阅读说明：本技术 基于深度信息的原料处理方法、装置、电子设备及系统 (Raw material processing method and device based on depth information, electronic equipment and system ) 是由 艾佳 苏显渝 邵双运 于 2020-04-13 设计创作，主要内容包括：本申请实施例公开了一种基于深度信息的原料处理方法、装置、电子设备及系统,该方法包括：获取原料的深度信息；根据所述原料的深度信息从多个待加工对象中确定目标加工对象；基于所述目标加工对象确定针对所述原料的处理方式。本申请通过获取原料的深度信息,并根据深度准确、快速地选取出适合原料的目标加工对象,再根据目标加工对象采用合适的处理方式,提高了对原料加工处理的灵活性,有利于提高对原料的加工效率。(The embodiment of the application discloses a raw material processing method, a raw material processing device, electronic equipment and a raw material processing system based on depth information, wherein the method comprises the following steps: acquiring depth information of the raw material; determining a target processing object from a plurality of objects to be processed according to the depth information of the raw material; and determining a processing mode for the raw material based on the target processing object. This application is through the degree of depth information who obtains the raw materials to accurately, select the target processing object who is fit for the raw materials fast according to the degree of depth, adopt suitable processing mode according to target processing object again, improved the flexibility of handling raw materials processing, be favorable to improving the machining efficiency to the raw materials.)

1. A raw material processing method based on depth information is characterized by comprising the following steps:

acquiring depth information of the raw material;

determining a target processing object from a plurality of objects to be processed according to the depth information of the raw material;

and determining a processing mode for the raw material based on the target processing object.

2. The method according to claim 1, wherein the determining a target processing object from a plurality of objects to be processed according to the depth information of the raw material comprises:

acquiring a first object to be processed from the plurality of objects to be processed, and acquiring depth information of the first object to be processed;

determining whether the raw material can be processed into the first object to be processed according to the depth information of the raw material and the depth information of the first object to be processed;

when it is determined that the raw material can be processed into the first object to be processed according to the depth information of the raw material and the depth information of the first object to be processed, determining the first object to be processed as the target object to be processed.

3. The method according to claim 2, wherein the determining whether the raw material can be processed into the first object to be processed according to the depth information of the raw material and the depth information of the first object to be processed includes:

acquiring a depth value of a target dimension in the depth information of the raw material as a first depth value;

acquiring a depth value of the target dimension in the depth information of the first object to be processed as a second depth value;

and when the first depth value is not smaller than the second depth value, determining that the raw material can be processed into the first object to be processed.

4. The method according to claim 2, wherein the determining a processing manner for the raw material based on the target processing object includes:

determining the processing quantity of the target processing object according to the depth information of the raw material and the depth information of the first object to be processed;

and determining a processing mode for the raw material according to the processing quantity and the target processing object.

5. The method of claim 2, further comprising:

when it is determined that the raw material cannot be processed into the first object to be processed according to the depth information of the raw material and the depth information of the first object to be processed, selecting a second object to be processed which is matched with the depth information of the raw material from the plurality of objects to be processed;

and determining the second object to be processed as the target processing object.

6. The method according to claim 5, wherein the extracting of the second object to be processed, which matches the depth information of the raw material, from the plurality of objects to be processed, comprises:

acquiring a depth value of a specified dimension in the depth information of the raw material;

and selecting the object to be processed with the depth value smaller than that of the raw material in the specified dimension from the plurality of objects to be processed as a second object to be processed matched with the depth information of the raw material.

7. The method according to claim 5, wherein the determining the second object to be machined as the target machined object comprises:

when the number of the second objects to be processed is multiple, acquiring the demand corresponding to the multiple second objects to be processed;

and determining a second object to be machined corresponding to the largest demand in the plurality of demands as a target machining object.

8. A depth information based material processing apparatus, the apparatus comprising:

the depth information acquisition module is used for acquiring the depth information of the raw material;

the target processing object determining module is used for determining a target processing object from a plurality of objects to be processed according to the depth information of the raw material;

and a processing mode determination module for determining a processing mode for the raw material based on the target processing object.

9. An electronic device, comprising:

a memory;

one or more processors coupled with the memory;

one or more programs, wherein the one or more application programs are stored in the memory and configured to be executed by the one or more processors, the one or more programs configured to perform the method of any of claims 1-7.

