阅读说明：本技术 一种串联电容的制作方法及可贴装的串联电容 (Manufacturing method of series capacitor and mountable series capacitor ) 是由 白清新 李际勇 庞溥生 王维 于 2020-03-16 设计创作，主要内容包括：本发明公开了一种串联电容的制作方法,包括：对瓷介芯片的正面进行金属电极化形成正面金属电极面；将瓷介芯片的背面分为第一背面和第二背面,对第一背面进行金属电极化形成第一背面金属电极面,对第二背面进行金属电极化形成第二背面金属电极面；通过焊料将第一引线焊接在第一背面金属电极面上,以及将第二引线焊接在第二背面金属电极面上,得到电极化的瓷介芯片；对电极化的瓷介芯片包封绝缘涂装层形成有串联效果的可贴装电容；本发明实现将原设计电路板上的两只电容器串联变成只安装一只此串联电容,从而在电路板上只需一次贴装动作,减少一次插装和焊接动作,节约时间提高生产效率；并适用于表面贴装,在电路板上安装时可减小安装空间位置。(The invention discloses a method for manufacturing a series capacitor, which comprises the following steps: performing metal electric polarization on the front surface of the ceramic dielectric chip to form a front metal electrode surface; dividing the back surface of the ceramic dielectric chip into a first back surface and a second back surface, performing metal electric polarization on the first back surface to form a first back surface metal electrode surface, and performing metal electric polarization on the second back surface to form a second back surface metal electrode surface; welding a first lead on the first back metal electrode surface and welding a second lead on the second back metal electrode surface through a welding flux to obtain an electrically polarized ceramic dielectric chip; an attachable capacitor with a series effect is formed by encapsulating the insulation coating layer on the electric polarized ceramic dielectric chip; the invention realizes that two capacitors on the original designed circuit board are connected in series to be changed into that only one capacitor is arranged in series, so that only one mounting action is required on the circuit board, one insertion and welding action is reduced, the time is saved, and the production efficiency is improved; and is suitable for surface mounting, and the mounting space position can be reduced when the circuit board is mounted.)

1. A method for manufacturing a series capacitor is characterized by comprising the following steps:

performing metal electric polarization on the front surface of the ceramic dielectric chip to form a front metal electrode surface, specifically, dividing the front surface of the ceramic dielectric chip into a first front surface and a second front surface, performing metal electric polarization on the first front surface to form a first front metal electrode surface, performing metal electric polarization on the second front surface to form a second front metal electrode surface, and connecting the first front metal electrode surface and the second front metal electrode surface through a conductor material;

dividing the back surface of the ceramic dielectric chip into a first back surface and a second back surface, carrying out metal electric polarization on the first back surface to form a first back surface metal electrode surface, and carrying out metal electric polarization on the second back surface to form a second back surface metal electrode surface;

welding a first lead on the first back metal electrode surface through a solder, and welding a second lead on the second back metal electrode surface to obtain an electrically polarized ceramic dielectric chip;

and encapsulating an insulating coating layer on the electrically polarized ceramic dielectric chip to form the attachable capacitor with a series effect.

2. The method of claim 1, wherein the first front metal electrode plane and the second front metal electrode plane are symmetrically covered on the front surface of the ceramic dielectric chip.

3. The method according to claim 1, wherein the first back metal electrode and the second back metal electrode are symmetrically covered on the back surface of the ceramic dielectric chip and correspond to the first front metal electrode and the second front metal electrode in position and area, respectively; and a spacing distance is arranged between the first back metal electrode surface and the second back metal electrode surface.

4. The method of claim 3 wherein the spacing distance is notched.

5. The method of claim 4, wherein the depth of the recess is greater than or equal to 0 and less than the thickness of the ceramic dielectric chip; the width of the groove is larger than 0 and smaller than that of the ceramic dielectric chip.

6. The method of manufacturing a series capacitor as claimed in any one of claims 1 to 5, wherein the ceramic dielectric chip has a shape comprising: cuboid, cylinder, spindle or dumbbell.

