阅读说明：本技术 开发板Type-C接口连接电路 (Development board Type-C interface connection circuit ) 是由 刘汉章 于 2020-05-20 设计创作，主要内容包括：本发明实施例公开了一种开发板Type-C接口连接电路,其包括开发板、高速开关芯片、CC逻辑控制芯片以及Type-C接口；所述开发板设有通讯模块；所述Type-C接口包括A连接面以及B连接面,所述A连接面设有CC1引脚,所述B连接面设有CC2引脚；所述通讯模块与所述高速开关芯片连接,所述高速开关芯片分别与所述A连接面以及所述B连接面连接,所述CC逻辑控制芯片分别与所述CC1引脚、CC2引脚以及所述高速开关芯片连接。通过开发板外的CC逻辑控制芯片负责检测Type-C接口的接入面(A连接面/B连接面),并控制高速开关芯片切换至对应的接入面。Type-C接口的接入面检测以及高速开关芯片的控制均由CC逻辑控制芯片完成,从而无需浪费开发板的硬件管脚资源以及软件资源。(The embodiment of the invention discloses a development board Type-C interface connection circuit, which comprises a development board, a high-speed switch chip, a CC logic control chip and a Type-C interface, wherein the development board is provided with a plurality of high-speed switch chips; the development board is provided with a communication module; the Type-C interface comprises an A connection surface and a B connection surface, wherein the A connection surface is provided with a CC1 pin, and the B connection surface is provided with a CC2 pin; the communication module is connected with the high-speed switch chip, the high-speed switch chip is respectively connected with the A connection surface and the B connection surface, and the CC logic control chip is respectively connected with the CC1 pin, the CC2 pin and the high-speed switch chip. The CC logic control chip outside the development board is responsible for detecting the access surface (A connection surface/B connection surface) of the Type-C interface and controlling the high-speed switch chip to be switched to the corresponding access surface. The access surface detection of the Type-C interface and the control of the high-speed switch chip are both completed by the CC logic control chip, so that the hardware pin resources and the software resources of the development board do not need to be wasted.)

1. A development board Type-C interface connection circuit is characterized by comprising a development board, a high-speed switch chip, a CC logic control chip and a Type-C interface; the development board is provided with a communication module; the Type-C interface comprises an A connection surface and a B connection surface, wherein the A connection surface is provided with a CC1 pin, and the B connection surface is provided with a CC2 pin; the communication module is connected with the high-speed switch chip, the high-speed switch chip is respectively connected with the connection surface A and the connection surface B, and the CC logic control chip is respectively connected with the CC1 pin, the CC2 pin and the high-speed switch chip; if the CC1 pin is detected to have an electric signal, the CC logic control chip sends a preset first control signal to the high-speed switch chip so that the high-speed switch chip is switched and connected to the A connection surface; and if the CC2 pin is detected to have an electric signal, the CC logic control chip sends a preset second control signal to the high-speed switch chip so that the high-speed switch chip is switched and connected to the B connection surface.

2. The development board Type-C interface connection circuit of claim 1, wherein the a connection plane includes a signal emission pin, and the signal emission pin of the a connection plane is connected to the high speed switch chip.

3. The development board Type-C interface connection circuit of claim 1, wherein the a connection plane includes signal receiving pins, and the signal receiving pins of the a connection plane are connected to the high speed switch chip.

4. The development board Type-C interface connection circuit of claim 1, wherein the B connection face includes a signal emission pin, the signal emission pin of the B connection face being connected with the high speed switch chip.

5. The development board Type-C interface connection circuit of claim 1, wherein the B connection face includes a signal receiving pin, and the signal receiving pin of the B connection face is connected with the high speed switch chip.

6. The development board Type-C interface connection circuit of claim 1, wherein the a connection plane includes communication data pins, and the communication data pins of the a connection plane are connected to the communication module.

7. The development board Type-C interface connection circuit of claim 1, wherein the B connection plane includes communication data pins, and the communication data pins of the B connection plane are connected to the communication module.

8. The development board Type-C interface connection circuit of claim 1, wherein the A connection face includes a power supply pin, and the power supply pin of the A connection face is connected to the communication module.

9. The development board Type-C interface connection circuit of claim 1, wherein the B connection face includes a power supply pin, and the power supply pin of the B connection face is connected with the communication module.

10. The development board Type-C interface connection circuit of claim 1, wherein the a connection face and the B connection face each include a ground pin; the grounding pin of the connection surface A and the grounding pin of the connection surface B are grounded.

Technical Field

The invention relates to the technical field of Type-C interfaces, in particular to a development board Type-C interface connecting circuit.

Background

The Type-C connection mode is rapidly applied to a plurality of electronic devices due to the advantages of automatic identification of front and back insertion, high-power supply, interface expansion and the like. Such as cell phones and notebook computers. The equipment is generally of a complete machine Type, and a special chip is usually used in the equipment to check CC logic detection of Type-C, namely front and back detection.