10. A depth information based material processing system, the system comprising:

a plurality of projection units for projecting structured light patterns onto the feedstock from different spatial locations, respectively;

the acquisition unit is used for acquiring the structured light pattern reflected on the raw material;

and the processing unit is used for acquiring the depth information of the raw material based on the reflected structured light pattern, determining a target processing object from a plurality of objects to be processed according to the depth information of the raw material, and determining a processing mode aiming at the raw material based on the target processing object.

Technical Field

The present disclosure relates to the field of processing technologies, and in particular, to a method, an apparatus, an electronic device, and a system for processing a raw material based on depth information.

Background

With the rapid development of science and technology, the processing technology for raw materials is continuously developed in the directions of precision, automation, high efficiency and the like.

However, the processing method for the raw materials is single at present, and only the raw materials with relatively fixed shapes and sizes can be processed, and the raw materials are difficult to fix and unify in appearance, so that the efficiency of processing the raw materials is low at present.

Disclosure of Invention

In view of the above problems, the present application provides a method, an apparatus, an electronic device and a system for processing raw materials based on depth information to solve the above problems.

In a first aspect, an embodiment of the present application provides a raw material processing method based on depth information, where the method includes: acquiring depth information of the raw material; determining a target processing object from a plurality of objects to be processed according to the depth information of the raw material; and determining a processing mode for the raw material based on the target processing object.

In a second aspect, an embodiment of the present application provides a raw material processing apparatus based on depth information, including: the device comprises a depth information acquisition module, a target processing object determination module and a processing mode determination module. The depth information acquisition module is used for acquiring depth information of the raw materials; the target processing object determining module is used for determining a target processing object from a plurality of objects to be processed according to the depth information of the raw material; and a processing mode determination module for determining a processing mode for the raw material based on the target processing object.

In a third aspect, an embodiment of the present application provides an electronic device, including one or more processors coupled with the memory; one or more programs, wherein the one or more application programs are stored in the memory and configured to be executed by the one or more processors, the one or more programs configured to perform the depth information based material processing method described above.

In a fourth aspect, embodiments of the present application provide a depth information-based material processing system, which includes a plurality of projection units, an acquisition unit, and a processing unit. Wherein the plurality of projection units are used for projecting structured light patterns to the raw material from different spatial positions respectively; the acquisition unit is used for acquiring the structured light pattern reflected on the raw material; the processing unit is used for acquiring depth information of the raw material based on the reflected structured light pattern, determining a target processing object from a plurality of objects to be processed according to the depth information of the raw material, and determining a processing mode aiming at the raw material based on the target processing object.

According to the raw material processing method, the raw material processing device, the electronic equipment and the raw material processing system based on the depth information, the depth information of the raw material is acquired, the target processing object is determined from the multiple objects to be processed according to the depth information of the raw material, and the depth information of the raw material can quickly and accurately reflect parameters such as the size, the shape and the like of the raw material, so that the target processing object determined from the multiple objects to be processed through the depth information can be suitable for the raw material to be processed, finally, the processing mode aiming at the raw material is determined according to the target processing object, different target processing objects can be selected aiming at different raw materials, different processing modes are used aiming at different target processing objects, the flexibility of raw material processing is improved, and the efficiency and the precision of raw material processing are also improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram illustrating an application environment of a depth information-based material processing method according to an embodiment of the present application.

FIG. 2 illustrates a method flow diagram of a method for depth information based material processing in accordance with an embodiment of the present application.

Fig. 3 shows a method flow diagram of a depth information based material processing method according to another embodiment of the present application.

FIG. 4 illustrates a method flow diagram according to one embodiment of step S230 of the depth information based material processing method illustrated in FIG. 3 herein.

FIG. 5 illustrates a method flow diagram according to one embodiment of step S250 of the depth information based material processing method illustrated in FIG. 3 herein.

Fig. 6 shows a method flowchart of a depth information-based material processing method according to another embodiment of the present application.

FIG. 7 illustrates a method flow diagram according to one embodiment of step S350 of the depth information based material processing method illustrated in FIG. 6 herein.

Fig. 8 shows a block diagram of a depth information-based material processing apparatus according to an embodiment of the present application.

Fig. 9 shows a block diagram of an electronic device provided in an embodiment of the present application.

Fig. 10 is a storage medium storing or carrying program code implementing a depth information-based material processing method according to an embodiment of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

With the rapid development of industrial manufacturing technology, more and more products are manufactured by machines instead of manual manufacturing, and compared with manual manufacturing, the raw materials are processed by the machine equipment, so that the processing efficiency is greatly improved and the labor cost is saved.