7. A mountable series capacitor manufactured by the method according to any one of claims 1 to 6, the mountable series capacitor comprising: the insulating coating layer, the ceramic dielectric chip, the lead, the solder and the metal electrode surface;

the metal electrode surface comprises a front metal electrode surface and a back metal electrode surface, the front metal electrode surface comprises a first front metal electrode surface and a second front metal electrode surface, the first front metal electrode surface and the second front metal electrode surface are covered on the front surface of the ceramic dielectric chip, and the front surface of the ceramic dielectric chip comprises a first front surface and a second front surface; the first front metal electrode surface covers the first front, the second front metal electrode surface covers the second front, and the first front metal electrode surface and the second front metal electrode surface are connected through a conductor material;

the back metal electrode surface comprises a first back metal electrode surface and a second back metal electrode surface, and the first back metal electrode surface and the second back metal electrode surface are covered on the back of the ceramic dielectric chip; the lead wires comprise a first lead wire and a second lead wire, and the first lead wire and the second lead wire are respectively welded on the first back metal electrode surface and the second back metal electrode surface through the welding flux; the insulating coating layer is encapsulated outside the ceramic dielectric chip after the metal electrode surface covering and the lead welding are carried out.

8. The mountable series capacitor of claim 7 wherein said leads are straight leads or bent leg leads; the lead wire direction can be led out to all directions in the same plane according to the use requirement.

9. The mountable series capacitor of claim 7 wherein said leads are cylindrical solderable conductors or flat solderable conductors.

10. The mountable series capacitor of claim 7 wherein said first back metal electrode and said second back metal electrode are of the same shape and area, said first back metal electrode and said second back metal electrode symmetrically cover the back of said ceramic dielectric chip, and a spacing distance is provided between said first back metal electrode and said second back metal electrode.

11. An attachable series capacitor according to claim 10, characterised in that the distance of separation is fluted.

12. The attachable series capacitor of claim 11 wherein said recess has a depth greater than or equal to 0 and less than the thickness of said ceramic dielectric chip; the width of the groove is larger than 0 and smaller than that of the ceramic dielectric chip.

13. The attachable series capacitor of any one of claims 7 to 12, wherein said ceramic chip is shaped to include: cuboid, cylinder, spindle or dumbbell.

Technical Field

The invention relates to the field of electronic components, in particular to a manufacturing method of a series capacitor and a mountable series capacitor.

Background

In designing a component mounting on a circuit board, two ceramic dielectric capacitors are usually connected in series on the circuit board in order to ensure the reliability of the component. As shown in the following figure 1, a conventional capacitor is internally provided with a disc ceramic chip, two sides of the chip are electrically polarized, then leads are welded, and an insulating coating layer is encapsulated outside the chip to form the capacitor. Because two ceramic dielectric capacitors need to be connected in series on the designed circuit board circuit, enough space needs to be reserved for the two capacitors when the ceramic dielectric capacitors are installed on the circuit board circuit, the capacitors are installed on the front surface of the circuit board, the lead penetrates through the circuit board and is welded on the back surface of the circuit board, the two surfaces of the circuit board are utilized, two times of insertion is needed when the capacitors are installed, and the efficiency is low.

Disclosure of Invention

The invention provides a manufacturing method of a series capacitor and a series capacitor capable of being pasted, which realize that only one pasting action is needed, reduce one inserting and welding action, save time and improve production efficiency; and is suitable for surface mounting, and the mounting space position can be reduced when the circuit board is mounted.

In order to solve the above technical problem, an embodiment of the present invention provides a method for manufacturing a series capacitor, including:

performing metal electric polarization on the front surface of the ceramic dielectric chip to form a front metal electrode surface, specifically, dividing the front surface of the ceramic dielectric chip into a first front surface and a second front surface, performing metal electric polarization on the first front surface to form a first front metal electrode surface, performing metal electric polarization on the second front surface to form a second front metal electrode surface, and connecting the first front metal electrode surface and the second front metal electrode surface through a conductor material;

dividing the back surface of the ceramic dielectric chip into a first back surface and a second back surface, carrying out metal electric polarization on the first back surface to form a first back surface metal electrode surface, and carrying out metal electric polarization on the second back surface to form a second back surface metal electrode surface;

welding a first lead on the first back metal electrode surface through a solder, and welding a second lead on the second back metal electrode surface to obtain an electrically polarized ceramic dielectric chip;

and encapsulating an insulating coating layer on the electrically polarized ceramic dielectric chip to form the attachable capacitor with a series effect.

Preferably, the first front metal electrode surface and the second front metal electrode surface symmetrically cover the front surface of the ceramic dielectric chip.

