed plate, an upper demoulding movable plate, a plurality of connecting columns, a plurality of upper demoulding thimbles and a plurality of springs; the upper demolding fixing plate is arranged on one side of the upper mold, which is far away from the lower mold, and is connected with the upper mold base; the upper demoulding movable plate is movably positioned between the upper demoulding fixed plate and the upper mould, and the spring is positioned between the upper demoulding movable plate and the upper demoulding fixed plate; the first end of the connecting column is connected with the part of the upper demoulding movable plate close to the edge, and the second end of the connecting column is abutted with the part of the upper mould close to the edge; the first end of the upper demoulding thimble is fixedly connected with the upper demoulding movable plate, the upper mould is provided with a plurality of upper thimble holes, and the second end of the upper demoulding thimble penetrates through the upper thimble holes of the upper mould. So can realize the product automatically and go up the drawing of patterns in the mould support, avoid the protruding muscle deformation damage of product.)
1. The utility model provides an industry camera mainboard heat dissipation support forming die which characterized in that: comprises an upper die holder, a lower die holder, an upper die demoulding component, a lower die and a lower die demoulding component; the upper die base and the lower die base are arranged oppositely, the upper die is arranged on the bottom surface of the upper die base facing the lower die base, and the lower die is arranged on the top surface of the lower die base facing the upper die base; the upper die demoulding component comprises an upper demoulding fixed plate, an upper demoulding movable plate, a plurality of connecting columns, a plurality of upper demoulding thimbles and a plurality of springs; the upper demolding fixing plate is arranged on one side of the upper mold, which is far away from the lower mold, and is connected with the upper mold base; the upper demoulding movable plate is movably positioned between the upper demoulding fixed plate and the upper mould, and the spring is positioned between the upper demoulding movable plate and the upper demoulding fixed plate; the first end of the connecting column is connected with the part of the upper demoulding movable plate close to the edge, and the second end of the connecting column is abutted with the part of the upper mould close to the edge; the first end of the upper demoulding thimble is fixedly connected with the upper demoulding movable plate, the upper mould is provided with a plurality of upper thimble holes, and the second end of the upper demoulding thimble penetrates through the upper thimble holes of the upper mould.
2. The industrial camera motherboard heat dissipation bracket molding die of claim 1, wherein: the lower mould is provided with a plurality of lower thimble holes, the lower mould demoulding component comprises a plurality of lower demoulding thimbles and a lower demoulding movable plate, the first end of each lower demoulding thimble penetrates through the lower thimble hole of the lower mould, and the second end of each lower demoulding movable plate is connected with the corresponding lower demoulding movable plate.
3. The industrial camera motherboard heat dissipation bracket molding die of claim 2, wherein: the lower demoulding movable plate is connected with a demoulding cylinder.
4. The industrial camera motherboard heat dissipation bracket molding die of claim 1, wherein: the device also comprises a first side hole forming module; the first side hole forming module comprises a first side hole forming block, a first pushing block positioned on one side of the first side hole forming block and a first driving unit for driving the first pushing block to move; a plurality of first hole forming columns are arranged on one side, away from the first pushing block, of the first side hole forming block in a protruding mode.
5. The industrial camera motherboard heat dissipation bracket molding die of claim 4, wherein: the first promotion piece is last to be provided with the sprue gate, and the sunken a plurality of guide troughs that are provided with on the first side hole shaping piece.
6. The industrial camera motherboard heat dissipation bracket molding die of claim 1, wherein: the second side hole forming module comprises a second side hole forming block and a second driving unit for driving the second side hole forming block to move; and a second hole forming column is arranged on one side, away from the second driving unit, of the second side hole forming block in a protruding mode.
7. The industrial camera motherboard heat dissipation bracket molding die of claim 6, wherein: and a handle forming lug is arranged on one side, far away from the second driving unit, of the second side hole forming block in a protruding mode.
8. The industrial camera motherboard heat dissipation bracket molding die of claim 1, wherein: and a flash groove is concavely arranged on one side of the lower die base, which is far away from the first side hole forming module.
Technical Field
The invention relates to the technical field of industrial camera production, in particular to a forming die for a heat dissipation support of an industrial camera mainboard.
Background
Referring to fig. 7, the back of the
Disclosure of Invention
In view of the above, the invention provides a forming mold for an industrial camera motherboard heat dissipation support, which can automatically realize demolding between a product and an upper mold support and avoid deformation and damage of a convex rib of the product, so as to solve the above problems.