However, the automatic processing of the raw materials by using the machine equipment is single, and only some raw materials which are fixed and uniform in shape and size can be processed into the same target processing object. The shapes and sizes of the raw materials are difficult to unify, so that differences exist all the time, if the difference between the actual raw materials and the preset raw material template is large, the expected target processing object cannot be obtained after the actual raw materials are processed in a fixed processing mode, defective products occur, raw material waste is caused, and the processing efficiency is reduced.

The inventor finds that if the raw material is detected before the raw material is processed so as to select a target processing object to be processed by the raw material according to the detection result, for example, the target processing object matched with the shape and the size of the raw material is selected from a processing object database according to the shape and the size of the raw material to be processed currently, the processing precision of the raw material can be improved, the output of defective products can be effectively avoided, and the processing efficiency of the raw material is improved.

However, the detection method for the raw material is complex, and many apparatuses are required to measure the distance of the raw material from different angles, for example, distance sensors are arranged in multiple directions to calculate the size of the raw material through the distance difference, which not only increases the cost of the detection apparatus, but also has a very limited detection range, and only can measure raw materials with relatively regular shapes.

The inventor finds in practical research that by collecting depth information of raw materials, the method is convenient to use, can collect information of raw materials with irregular shapes, can quickly and accurately obtain parameters such as shapes and sizes of the raw materials according to the depth information, and can conveniently select target processing objects suitable for the raw materials based on the parameters by using a three-dimensional measurement technology based on structured light projection. Meanwhile, the cost spent on detection equipment can be reduced, and the detection efficiency and accuracy are improved.

Therefore, in view of the above problems, the inventor proposes a raw material processing method based on depth information in the embodiments of the present application, which can improve flexibility of processing raw materials and is beneficial to improving processing efficiency of raw materials by acquiring depth information of raw materials, accurately and quickly selecting a target processing object suitable for raw materials according to depth, and then adopting a suitable processing mode according to the target processing object.

Referring to fig. 1, fig. 1 is a schematic diagram illustrating an application environment of a depth information-based material processing method according to an embodiment of the present application. Alternatively, the depth information-based material processing method according to the embodiment of the present application may be applied to a depth information-based material processing system as shown in fig. 1, and in particular, the method may be applied to the processing unit 4 of the system.

The raw material 1 processing system based on depth information in the embodiment of the present application may include: a projection unit 2, an acquisition unit 3 and a processing unit 4, wherein the number of the projection units 2 may be multiple, for projecting structured light patterns to the raw material 1 from different spatial positions, respectively. The collecting unit 3 is used for collecting the structured light pattern reflected on the raw material 1. The processing unit 4 is configured to acquire depth information of the raw material 1 based on the reflected structured light pattern, determine a target processing object from the plurality of objects to be processed according to the depth information of the raw material 1, and determine a processing manner for the raw material 1 based on the target processing object. Optionally, the processing unit 4 is connected to the acquisition unit 3 and the projection unit 2, respectively, where the connection mode may be a wireless connection or a wired connection, so as to receive the acquisition data of the acquisition unit 3 and control the projection unit 2 to perform projection.

Alternatively, the projection unit 2 may be a visible light projection device. Alternatively, the projection unit 2 may be an infrared laser module, and the light source may be a VCSEL array laser for projecting an infrared pattern.

The specific type of the structured light pattern projected by the projection unit 2 is not limited in the embodiment of the present application. The structured pattern may include point structured light, line structured light, and area structured light, such as grating stripes, speckle, and the like. When the same structured light pattern is projected from the projection unit 2, the structured light pattern is modulated by the height of the raw material after reaching the surface of the projected raw material, and the modulated structured light is collected by the collection unit 3 and is transmitted to the processing unit 4 for analysis and calculation to obtain the three-dimensional surface shape data of the surface of the raw material.

The specific light source of the projection unit 2 is not limited in this embodiment, and the structured light pattern projected by the projection unit 2 may be collected by the corresponding collection unit 3, for example, the structured light pattern projected by the infrared projection unit 2 is collected by an infrared image collection device, and the structured light pattern projected by the visible light projection unit 2 is collected by a visible light image collection device.