Preferably, the first back metal electrode surface and the second back metal electrode surface are symmetrically covered on the back surface of the ceramic dielectric chip and respectively correspond to the first front metal electrode surface and the second front metal electrode surface in position and area; and a spacing distance is arranged between the first back metal electrode surface and the second back metal electrode surface.

Preferably, the spacing distance is provided with a groove.

Preferably, the depth of the groove is greater than or equal to 0 and less than the thickness of the ceramic dielectric chip; the width of the groove is larger than 0 and smaller than that of the ceramic dielectric chip.

Preferably, the ceramic dielectric chip has a shape including: cuboid, cylinder, spindle or dumbbell.

The embodiment of the present invention further provides a mountable series capacitor, which is manufactured by the method for manufacturing a series capacitor according to any one of the above embodiments, and the mountable series capacitor includes: the insulating coating layer, the ceramic dielectric chip, the lead, the solder and the metal electrode surface;

the metal electrode surface comprises a front metal electrode surface and a back metal electrode surface, the front metal electrode surface comprises a first front metal electrode surface and a second front metal electrode surface, the first front metal electrode surface and the second front metal electrode surface are covered on the front surface of the ceramic dielectric chip, and the front surface of the ceramic dielectric chip comprises a first front surface and a second front surface; the first front metal electrode surface covers the first front, the second front metal electrode surface covers the second front, and the first front metal electrode surface and the second front metal electrode surface are connected through a conductor material;

the back metal electrode surface comprises a first back metal electrode surface and a second back metal electrode surface, and the first back metal electrode surface and the second back metal electrode surface are covered on the back of the ceramic dielectric chip; the lead wires comprise a first lead wire and a second lead wire, and the first lead wire and the second lead wire are respectively welded on the first back metal electrode surface and the second back metal electrode surface through the welding flux; the insulating coating layer is encapsulated outside the ceramic dielectric chip after the metal electrode surface covering and the lead welding are carried out.

Preferably, the lead is a straight lead or a bent lead.

Preferably, the lead direction may be led out in various directions in the same plane according to the use requirement.

Preferably, the lead is a cylindrical weldable conductor or a flat weldable conductor.

Preferably, the first back metal electrode surface and the second back metal electrode surface have the same shape and area, the first back metal electrode surface and the second back metal electrode surface symmetrically cover the back of the ceramic dielectric chip, and a spacing distance is provided between the first back metal electrode surface and the second back metal electrode surface.

Preferably, the spacing distance is provided with a groove.

Preferably, the depth of the groove is greater than or equal to 0 and less than the thickness of the ceramic dielectric chip; the width of the groove is larger than 0 and smaller than that of the ceramic dielectric chip.

Preferably, the ceramic dielectric chip has a shape including: cuboid, cylinder, spindle or dumbbell.

Compared with the prior art, the embodiment of the invention has the following beneficial effects:

1. according to the technical scheme, the front metal electrode surface covers the front surface of the ceramic dielectric chip, the two parts of electric polarization are carried out on the back surface of the ceramic dielectric chip to form the two parts of electrode surfaces, and then the conductor leads are respectively led out to form the ceramic dielectric capacitor with the series effect, so that the ceramic dielectric capacitor is mounted on a circuit board only by carrying out mounting action once, one insertion and welding action is reduced, the time is saved, and the production efficiency is improved; and is suitable for surface mounting, and the mounting space position can be reduced when the circuit board is mounted.

2. Set up recess spacing distance in the middle of the two parts electrode face through carrying out the electric polarization at the back of ceramic dielectric chip, can prevent that the creepage condition from appearing, improve this series capacitance's practicality.

Drawings

FIG. 1: is a structural schematic diagram of a capacitor element in the prior art;

FIG. 2: is a schematic front structure diagram of the attachable series capacitor in the embodiment of the invention;

FIG. 3: is a back structure schematic diagram of the attachable series capacitor in the embodiment of the invention;

FIG. 4: is a schematic outline diagram of a mountable series capacitor with a bent pin lead in the embodiment of the invention;

wherein the reference numbers of the drawings in the specification are as follows:

firstly, insulating a coating layer; ② ceramic dielectric chip; thirdly, leading wires; welding flux; fifthly, metal electrode surface; sixthly, a bent pin lead (also called a bent pin substrate).

