Entropy-stable ceramic thin film coating, method for the production thereof and element coated with such a coating
阅读说明:本技术 熵稳定陶瓷薄膜涂层,其制备方法以及涂覆有该涂层的元件 (Entropy-stable ceramic thin film coating, method for the production thereof and element coated with such a coating ) 是由 卞海东 赫全锋 李泽彪 吕坚 杨勇 李扬扬 于 2020-04-23 设计创作,主要内容包括:本发明公开了一种制备熵稳定陶瓷薄膜涂层的方法,包括制备由多种金属元素形成的第一层,以及使第一层与阴离子反应从而将第一层的至少一部分转变成第二层。本发明还公开了一种熵稳定陶瓷薄膜涂层以及涂覆有熵稳定陶瓷薄膜涂层的元件。(A method of producing an entropy-stable ceramic thin film coating includes producing a first layer formed from a plurality of metal elements, and reacting the first layer with anions to convert at least a portion of the first layer into a second layer. The invention also discloses an entropy-stable ceramic thin film coating and an element coated with the entropy-stable ceramic thin film coating.)
1. A method of preparing an entropy stable ceramic thin film coating comprising the steps of:
a) preparing a first layer formed of a raw material having a plurality of metal elements; and
b) reacting the first layer with an anion, thereby converting at least a portion of the first layer to a second layer.
2. The method of claim 1, wherein the first layer is arranged to react with anions in a top-down manner.
3. The method of claim 1, wherein the feedstock is provided in approximately equal atomic ratios.
4. The method of claim 1, wherein the raw material is selected from the group consisting of titanium, aluminum, vanadium, iron, cobalt, nickel, chromium, and niobium.
5. The method of claim 1, wherein the second layer is tightly bonded to the first layer.
6. The method of claim 5, wherein step b) further comprises the step of forming a mesoporous structure between the first layer and the second layer.
7. The method of claim 6, wherein the physical properties of the film are related to the morphology of the mesoporous structure.
8. The method of claim 7, wherein the mesoporous structure has a pore size of 10 to 50 nm.
9. The method of claim 1, wherein the first layer comprises an entropy-stabilized alloy.
10. The method of claim 9, wherein the entropy-stable alloy is selected from the group consisting of TiAlV, TiAlVCr, FeCoNi, and TiAlVNbCr.
11. The method of claim 1, wherein step b) further comprises the step of anodizing the first layer with the anions to form the second layer.
12. The method of claim 11, wherein the anions are incorporated into the crystal lattice of the first layer under an anodized electric field to form the second layer.
13. The method of claim 1, wherein the anion comprises an oxyanion.
14. The method of claim 1, wherein the second layer comprises an oxide.
15. The method of claim 11, wherein the physical properties of the thin film are controlled by at least one of an anodic oxidation potential, a type of electrolyte, a concentration of electrolyte, and a duration of anodic oxidation.
16. The method of claim 15, wherein the anodic oxidation potential is 10 to 100V.
17. The method of claim 15, wherein the electrolyte comprises an acid solution.
18. An entropy-stable ceramic thin film coating prepared by the method of claim 1.
19. The entropy stabilized ceramic thin film coating of claim 18, wherein the hardness is between 9 and 14 GPa.
20. The entropy-stabilized ceramic thin film coating of claim 19, wherein the reduction modulus is between 140 and 190 GPa.
21. An element coated with an entropy-stabilized ceramic thin-film coating according to claim 18.
Technical Field
The invention relates to an entropy-stable ceramic thin-film coating, a method for the production thereof and an element coated with the coating.
Background
Entropy stable ceramics have superior physical and mechanical properties. Current manufacturing methods are limited to additive processes such as sputtering, laser cladding, atomized spray pyrolysis or high temperature sintering processes. However, this method of manufacture has several insurmountable limitations. For example, these entropy-stabilized ceramic techniques typically require expensive equipment such as vacuum, shielding gas, or complex control systems. In addition, these techniques only provide small area manufacturing with low uniformity, small scale production, and in fact the manufacturing process is very cumbersome. Thus, entropy-stable ceramics are only suitable for several entropy-stable alloys and are not suitable for commercialization.
Disclosure of Invention
In one aspect of the invention, there is provided a method of preparing an entropy-stable ceramic thin film coating, comprising the steps of:
a) preparing a first layer formed of a raw material having a plurality of metal elements; and
b) the first layer is reacted with an anion, thereby converting at least a portion of the first layer to a second layer.