The acquisition unit 3 may be an image sensor that records the wavelength of the pattern emitted by the projection unit 2, and is configured to acquire the image of the structured light pattern projected by the projection unit 2, and may include a photosensitive element, an optical filter, a lens, and the like. The acquisition unit 3 may be an image sensor corresponding to the type of the light source, for example, the light source of the projection unit 2 is infrared light, and the acquisition unit 3 is an infrared light image acquisition device; if the light source is visible light, the collecting unit 3 is a visible light image collecting device. The position relationship between the image capturing unit 3 and the projection unit 2 is not limited in the embodiment of the present application, for example, the projection unit 2 is horizontally disposed, horizontally projected, and the image capturing unit 3 and the projection unit 2 are disposed at the same horizontal height.

The processing unit 4 is connected to the collecting unit 3, and is specifically configured to process the structured light pattern reflected by the raw material 1 acquired by the collecting unit 3, and calculate depth information of the raw material 1 according to the acquired structured light pattern. The platform of the processing unit 4 may be one of an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA), and a Digital Signal Processor (DSP), and is configured to process the acquired structured light pattern, and also configured to control the projection of the projection unit 2 and the pattern acquisition of the acquisition unit 3. Optionally, the processing unit 4 may include a controller for performing control, such as control by a synchronous timing circuit and an asynchronous timing circuit; a depth processor may also be included for performing the process of depth information acquisition.

The units in the system can be independent from each other or integrated together. For example, the system may be an electronic device such as a mobile phone, a tablet computer, a notebook computer, etc. which integrates the projection unit 2, the acquisition unit 3, a storage unit (not shown in fig. 1), and the processing unit 4.

The depth information-based material processing method according to the embodiment of the present application will be described below with reference to the application environment of the above-described embodiment.

Referring to fig. 2, fig. 2 illustrates a method for processing raw material based on depth information according to an embodiment of the present application, the method including:

and S110, acquiring depth information of the raw material.

The processing unit in the raw material processing system of the above embodiment may obtain the depth information of the raw material, and specifically, the processing unit may receive the structured light pattern reflected on the raw material collected by the collecting unit, and then calculate the depth information of the raw material based on the structured light pattern. As an example, a structured light pattern to be emitted may be stored in a nonvolatile memory as a reference image in advance, the structured light bolus is emitted to a raw material by a projection unit, the emitted structured light pattern is modulated by the raw material in space and then deformed, the deformed structured light pattern is collected by a collection unit and then transmitted to a processing unit, the processing unit calculates a deviation value (deformation) of each pixel by using the currently obtained structured light pattern and the reference pattern through an image matching algorithm, and finally, based on the deviation value, the depth of the raw material may be calculated by using a trigonometric principle, so as to obtain the depth information of the raw material.

Optionally, the structured light pattern is a grayscale pattern or a binarization pattern.

And S120, determining a target processing object from the plurality of objects to be processed according to the depth information of the raw material.

Optionally, the database with the processing object may be configured in the processing unit, or may be configured in a cloud server in communication with the processing unit.

As an example, the processing unit may randomly obtain depth information of one object to be processed from a plurality of objects to be processed in the object database to be processed, compare the depth information of the object to be processed with the depth information of the raw material, and determine that the raw material meets the processing condition of the object to be processed after the comparison, for example, when the comparison determines that the size of the raw material in each dimension is larger than the size of the object to be processed in the corresponding dimension, the object to be processed may be determined as the target object to be processed.

And S130, determining a processing mode for the raw material based on the target processing object.

As an example, after the target processing object is determined, some specific size parameters of the target processing object may be obtained, obtaining target sizes, such as height, bottom areas corresponding to different heights, and the like, then calculating the size parameters corresponding to the target processing object according to the depth information of the raw material, obtaining the size of the raw material, and then calculating how many target processing objects can be processed by the raw material at most according to the target size and the size of the raw material. Thus, it is possible to determine whether the processing mode is a processing mode in which the raw material is processed into one target processing object or a processing mode in which the raw material is processed into a plurality of target processing objects.

In the embodiment, by acquiring the depth information of the raw material and determining the target processing object from the plurality of objects to be processed according to the depth information of the raw material, the depth information of the raw material can quickly and accurately reflect parameters such as the size and the shape of the raw material, so that the target processing object determined from the plurality of objects to be processed through the depth information can be suitable for the raw material to be processed, and finally, the processing mode for the raw material is determined based on the target processing object, so that different target processing objects can be selected for different raw materials, different processing modes are used for different target processing objects, the flexibility of raw material processing is improved, the efficiency and the precision of raw material processing are improved, and the waste of the raw material can be effectively avoided.