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 2-3, a preferred embodiment of the present invention provides a method for manufacturing a series capacitor, which includes the steps of:

s1, carrying out metal electric polarization on the front surface of the ceramic dielectric chip to form a front metal electrode surface, specifically, dividing the front surface of the ceramic dielectric chip into a first front surface and a second front surface, carrying out metal electric polarization on the first front surface to form the first front metal electrode surface, carrying out metal electric polarization on the second front surface to form the second front metal electrode surface, and connecting the first front metal electrode surface and the second front metal electrode surface through a conductor material. It should be noted that the front metal electrode may be the whole front surface, or the front surface may be divided into two symmetrical metal electrode surfaces, but the two metal electrode surfaces must be connected by a conductor, and the two front metal electrode surfaces correspond to the two back metal electrode surfaces in size, shape and position.

And S2, dividing the back surface of the ceramic dielectric chip into a first back surface and a second back surface, performing metal electric polarization on the first back surface to form a first back surface metal electrode surface, and performing metal electric polarization on the second back surface to form a second back surface metal electrode surface.

S3, welding a first lead on the first back metal electrode surface through solder, and welding a second lead on the second back metal electrode surface to obtain an electrically polarized ceramic dielectric chip; the direction of the conductor lead can be led out in all directions in the same plane according to the use requirement.

And S4, encapsulating an insulating coating layer on the electrically polarized ceramic dielectric chip to form the attachable capacitor with the series effect.

In a preferred embodiment, the first back metal electrode surface and the second back metal electrode surface are symmetrically covered on the back surface of the ceramic dielectric chip, and a spacing distance is arranged between the first back metal electrode surface and the second back metal electrode surface. In this embodiment, the separation distance is provided with a groove.

It should be noted that, in any of the above embodiments, the depth of the groove is greater than or equal to 0 and less than the thickness of the ceramic dielectric chip; the width of the groove is larger than 0 and smaller than that of the ceramic dielectric chip.

In any of the above embodiments, the ceramic dielectric chip has a shape including: cuboid, cylinder, spindle or dumbbell.

In the preferred embodiment of the invention, a groove (anti-creepage) is designed on a ceramic dielectric chip, and conductor leads are respectively led out from two electrode surfaces which are not connected with each other on the same surface of the chip through reasonable electrode surface arrangement. After insulation coating, a ceramic dielectric capacitor with series effect can be formed. The appearance shape of the new series capacitor is different from that of the original capacitor product, the appearance shape of the main body of the original capacitor is an ellipsoid, and leads are arranged on two side surfaces of the capacitor and are suitable for being inserted on a circuit board; the appearance of the novel capacitor main body is a cuboid, leads are led out from the same side face of the capacitor, and the novel capacitor main body is suitable for surface mounting (or plug-in mounting) on a circuit board. The Y capacitor of the present invention has two advantages when mounted on a circuit board line. The capacitor is suitable for surface mounting, and the mounting space position can be reduced when the capacitor is mounted on a circuit board; of course, if the spatial position of the circuit board is enough, the lead can be lengthened for insertion; secondly, two original capacitors are arranged on the circuit board, and two times of insertion and welding actions are required; at present, a new capacitor is installed on a circuit board, only one mounting action is needed, one insertion and welding action is reduced, time is saved, and production efficiency is improved.

The embodiment of the present invention further provides a mountable series capacitor, which is manufactured by the method for manufacturing a series capacitor according to any one of the above embodiments, and the mountable series capacitor includes: the insulating coating layer, the ceramic dielectric chip, the lead, the solder and the metal electrode surface;

the metal electrode surface comprises a front metal electrode surface and a back metal electrode surface, the front metal electrode surface comprises a first front metal electrode surface and a second front metal electrode surface, the first front metal electrode surface and the second front metal electrode surface are covered on the front surface of the ceramic dielectric chip, and the front surface of the ceramic dielectric chip comprises a first front surface and a second front surface; the first front metal electrode surface covers the first front, the second front metal electrode surface covers the second front, and the first front metal electrode surface and the second front metal electrode surface are connected through a conductor material; the back metal electrode surface comprises a first back metal electrode surface and a second back metal electrode surface, and the first back metal electrode surface and the second back metal electrode surface are covered on the back of the ceramic dielectric chip; the lead wires comprise a first lead wire and a second lead wire, and the first lead wire and the second lead wire are respectively welded on the first back metal electrode surface and the second back metal electrode surface through the welding flux; the insulating coating layer is encapsulated outside the ceramic dielectric chip after the metal electrode surface covering and the lead welding are carried out. The direction of the conductor lead can be led out in all directions in the same plane according to the use requirement.