In one embodiment, the first layer is arranged to react with the anion in a top-down manner.
In one embodiment, the starting materials are provided in approximately equal atomic ratios.
In one embodiment, the raw material is selected from titanium, aluminum, vanadium, iron, cobalt, nickel, chromium, and niobium.
In one embodiment, the second layer is tightly bonded to the first layer.
In one embodiment, step b) further comprises the step of forming a mesoporous structure between the first layer and the second layer.
In one embodiment, the physical properties of the film are related to the morphology of the mesoporous structure.
In one embodiment, the pore size of the mesoporous structure is from 10 to 50 nm.
In one embodiment, the first layer comprises an entropy stable alloy.
In one embodiment, the entropy-stabilizing alloy is selected from the group consisting of TiAlV, TiAlVCr, FeCoNi, and TiAlVNbCr.
In one embodiment, step b) further comprises the step of anodizing the first layer with anions to form the second layer.
In one embodiment, anions are incorporated into the crystal lattice of the first layer under the electric field of anodization to form a second layer.
In one embodiment, the anion comprises an oxyanion.
In one embodiment, the second layer comprises an oxide.
In one embodiment, the physical properties of the thin film are controlled by at least one of an anodic oxidation potential, a type of electrolyte, a concentration of the electrolyte, and a duration of the anodic oxidation.
In one embodiment, the anodization potential is 10 to 100V.
In one embodiment, the electrolyte comprises an acid solution.
In another aspect of the invention, entropy stable ceramic thin film coatings prepared according to the methods described herein are provided.
In one embodiment, the hardness is between 9 and 14 GPa.
In one embodiment, the reduced modulus is between 140 and 190 GPa.
In yet another aspect of the invention, there is provided an element coated with an entropy-stable ceramic thin film coating as described herein.
Drawings
The invention will be further described with reference to the accompanying drawings which illustrate possible arrangements of the invention. Other arrangements of the invention are possible and consequently the particularity of the accompanying drawings is not to be understood as superseding the generality of the preceding description of the invention.
FIG. 1 illustrates an entropy-stable alloy, anions, and an entropy-stable ceramic used in a reaction to produce an entropy-stable ceramic in an exemplary embodiment of the invention;
FIG. 2a is a set of grayscale photomicrographs depicting the applied anodization potential of 10 to 100V;
FIG. 2b is a top view of a Scanning Electron Microscope (SEM) image of an entropy-stabilized ceramic produced by the present method at an anodic oxidation potential of 10V for 2 hours;
FIG. 2c is a top view of an SEM image of an entropy-stabilized ceramic produced by the present method at an anodization potential of 20V for 2 hours;
FIG. 2d is a top view of an SEM image of an entropy-stabilized ceramic produced by the present method at an anodization potential of 30V for 2 hours;
FIG. 2e is a top view of an SEM image of an entropy-stabilized ceramic produced by the present method at an anodization potential of 40V for 2 hours;
FIG. 2f is a top view of an SEM image of an entropy-stabilized ceramic produced by the present method at an anodization potential of 50V for 2 hours;
FIG. 2g is a top view of an SEM image of an entropy-stabilized ceramic produced by the present method at an anodization potential of 60V for 2 hours;
FIG. 2h is a top view of an SEM image of an entropy-stabilized ceramic produced by the present method at an anodization potential of 70V for 2 hours;
FIG. 2i is a top view of an SEM image of an entropy-stabilized ceramic produced by the present method at an anodization potential of 80V for 2 hours;
FIG. 2j is a top view of an SEM image of an entropy-stabilized ceramic produced by the present method at an anodization potential of 90V for 2 hours;
FIG. 2k is a top view of an SEM image of an entropy-stabilized ceramic produced by the present method at an anodization potential of 100V for 2 hours;
fig. 3 provides a plurality of images associated with the present method, wherein: image a is an image of the entropy-stabilized ceramic produced by the method; image b is a High Resolution Transmission Electron Microscope (HRTEM) image of the entropy stabilized ceramic of image a and the corresponding selected region electron diffraction (SAED) results; FIG. c is an energy chromatography (EDS) map image of the entropy stabilized ceramic of FIG. a; image d shows only the aluminum content of the entropy-stabilized ceramic in the EDS-mapped image of image c; image e shows only the oxygen content of the entropy-stabilized ceramic in the EDS-mapped image of image c; image f shows only the titanium content of the entropy-stabilized ceramic in the EDS-mapped image of image c; graph g shows only the vanadium content of the entropy-stable ceramic in the EDS map of figure c;
FIG. 4 is TiAlVO prepared at 100V anodic oxidation potential for 2 hoursxAn X-ray photoelectron spectroscopy (XPS) depth profile of an entropy-stabilized oxide (ESO);
FIG. 5a is a graph showing TiAlVO obtained at different anodic oxidation potentials in the range of 10-100VxHardness profile of ESO; and
FIG. 5b is a graph showing TiAlVO obtained at different anodic oxidation potentials in the range of 10-100VxGraph of the reduced modulus of ESO.