Referring to fig. 3, fig. 3 shows a depth information-based raw material processing method according to another embodiment of the present application, which includes:

and S210, acquiring depth information of the raw material.

The specific implementation of S210 may refer to S110, and therefore is not described herein.

S220, a first object to be processed is acquired from the plurality of objects to be processed, and depth information of the first object to be processed is acquired.

In some embodiments, one object to be machined may be randomly selected from a plurality of objects to be machined as the first machined object.

In some embodiments, a plurality of objects to be processed may be numbered in advance, and then the objects to be processed are selected as the first processed object according to the sequence of the serial numbers of the objects to be processed from small to large or from large to small.

In other embodiments, the demand record of the objects to be processed in the processing unit may also be called, and one object to be processed with the largest demand is selected from the multiple objects to be processed according to the demand record as the first object to be processed, so as to better adapt to the production demand.

In some embodiments, the plurality of objects to be processed may have corresponding serial numbers set in advance, the depth information of the plurality of objects to be processed may be stored in the depth information database in advance, and the serial number of each object to be processed corresponds to the depth information, so that the depth information of the first object to be processed may be acquired from the depth information database according to the serial number of the first object to be processed.

And S230, determining whether the raw material can be processed into the first object to be processed according to the depth information of the raw material and the depth information of the first object to be processed.

In one embodiment, the three-dimensional dimensions of the material, i.e., length, width, and height, may be obtained from the depth information of the material. Here, it can be understood that the depth information of the material in the longitudinal direction, i.e., the length of the material, the depth information of the material in the width direction, i.e., the width of the material, and the depth information of the material in the height direction, i.e., the height of the material. Similarly, the three-dimensional size, that is, the length, the width, and the height of the first object to be processed can be obtained according to the depth information of the first object to be processed.

Alternatively, when the size of any one of the three-dimensional sizes of the raw material is not smaller than the largest size of the three-dimensional sizes of the first object to be processed, it may be determined whether the raw material can be processed into the first object to be processed.

As an example, for example, the three-dimensional sizes of the raw material are 5cm, 6cm, and 8cm, respectively, and when the largest size among the three-dimensional sizes of the first object to be processed is 4cm, it can be said that the volume of the raw material is larger than the volume of the first object to be processed, and thus the raw material can be processed into the first object to be processed. Therefore, whether the raw material can be processed into the first object to be processed can be determined quickly and effectively.

In some embodiments, as shown in fig. 4, S230 may include the following steps:

s231, obtaining a depth value of a target dimension in the depth information of the raw material as a first depth value.

As an example, for example, the target dimension includes a dimension corresponding to a length direction of the material, a dimension corresponding to a width direction of the material, and a dimension corresponding to a height direction of the material, and the first depth value includes a length, a width, and a height of the material. Specifically, the manner of obtaining the depth value of the target dimension may be that the projection unit projects the structured light patterns from the length direction, the width direction, and the height direction of the raw material, and the processing unit analyzes the depth information of the corresponding direction from the structured light patterns collected in different directions based on the collection unit, so as to obtain the depth value of the target dimension.

S232, obtain a depth value of the target dimension in the depth information of the first object to be processed as a second depth value.

As an example, the depth value of the first object to be processed in the target dimension may be stored in the database in advance and be in a corresponding relationship with a name, a sequence number, or an Identity Document (ID) of the first object to be processed, and the processing unit may query the depth value of the first object to be processed in the target dimension from the database according to the name, the sequence number, or the Identity document of the first object to be processed.

And S233, when the first depth value is not less than the second depth value, determining that the raw material can be processed into the first object to be processed.

As an example, the depth values of the target dimension of the raw material are, for example, length (L ═ 10cm), length (W ═ 8cm), and height (W ═ 5cm), respectively. When the depth values of the target dimensions of the first object to be processed are respectively length (L ═ 8cm), length (W ═ 5cm), and height (W ═ 3cm), that is, when all of the three-dimensional dimensions of the first object to be processed are smaller than the three-dimensional dimensions of the raw material, it is determined that the raw material can be processed into the first object to be processed.

And S234, when the first depth value is smaller than the second depth value, determining that the raw material cannot be processed into the first object to be processed.