The above detection process requires an I2C interface and some GPIO interfaces of the processor used for the terminal and interrupt processing resources, requiring software control of the high-speed switch chip. This is not problematic for devices with sufficient hardware pin resources, such as mobile phones and notebook computers. However, for the communication module developing the standard interface on the board, the fixed hardware pin resources are determined by project or need to meet certain specification standards. If the hardware pin resources on the development board are allocated to Type-C front and back detection, the hardware pin resources are wasted. Meanwhile, the control of the high-speed switch chip wastes software resources of the development board.

Disclosure of Invention

The embodiment of the invention provides a development board Type-C interface connection circuit, aiming at solving the problem that the existing Type-C front and back detection method wastes hardware pin resources and software resources of a development board.

In order to solve the above problem, an embodiment of the present invention provides a development board Type-C interface connection circuit, where the development board Type-C interface connection circuit includes a development board, a high-speed switch chip, a CC logic control chip, and a Type-C interface; the development board is provided with a communication module; the Type-C interface comprises an A connection surface and a B connection surface, wherein the A connection surface is provided with a CC1 pin, and the B connection surface is provided with a CC2 pin; the communication module is connected with the high-speed switch chip, the high-speed switch chip is respectively connected with the connection surface A and the connection surface B, and the CC logic control chip is respectively connected with the CC1 pin, the CC2 pin and the high-speed switch chip; if the CC1 pin is detected to have an electric signal, the CC logic control chip sends a preset first control signal to the high-speed switch chip so that the high-speed switch chip is switched and connected to the A connection surface; and if the CC2 pin is detected to have an electric signal, the CC logic control chip sends a preset second control signal to the high-speed switch chip so that the high-speed switch chip is switched and connected to the B connection surface.

The technical scheme is that the A connection surface comprises a signal emission pin, and the signal emission pin of the A connection surface is connected with the high-speed switch chip.

The further technical scheme is that the A connection surface comprises a signal receiving pin, and the signal receiving pin of the A connection surface is connected with the high-speed switch chip.

The technical scheme is that the B connection surface comprises a signal emission pin, and the signal emission pin of the B connection surface is connected with the high-speed switch chip.

The further technical scheme is that the B connection surface comprises a signal receiving pin, and the signal receiving pin of the B connection surface is connected with the high-speed switch chip.

The communication module is characterized in that the A connection surface comprises a communication data pin, and the communication data pin of the A connection surface is connected with the communication module.

The technical scheme is that the B connection surface comprises a communication data pin, and the communication data pin of the B connection surface is connected with the communication module.

The technical scheme is that the A connection surface comprises a power supply pin, and the power supply pin of the A connection surface is connected with the communication module.

The technical scheme is that the B connection surface comprises a power supply pin, and the power supply pin of the B connection surface is connected with the communication module.

The further technical scheme is that the connection surface A and the connection surface B both comprise grounding pins; the grounding pin of the connection surface A and the grounding pin of the connection surface B are grounded.

Compared with the prior art, the embodiment of the invention can achieve the following technical effects:

in the embodiment of the invention, the CC logic control chip outside the development board is responsible for detecting the access surface (A connection surface/B connection surface) of the Type-C interface and controlling the high-speed switch chip to be switched to the corresponding access surface. The access surface detection of the Type-C interface and the control of the high-speed switch chip are both completed by the CC logic control chip, so that the hardware pin resources and the software resources of the development board do not need to be wasted.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic block diagram of a structure of a Type-C interface connection circuit of a development board according to an embodiment of the present invention;

fig. 2 is a schematic pin diagram of a Type-C interface of a development board Type-C interface connection circuit according to an embodiment of the present invention.

Reference numerals

The device comprises a development board 10, a high-speed switch chip 20, a CC logic control chip 30, a Type-C interface 40 and a communication module 11.

Detailed Description

The technical solutions in the embodiments will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, wherein like reference numerals represent like elements in the drawings. It is apparent that the embodiments to be described below are only a part of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the invention. As used in the description of embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

Referring to fig. 1-2, an embodiment of the invention provides a development board Type-C interface connection circuit. As can be seen from the figure, the development board Type-C interface connection circuit includes a development board 10, a high-speed switch chip 20, a CC logic control chip 30, and a Type-C interface 40. The high-speed switch chip 20 plays a role of a switch and is switched to connect the access surface of the Type-C interface 40. The CC logic control chip 30 functions to detect the access plane of the Type-C interface 40.

The development board 10 is provided with a communication module 11. The development board 10 communicates with an external device through the communication module 11.

Type-C interface 40 includes that A connects the face and B connects the face. The connection surface A and the connection surface B are symmetrically arranged, so that the Type-C interface 40 is not limited by forward and reverse insertion. The A connection surface of the Type-C interface 40 is provided with a CC1 pin, and the B connection surface of the Type-C interface 40 is provided with a CC2 pin.