In a preferred embodiment, the first back metal electrode surface and the second back metal electrode surface have similar shapes and areas, the first back metal electrode surface and the second back metal electrode surface symmetrically cover the back of the ceramic dielectric chip, and a spacing distance is provided between the first back metal electrode surface and the second back metal electrode surface. In this embodiment, the separation distance is provided with a groove.

It should be noted that, in any of the above embodiments, the depth of the groove is greater than or equal to 0 and less than the thickness of the ceramic dielectric chip; the width of the groove is larger than 0 and smaller than that of the ceramic dielectric chip.

In any of the above embodiments, the leads may be straight leads or bent-leg leads. The lead may be a cylindrical solderable conductor or a flat solderable conductor.

In any of the above embodiments, the ceramic dielectric chip has a shape including: cuboid, cylinder, spindle or dumbbell.

Specifically, the series capacitor of the preferred embodiment of the present invention has a rectangular ceramic dielectric chip, one side (front side) of the chip is fully metal-polarized or symmetrically divided into two metal-polarized parts, and the two metal-polarized parts must be connected by a conductor material and have the same position, shape and size as the two metal-polarized parts symmetrically arranged on the back side; the other pair of metal electrodes (back) is divided into two symmetrical parts, the middle part is provided with a groove distance for increasing the interval of the electrodes at two sides to prevent creepage, and then the electrode surfaces at two sides are welded with leads. The external of the whole electric polarized chip is enveloped with an insulating coating layer to form a capacitor which can be attached and has a series effect.

According to the invention, under the conditions of the existing production technology, through the structural design and the suitable process production and processing of the ceramic dielectric chip, the rectangular ceramic dielectric chip (cylinder, spindle, dumbbell and the like) is reasonably subjected to metal electric polarization, and after two conductor leads are led out from the same side, the ceramic dielectric chip is subjected to insulator coating and packaging, so that an independent ceramic dielectric capacitor with a series effect and capable of being surface-mounted is formed. After the series ceramic dielectric capacitor is subjected to surface mounting on the circuit board, the series ceramic dielectric capacitor can replace the effect of two existing independent ceramic dielectric capacitors after being inserted and connected in series, so that the space of the circuit board back package is saved, and meanwhile, the two-time plug-in welding process during the back package is changed into a surface mounting process, so that the operation time is reduced, and the production efficiency is improved.

Compared with the existing capacitor, the capacitor created by the invention has the following advantages:

the existing capacitors are connected in series on a circuit board circuit, enough space needs to be reserved for the two capacitors, the capacitors are arranged on the front side of the circuit board, a lead penetrates through the circuit board and then is welded on the back side of the circuit board, and the two sides of the circuit board are utilized. Moreover, the capacitor needs to be inserted twice when being installed, and the efficiency is low.

The capacitor provided by the invention forms a ceramic dielectric capacitor with a series effect on a ceramic dielectric chip. The appearance shape of the new series capacitor is different from that of the original capacitor product, the appearance shape of the main body of the original capacitor is an ellipsoid, and leads are arranged on two side surfaces of the capacitor and are suitable for being inserted on a circuit board; the appearance of the novel capacitor main body is a cuboid, the lead is short (the lead can be lengthened according to use requirements and inserted on a circuit board), and the lead is led out from the same side surface of the capacitor, so that the novel capacitor main body is suitable for surface mounting on the circuit board.

The capacitor of the present invention has two advantages when mounted on a circuit board line. The capacitor is suitable for surface mounting, and the mounting space position can be reduced when the capacitor is mounted on a circuit board; secondly, two original capacitors are arranged on the circuit board, and two times of insertion and welding actions are required; at present, a new capacitor is installed on a circuit board, only one mounting action is needed, one insertion and welding action is reduced, time is saved, and production efficiency is improved.

The above-mentioned embodiments are provided to further explain the objects, technical solutions and advantages of the present invention in detail, and it should be understood that the above-mentioned embodiments are only examples of the present invention and are not intended to limit the scope of the present invention. It should be understood that any modifications, equivalents, improvements and the like, which come within the spirit and principle of the invention, may occur to those skilled in the art and are intended to be included within the scope of the invention.