As an example, when there is at least one dimension in the three-dimensional size of the first object to be processed larger than the size of the raw material in the same dimension, it is determined that the first depth value is smaller than the second depth value, and the raw material cannot be processed into the first object to be processed. For example, the depth values of the target dimensions of the raw material are respectively a length (L ═ 10cm), a length (W ═ 8cm), and a height (W ═ 5cm), and the depth values of the target dimensions of the first object to be processed are respectively a length (L ═ 8cm), a length (W ═ 10cm), and a height (W ═ 3 cm).

In this embodiment, by acquiring a depth value of a target dimension in the depth information of the raw material as a first depth value and acquiring a depth value of a target dimension in the depth information of the first object to be processed as a second depth value, when the first depth value is not less than the second depth value, it is determined that the raw material can be processed into the first object to be processed. Whether the raw material can be processed into the first object to be processed can be judged more accurately.

And S240, when the raw material is determined to be capable of being processed into the first object to be processed according to the depth information of the raw material and the depth information of the first object to be processed, determining the first object to be processed as a target object to be processed.

And S250, determining a processing mode for the raw material based on the target processing object.

In some embodiments, as shown in fig. 5, S250 may include the steps of:

and S251, determining the processing quantity of the target processing object according to the depth information of the raw material and the depth information of the first object to be processed.

As an example, for example, if it is found from the depth information of the raw material and the depth information of the first object to be processed that the bottom area of the raw material is larger than the bottom area of the first object to be processed and the height of the raw material is 4 times the height of the first object to be processed, it can be determined that the raw material can be processed into at least 4 first objects to be processed, and thus the processing number is 4.

S252, a processing method for the material is determined based on the number of processes and the target process object.

Specifically, as one processing method, the raw material may be processed into the target processing object of the processing number according to the target processing object and the processing number. For example, if the number of processes is 4, the raw material can be processed into 4 target processing objects. As another processing method, for example, when the number of processes is 4, the raw material may be processed into less than 4 target processing objects, and the remaining raw material may be used for processing into another object to be processed.

In the embodiment, the processing quantity of the target processing object is determined according to the depth information of the raw material and the depth information of the first object to be processed, and the processing mode for the raw material is determined according to the processing quantity and the target processing object, so that the raw material can be fully utilized for processing, and the waste of the raw material is avoided.

In this embodiment, a first object to be processed is obtained from a plurality of objects to be processed, and it is determined whether or not a raw material can be processed into the first object to be processed, and if so, a processing mode is generated with the first object to be processed as a target object to be processed, so that accurate processing is achieved, and the probability of occurrence of defective products is reduced.

Referring to fig. 6, fig. 6 shows a depth information-based raw material processing method according to another embodiment of the present application, including:

and S310, acquiring depth information of the raw material.

S320, a first object to be processed is acquired from the plurality of objects to be processed, and depth information of the first object to be processed is acquired.

And S330, determining whether the raw material can be processed into the first object to be processed according to the depth information of the raw material and the depth information of the first object to be processed.

And S340, when the raw material is determined to be capable of being processed into the first object to be processed according to the depth information of the raw material and the depth information of the first object to be processed, determining the first object to be processed as a target object to be processed.

The specific implementation of S310 to S340 can refer to S210 to S240, and therefore will not be described herein.

And S350, when the raw material cannot be processed into the first object to be processed according to the depth information of the raw material and the depth information of the first object to be processed, selecting a second object to be processed matched with the depth information of the raw material from the plurality of objects to be processed.

As an example, the three-dimensional size of the raw material may be calculated according to the depth information of the raw material, and then the three-dimensional size of each of the plurality of objects to be processed may be acquired, and the specific manner of acquiring may refer to the manner of acquiring the depth value of the target dimension in the depth information of the first object to be processed in S232, and then the three-dimensional size of the raw material may be compared with the three-dimensional size of each object to be processed, respectively. And determining the objects to be processed with the three-dimensional sizes smaller than the raw material as second objects to be processed.

In some embodiments, as shown in fig. 7, S350 may include the steps of:

s351, obtaining the depth value of the specified dimension in the depth information of the raw material.

As an example, for example, if the specified dimensions include a dimension corresponding to a length direction of the material, a dimension corresponding to a width direction of the material, and a dimension corresponding to a height direction of the material, the first depth value includes a length, a width, and a height of the material. Specifically, the manner of obtaining the depth value of the specified dimension may be that the projection unit projects the structured light patterns from the length direction, the width direction, and the height direction of the raw material, and the processing unit analyzes the depth information of the corresponding direction from the structured light patterns collected in different directions based on the collection unit, that is, the depth value of the specified dimension is obtained.