A forming die for a heat dissipation bracket of an industrial camera mainboard comprises an upper die base, a lower die base, an upper die demoulding assembly, a lower die and a lower die demoulding assembly; the upper die base and the lower die base are arranged oppositely, the upper die is arranged on the bottom surface of the upper die base facing the lower die base, and the lower die is arranged on the top surface of the lower die base facing the upper die base; the upper die demoulding component comprises an upper demoulding fixed plate, an upper demoulding movable plate, a plurality of connecting columns, a plurality of upper demoulding thimbles and a plurality of springs; the upper demolding fixing plate is arranged on one side of the upper mold, which is far away from the lower mold, and is connected with the upper mold base; the upper demoulding movable plate is movably positioned between the upper demoulding fixed plate and the upper mould, and the spring is positioned between the upper demoulding movable plate and the upper demoulding fixed plate; the first end of the connecting column is connected with the part of the upper demoulding movable plate close to the edge, and the second end of the connecting column is abutted with the part of the upper mould close to the edge; the first end of the upper demoulding thimble is fixedly connected with the upper demoulding movable plate, the upper mould is provided with a plurality of upper thimble holes, and the second end of the upper demoulding thimble penetrates through the upper thimble holes of the upper mould.
Furthermore, a plurality of lower thimble holes are formed in the lower die, the lower die demolding assembly comprises a plurality of lower demolding thimbles and a lower demolding movable plate, the first ends of the lower demolding thimbles penetrate through the lower thimble holes of the lower die, and the second ends of the lower demolding thimbles are connected with the lower demolding movable plate.
Further, the lower demoulding movable plate is connected with a demoulding cylinder.
Further, the device also comprises a first side hole forming module; the first side hole forming module comprises a first side hole forming block, a first pushing block positioned on one side of the first side hole forming block and a first driving unit for driving the first pushing block to move; a plurality of first hole forming columns are arranged on one side, away from the first pushing block, of the first side hole forming block in a protruding mode.
Furthermore, a pouring gate is arranged on the first pushing block, and a plurality of material guiding grooves are concavely arranged on the first side hole forming block.
Further, the second side hole forming module comprises a second side hole forming block and a second driving unit for driving the second side hole forming block to move; and a second hole forming column is arranged on one side, away from the second driving unit, of the second side hole forming block in a protruding mode.
Further, a handle forming lug is arranged on one side, away from the second driving unit, of the second side hole forming block in a protruding mode.
Furthermore, a flash groove is concavely arranged on one side, away from the first side hole forming module, of the lower die holder.
Compared with the prior art, the forming die for the heat dissipation bracket of the main board of the industrial camera comprises an upper die base, a lower die base, an upper die demoulding assembly, a lower die and a lower die demoulding assembly; the upper die base and the lower die base are arranged oppositely, the upper die is arranged on the bottom surface of the upper die base facing the lower die base, and the lower die is arranged on the top surface of the lower die base facing the upper die base; the upper die demoulding component comprises an upper demoulding fixed plate, an upper demoulding movable plate, a plurality of connecting columns, a plurality of upper demoulding thimbles and a plurality of springs; the upper demolding fixing plate is arranged on one side of the upper mold, which is far away from the lower mold, and is connected with the upper mold base; the upper demoulding movable plate is movably positioned between the upper demoulding fixed plate and the upper mould, and the spring is positioned between the upper demoulding movable plate and the upper demoulding fixed plate; the first end of the connecting column is connected with the part of the upper demoulding movable plate close to the edge, and the second end of the connecting column is abutted with the part of the upper mould close to the edge; the first end of the upper demoulding thimble is fixedly connected with the upper demoulding movable plate, the upper mould is provided with a plurality of upper thimble holes, and the second end of the upper demoulding thimble penetrates through the upper thimble holes of the upper mould. So can realize the product automatically and go up the drawing of patterns in the mould support, avoid the protruding muscle deformation damage of product.
Drawings
Embodiments of the invention are described below with reference to the accompanying drawings, in which:
fig. 1 is a schematic perspective view of a molding mold for a heat dissipation bracket of an industrial camera motherboard according to the present invention.
Fig. 2 is a schematic perspective view of the upper die base of the industrial camera motherboard heat dissipation support forming die provided by the invention removed.
Fig. 3 is a side view of fig. 2 from another perspective.
Fig. 4 is a perspective view of fig. 2 with the upper stripper fixing plate removed.
Fig. 5 is a perspective view of fig. 4 with the upper stripper movable plate removed.
Fig. 6 is a partially disassembled schematic view of the industrial camera motherboard heat dissipation bracket molding die provided by the invention.
Fig. 7 is a schematic perspective view of a mold for forming a heat dissipation support of an industrial camera motherboard and an upper mold release thimble.
Detailed Description
Specific embodiments of the present invention will be described in further detail below based on the drawings. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.
Referring to fig. 1 to 6, the mold for forming a heat dissipating bracket of an industrial camera motherboard according to the present invention includes an
The
The upper
The upper stripper fixing plate 41 is disposed on a side of the
The upper
The connecting
The first end of the
The
The forming die for the industrial camera mainboard radiating support further comprises a first side hole forming module 60 and a second side hole forming module 70.
The first side hole forming module 60 includes a first side
A plurality of first
The first pushing
The second side hole forming module 70 includes a second side
The
The
Compared with the prior art, the forming die for the heat dissipation bracket of the main board of the industrial camera comprises an
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, and any modifications, equivalents or improvements that are within the spirit of the present invention are intended to be covered by the following claims.
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