Detailed Description
The inventor designs the entropy-stable ceramic through own research, experiments and experiments, has excellent mechanical and physical properties, and invents a practical method for preparing the entropy-stable ceramic, which can be used for industrial application.
The inventors have found that the existing major entropy-stable ceramic elements are usually manufactured by combining or sintering several metal salts or ceramics in a "bottom-up" process, often requiring expensive equipment, such as vacuum devices, protective gases or complex control systems, long high temperature treatments and/or complex synthesis processes, to obtain entropy-stable ceramics, which inevitably increases the manufacturing costs of the entropy-stable ceramics and limits their practical applications.
In the present invention, the inventors have devised a completely novel, rapid, yet simple and economical method that consumes less energy to produce entropy-stable ceramic membranes.
Referring first to FIG. 1, there is provided a method of making an entropy stable ceramic
Turning now to the detailed structure of
The
To fabricate the second layer 104, the upper surface of the
For example, the
To form such a
During anodization, the
Alternatively, by adjusting anodization parameters, such as anodization potential, electrolyte concentration, etc., various mesoporous entropy-stable
Advantageously, many possible entropy-stable ceramics 104 may be formed by processing different entropy-
In one exemplary embodiment, TiAlVO is fabricated by anodization of the present inventionxProvided is a system. Referring to images a to g of fig. 3, the amorphous character of the prepared entropy stabilized ceramic 104 is revealed by HRTEM and SAED characterization. Elemental mapping results, i.e. TiAlVOxAnd the electronic images of each of the constituent elements Ti, V, Al, and O, shown in the same scale in each of the corresponding EDS map images, indicate a uniform distribution of the constituent elements.
Referring also to FIG. 4, the same TiAlVO was aligned by X-ray photoelectron spectroscopy (XPS)xThe system carries out deep analysis and draws the relationship between the element content of each element O, Ti, V and Al and the depth of the film. It is particularly noted that from 0nm to 250nm, the three metal component elements Ti, V, Al have approximately the same element content and the element content of O is substantially the sameGreater than these metal components. This indicates that the metal elements of V, Ti and Al are distributed nearly equimolar on the upper surface of the
Advantageously, the entropy stabilizing ceramic film 104 is tightly bonded to the entropy stabilizing
Referring to fig. 5a to 5b, the nanoindentation test shows that the hardness (H) of the
Advantageously, the present invention provides an economical and efficient anodizing process for producing entropy stable ceramic coatings. It aims to reduce the manufacturing cost of the current entropy-stable ceramics and realize various novel entropy-stable oxides. By adjusting the anodic oxidation parameters, the entropy-stable ceramic film can be directly formed on the surface of the entropy-stable alloy.
Advantageously, since the present invention relates to a solution-based approach, it will be highly compatible with various industrial applications. The physical properties of the entropy-stabilized
Advantageously, the entropy-stable ceramic 104 grown on the
From a microscopic perspective, the mesoporous nature of the manufactured entropy-stable
Advantageously, the present invention can support the fabrication of large area films. Since the surface of the entropy-stable alloy is shaped to form an anode and is directly anodized by anions, the physical properties of the film can be precisely controlled, and the prepared film has high uniformity over the entire anodized surface. Therefore, the present invention is highly compatible with mass production on an industrial scale.
It will be appreciated by persons skilled in the art that numerous variations and/or modifications may be made to the invention as shown in the specific embodiments without departing from the spirit or scope of the invention as broadly described. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive.
Those skilled in the art will also appreciate that the present invention may include additional modifications to the method without affecting the overall functionality of the method.
Any reference to prior art contained herein is not to be taken as an admission that the information is common general knowledge, unless otherwise indicated. It will be appreciated that, if any prior art information is referred to herein, this reference does not constitute an admission that the information forms part of the common general knowledge in the art (in any other country).
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