And S352, selecting the object to be processed with the depth value smaller than that of the raw material in the specified dimension from the plurality of objects to be processed as a second object to be processed matched with the depth information of the raw material.

As an example, for example, the depth values of the target dimensions of the raw material are respectively a length (L ═ 10cm), a length (W ═ 8cm), and a height (W ═ 5cm), and the object to be processed having a length of less than 10cm, a width of less than 8cm, and a height of less than 5cm may be selected from the plurality of objects to be processed as the second object to be processed. For example, when the depth values of the designated dimensions of one of the objects to be processed are respectively length (L ═ 8cm), length (W ═ 5cm), and height (W ═ 3cm), that is, the three-dimensional sizes of the objects to be processed are all smaller than the three-dimensional size of the raw material, the object to be processed may be determined as a second object to be processed.

And S360, determining the second object to be processed as a target processing object.

In some embodiments, a specific embodiment of S360 may be: when the number of the second objects to be processed is multiple, acquiring the demand corresponding to the multiple second objects to be processed; and determining a second object to be machined corresponding to the largest demand in the multiple demands as a target machining object.

As an example, the second object to be processed includes, for example, an object a to be processed, an object b to be processed, and an object c to be processed. If the demand of the object to be processed a is 30, the demand of the object to be processed b is 50, and the demand of the object to be processed c is 40, the object to be processed b is set as the target processing object.

In the embodiment, according to the determination that the second object to be processed with a large demand is used as the target processing object, the production requirement can be conveniently met.

In other embodiments, the specific implementation manner of S360 may also be: the method comprises the steps of obtaining the demand quantity corresponding to a plurality of second objects to be processed, sequencing the second objects to be processed according to the sequence of the demand quantity from large to small to obtain a demand quantity sequence, taking the second objects to be processed corresponding to the demand quantity arranged in the demand quantity sequence in the front preset number as initial objects to be processed, and randomly selecting one object to be processed from the initial objects to be processed in the preset number as a target object to be processed.

S370, a processing method for the material is determined based on the target processing object.

In this embodiment, when it is determined that the raw material cannot be processed into the first object to be processed according to the depth information of the raw material and the depth information of the first object to be processed, the second object to be processed, which matches the depth information of the raw material, is selected from the plurality of objects to be processed as the target object to be processed, so that the flexibility of processing can be improved, the efficiency of processing the raw material is also improved, and the waste of the raw material is avoided.

Referring to fig. 8, fig. 8 is a block diagram illustrating a depth information-based material processing apparatus according to an embodiment of the present disclosure. The apparatus 400 includes a depth information acquiring module 410, a target processing object determining module 420, and a processing manner determining module 430. Wherein:

and a depth information obtaining module 410, configured to obtain depth information of the raw material.

And a target processing object determining module 420, configured to determine a target processing object from the multiple objects to be processed according to the depth information of the raw material.

And a processing method determining module 430 for determining a processing method for the raw material based on the target processing object.

Further, the target processing object determining module 420 specifically includes:

the depth information acquisition unit of the first object to be processed is configured to acquire the first object to be processed from the plurality of objects to be processed and acquire depth information of the first object to be processed.

And the judging unit is used for determining whether the raw material can be processed into the first object to be processed according to the depth information of the raw material and the depth information of the first object to be processed.

And a first target processing object determining unit configured to determine the first object to be processed as a target processing object when it is determined that the raw material can be processed into the first object to be processed based on the depth information of the raw material and the depth information of the first object to be processed.

Further, the determining unit specifically includes:

and the first depth value acquisition subunit is used for acquiring the depth value of the target dimension in the depth information of the raw material as the first depth value.

And the second depth value acquiring subunit is configured to acquire a depth value of the target dimension in the depth information of the first object to be processed as the second depth value.

And the processing determining subunit is used for determining that the raw material can be processed into the first object to be processed when the first depth value is not less than the second depth value.

Further, the processing mode determining module 430 includes:

and the processing quantity determining unit is used for determining the processing quantity of the target processing object according to the depth information of the raw material and the depth information of the first object to be processed.

And a processing mode determining unit for determining a processing mode for the raw material according to the processing quantity and the target processing object.