The connection relationship of the above devices is as follows: the communication module 11 is connected to the high-speed switch chip 20, the high-speed switch chip 20 is connected to the connection plane a and the connection plane B, and the CC logic control chip 30 is connected to the pin CC1, the pin CC2, and the high-speed switch chip 20.

In the embodiment of the present invention, if it is detected that an electrical signal exists at the CC1 pin, it indicates that the a connection plane of the Type-C interface 40 is connected to an external device, and the CC logic control chip 30 sends a preset first control signal to the high-speed switch chip 20, so that the high-speed switch chip 20 is switched to be connected to the a connection plane. When the high-speed switch chip 20 is switched to be connected to the a connection surface, the a connection surface is connected to the communication module 11, and thus the communication module 11 is connected to the external device.

If the electrical signal is detected to exist at the pin CC2, it indicates that the B connection surface of the Type-C interface 40 is connected to an external device, and the CC logic control chip 30 sends a preset second control signal to the high-speed switch chip 20, so that the high-speed switch chip 20 is switched to be connected to the B connection surface. When the high-speed switch chip 20 is switched to be connected to the B connection surface, the B connection surface is connected to the communication module 11, and thus the communication module 11 is connected to an external device.

In the embodiment of the present invention, the CC logic control chip 30 outside the development board 10 is responsible for detecting the access plane (a connection plane a/B connection plane) of the Type-C interface 40, and controlling the high-speed switch chip 20 to switch to the corresponding access plane. The access surface detection of the Type-C interface 40 and the control of the high-speed switch chip 20 are both completed by the CC logic control chip 30, so that the hardware pin resources and the software resources of the development board 10 do not need to be wasted.

Continuing with reference to fig. 1-2, in some embodiments, such as the present embodiment, the a-side includes signal launch pins, and the signal launch pins included in the a-side specifically include TX1+ pin a2 and TX 1-pin A3. The signal transmitting pin of the A connection surface is connected with the high-speed switch chip 20, namely, a TX1+ pin A2 and a TX 1-pin A3 are both connected with the high-speed switch chip 20.

Further, the a connection face includes signal receiving pins, and the signal receiving pins included in the a connection face specifically include RX2+ pin a11 and RX 2-pin a 10. The signal receiving pin of the A connection surface is connected with the high-speed switch chip 20, namely RX2+ pin A11 and RX 2-pin A10 are both connected with the high-speed switch chip 20.

The B connection surface comprises a signal transmitting pin, and the signal transmitting pin comprises a TX2+ pin B2 and a TX 2-pin B3. The signal transmitting pin of the A connection surface is connected with the high-speed switch chip 20, namely, a TX2+ pin B2 and a TX 2-pin B3 are both connected with the high-speed switch chip 20.

Further, the signal receiving pins of the B connection surface include RX1+ pin B11 and RX 1-pin B10. The signal receiving pin of the B connection surface is connected with the high-speed switch chip 20, namely RX1+ pin B11 and RX 1-pin B10 are both connected with the high-speed switch chip 20.

Further, the a connection surface includes communication data pins, and the communication data pins of the a connection surface specifically include a D + pin a6 and a D-pin a 7; the communication data pin of the a connection face is connected with the communication module 11, that is, the D + pin a6 and the D-pin a7 of the a connection face are both connected with the communication module 11.

Further, the B connection surface includes communication data pins, and the communication data pins of the B connection surface specifically include a D + pin B6 and a D-pin B7; the communication data pin of the B connection surface is connected to the communication module 11, that is, both the D + pin B6 and the D-pin B7 of the B connection surface are connected to the communication module 11.

Further, the a connection surface comprises a power supply pin, and the power supply pin of the a connection surface specifically comprises a VBUS pin (a4, a 9). The power supply pin of the a connection plane is connected to the communication module 11, i.e. the VBUS pin (a4, a9) of the a connection plane is connected to the communication module 11.

Further, the B connection surface includes a power supply pin, and the power supply pin of the B connection surface specifically includes a VBUS pin (B4, B9). The power supply pin of the B connection surface is connected to the communication module 11, that is, the VBUS pin (B4, B9) of the B connection surface is connected to the communication module 11.

Further, the connection surface a and the connection surface B both include a ground pin. Specifically, the ground pins of the a-connection face include GND pins (a1, a 12). The ground pins of the B connection surface include GND pins (B1, B12).

The grounding pin of the A connection surface and the grounding pin of the B connection surface are grounded, namely, the GND pins (A1 and A12) of the A connection surface and the GND pins (B1 and B12) of the B connection surface are grounded.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, while the invention has been described with respect to the above-described embodiments, it will be understood that the invention is not limited thereto but may be embodied with various modifications and changes.

While the invention has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.