Further, the apparatus 400 further comprises:

and the second object to be processed selecting unit is used for selecting a second object to be processed matched with the depth information of the raw material from the plurality of objects to be processed when the raw material cannot be processed into the first object to be processed according to the depth information of the raw material and the depth information of the first object to be processed.

And the second target processing object determining unit is used for determining the second object to be processed as the target processing object.

Further, the second object to be processed selecting unit includes:

and the depth value acquisition subunit is used for acquiring the depth value of the specified dimension in the depth information of the raw material.

And the second object to be processed selecting subunit is used for selecting the object to be processed with the depth value smaller than that of the raw material in the specified dimension from the plurality of objects to be processed as the second object to be processed matched with the depth information of the raw material.

Further, the second object to be processed selects the subunit, is specifically used for obtaining the demand corresponding to a plurality of second objects to be processed when the number of the second objects to be processed is multiple; and determining a second object to be machined corresponding to the largest demand in the multiple demands as a target machining object.

Referring to fig. 1 again, the processing system of raw material 1 based on depth information provided in the embodiment of the present application includes a plurality of projection units 2, an acquisition unit 3, and a processing unit 4, wherein:

the plurality of projection units 2 are used for projecting structured light patterns to the raw material 1 from different spatial positions respectively;

the acquisition unit 3 is used for acquiring the structured light pattern reflected on the raw material 1;

the processing unit 4 is configured to acquire depth information of the raw material 1 based on the reflected structured light pattern, determine a target processing object from the plurality of objects to be processed according to the depth information of the raw material 1, and determine a processing manner for the raw material 1 based on the target processing object.

Referring to fig. 9, a block diagram of an electronic device 500 according to an embodiment of the present disclosure is shown. The electronic device 500 in the present application may include one or more of the following components: a processor 510, a memory 520, and one or more applications, wherein the one or more applications may be stored in the memory 520 and configured to be executed by the one or more processors 510, the one or more programs configured to perform a method as described in the aforementioned method embodiments.

Processor 510 may include one or more processing cores. The processor 510 interfaces with various components throughout the electronic device 500 using various interfaces and circuitry to perform various functions of the electronic device 500 and process data by executing or executing instructions, programs, code sets, or instruction sets stored in the memory 520 and invoking data stored in the memory 520. Alternatively, the processor 510 may be implemented in hardware using at least one of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), and Programmable Logic Array (PLA). The processor 510 may integrate one or more of a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a modem, and the like. Wherein, the CPU mainly processes an operating system, a user interface, an application program and the like; the GPU is used for rendering and drawing display content; the modem is used to handle wireless communications. It is understood that the modem may not be integrated into the processor 510, but may be implemented by a communication chip.

The Memory 520 may include a Random Access Memory (RAM) or a Read-Only Memory (Read-Only Memory). The memory 520 may be used to store instructions, programs, code sets, or instruction sets. The memory 520 may include a stored program area and a stored data area, wherein the stored program area may store instructions for implementing an operating system, instructions for implementing at least one function (such as a touch function, a sound playing function, an image playing function, etc.), instructions for implementing various method embodiments described below, and the like. The data storage area may also store data created during use by the electronic device 500 (e.g., phone books, audio-visual data, chat log data), and so forth.

Referring to fig. 10, a block diagram of a computer-readable storage medium according to an embodiment of the present application is shown. The computer-readable storage medium 600 has stored therein a program code that can be called by a processor to execute the method described in the above-described method embodiments.

The computer-readable storage medium 600 may be an electronic memory such as a flash memory, an EEPROM (electrically erasable programmable read only memory), an EPROM, a hard disk, or a ROM. Alternatively, the computer-readable storage medium 600 includes a non-volatile computer-readable storage medium. The computer readable storage medium 600 has storage space for program code 610 for performing any of the method steps of the method described above. The program code can be read from or written to one or more computer program products. The program code 610 may be compressed, for example, in a suitable form.

To sum up, the depth information of the raw material can be acquired, and the target processing object can be determined from the multiple objects to be processed according to the depth information of the raw material, because the depth information of the raw material can quickly and accurately reflect the parameters such as the size, the shape and the like of the raw material, the target processing object determined from the multiple objects to be processed through the depth information can be suitable for the raw material to be processed, and finally, the processing mode of the raw material is determined based on the target processing object, so that different target processing objects can be selected according to different raw materials, different processing modes are used according to different target processing objects, the flexibility of raw material processing is improved, and the efficiency and the precision of raw material processing are also improved.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not necessarily depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.